CN108336108B - Touch display panel and touch display device - Google Patents

Touch display panel and touch display device Download PDF

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Publication number
CN108336108B
CN108336108B CN201710123475.3A CN201710123475A CN108336108B CN 108336108 B CN108336108 B CN 108336108B CN 201710123475 A CN201710123475 A CN 201710123475A CN 108336108 B CN108336108 B CN 108336108B
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layer
touch
insulating layer
display panel
substrate
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CN108336108A (en
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王丽花
周星耀
曾洋
姚绮君
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Shanghai Tianma Microelectronics Co Ltd
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Shanghai Tianma Microelectronics Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/042—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Position Input By Displaying (AREA)

Abstract

The invention discloses a touch display panel and a touch display device, which are used for avoiding the phenomenon of poor contact when a signal outgoing line and a touch sensor outgoing line are bound with an integrated circuit element in a binding area and improving the yield of products. Specifically, when the integrated circuit element is electrically connected to the signal lead-out wire and the touch sensor lead-out wire through the conductive adhesive, the conductive adhesive includes conductive particles, and the conductive particles can perform a conductive function when being compressed to 80% of the diameter of the conductive particles. Compared with the prior art, in the embodiment of the invention, in the binding region, the difference value between the distance from the touch sensor outgoing line to the upper surface of the substrate and the distance from the signal outgoing line to the upper surface of the substrate is less than 80% of the diameter of the conductive particles, so that the phenomenon of poor contact when the integrated circuit element is electrically connected with the signal outgoing line and the touch sensor outgoing line through the conductive adhesive is avoided, and the product yield is improved.

Description

Touch display panel and touch display device
Technical Field
The present invention relates to the field of touch technologies, and in particular, to a touch display panel and a touch display device.
Background
At present, an Organic Light Emitting Diode (OLED) display screen integrated with a touch function becomes a hot spot for current high-end intelligent products to pursue adoption.
In the prior art, a device with a touch function is disposed in an OLED display device to form a touch display panel with touch and display functions. The touch device can be classified into two types according to different integration degrees of the touch device and the display panel. The type in which the touch element is manufactured On the outer surface of the display panel is called an On-cell (On-cell) touch display panel, and the touch display panel has low integration degree and large thickness; the type of touch device directly fabricated inside the display panel is called an In-cell (In-ce11) touch display panel, which has a high integration and a small thickness.
Referring to fig. 1, the touch display panel provided by the prior art includes an array substrate 10, an organic light emitting layer 11 disposed on the array substrate 10, and a touch electrode layer 12 disposed on the organic light emitting layer 11 and insulated from the organic light emitting layer, wherein the touch electrode layer 12 is connected to an integrated circuit chip 13 disposed in a frame region of the array substrate through a touch electrode lead 14. The array substrate 10 further includes a display device (not shown in the drawings) for displaying image information and a display signal outlet 105 electrically connected to the display device, and the display signal outlet 15 extends to the frame region. The touch electrode lead 14 for touch control and the display signal lead 15 for display are connected to the integrated circuit chip 13 through conductive adhesive. In addition, in the frame region, an insulating layer 16 is further included between the touch electrode outgoing line 14 and the array substrate 10, so that the touch electrode outgoing line 14 and the display signal outgoing line 15 are prevented from being oxidized and corroded, wherein the insulating layer 16 further includes an organic film layer, and stress of the frame region is further increased. However, the insulating layer 16 increases the height difference between the side of the touch electrode lead 14 away from the array substrate and the side of the display signal lead away from the array substrate.
Therefore, referring to fig. 1, the height difference between the touch signal outlet and the display signal outlet for displaying is too large, so that when the integrated circuit chip 13 is bound, a phenomenon of poor contact occurs, thereby affecting the display or touch effect.
Disclosure of Invention
The invention provides a touch display panel and a touch display device, which are used for avoiding the phenomenon of poor contact when a signal outgoing line and a touch sensor outgoing line are bound with an integrated circuit element in a binding area and improving the product yield.
