CN108340653A - The manufacturing method and its product of the frame of electronic product - Google Patents

The manufacturing method and its product of the frame of electronic product Download PDF

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Publication number
CN108340653A
CN108340653A CN201710057998.2A CN201710057998A CN108340653A CN 108340653 A CN108340653 A CN 108340653A CN 201710057998 A CN201710057998 A CN 201710057998A CN 108340653 A CN108340653 A CN 108340653A
Authority
CN
China
Prior art keywords
frame
metal layer
opening
prepreg bed
electronic product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710057998.2A
Other languages
Chinese (zh)
Inventor
陈昱龙
洪万顺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced International Multitech Co Ltd
Original Assignee
Advanced International Multitech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced International Multitech Co Ltd filed Critical Advanced International Multitech Co Ltd
Priority to CN201710057998.2A priority Critical patent/CN108340653A/en
Publication of CN108340653A publication Critical patent/CN108340653A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0253—Polyolefin fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0261—Polyamide fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0276—Polyester fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/106—Carbon fibres, e.g. graphite fibres

Landscapes

  • Laminated Bodies (AREA)

Abstract

A kind of manufacturing method of the frame of electronic product a, including roughening step, a superimposition step and a forming step.In the roughening step, prepare multiple metal layers for respectively surrounding out one first opening, and roughening treatment is carried out to the surface of the metal layer respectively.In the superimposition step, by the metal layer and multiple prepreg bed of material interactive stackings, each prepreg bed of material surrounds out one second opening, and first opening and second opening are interconnected.In the forming step, by the metal layer and the prepreg bed of material it is hot-forming be a frame.The frame due to having preimpregnation material and metal simultaneously, therefore the advantage for being easy to be molded and structural strength is good has been had both, since roughening treatment is passed through on the surface of the metal layer, the contact area when resin gone out with the overflow of the prepreg bed of material institute when can increase hot pressing binds promotes bond strength.

