CN108337856B - Heat dissipation rack and server node - Google Patents
Heat dissipation rack and server node Download PDFInfo
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- CN108337856B CN108337856B CN201711483159.3A CN201711483159A CN108337856B CN 108337856 B CN108337856 B CN 108337856B CN 201711483159 A CN201711483159 A CN 201711483159A CN 108337856 B CN108337856 B CN 108337856B
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- inclined plane
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 49
- 238000012545 processing Methods 0.000 claims abstract description 14
- 230000007246 mechanism Effects 0.000 claims description 22
- 230000006835 compression Effects 0.000 claims description 15
- 238000007906 compression Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 6
- 230000005540 biological transmission Effects 0.000 abstract description 4
- 238000001816 cooling Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000000110 cooling liquid Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010622 cold drawing Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a heat dissipation cabinet and a server node, which can improve the heat dissipation effect. The cooling system comprises a cabinet body, a plurality of server nodes and a plurality of cold plates, wherein the server nodes are arranged in the cabinet body; the side face, attached to the cold plate, of the server node is of a first inclined plane structure, the side face, attached to the cold plate, of the cold plate is of a second inclined plane structure, and the first inclined plane structure and the second inclined plane structure are arranged in parallel. Because the first side of the radiator is attached to the service chip, and the second side of the radiator is connected with the cold plate, the radiator can conduct heat generated in the service chip processing service process to the cold plate, and the heat is directly radiated by the radiator, so that the heat is reduced from the service chip to a radiating transmission path between the cold plates, and the radiating efficiency of the service chip is effectively improved.
Description
Technical Field
The invention relates to the technical field of communication, in particular to a heat dissipation cabinet and a server node.
Background
In recent years, with the continuous development of internet technology, the integration level of electronic devices is required to be higher, and more highly integrated chips with large power consumption are applied to server nodes. In order to solve the problem of heating points in the server nodes, the server nodes and the cold plate can be attached together in a hard contact mode to transfer heat, and the attaching mode determines the heat transfer capacity, so that the method is a key technology of the scheme.
As shown in fig. 1, the industry solution is to attach the sides of the server node 101 to a cold plate. Specifically, a heat sink substrate 102 is added on a server node 101, the heat sink substrate 102 is connected with a copper plate 104 on the side surface through a heat pipe 103, and the copper plate 104 is closely attached to a cold plate 105 on a machine frame to take away heat.
The main problems in the prior art are as follows: the heat transfer path from the server node 101 to the cold plate 105 of the frame is too long, up to about 100mm, increasing the thermal resistance. The contact area between the copper plate 104 of the server node 101 and the cold plate 105 of the machine frame is limited by height, and cannot be large, so that the contact thermal resistance is large, and the maximum supporting heat dissipation power is limited. And the dissipated heat is drawn away through a plurality of heat pipes, so that the cost is higher.
Disclosure of Invention
The invention provides a heat dissipation cabinet and a server node, which can improve the heat dissipation effect.
A first aspect of an embodiment of the present invention provides a heat dissipation cabinet, including a cabinet body, a plurality of server nodes installed inside the cabinet body, and a plurality of cold plates for dissipating heat of the server nodes; the server node comprises a service single board, wherein a service chip and a radiator for processing services are fixedly arranged on the service single board, a first side surface of the radiator is attached to the service chip, a second side surface of the radiator is attached to the cold plate, and the radiator is used for conducting heat generated by the service chip to the cold plate; the side face, attached to the cold plate, of the server node is of a first inclined plane structure, the side face, attached to the cold plate, of the cold plate is of a second inclined plane structure, and the first inclined plane structure and the second inclined plane structure are arranged in parallel.
Wherein the service chip generates a large amount of heat when processing services. In order to dissipate heat generated by the service chip when processing services, a cooling channel through which a cooling liquid flows is disposed inside the cold plate shown in this embodiment. Because the side surface of the server node is attached to the cold plate, the heat generated by the service chip is transferred to the cold plate, and the heat is cooled and dissipated by the cooling liquid in the cold plate.