The embodiment of the invention provides a touch display panel, which is provided with a display area and a binding area adjacent to the display area; the touch display panel includes: the substrate comprises a substrate upper surface and a substrate lower surface which are oppositely arranged; the thin film transistors are arranged on one side of the upper surface of the substrate in an array mode, and the signal outgoing lines are electrically connected with the thin film transistors and extend to the binding region; the touch sensor lead-out wire is electrically connected with the touch sensor and extends to the binding region; the integrated circuit element is arranged in the binding area and is electrically connected with the signal outgoing line and the touch sensor outgoing line through conductive adhesive, and the conductive adhesive comprises conductive particles; the thickness of the touch sensor lead wire away from the substrate from the upper surface of the substrate is d1, the thickness of the signal lead wire away from the substrate from the upper surface of the substrate is d2, the diameter of the conductive particles in the conductive adhesive is d3, and the relationship among d1, d2 and d3 satisfies the following conditions: d1-d2 < d3 x 80%.
Correspondingly, the embodiment of the invention also provides a touch display device which comprises any one of the touch display panels provided by the embodiment of the invention.
The invention has the following beneficial effects:
the embodiment of the invention provides a touch display panel and a touch display device, and particularly relates to a touch display panel and a touch display device, wherein when an integrated circuit element is electrically connected with a signal outgoing line and a touch sensor outgoing line through a conductive adhesive, the conductive adhesive comprises conductive particles, and the conductive particles can only play a role of conduction when being compressed to 80% of the diameter of the conductive particles. Compared with the prior art, in the embodiment of the invention, in the binding region, the difference value between the distance from the touch sensor outgoing line to the upper surface of the substrate and the distance from the signal outgoing line to the upper surface of the substrate is less than 80% of the diameter of the conductive particles, so that the phenomenon of poor contact when the integrated circuit element is electrically connected with the signal outgoing line and the touch sensor outgoing line through the conductive adhesive is avoided, and the product yield is improved.
Drawings
Fig. 1 is a schematic structural diagram of a touch display panel provided in the prior art;
fig. 2(a) and fig. 2(b) are respectively schematic structural diagrams of a touch display panel according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a second touch display panel according to an embodiment of the present invention;
fig. 4 is a top view of a touch sensor provided in an embodiment of the invention;
fig. 5 is a schematic structural diagram of a third touch display panel according to an embodiment of the disclosure;
fig. 6 is a schematic structural diagram of a fourth touch display panel according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a fifth touch display panel according to an embodiment of the disclosure;
fig. 8(a), fig. 8(b) and fig. 8(c) are respectively three schematic structural diagrams of a sixth touch display panel according to an embodiment of the present invention;
fig. 9(a), 9(b) and 9(c) are respectively three schematic structural diagrams of a seventh touch display panel according to an embodiment of the present invention;
fig. 10 is a schematic structural diagram of an eighth touch display panel according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a touch display panel and a touch display device, which are used for avoiding the phenomenon of poor contact when a signal outgoing line and a touch sensor outgoing line are bound with an integrated circuit element in a binding area and improving the product yield.
The following describes specific embodiments of a touch display panel and a touch display device according to embodiments of the present invention in detail with reference to the accompanying drawings.
The thicknesses and shapes of the various film layers in the drawings are not to be considered true proportions, but are merely intended to illustrate the present invention.
The structure of the touch display panel provided by the embodiment of the invention is described in detail below. Referring to fig. 2(a), a touch display panel provided in an embodiment of the present invention has a display area a and a binding area B adjacent to the display area; cutting along the direction of a-a1 in fig. 2(a) to obtain the schematic cross-sectional view shown in fig. 2(b), and referring to fig. 2(b), the touch display panel includes: a substrate 01, wherein the substrate 01 comprises a substrate upper surface 011 and a substrate lower surface 012 which are oppositely arranged; the thin film transistors 02 are arranged on one side of the upper surface 011 of the substrate in an array mode, and the signal outgoing lines 03 are electrically connected with the thin film transistors 02, and the signal outgoing lines 03 extend to the binding region B; a touch sensor 04 disposed on one side of the upper surface 011 of the substrate, and a touch sensor lead-out line 05 electrically connected to the touch sensor 04, the touch sensor lead-out line 05 extending to the binding region B; and an integrated circuit element 06 disposed in the bonding region B, wherein the integrated circuit element 06 is electrically connected to the signal lead 03 and the touch sensor lead 05 through a conductive paste 07, and the conductive paste 07 includes conductive particles 071.
