CN108341394B - 微机电系统装置 - Google Patents
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Abstract
一种微机电系统装置包含一处理晶粒、一微机电系统晶粒以及多个引线。微机电系统晶粒包含一基板以及一微机电系统元件。基板具有一第一表面,且第一表面包含一电路以及与电路电性连接的多个第一导电接点。微机电系统元件具有一第二表面、一第三表面以及至少一第二导电接点,其中微机电系统元件以第二表面设置于基板的第一表面,且至少一第二导电接点设置于微机电系统元件的第三表面。多个引线经由多个第一导电接点以及第二导电接点分别电性连接微机电系统晶粒的基板以及微机电系统元件至处理晶粒。
Description
技术领域
本发明是有关一种微机电系统装置,特别是一种利用引线与外部芯片电性连接的微机电系统装置。
背景技术
自1970年代微机电系统装置概念成形起,微机电系统(MicroelectromechanicalSystem,MEMS)装置已从实验室的探索对象进步至成为高阶系统整合的对象,并已在大众消费性装置中有广泛的应用,展现了惊人且稳定的成长。微机电系统装置包含一可动的微机电系统元件,藉由感测可动的微机电系统元件的运动物理量所造成的电容差异可实现微机电系统装置的各项功能。
已知的微机电系统装置是将可动的微机电系统元件是设置于一半导体基板,微机电系统元件再经由导电贯孔与半导体基板电性连接,最后利用半导体基板的导电接点与外部的晶片的电性连接。依据上述结构将增加微机电系统元件的半导体工艺,导致微机电系统装置的制造成本提高。有鉴于此,如何简化微机电系统装置的工艺便是目前极需努力的目标。
发明内容
本发明提供一种微机电系统装置,其是利用引线将微机电系统元件电性连接至一外部芯片,如此可免除用以电性连接微机电系统元件以及半导体基板的导电贯孔的半导体工艺,进而降低微机电系统装置的制造成本。
本发明一实施例的微机电系统装置包含一处理晶粒、一微机电系统晶粒以及多个引线。微机电系统晶粒包含一基板以及一微机电系统元件。基板具有一第一表面,且第一表面包含一电路以及与电路电性连接的多个第一导电接点。微机电系统元件具有一第二表面、一第三表面以及至少一第二导电接点,其中微机电系统元件以第二表面朝向基板设置于基板的第一表面,且至少一第二导电接点设置于微机电系统元件的第三表面。多个引线经由多个第一导电接点以及至少一第二导电接点电性连接微机电系统晶粒的基板以及微机电系统元件至处理晶粒。
以下藉由具体实施例配合所附的图式详加说明,当更容易了解本发明的目的、技术内容、特点及其所达成的功效。
附图说明
图1为一俯视图,显示本发明一第一实施例的微机电系统装置。
图2为一示意图,显示沿图1的AA线的本发明一第一实施例的微机电系统装置的剖面结构。
图3为一示意图,显示本发明一第二实施例的微机电系统装置。
图4为一示意图,显示本发明一第三实施例的微机电系统装置。
图5为一示意图,显示本发明一第四实施例的微机电系统装置。
符号说明
10 微机电系统晶粒
11 基板
111 第一表面
112a 感测电极
112b 参考电极
113 第一导电接点
114 支撑元件
12 微机电系统元件
121 第二表面
122 第三表面
123 第二导电接点
20 处理晶粒
21 导电接点
30 引线
具体实施方式
以下将详述本发明的各实施例,并配合图式作为例示。除了这些详细说明之外,本发明亦可广泛地施行于其它的实施例中,任何所述实施例的轻易替代、修改、等效变化都包含在本发明的范围内,并以申请专利范围为准。在说明书的描述中,为了使读者对本发明有较完整的了解,提供了许多特定细节;然而,本发明可能在省略部分或全部特定细节的前提下,仍可实施。此外,众所周知的步骤或元件并未描述于细节中,以避免对本发明形成不必要的限制。图式中相同或类似的元件将以相同或类似符号来表示。特别注意的是,图式仅为示意之用,并非代表元件实际的尺寸或数量,有些细节可能未完全绘出,以求图式的简洁。
请参照图1以及图2,本发明的一实施例的微机电系统装置包含一微机电系统晶粒(die)10以及一处理晶粒20。处理晶粒20透过多个引线30与微机电系统晶粒10电性连接,以处理微机电系统晶粒10所输出的感测信号。于一实施例中,处理晶粒20可为一专用集成电路(Application specific integrated circuit,ASIC)。
微机电系统晶粒10包含一基板11以及一微机电系统元件12。基板11的一第一表面111包含一电路以及与电路电性连接的多个第一导电接点113。举例而言,基板11包含至少一金属层。于图2所示的实施例中,基板11包含多层金属层所形成的电路,而最上层的金属层部分曝露于基板11的第一表面111。曝露出来的金属层可作为感测电容的感测电极112a以及参考电容的参考电极112b。可以理解的是,多个第一导电接点113可经由内连接线路与感测电极112a以及参考电极112b电性连接。于一实施例中,基板11可为一互补式金氧半导体基板。
