CN108337616A - The noise suppression method of MEMS acoustic sensors - Google Patents
The noise suppression method of MEMS acoustic sensors Download PDFInfo
- Publication number
- CN108337616A CN108337616A CN201711432431.5A CN201711432431A CN108337616A CN 108337616 A CN108337616 A CN 108337616A CN 201711432431 A CN201711432431 A CN 201711432431A CN 108337616 A CN108337616 A CN 108337616A
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- mems
- acoustic
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- acoustic sensors
- noise suppression
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Micromachines (AREA)
- Soundproofing, Sound Blocking, And Sound Damping (AREA)
- Gyroscopes (AREA)
Abstract
The present invention provides a kind of noise suppression method of MEMS acoustic sensors, including：Acoustic MEMS chip is powered on；By the induction mouth being arranged in the encapsulating structure of MEMS acoustic sensors, whether detection acoustic MEMS chip is in running order；When incude mouth detect that acoustic MEMS chip be in off working state when, be arranged the second asic chip heating power module be intermittent work pattern；When induction mouth detects that acoustic MEMS chip is in running order, heating power module is converted to duration operating mode by intermittent work pattern.Using the present invention, it can solve the problems, such as that MEMS acoustic noises increase caused by the intermittent fever of chip when existing MEMS acoustic sensors work.
Description
Technical field
The present invention relates to MEMS technology fields, more specifically, are related to a kind of noise suppression side of MEMS acoustic sensors
Method.
Background technology
MEMS (Micro electro mechanical Systems, MEMS) is a kind of micromachined skill
The electroacoustic transducer that art is made has the characteristics that small, good frequency response, noise are low.It is small with electronic equipment
Skilfulization, slimming development, MEMS microphone are applied to more and more widely in these equipment.
In current MEMS acoustic sensors, MEMS acoustic sensors include the digit chips such as MEMS chip, asic chip,
When digit chip intermittent work (periodic wakeup), it is periodically small that intermittent fever easily causes ambient gas
Barometric fluctuation is picked up by acoustic MEMS, causes raising of originally making an uproar.
To solve the above problems, the present invention provides a kind of noise suppression method of MEMS acoustic sensors.
Invention content
In view of the above problems, the object of the present invention is to provide a kind of noise suppression methods of MEMS acoustic sensors, with solution
The problem of certainly noise increases caused by the intermittent fever of chip when acoustic MEMS chip operation.
The present invention provides a kind of noise suppression method of MEMS acoustic sensors, including：
Acoustic MEMS chip is powered on；
By the induction mouth being arranged in the encapsulating structure of MEMS acoustic sensors, whether detection acoustic MEMS chip is in
Working condition；Wherein,
When induction mouth detects that acoustic MEMS chip is in off working state, the fever work(in the second asic chip is set
Rate module is intermittent work pattern；
When induction mouth detects that acoustic MEMS chip is in running order, heating power module is by intermittent work pattern
Be converted to duration operating mode.
Furthermore it is preferred that scheme be that encapsulating structure is formed by shell and pcb board, wherein acoustic MEMS chip, second
Asic chip is arranged inside encapsulating structure, also, the first asic chip and the 2nd MEMS are additionally provided with inside encapsulating structure
Chip.
Furthermore it is preferred that scheme be, induction mouth be arranged between the first asic chip and the second asic chip.
Furthermore it is preferred that scheme be to be provided with to make acoustic MEMS chip and the external acoustic aperture being connected on pcb board.
Furthermore it is preferred that scheme be, the first asic chip by metal wire respectively with acoustic MEMS chip, the 2nd ASIC cores
Piece, pcb board electrical connection.
Furthermore it is preferred that scheme be acoustic MEMS chip, the second MEMS chip, the first asic chip and the 2nd ASIC
Chip is fixed on by bonding die glue on pcb board.
From technical solution above it is found that the suppressing method of MEMS acoustic sensors noise provided by the invention, passes through sense
The working condition for answering mouth detection acoustic MEMS chip, if acoustic MEMS chip is in running order, the second asic chip, which enters, makes an uproar
Sound suppression mode, this measure effectively inhibit the generation of acoustic noise, promote acoustic sensor stability；This merotype simultaneously
Suppression mode can also reduce unnecessary power attenuation.
To the accomplishment of the foregoing and related purposes, one or more aspects of the present invention includes the spy being particularly described below
Sign.Certain illustrative aspects of the invention is described in detail in the following description and the annexed drawings.However, these aspect instructions are only
It is that some of the various ways in the principles of the present invention can be used.In addition, the present invention is intended to include all such aspects with
And their equivalent.