The thickness of the substrate upper surface 011 of the substrate away from the substrate side of the touch sensor lead wire 05 is d1, the thickness of the substrate upper surface 011 of the substrate away from the substrate side of the signal lead wire 03 is d2, the diameter of the conductive particles 071 in the conductive adhesive 07 is d3, and the relation among d1, d2 and d3 meets the condition: d1-d2 < d3 x 80%.
Generally, the conductive adhesive in the embodiment of the present invention is an anisotropic conductive adhesive, which is a conductive adhesive used for electronic component packaging, and has functions of unidirectional (vertical conduction, parallel non-conduction) conduction and gluing fixation. The conductive adhesive comprises a monolayer distribution of conductive particles. The conduction mechanism is simple, after proper pressure is applied to the glue, the conductive particles can deform under the pressure between the upper layer and the lower layer, and when the conductive particles are pressed to be less than or equal to 80% of the diameter of the conductive particles, the conductive particles have a conductive effect, so that the conductive adhesive has a conductive effect and electrically connects the integrated circuit element with the signal leading-out wire and the touch sensor leading-out wire.
Compared with the prior art, in the embodiment of the invention, in the binding region, the difference value between the distance from the touch sensor outgoing line to the upper surface of the substrate and the distance from the signal outgoing line to the upper surface of the substrate is less than 80% of the diameter of the conductive particles, so that the phenomenon of poor contact when the integrated circuit element is electrically connected with the signal outgoing line and the touch sensor outgoing line through the conductive adhesive is avoided, and the product yield is improved.
In order to further explain the touch display panel provided by the embodiment of the invention, the structure of the display area is described in detail below.
In some optional implementations, in the display area of the touch display panel, referring to fig. 2(b), the thin film transistor 02 is disposed on the substrate upper surface 011, wherein the thin film transistor 02 sequentially includes, in a direction away from the substrate upper surface: a semiconductor active layer 021, wherein the semiconductor active layer 021 includes a source region and a drain region formed by doping N-type impurity ions or P-type impurity ions, and a channel region between the source region and the drain region, which is not doped with impurities; a gate insulating layer 022, a gate metal layer 023, and an interlayer insulating layer 024 are formed on the semiconductor active layer 021, and a pattern of a source electrode 025 and a drain electrode 026 are formed on the interlayer insulating layer 024, the source electrode 025 and the drain electrode 026 being electrically connected to a source region and a drain region in the semiconductor active layer through contact holes in the gate insulating layer 022 and the interlayer insulating layer 024, respectively. It should be noted that fig. 2(b) exemplarily illustrates a film layer structure of a top-gate thin film transistor, and the present invention is also applicable to other types of thin film transistors such as a bottom-gate thin film transistor, and the present invention does not specifically limit the specific structure type of the thin film transistor.
In some optional implementations, the signal outlet 03 in the embodiment of the present invention is electrically connected to the thin film transistor, and the signal outlet 03 includes a scan line connected to the gate metal layer 023 of the thin film transistor or a data line connected to the source 025 of the thin film transistor, and optionally, the signal outlet 03 includes both a scan line connected to the gate metal layer 023 of the thin film transistor and a data line connected to the source 025 of the thin film transistor.