The heat sink shown in this embodiment may be a heat pipe, or may be a heat conducting material such as a heat conducting metal block, so as to ensure heat transfer. The server node and the cold plate are detachable structures, that is, the server node and the cold plate are not integrally formed, and the server node and the cold plate are not directly fixed together. It can be seen that the cold plate shown in this embodiment need not be plugged together with the server node, reaches the effect of separating the server node and the cold plate, can avoid the risk of liquid leakage, reduces the potential safety hazard of the heat dissipation cabinet. And the heat dissipation rack of design like this can reduce the wiring on the server node.
Because the first side surface of the heat radiator shown in this embodiment is attached to the service chip, and the second side surface of the heat radiator is connected to the cold plate, the heat radiator can conduct heat generated in the service chip processing service process to the cold plate, and direct heat radiation is performed through the heat radiator, so that a heat radiation transmission path from the service chip to the cold plate is reduced, and the efficiency of heat radiation of the service chip is effectively improved; by adopting the structure shown in the embodiment, the contact area between the server node and the cold plates can be effectively improved, the heat dissipation effect of the server node is effectively improved by the cold plates, and the heat dissipation cabinet shown in the embodiment does not need to adopt a remote heat pipe, so that the cost of the heat dissipation cabinet is reduced.
In an optional implementation manner of the first aspect of the embodiment of the present invention, based on the first aspect of the embodiment of the present invention, the server node and the cold plate are wedge-shaped.
The server node shown in this embodiment may have a wedge-shaped structure, so that the first inclined plane structure is formed on the side surface of the server node, and the cold plate may have a wedge-shaped structure, so that the second inclined plane structure is formed on the side surface of the cold plate.
In this embodiment, the first preset angle and the second preset angle are matched, so that the first inclined plane structure and the second inclined plane structure are arranged in parallel, and the server node can be tightly attached to the cold plate.
Based on the first aspect of the embodiment of the present invention, in an optional implementation manner of the first aspect of the embodiment of the present invention, the first inclined plane-shaped structure is formed on a side surface of the heat sink, and the heat sink is in a wedge-shaped structure.
Because the first inclined plane shape structure of radiator with the second inclined plane shape of cold plate is laminated mutually, effectual promotion the cold drawing is to the radiating efficiency of server node.
Based on the first aspect of the embodiments of the present invention, in an optional implementation manner of the first aspect of the embodiments of the present invention, wrench mechanisms are respectively disposed at two end portions of the server node, and are configured to apply an acting force to the server node, where the acting force is decomposed into a first acting force and a second acting force on the first inclined plane-shaped structure, where the first acting force is perpendicular to a pressing and matching surface, the pressing and matching surface is formed between the first inclined plane-shaped structure and the second inclined plane-shaped structure, and the second acting force is configured to overcome a friction force between the first inclined plane-shaped structure and the second inclined plane-shaped structure.
The first acting force F1 is perpendicular to the pressing matching surface, and the pressing matching surface is formed between the first inclined plane structure and the second inclined plane structure. The first acting force F1 is used to press the server node against the side of the cold plate so that the heat sink can be in close contact with the cold plate, so that the cold plate can dissipate heat from the heat sink, and the heat of the heat sink can be conducted from the heat sink to the cold plate. The second force F2 is used to overcome the friction between the first and second ramp-shaped structures, and the server node can be mounted inside the cabinet body by the second force F2. In this embodiment, if the acting force F is too large, the cold plate may be crushed, but if the acting force F is too small, the radiator and the cold plate may be in poor contact, so that the heat dissipation efficiency of the cold plate for dissipating heat of the radiator is reduced.
Based on the first aspect of the embodiment of the present invention, in an optional implementation manner of the first aspect of the embodiment of the present invention, the wrench mechanism further includes a compression spring, and the compression spring in a compressed state is used for controlling the acting force within a preset range.
Based on the first aspect of the embodiments of the present invention, in an optional implementation manner of the first aspect of the embodiments of the present invention, the wrench mechanism includes a wrench, a rotating shaft of the wrench is connected to an end of the server node, so that the wrench is rotatably installed at the end of the server node through the rotating shaft, a buckle is formed at the end of the wrench, and an accommodating groove is formed at a position of the cabinet body opposite to the buckle position, so that when the wrench rotates through the rotating shaft, the buckle can be buckled inside the accommodating groove or the buckle can be disengaged from the inside of the accommodating groove.