Description of the drawings
By reference to the explanation below in conjunction with attached drawing, and with a fuller understanding of the present invention, of the invention is other
Purpose and result will be more clearly understood and understood.In the accompanying drawings：
Fig. 1 is the suppressing method flow diagram according to the MEMS acoustic sensor noises of the embodiment of the present invention；
Fig. 2 is the MEMS acoustic sensor structural schematic diagrams according to the embodiment of the present invention.
Reference numeral therein includes：1, shell, 2, pcb board, 3, acoustic MEMS chip, 4, metal wire, the 5, the first ASIC
Chip, 6, induction mouth, the 7, second asic chip, 8, heating power module, the 9, second MEMS chip, 10, acoustic aperture.
Identical label indicates similar or corresponding feature or function in all the appended drawings.
Specific implementation mode
In the following description, for purposes of illustration, it in order to provide the comprehensive understanding to one or more embodiments, explains
Many details are stated.It may be evident, however, that these embodiments can also be realized without these specific details.
For aforementioned proposition existing MEMS acoustic sensors work when caused by the intermittent fever of chip
The problem of noise increases, the present invention provides a kind of noise suppression methods of MEMS acoustic sensors, pass through different pattern controls
System inhibits the generation of noise, promotes the stability of MEMS acoustic sensors.
Hereinafter, specific embodiments of the present invention will be described in detail with reference to the accompanying drawings.
In order to illustrate the noise suppression method of MEMS acoustic sensors provided by the invention, Fig. 1 is shown according to the present invention
The noise suppression method flow of the MEMS acoustic sensors of embodiment.
As shown in Figure 1, the noise suppression method of MEMS acoustic sensors provided by the invention, including：
S110：Acoustic MEMS chip is powered on；
S120：By the induction mouth being arranged in the encapsulating structure of MEMS acoustic sensors, detection acoustic MEMS chip is
It is no in running order；Wherein, if being in off working state, S130 is entered step；If in running order, enter step
S140；
S130：When induction mouth detects that the acoustic MEMS chip is in off working state, it is arranged in the 2nd ASIC cores
The heating power module of piece is intermittent work pattern；
S140：When incude mouth detect that the acoustic MEMS chip is in running order when, the heating power module by
Intermittent work pattern is converted to duration operating mode；
After step, cycle detection acoustic MEMS chip state in which, i.e.,：
S150：Whether the induction mouth being arranged in the encapsulating structure of MEMS acoustic sensors, detection acoustic MEMS chip are located
In working condition；Wherein,
If being in off working state, return to step S130；If in running order, return to step S140.
The specific method of the above-mentioned noise suppression for MEMS acoustic sensors provided by the invention, wherein need to illustrate
Step S130, be arranged the second asic chip heating power module be intermittent work pattern, i.e.,：MEMS acoustics sensors
Device is into normal mode；Step S140, the heating power module of the second asic chip is converted to by intermittent work pattern holds
Continuous sex work pattern, i.e.,：MEMS acoustic sensors are to enter to inhibit noise pattern.
In step S140, the heating power module of the second asic chip is that intermittent work pattern is converted to duration work
Operation mode is in order to avoid causing the small barometric fluctuation of ambient gas.This measure effectively inhibits the generation of noise, is promoted
The stability of MEMS acoustic sensors.
In the present invention, it uses normal mode and inhibits two kinds of operating modes of pattern of noise, this merotype control
The operating mode of mode not only can effectively inhibit the generation of acoustic noise, can also reduce unnecessary power attenuation.
In order to further illustrate the structure of MEMS acoustic sensors, Fig. 2 is to be passed according to the MEMS acoustics of the embodiment of the present invention
Sensor structure.
As shown in Fig. 2, MEMS acoustic sensors include the encapsulating structure formed by shell 1 and pcb board 2, wherein acoustics
MEMS chip 3, the second asic chip 7 are arranged inside encapsulating structure, also, are additionally provided with the first ASIC inside encapsulating structure
Chip 5 and the second MEMS chip 9.
In present invention embodiment shown in Fig. 2, acoustic MEMS chip 3, the second MEMS chip 9, the first asic chip 5 with
And second asic chip 7 be fixed on pcb board 2.
Wherein, induction mouth 6 is arranged between the first asic chip 5 and the second asic chip 6.Induction mouth 6 is for detecting
In MEMS acoustic sensors acoustic MEMS chip whether working condition.
Wherein, it is provided with heating power module 8 on the second asic chip 7, when acoustic MEMS chip 3 works, second
The heating power module 8 of asic chip is that intermittent work pattern is converted to duration operating mode, is in order to avoid causing week
The small barometric fluctuation for enclosing gas, to inhibit acoustic noise.
Wherein, the acoustic aperture 10 for making acoustic MEMS chip 3 be connected to outside is provided on pcb board 2.