In some optional implementation manners, referring to fig. 2(b), the touch display panel in the embodiment of the present invention further includes: a light emitting device 08 disposed between the thin film transistor 02 and the touch sensor 04, and a thin film encapsulation layer 09 covering the light emitting device 08, the touch sensor 04 being located on a side of the thin film encapsulation layer 09 away from the substrate. The light-emitting device 08 includes, in order from the thin film transistor 02: a first electrode layer 081, a pixel defining layer 082, a light emitting layer 083, and a second electrode layer 084. The first electrode layer 081 is electrically connected to the source electrode 025 or the drain electrode 026 (in fig. 2 b, the first electrode layer 081 is electrically connected to the drain electrode 026). The light emitting layer may be formed of a low molecular weight organic material or a high molecular weight material, include an organic emission layer, and further include at least one of a Hole Injection Layer (HIL), a Hole Transport Layer (HTL), an Electron Transport Layer (ETL), and an Electron Injection Layer (EIL). The first electrode layer and the second electrode layer may be transparent electrodes or reflective electrodes. When the first electrode layer is a transparent electrode, Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), or the like may be included; when the first electrode layer is a reflective electrode, the reflective layer may be formed of Ag, magnesium (Mg), Al, Pt, Pd, Au, Ni, Nd, iridium (Ir), Cr, or a mixture thereof, and ITO, IZO, ZnO, In2O3, or the like may be formed on the reflective layer; when the second electrode layer is a transparent electrode, a compound such as lithium (Li), calcium (Ca), lithium fluoride/calcium (LiF/Ca), lithium fluoride/aluminum (LiF/Al), aluminum (Al), magnesium (Mg), or a combination thereof may be included and may be initially deposited on the light emitting layer by evaporation, and a transparent electrode forming material such as ITO, IZO, ZnO, or In2O3 may be deposited on the compound; when the second electrode is a reflective electrode, the second electrode layer may be formed by evaporation using Li, Ca, LiF/Al, Mg, or a mixture thereof on the entire surface of the substrate. It should be noted that, in the embodiment provided by the present invention, the touch sensor is located on a side of the thin film encapsulation layer away from the substrate, and in other alternative implementations, the touch sensor may be integrated in other positions of the touch display panel, for example, the touch sensor may be integrated in the light emitting device 08.
Optionally, the light emitting devices 08 are arranged in an array, and each light emitting device 08 is electrically connected to one thin film transistor 02. The film encapsulation layer 09 covers the light emitting device 08 to prevent the light emitting device 08 from being damaged by external air or moisture, and the film encapsulation layer 09 covers the display area of the touch display panel. A thin film encapsulation layer 09 is positioned over the light emitting device 08, and protects the light emitting layer and other thin layers from external moisture, oxygen, and the like. Optionally, the thin film encapsulation layer includes an inorganic layer and an organic layer, or the inorganic layer and the organic layer are alternately stacked.
In some optional implementations, the touch display panel further includes: and a passivation layer 010 and a planarization layer 211 disposed between the film layer where the source and drain electrodes 025 and 026 of the thin film transistor 02 are formed and the light emitting device 08. In which the first electrode layer 081 in the light emitting device 08 is electrically connected to the drain electrode 026 in the thin film transistor 02 through a via hole penetrating the passivation layer 010 and the planarization layer 211. Wherein the planarization layer 211 is disposed between the passivation layer 010 and the first electrode layer 081, the pixel defining layer 082 is disposed between the first electrode layer 081 and the light emitting layer 083, and the pixel defining layer 082 is disposed over the planarization layer 211 and covers an edge area of the first electrode layer 081. The planarization layer 211 includes an organic layer of acryl, Polyimide (PI), benzocyclobutene (BCB), or the like. The pixel defining layer includes an organic material such as Polyimide (PI), polyamide, benzocyclobutene (BCB), acryl resin, or phenol resin. The electrode insulating layer is made of an organic material or an inorganic material.
Referring to fig. 3, in an alternative, a touch sensor provided in an embodiment of the present invention includes: an electrode insulating layer 041, a first conductive layer 042 and a second conductive layer 043, the electrode insulating layer 041 being located between the first conductive layer 042 and the second conductive layer 043. The touch sensor includes a touch driving electrode and a touch sensing electrode disposed on the same layer, or a touch driving electrode and a touch sensing electrode disposed in a different layer structure, and fig. 3 illustrates the touch driving electrode and the touch sensing electrode disposed on the same layer by way of example, but not limited to the structure included in fig. 3.
In one aspect, a first conductive layer 042 of the touch sensor includes a touch driving electrode and a touch sensing electrode that are insulated from each other, and a second conductive layer 043 includes a bridge-crossing wire, wherein the touch sensor lead wire includes a touch driving electrode lead wire electrically connected to the touch driving electrode and a touch sensing electrode lead wire electrically connected to the touch sensing electrode. Specifically, in an alternative implementation manner of forming the structure of the touch sensor, a touch driving electrode and a touch sensing electrode are formed on the surface of the thin film encapsulation layer, then an electrode insulating layer is formed on the touch driving electrode and the touch sensing electrode, and finally a bridge-crossing wire is formed on the electrode insulating layer, wherein the area where the electrode insulating layer is formed only includes a bridge-crossing region. Referring to fig. 4, a schematic top view structure of the touch sensor is shown, in which the first conductive layer includes a touch driving electrode 0421 and a touch sensing electrode 0422 that are insulated from each other, the second conductive layer 043 is used to connect adjacent touch sensing electrodes 0422, and an electrode insulating layer 041 for insulating the touch driving electrode 0421 and the touch sensing electrode 0422 is further included. Fig. 4 is a schematic diagram of an embodiment, and the touch display panel provided in the embodiment of the present invention is not limited to the structure of the touch sensor shown in fig. 4.