微机电系统元件12具有一第二表面121、一第三表面122以及至少一第二导电接点123。微机电系统元件12以第二表面121朝向基板11设置于基板11的第一表面111。至少一第二导电接点123则设置于微机电系统元件12的第三表面122。于一实施例中,微机电系统元件12能够以共晶键合(eutectic bonding)技术与基板11接合。举例而言,基板11以及微机电系统元件12的接合位置包含一合金,其包含铝、铜、锗、铟、金以及硅至少其中之一。但不限于此,微机电系统元件12亦能够以熔接(fusion bond)、焊接以及黏合至少其中之一的技术与基板11接合。于一实施例中,微机电系统元件12可为单晶硅。
举例而言,可先将一单晶硅基板以共晶键合、熔接、焊接或黏合等技术与基板11接合,接着,将至少一第二导电接点123藉由适当的半导体工艺,例如沉积、曝光、显影、蚀刻等,形成于单晶硅基板的第三表面122。最后,再利用半导体工艺将单晶硅基板形成微机电系统元件12。多个引线30可连接基板11上的多个第一导电接点113以及微机电系统元件12上的至少一第二导电接点123至处理晶粒20上的导电接点21,以电性连接微机电系统晶粒10的基板11以及微机电系统元件12至处理晶粒20。
以图1以及图2所示的压力传感器为例,微机电系统元件12与基板11间形成一气密空腔,且微机电系统元件12与固定电极112a相对。依据此结构,微机电系统元件12即可随着外部环境的压力变化而产生形变,进而导致微机电系统元件12以及固定电极112a间的电容值变化,如此即可感测外部环境的压力变化。需注意的是,第二导电接点123并未经由微机电系统元件12与基板11上的电路电性连接。换言之,本发明的微机电系统装置无需在微机电系统元件12上形成导电贯孔或其它相似的导电结构,如此可减少多道半导体工艺,进而降低微机电系统装置的制造成本。
可以理解的是,参考电极112b靠近气密空腔的侧壁设置,则微机电系统元件12与参考电极112b相对应的区域即因气密空腔的侧壁的支撑而与参考电极112b维持一固定间距,如此,参考电极112b与微机电系统元件12间即近似一固定间距,换言之,参考电极112b与微机电系统元件12间可形成一电容值为定值的参考电容。于一实施例中,微机电系统晶粒10更包含一支撑元件114,其设置于靠近气密空腔的侧壁,以维持参考电极112b以及微机电系统元件12间为一固定间距。于图1所示的实施例中,支撑元件114为一墙状。但不限于此,支撑元件114亦可为柱状(如图3所示)、环状(如图4所示)、弧状(如图5所示)或其它适当的结构。
综合上述,本发明的微机电系统装置是利用引线将微机电系统元件直接电性连接至处理晶粒,如此即无需在微机电系统元件上形成导电贯孔或相似的导电结构,因而可简化半导体工艺并降低微机电系统装置的制造成本。
以上所述的实施例仅是为说明本发明的技术思想及特点,其目的在使本领域技术人员能够了解本发明的内容并据以实施,当不能以之限定本发明的专利范围,即大凡依本发明所揭示的精神所作的均等变化或修饰,仍应涵盖在本发明的专利范围内。
Claims (8)
1.一种微机电系统装置,其特征在于,包含:
一处理晶粒;
一微机电系统晶粒,其包含:
一基板,其具有一第一表面,且该第一表面包含一电路以及与该电路电性连接的多个第一导电接点,其中该电路包括一感测电极;以及
一微机电系统元件,其具有一第二表面、一第三表面以及至少一第二导电接点,其中该微机电系统元件以该第二表面朝向该基板设置于该基板的该第一表面并与该感测电极相对,且该至少一第二导电接点设置于该微机电系统元件的该第三表面,该微机电系统元件和该感测电极间的一电容值随着外部环境的压力变化而变化;以及
多个引线,其经由该多个第一导电接点以及该至少一第二导电接点分别电性连接该微机电系统晶粒的该基板以及该微机电系统元件至该处理晶粒。
2.如权利要求1所述的微机电系统装置,其特征在于,该基板包含一互补式金氧半导体基板。
3.如权利要求1所述的微机电系统装置,其特征在于,该微机电系统元件包含单晶硅。
4.如权利要求1所述的微机电系统装置,其特征在于,该微机电系统元件以及该基板间形成一气密空腔,使该微机电系统装置作为一压力传感器。
5.如权利要求4所述的微机电系统装置,其特征在于,该微机电系统晶粒更包含一支撑元件,其设置于靠近该气密空腔的侧壁。
6.如权利要求5所述的微机电系统装置,其特征在于,该支撑元件为墙状、柱状、环状或弧状。
7.如权利要求1所述的微机电系统装置,其特征在于,该基板与该微机电系统元件的接合是以共晶键合、熔接、焊接以及黏合至少其中之一加以实现。
8.如权利要求1所述的微机电系统装置,其特征在于,该处理晶粒为一专用集成电路。
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