In an embodiment of the present invention, the first asic chip 5 by metal wire 4 respectively with 3, the acoustic MEMS core,
Two asic chips 7, pcb board 2 are electrically connected；Meanwhile acoustic MEMS chip 3, the second MEMS chip 9, the first asic chip 5 and
Two asic chips 7 are fixed on by bonding die glue on pcb board 2.
By the above embodiment as can be seen that the suppressing method of MEMS acoustic sensors noise provided by the invention, leads to
Cross induction mouth detection acoustic MEMS chip working condition, if acoustic MEMS chip is in running order, the second asic chip into
Enter noise suppression pattern, this measure effectively inhibits the generation of noise, promotes acoustic sensor stability；This merotype simultaneously
Suppression mode can also reduce unnecessary power attenuation.
Describe the suppression according to MEMS acoustic sensors noise proposed by the present invention in an illustrative manner above with reference to attached drawing
Method processed.It will be understood by those skilled in the art, however, that the MEMS acoustic sensor noises proposed for aforementioned present invention
Suppressing method can also make various improvement on the basis of not departing from the content of present invention.Therefore, protection scope of the present invention is answered
It is determined when by the content of appended claims.
Claims (6)
1. a kind of noise suppression method of MEMS acoustic sensors, including：
MEMS acoustic sensors power on acoustic MEMS chip；
By the way that the induction mouth in the encapsulating structure of the MEMS acoustic sensors is arranged, whether the acoustic MEMS chip is detected
It is in running order；Wherein,
When the induction mouth detects that the acoustic MEMS chip is in off working state, the hair in the second asic chip is set
Thermal power module is intermittent work pattern；
When the induction mouth detects that the acoustic MEMS chip is in running order, the heating power module is by intermittence
Working mode change is duration operating mode.
2. the noise suppression method of MEMS acoustic sensors as described in claim 1, wherein
The encapsulating structure is formed by shell and pcb board, wherein the acoustic MEMS chip, second asic chip setting
Inside the encapsulating structure, also, first asic chip and the 2nd MEMS are additionally provided with inside the encapsulating structure
Chip.
3. the noise suppression method of MEMS acoustic sensors as claimed in claim 2, wherein
The induction mouth is arranged between first asic chip and second asic chip.
4. the noise suppression method of MEMS acoustic sensors as claimed in claim 2, wherein
The acoustic aperture for making the acoustic MEMS chip be connected to outside is provided on the pcb board.
5. the noise suppression method of MEMS acoustic sensors as claimed in claim 2, wherein
First asic chip by metal wire respectively with the acoustic MEMS chip, second asic chip, the PCB
Plate is electrically connected.
6. the noise suppression method of MEMS acoustic sensors as claimed in claim 2, wherein
The acoustic MEMS chip, second MEMS chip, first asic chip and second asic chip are equal
It is fixed on the pcb board by bonding die glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711432431.5A CN108337616B (en) | 2017-12-26 | 2017-12-26 | Noise suppression method for MEMS acoustic sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711432431.5A CN108337616B (en) | 2017-12-26 | 2017-12-26 | Noise suppression method for MEMS acoustic sensor |
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| Publication Number | Publication Date |
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| CN108337616A true CN108337616A (en) | 2018-07-27 |
| CN108337616B CN108337616B (en) | 2020-08-07 |
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| CN201711432431.5A Active CN108337616B (en) | 2017-12-26 | 2017-12-26 | Noise suppression method for MEMS acoustic sensor |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102695113A (en) * | 2011-03-11 | 2012-09-26 | 快捷半导体(苏州)有限公司 | Temperature compensation system and temperature compensation method |
| CN102804807A (en) * | 2009-06-29 | 2012-11-28 | 诺基亚公司 | Temperature compensated microphone |
| US20150078591A1 (en) * | 2013-09-13 | 2015-03-19 | Omron Corporation | Acoustic transducer and microphone |
-
2017
- 2017-12-26 CN CN201711432431.5A patent/CN108337616B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102804807A (en) * | 2009-06-29 | 2012-11-28 | 诺基亚公司 | Temperature compensated microphone |
| CN102695113A (en) * | 2011-03-11 | 2012-09-26 | 快捷半导体(苏州)有限公司 | Temperature compensation system and temperature compensation method |
| US20150078591A1 (en) * | 2013-09-13 | 2015-03-19 | Omron Corporation | Acoustic transducer and microphone |
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| Publication number | Publication date |
|---|---|
| CN108337616B (en) | 2020-08-07 |
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Effective date of registration: 20200605 Address after: 261031 building 10, Geer phase II Industrial Park, No. 102, Ronghua Road, Ronghua community, Xincheng street, high tech Zone, Weifang City, Shandong Province Applicant after: Weifang goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Applicant before: GOERTEK Inc. |
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