In the prior art, the operation modes of the touch sensor are a mutual capacitance type and a self-capacitance type, and for example, a mutual capacitance type touch sensor and a self-capacitance type touch sensor are provided herein according to the embodiments of the present invention. The mutual capacitance type touch sensor provided by the embodiment of the invention comprises a touch driving electrode and a touch sensing electrode, wherein an electric field is formed between the touch driving electrode and the touch sensing electrode and is used for detecting touch operation. The self-capacitance touch sensor provided by the embodiment of the invention comprises the touch electrode, and the touch electrode independently detects touch operation. In a mutual capacitance type touch sensor, a first conductive layer 042 in the touch sensor includes a touch driving electrode, and a second conductive layer 043 includes a touch sensing electrode; the touch sensor lead-out line 05 includes a touch driving electrode lead-out line electrically connected to the touch driving electrode and a touch sensing electrode lead-out line electrically connected to the touch sensing electrode. Alternatively, the first conductive layer 042 in the touch sensor includes a touch sensing electrode, and the second conductive layer 043 includes a touch driving electrode; the touch sensor lead-out line 05 includes a touch driving electrode lead-out line electrically connected to the touch driving electrode and a touch sensing electrode lead-out line electrically connected to the touch sensing electrode. In the self-capacitance type touch sensor, the first conductive layer 042 and the second conductive layer 043 each include a touch electrode that independently detects a touch operation, and the touch sensor lead line 05 includes a touch electrode lead line that is electrically connected to the touch electrodes in the first conductive layer 042 and the second conductive layer 043.
According to the structure of the display area of the touch display panel described above, the following is further described from various cases with respect to the structure of the binding area. The embodiment of the present invention exemplarily provides three implementation manners of the structure of the binding region.
The first condition is as follows:
referring to fig. 5, in a binding region B of the touch display panel provided in the embodiment of the present invention, a region where a touch sensor outgoing line 05 is located sequentially includes, according to a direction away from a substrate 01: a first insulating layer 30 and a touch sensor lead-out line 05. The region where the signal lead-out line 03 is located includes only in a direction away from the substrate 01: a signal outlet 03.
Specifically, the first insulating layer 30 in the embodiment of the present invention may have a one-layer structure, or a multi-layer structure. In the embodiment of the present invention, only the insulating layer having a single-layer structure, or a two-layer structure, or a three-layer structure is taken as an example for illustration. Further, the first insulating layer 30 has a single-layer structure, and the first insulating layer 30 is formed in the same process as any one of the passivation layer 010, the planarization layer 211, and the pixel defining layer 082. Alternatively, the first insulating layer 30 includes a two-layer structure, and the two-layer structure is formed in the same process as any two layers of the passivation layer 010, the planarization layer 211, and the pixel defining layer 082. Alternatively, the first insulating layer 30 includes a three-layer structure, and the three-layer structure is formed in the same process as the passivation layer 010, the planarization layer 211, and the pixel defining layer 082, respectively.
Case two:
referring to fig. 6, in a binding region B of the touch display panel provided in the embodiment of the present invention, a region where a touch sensor outgoing line 05 is located sequentially includes, according to a direction away from a substrate 01: a second insulating layer 31, a first insulating layer 30, and a touch sensor lead-out line 05. The region where the signal lead-out line 03 is located includes only in a direction away from the substrate 01: a second insulating layer 31 and a signal outlet 03.