Description

The manufacturing method and its product of the frame of electronic product
Technical field
The present invention relates to a kind of manufacturing method of frame and its products, are manufactured more particularly to a kind of frame of electronic product Method and its product.
Background technology
Under being constantly progressive of science and technology, miscellaneous electronic product is gradually miniaturized, and function exquisiteness degree is also constantly broken through, Seem smartwatch it is wherein an example, not only has traditional time display function, moreover it is possible to measure sleep quality, positioning, prison Control user's physical function state, prompt incoming call and message etc..Due to miniature and function sophistication as a result, therefore such electricity The frame of sub- product needs to have higher intensity, and puts demand, the material of the frame to increase design sense or internal component Material will also be easy to be molded.And although the frame of all-metal has higher intensity, but processing and forming is not easy, and smartwatch is this kind of Product often need and then that user movement is to monitor exercise data, and the heavier-weight of all-metal frame can aggravate user's fortune Burden when dynamic simultaneously influences wearing experience.And composite material (such as carbon fiber) although made of frame is lighter and opposite is easy to Molding, but intensity is relatively low and lacks metal-like and external form is not good enough, in addition the component in general electronic products needs to be grounded, if If using composite material frame, then ground wire need to be in addition socketed by lower portion, electronic loop configuration is more troublesome.
Invention content
The purpose of the present invention is to provide a kind of manufacturing methods of the outline border of the electronic product with composite material and metal.
The manufacturing method of the frame of electronic product of the present invention, it is characterised in that：The manufacturing method include a roughening step, One superimposition step and a forming step prepare multiple metal layers in the roughening step, each metal layer surrounds out One first opening, and roughening treatment is carried out to the surface of the metal layer respectively, in the superimposition step, by the metal layer With multiple prepreg bed of material interactive stackings, each prepreg bed of material surrounds out one second opening, first opening and institute State the second opening be interconnected, in the forming step, by the metal layer and the prepreg bed of material it is hot-forming be one Frame.
Preferably, the manufacturing method of the frame of aforementioned electronic product is to each metal wherein in the roughening step The opposite sides of layer are roughened.
Preferably, the manufacturing method of the frame of aforementioned electronic product, wherein in the superimposition step, each preimpregnation material Layer is selected from carbon fiber, polyethylene terephthalate, polyethylene, polypropylene, Ke Weila fibers, aramid fiber, glass fibre Or made by basalt fibre.
It is another object of the present invention to provide a kind of products by obtained by the manufacturing method.
The frame of electronic product of the present invention, it is characterised in that：The frame include multiple metal layers and it is multiple respectively with it is described The prepreg bed of material that metal layer is staggered, each metal layer surround out one first opening, and at least one coarse Face, each prepreg bed of material be on one side at least within cemented adjacent metal rough surface, and the prepreg bed of material surrounds Go out the second opening of the first opening of two adjacent metals of connection.
Preferably, there are two reciprocal rough surfaces for the frame of aforementioned electronic product, wherein each metal layer tool, often The opposite sides of one prepreg bed of material are the corresponding rough surfaces of cemented two neighboring metal layer respectively.
Preferably, the frame of aforementioned electronic product, wherein each prepreg bed of material are selected from carbon fiber, poly- terephthaldehyde Made by diethyl phthalate, polyethylene, polypropylene, Ke Weila fibers, aramid fiber, glass fibre or basalt fibre.
The beneficial effect of the present invention is：The frame has had both easily due to having preimpregnation material and metal simultaneously In the good advantage of molding and structural strength, while the ground wire of the electronic building brick in the frame can be directly connected to the metal layer, Therefore it is not required in addition connect up, simplifies electronic circuit configuration.In addition, when hot-forming, the tree that is gone out by the preimpregnation material laminar flow Fat can trickle in the surface of the metal layer, since roughening treatment is passed through on the surface of the metal layer, can increase and resin The contact area of bonding, and then promote bond strength.
Description of the drawings
Fig. 1 is a flow chart, illustrates an embodiment of the manufacturing method of the frame of electronic product of the present invention；
Fig. 2 is a stereogram, illustrates a roughening step of the present embodiment；
Fig. 3 is a stereogram exploded view, illustrates a superimposition step of the present embodiment；
Fig. 4 is a stereogram, illustrates a forming step of the present embodiment；And
Fig. 5 is a sectional view, illustrates a frame obtained by the embodiment.
Specific implementation mode
The following describes the present invention in detail with reference to the accompanying drawings and embodiments.
Refering to figure Fig. 1 and Fig. 2, one embodiment of the manufacturing method of the frame 1 of electronic product of the present invention, including one thick Change step 21, a superimposition step 22 and a forming step 23.In the roughening step 21, first prepare multiple metal layers 3, Each metal layer 3 surrounds out one first opening 31.Then by sand paper or other modes to opposite the two of the metal layer 3 Face is roughened, and to make each metal layer 3 tool, there are two reciprocal rough surfaces 32.
Refering to fig. 1 and Fig. 3 prepares multiple prepreg bed of materials 4 in the superimposition step 22, each prepreg bed of material 4 encloses Lay out one second opening 41.Then by the metal layer 3 and 4 interactive stacking of the prepreg bed of material, and described first is made to open Mouth 31 is connected and corresponds with second opening 41.In the present embodiment, each prepreg bed of material 4 is to be selected from carbon fiber Dimension, polyethylene terephthalate, polyethylene, polypropylene, Ke Weila fibers, aramid fiber, glass fibre or basalt fibre It is made.
The metal layer 3 and the prepreg bed of material 4 are placed in by refering to fig. 1, Fig. 4 and Fig. 5 in the forming step 23 (not shown) in mold, and carry out hot-forming, in aforementioned process, contained resin can flow out in the prepreg bed of material 4 And trickle to the rough surface 32 of the metal layer 3 so that the metal layer 3 can pass through resin and the prepreg bed of material 4 bondings.The opening mold after hot-forming, can obtain the frame 1 of an electronic product, which includes multiple metal layers 3 And multiple prepreg bed of materials 4, and surround out an accommodating space 11 for housing electronic building brick.
The metal layer 3 can provide better structural strength, and the prepreg bed of material 4 is more easily molded and reduces difficult processing Degree, and the ground wire for the electronic building brick being set in the accommodating space 11 can be directly connected to the metal layer 3, remove other configuration from The puzzlement of circuit.In addition, the rough surface 32 and the contact area of resin are larger, therefore can increase and the prepreg bed of material 4 Binding force when bonding.
In conclusion the metal layer 3 not only has metallic luster and more beauty, and provide preferable structural strength. The prepreg bed of material 4 is more easily molded and keeps exterior design more flexible, therefore can reach the purpose of the present invention really.