Based on the first aspect of the embodiment of the present invention, in an optional implementation manner of the first aspect of the embodiment of the present invention, the server node is provided with a sliding groove, and the rotating shaft can slide along the guiding direction of the sliding groove.
Based on the first aspect of the embodiment of the present invention, in an optional implementation manner of the first aspect of the embodiment of the present invention, a first end of the pressure spring is fixed inside the server node, and a second end of the pressure spring is connected to the rotating shaft.
A second aspect of the embodiments of the present invention provides a server node, which is disposed inside a heat dissipation cabinet, where the server node includes a service single board, a service chip and a heat sink for processing a service are fixedly disposed on the service single board, a first side surface of the heat sink is attached to the service chip, a second side surface of the heat sink is attached to the cold plate, and the heat sink is configured to conduct heat generated by the service chip to the cold plate; the side face, attached to the cold plate, of the server node is of a first inclined plane structure, the side face, attached to the cold plate, of the cold plate is of a second inclined plane structure, and the first inclined plane structure and the second inclined plane structure are arranged in parallel.
Based on the second aspect of the embodiment of the present invention, in an optional implementation manner of the second aspect of the embodiment of the present invention, the server node is in a wedge structure.
Based on the second aspect of the embodiment of the present invention, in an optional implementation manner of the second aspect of the embodiment of the present invention, the first inclined plane-shaped structure is formed on a side surface of the heat sink, and the heat sink is in a wedge-shaped structure.
Based on the second aspect of the embodiment of the present invention, in an optional implementation manner of the second aspect of the embodiment of the present invention, two end portions of the server node are respectively provided with a wrench mechanism, the wrench mechanism is configured to apply an acting force to the server node, the acting force is decomposed into a first acting force and a second acting force on the first inclined plane-shaped structure, where the first acting force is perpendicular to a pressing and matching surface, the pressing and matching surface is formed between the first inclined plane-shaped structure and the second inclined plane-shaped structure, and the second acting force is configured to overcome a friction force between the first inclined plane-shaped structure and the second inclined plane-shaped structure.
Based on the second aspect of the embodiment of the present invention, in an optional implementation manner of the second aspect of the embodiment of the present invention, the wrench mechanism further includes a compression spring, and the compression spring in a compressed state is used for controlling the acting force within a preset range.
Based on the second aspect of the embodiment of the present invention, in an optional implementation manner of the second aspect of the embodiment of the present invention, the wrench mechanism includes a wrench, a rotating shaft of the wrench is connected to an end of the server node, so that the wrench is rotatably installed at the end of the server node through the rotating shaft, a buckle is formed at the end of the wrench, and an accommodating groove is disposed at a position of the heat dissipation cabinet opposite to the buckle, so that when the wrench rotates through the rotating shaft, the buckle can be buckled inside the accommodating groove or the buckle can be separated from the inside of the accommodating groove.
Based on the second aspect of the embodiment of the present invention, in an optional implementation manner of the second aspect of the embodiment of the present invention, the server node is provided with a sliding groove, and the rotating shaft can slide along a guide of the sliding groove.
Based on the second aspect of the embodiment of the present invention, in an optional implementation manner of the second aspect of the embodiment of the present invention, a first end of the pressure spring is fixed inside the server node, and a second end of the pressure spring is connected to the rotating shaft.
The invention provides a heat dissipation cabinet and a server node, which can improve the heat dissipation effect. The heat dissipation cabinet comprises a cabinet body, a plurality of server nodes and a plurality of cold plates, wherein the server nodes are installed inside the cabinet body; the side face, attached to the cold plate, of the server node is of a first inclined plane structure, the side face, attached to the cold plate, of the cold plate is of a second inclined plane structure, and the first inclined plane structure and the second inclined plane structure are arranged in parallel. Because the first side of the radiator is attached to the service chip, and the second side of the radiator is connected with the cold plate, the radiator can conduct heat generated in the service chip processing service process to the cold plate, and the heat is directly radiated by the radiator, so that the heat is reduced from the service chip to a radiating transmission path between the cold plates, and the radiating efficiency of the service chip is effectively improved.
Drawings
Fig. 1 is a diagram illustrating a structure of a heat dissipation cabinet provided in the prior art;
fig. 2 is a schematic view of an overall structure of an embodiment of a heat dissipation cabinet provided in the present invention;
fig. 3 is a schematic partial structure diagram of an embodiment of a heat dissipation cabinet provided in the present invention;
fig. 4 is a schematic cross-sectional structure view of an embodiment of a heat dissipation cabinet provided in the present invention;
fig. 5 is a schematic cross-sectional view of another embodiment of a heat dissipation cabinet provided in the present invention;
fig. 6 is a schematic structural diagram of another embodiment of a heat dissipation cabinet provided in the present invention;
FIG. 7 is an exploded view of the force provided by the present invention;
fig. 8 is a schematic partial structure diagram of an embodiment of a heat dissipation cabinet provided in the present invention;
fig. 9 is a partial structural schematic view of another embodiment of a heat dissipation cabinet provided in the present invention.
Detailed Description
First, the overall structure of the heat dissipation cabinet shown in this embodiment is described as follows:
referring to fig. 2 and 3, the present embodiment provides a heat dissipation cabinet, which includes a cabinet body 200, a plurality of server nodes 201 installed in the cabinet body 200, and a plurality of cold plates 202 installed in the cabinet body 200.
Specifically, the cabinet body 200 shown in this embodiment is used to support and fix the server node 201 and the cold plate 202.
More specifically, the cold plate 202 of the present embodiment is used to dissipate heat dissipated by the server node 201.
As further shown in fig. 3, the server node 201 shown in this embodiment includes: the service chip is used for carrying out service processing, and the service chip can generate a large amount of heat when processing services.
In order to dissipate heat generated by the service chip during service processing, a cooling channel through which a cooling fluid flows is disposed inside the cold plate 202 shown in this embodiment.
Because the side surface of the server node 201 is attached to the cold plate 202, the heat generated by the service chip is transferred to the cold plate 202, and is cooled and dissipated by the cooling liquid in the cold plate 202.
In order to achieve the purpose of transferring the heat generated by the service chip to the cold plate 202, as shown in fig. 4, a service single board 400 may be further disposed inside the server node 201 shown in this embodiment, where the service single board 400 is fixedly disposed with the service chip 402, and a heat sink 401 is disposed in contact with the service chip 402.
Specifically, the first side surface of the heat sink 401 is attached to the service chip 402, and the second side surface of the heat sink 401 is connected to the cold plate 202, so that the heat sink 401 is configured to conduct heat generated in a process of processing services by the service chip 402 to the cold plate 202, so that the cold plate 202 dissipates heat of the service chip 402, and the efficiency of conducting heat from the service chip 402 to the cold plate 202 is improved.
Optionally, the heat sink 401 shown in this embodiment may be a heat pipe, or may also be a heat conducting material such as a heat conducting metal block, so as to ensure heat transfer.
The server node 201 and the cold plate 202 shown in this embodiment are detachable structures, that is, the server node 201 and the cold plate 202 shown in this embodiment are not integrally formed, so that the server node 201 and the cold plate 202 are not directly fixed together, and when the server node 201 is installed, the server node 201 only needs to be inserted into the cabinet body 200, so that the side surface of the server node 201 is attached to the cold plate 202, and further, the heat sink 401 included in the server node 201 is attached to the cold plate 202.
It can be seen that the cold plate 202 shown in this embodiment does not need to be plugged together with the server node 201, so that the server node 201 and the cold plate 202 are separated, the risk of liquid leakage can be avoided, and the potential safety hazard of the heat dissipation cabinet is reduced. And the heat dissipation rack of design like this can reduce the wiring on the server node.
Optionally, the cold plate 202 of the present embodiment may be removably mounted within the cabinet body 200 to facilitate maintenance.
In this embodiment, as shown in fig. 4, the side surface of the server node 201 attached to the cold plate 202 is a first inclined plane structure, and specifically, the side surface of the server node 201 attached to the cold plate 202 and the vertical direction of the heat dissipation cabinet form a first preset angle, so that the side surface of the server node 201 attached to the cold plate 202 is the first inclined plane structure.