Claims (6)

1. a kind of manufacturing method of the frame of electronic product, it is characterised in that：The manufacturing method include a roughening step, one Superimposition step and a forming step prepare multiple metal layers in the roughening step, each metal layer surrounds out one First opening, and respectively to the surface of the metal layer carry out roughening treatment, in the superimposition step, by the metal layer with it is more A prepreg bed of material interactive stacking, each prepreg bed of material surround out one second opening, first opening and described the Two opening be interconnected, in the forming step, by the metal layer and the prepreg bed of material it is hot-forming be a frame.
2. the manufacturing method of the frame of electronic product according to claim 1, it is characterised in that：In the roughening step, it is The opposite sides of each metal layer are roughened.
3. the manufacturing method of the frame of electronic product according to claim 1, it is characterised in that：In the superimposition step, often One prepreg bed of material is fine selected from carbon fiber, polyethylene terephthalate, polyethylene, polypropylene, Ke Weila fibers, aramid fiber Made by dimension, glass fibre or basalt fibre.
4. a kind of frame of electronic product, it is characterised in that：The frame include multiple metal layers and it is multiple respectively with the metal The prepreg bed of material that layer is staggered, each metal layer surrounds out one first opening, and has at least one rough surface, often One prepreg bed of material be on one side at least within cemented adjacent metal rough surface, and the prepreg bed of material surrounds out one It is connected to the second opening of the first opening of two adjacent metals.
5. the frame of electronic product according to claim 4, it is characterised in that：There are two opposite each other for each metal layer tool Rough surface, the opposite sides of each prepreg bed of material are the corresponding rough surfaces of cemented two neighboring metal layer respectively.
6. the frame of electronic product according to claim 4, it is characterised in that：Each prepreg bed of material is to be selected from carbon fiber Dimension, polyethylene terephthalate, polyethylene, polypropylene, Ke Weila fibers, aramid fiber, glass fibre or basalt fibre It is made.
CN201710057998.2A 2017-01-23 2017-01-23 The manufacturing method and its product of the frame of electronic product Pending CN108340653A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710057998.2A CN108340653A (en) 2017-01-23 2017-01-23 The manufacturing method and its product of the frame of electronic product

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710057998.2A CN108340653A (en) 2017-01-23 2017-01-23 The manufacturing method and its product of the frame of electronic product

Publications (1)

Publication Number Publication Date
CN108340653A true CN108340653A (en) 2018-07-31

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103037642A (en) * 2011-09-30 2013-04-10 深圳富泰宏精密工业有限公司 Shell, electronic device using the same and manufacturing method thereof
US20140198464A1 (en) * 2013-01-14 2014-07-17 Samsung Electronics Co., Ltd. Frame structure for preventing deformation, and electronic device including the same
CN104411126A (en) * 2014-11-14 2015-03-11 东莞劲胜精密组件股份有限公司 Electronic product housing and manufacturing method thereof
CN105644062A (en) * 2014-12-03 2016-06-08 比亚迪股份有限公司 Composite material and housing for mobile terminal, preparation method thereof and mobile terminal

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103037642A (en) * 2011-09-30 2013-04-10 深圳富泰宏精密工业有限公司 Shell, electronic device using the same and manufacturing method thereof
US20140198464A1 (en) * 2013-01-14 2014-07-17 Samsung Electronics Co., Ltd. Frame structure for preventing deformation, and electronic device including the same
CN104411126A (en) * 2014-11-14 2015-03-11 东莞劲胜精密组件股份有限公司 Electronic product housing and manufacturing method thereof
CN105644062A (en) * 2014-12-03 2016-06-08 比亚迪股份有限公司 Composite material and housing for mobile terminal, preparation method thereof and mobile terminal

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