In this embodiment, the size of the first preset angle is not limited, and the embodiment takes the structure that the first preset angle is an acute angle as an example for illustration.
The cold plate 202 with the side that the server node 201 was laminated is second inclined plane shape structure, and is specific, cold plate 202 with the side that the server node 201 was laminated with the vertical direction of heat dissipation rack is the second and predetermines the angle, so that cold plate 202 with the side that the server node 201 was laminated is second inclined plane shape structure.
In this embodiment, the size of the second preset angle is not limited, and the second preset angle is taken as an obtuse angle structure for an exemplary explanation.
Specifically, in this embodiment, the first preset angle and the second preset angle are matched, so that the first inclined plane structure and the second inclined plane structure are arranged in parallel, and the server node 201 can be attached to the cold plate 202.
Optionally, the server node 201 shown in this embodiment may have a wedge-shaped structure, so that the first inclined plane structure is formed on a side surface of the server node 201, and the cold plate 202 may have a wedge-shaped structure, so that the second inclined plane structure is formed on a side surface of the cold plate 202.
If the heat dissipation efficiency of the cold plate 202 to the server node 201 is improved, the heat sink 401 shown in this embodiment is in a wedge-shaped structure, so that the first inclined plane-shaped structure is formed on the side surface of the heat sink 401.
As shown in fig. 5 and 6, in order to mount the server node 201 inside the cabinet body 200, wrench mechanisms 601 are respectively provided at two end portions of a side surface of the server node 201.
The wrench mechanism 601 is used for applying a force F to the server node 201, and the force F is shown in fig. 7. The force F is resolved into a first force F1 and a second force F2 on the first ramp shaped structure.
The first acting force F1 is perpendicular to the press fit surface 600, and as shown in fig. 4, the press fit surface 600 is formed between the first inclined plane structure and the second inclined plane structure. The first force F1 is used to press the server node 201 against the side of the cold plate 202 to enable the heat sink 401 to closely fit the cold plate 202, so that the cold plate 202 can dissipate heat from the heat sink 401, and the heat of the heat sink 401 is conducted from the heat sink 401 to the cold plate 202.
The second force F2 is used to overcome the friction between the first and second ramp-shaped structures, and the server node 201 can be installed inside the cabinet body 200 by the second force F2.
In this embodiment, if the acting force F is too large, the cold plate 202 may be crushed, but if the acting force F is too small, the heat sink 401 and the cold plate 202 may be in poor contact, so as to reduce the heat dissipation efficiency of the cold plate 202 for dissipating the heat of the heat sink 401, where the wrench mechanism 601 shown in this embodiment can control the acting force F within a target preset range, so that the acting force F within the target preset range can enable the heat sink 401 and the cold plate 202 to be in close contact, and the server node 201 can be successfully installed inside the cabinet body 200.
In order to control the acting force F within the target preset range by the wrench mechanism 601 shown in the present embodiment, refer to fig. 8 and 9:
the wrench mechanism 601 includes a wrench 801, and a rotating shaft 802 of the wrench 801 is connected to an end of the server node 201, so that the wrench 801 is rotatably mounted on the end of the server node 201 through the rotating shaft 802.
Specifically, a buckle 803 is formed at an end of the wrench 801, and a receiving groove 804 is formed at a position of the cabinet body 200 opposite to the buckle 803.
When the wrench 801 receives a rotational force input by a user, and the wrench 801 can rotate through the rotation shaft 802, the latch 803 can be latched inside the receiving groove 804 or the latch 803 can be disengaged from the receiving groove 804.
In this embodiment, as shown in fig. 8, a structural diagram of the wrench structure 601 in an initial state is shown, and when the wrench structure 601 is in the initial state, the buckle 803 is buckled inside the receiving groove 804.
When the server node 201 needs to be installed inside the cabinet body 200, as shown in fig. 9, the wrench 801 may be rotated to disengage the buckle 803 from the inside of the receiving groove 804, so that a user may apply a force F to the server node 201 through the wrench 801.
In this embodiment, in order to control the acting force F within a target preset range, the wrench mechanism 601 further includes a compression spring 805, and the compression spring 805 in a compressed state is used to control the acting force F within a preset range.
Specifically, a first end of the compressed spring 805 is fixed inside the server node 201, and a second end of the compressed spring 805 is connected to the rotating shaft 802.
Specifically, the server node 201 is provided with a sliding slot 806, and the rotating shaft 802 can slide along the guiding direction of the sliding slot 806.
In a specific application process, in the process of applying an acting force to the wrench 801, the rotating shaft 802 may slide along the guide of the sliding slot 806, and in the process of sliding the rotating shaft 802, the pressure spring 805 applies a pressure to the rotating shaft 802 in a direction opposite to the direction of the acting force F, so that the sliding stroke of the rotating shaft 802 through the sliding slot 806 is controlled, and the pressure of the pressure spring 805 can control the acting force F within the target preset range, so that the acting force F within the target preset range can enable the heat sink 401 to be in close contact with the cold plate 202, and the server node 201 can be successfully installed inside the cabinet body 200.
The following explains the beneficial effects of the heat dissipation cabinet shown in this embodiment: because the first side surface of the heat spreader 401 shown in this embodiment is attached to the service chip 402, and the second side surface of the heat spreader 401 is connected to the cold plate 202, the heat spreader 401 can conduct heat generated in the process of processing services by the service chip 402 to the cold plate 202, and direct heat dissipation is performed through the heat spreader 401, so that a heat dissipation transmission path from the service chip 402 to the cold plate 202 is reduced, and the efficiency of heat dissipation of the service chip 402 is effectively improved;
by adopting the structure shown in the embodiment, the contact area between the server node 201 and the cold plate 202 can be effectively improved, the heat dissipation effect of the cold plate 202 on the server node 201 is effectively improved, and the heat dissipation cabinet shown in the embodiment does not need to adopt a remote heat pipe, so that the cost of the heat dissipation cabinet is reduced.
In addition, in this embodiment, the server node 201 may be installed inside the heat dissipation cabinet 200 or the server node 201 may be taken out from the heat dissipation cabinet 200 through a wrench mechanism, and a pressure spring is provided inside the wrench mechanism shown in this embodiment, so that an acting force exerted on the server node 201 by the wrench mechanism can be controlled within the target preset range through pre-compression of the pressure spring, so that the acting force F within the target preset range can make the heat sink 401 and the cold plate 202 tightly contact, and the server node 201 can be successfully installed inside the cabinet body 200.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (12)
1. A heat dissipation cabinet is characterized by comprising a cabinet body, a plurality of server nodes and a plurality of cold plates, wherein the server nodes are installed inside the cabinet body;
the server node comprises a service single board, wherein a service chip and a radiator for processing services are fixedly arranged on the service single board, a first side surface of the radiator is attached to the service chip, a second side surface of the radiator is attached to the cold plate, and the radiator is used for conducting heat generated by the service chip to the cold plate; the side surface of the server node, which is jointed with the cold plate, is of a first inclined plane structure, the side surface of the cold plate, which is jointed with the server node, is of a second inclined plane structure, and the first inclined plane structure and the second inclined plane structure are arranged in parallel;
the first inclined plane-shaped structure is formed on the side face of the radiator, and the radiator is of a wedge-shaped structure;
wrench mechanisms are respectively arranged at two end parts of the server node and used for applying acting force to the server node, the acting force is decomposed into a first acting force and a second acting force on the first inclined plane-shaped structure, the first acting force is perpendicular to a pressing matching surface, the pressing matching surface is formed between the first inclined plane-shaped structure and the second inclined plane-shaped structure, and the second acting force is used for overcoming the friction force between the first inclined plane-shaped structure and the second inclined plane-shaped structure.
2. The heat dissipating cabinet of claim 1, wherein the server node and the cold plate are wedge shaped.
3. The heat dissipating cabinet of claim 2, wherein the wrench mechanism further comprises a compression spring, the compression spring in a compressed state being configured to control the force within a predetermined range.
4. The heat dissipating cabinet of claim 2 or 3, wherein the wrench mechanism comprises a wrench, a rotating shaft of the wrench is connected to an end of the server node, so that the wrench can be rotatably mounted to the end of the server node through the rotating shaft, a buckle is formed at the end of the wrench, and a receiving groove is formed in the cabinet body opposite to the buckle, so that when the wrench rotates through the rotating shaft, the buckle can be buckled inside the receiving groove or the buckle can be separated from the receiving groove.
5. The heat dissipation cabinet of claim 4, wherein the server node is provided with a sliding slot, and the rotating shaft can slide along the guiding direction of the sliding slot.
6. The heat dissipating cabinet of claim 5, wherein a first end of the compression spring is fixed inside the server node and a second end of the compression spring is connected to the rotating shaft.
7. A server node is arranged in a heat dissipation cabinet and is characterized by comprising a service single board, wherein a service chip and a radiator for processing services are fixedly arranged on the service single board, a first side surface of the radiator is attached to the service chip, a second side surface of the radiator is attached to a cold plate, and the radiator is used for conducting heat generated by the service chip to the cold plate; the side surface of the server node, which is jointed with the cold plate, is of a first inclined plane structure, the side surface of the cold plate, which is jointed with the server node, is of a second inclined plane structure, and the first inclined plane structure and the second inclined plane structure are arranged in parallel;
the first inclined plane-shaped structure is formed on the side face of the radiator, and the radiator is of a wedge-shaped structure;
wrench mechanisms are respectively arranged at two end parts of the server node and used for applying acting force to the server node, the acting force is decomposed into a first acting force and a second acting force on the first inclined plane-shaped structure, the first acting force is perpendicular to a pressing matching surface, the pressing matching surface is formed between the first inclined plane-shaped structure and the second inclined plane-shaped structure, and the second acting force is used for overcoming the friction force between the first inclined plane-shaped structure and the second inclined plane-shaped structure.
8. The server node of claim 7, wherein the server node is wedge-shaped.
9. The server node of claim 8, wherein the wrench mechanism further comprises a compression spring, the compression spring in a compressed state being configured to control the force within a predetermined range.
10. The server node according to claim 9, wherein the wrench mechanism includes a wrench, a rotating shaft of the wrench is connected to an end of the server node, so that the wrench is rotatably mounted to the end of the server node through the rotating shaft, a buckle is formed at the end of the wrench, and a receiving groove is formed at a position of the heat dissipation cabinet opposite to the buckle, so that when the wrench rotates through the rotating shaft, the buckle can be buckled inside the receiving groove or the buckle can be separated from the receiving groove.
11. The server node according to claim 10, wherein the server node is provided with a sliding slot, and the rotating shaft is slidable along a guide of the sliding slot.
12. The server node of claim 10 or 11, wherein a first end of the compression spring is fixed inside the server node, and a second end of the compression spring is connected with the rotating shaft.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711483159.3A CN108337856B (en) | 2017-12-29 | 2017-12-29 | Heat dissipation rack and server node |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711483159.3A CN108337856B (en) | 2017-12-29 | 2017-12-29 | Heat dissipation rack and server node |
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| CN108337856A CN108337856A (en) | 2018-07-27 |
| CN108337856B true CN108337856B (en) | 2020-01-03 |
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| CN201711483159.3A Active CN108337856B (en) | 2017-12-29 | 2017-12-29 | Heat dissipation rack and server node |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104812217A (en) * | 2015-04-17 | 2015-07-29 | 华为技术有限公司 | Cabinet and cooling system |
| CN205755216U (en) * | 2016-05-06 | 2016-11-30 | 中兴通讯股份有限公司 | A kind of liquid-cooling heat radiation rack |
-
2017
- 2017-12-29 CN CN201711483159.3A patent/CN108337856B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104812217A (en) * | 2015-04-17 | 2015-07-29 | 华为技术有限公司 | Cabinet and cooling system |
| CN205755216U (en) * | 2016-05-06 | 2016-11-30 | 中兴通讯股份有限公司 | A kind of liquid-cooling heat radiation rack |
Also Published As
| Publication number | Publication date |
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| CN108337856A (en) | 2018-07-27 |
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