Specifically, the first insulating layer 30 in the embodiment of the present invention may have a one-layer structure, or a multi-layer structure. In the embodiment of the present invention, only the insulating layer having a single-layer structure, or a two-layer structure, or a three-layer structure is taken as an example for illustration. Further, the first insulating layer 30 has a single-layer structure, and the first insulating layer 30 is formed in the same process as any one of the passivation layer 010, the planarization layer 211, and the pixel defining layer 082. Alternatively, the first insulating layer 30 includes a two-layer structure, and the two-layer structure is formed in the same process as any two layers of the passivation layer 010, the planarization layer 211, and the pixel defining layer 082. Alternatively, the first insulating layer 30 includes a three-layer structure, and the three-layer structure is formed in the same process as the passivation layer 010, the planarization layer 211, and the pixel defining layer 082, respectively.
The second insulating layer in the embodiment of the present invention may include a single layer structure, or a double layer structure. Specifically, the second insulating layer 31 is formed in the same step as any one of the gate insulating layer 022 and the interlayer insulating layer 024; alternatively, the second insulating layer 31 includes a two-layer structure, and the two-layer structure is formed in the same step as the gate insulating layer 022 and the interlayer insulating layer 024.
According to the structures of the touch display panel in the first and second cases, in order to satisfy the formula: d1-d2 < d3 x 80%, the first insulating layer may be modified in that a groove may be provided in the first insulating layer, and the touch sensor lead lines may be provided in the groove. So that the side of the lead-out wire of the touch sensor, which is far away from the substrate, is far away from the upper surface of the substrate, and the height difference between the side of the lead-out wire of the touch sensor, which is far away from the substrate, and the upper panel of the substrate is less than 80 percent of the diameter of the conductive particle.
In some optional implementation manners, the depth of the groove is set to be larger, so that the thickness of the side, away from the substrate, of the touch sensor lead-out line 05 from the upper surface 011 of the substrate is equal to the thickness of the side, away from the substrate, of the signal lead-out line 03 from the upper surface 011 of the substrate. Namely: d1 ═ d2, see fig. 7. Or, in the area for forming the lead-out wire of the touch sensor, the first insulating layer is etched away, so that no height difference exists between the side, away from the substrate, of the lead-out wire of the touch sensor and the upper surface of the substrate, and the side, away from the substrate, of the signal lead-out wire and the upper panel of the substrate.
The structure of the bonding area of the touch display panel is described in detail below with specific embodiments and with reference to the accompanying drawings. It should be noted that the embodiments of the present invention are specifically described only based on the embodiments in case two.
For example, the detailed description will be given by taking only the first insulating layer as a single-layer structure, but the first insulating layer is not limited to only a single-layer structure.
In some alternative implementations, the first insulating layer 30 is formed in the same process step as any one of the passivation layer 010, the planarization layer 211, and the pixel defining layer 082. For example, when the passivation layer 010 is formed in the touch display panel, the passivation layer is formed on the substrate of the binding region, and thus, the first insulating layer of the binding region is formed at the same time as the passivation layer of the touch display panel. Alternatively, when the planarization layer is formed in the display region of the touch display panel, the planarization layer is formed on the substrate of the binding region, and thus, the first insulating layer of the binding region is formed simultaneously with the planarization layer of the touch display panel. Alternatively, the pixel defining layer is formed on the substrate of the binding region at the same time as the pixel defining layer is formed in the display region of the touch display panel, and thus, the first insulating layer of the binding region is formed at the same time as the pixel defining layer of the display region of the touch display panel.
Referring to fig. 8(a), 8(b) and 8(c), the first insulating layer 30 in the touch display panel is a single-layer structure, and sequentially includes, in the binding region, in a direction away from the substrate: a substrate 01, a second insulating layer 31, a signal lead 03, a first insulating layer 30, and a touch sensor lead 05. The second insulating layer 31 has a two-layer structure, and is formed in the same process as the gate insulating layer 022 and the interlayer insulating layer 024 in the display region. Here, referring to fig. 8(a), the first insulating layer 30 is formed at the same time as the passivation layer 010 of the display region of the touch display panel, and a groove 101 is provided in the first insulating layer 30, and the touch sensor lead line 05 is disposed in the groove. Referring to fig. 8(b), the first insulating layer 30 is formed simultaneously with the planarization layer 211 of the display region of the touch display panel, and a groove 101 is provided in the first insulating layer 30, and the touch sensor lead line 05 is disposed in the groove 101. Referring to fig. 8(c), the first insulating layer 30 is formed simultaneously with the pixel defining layer 082 of the display region of the touch display panel, and a groove 101 is disposed in the first insulating layer 30, and the touch sensor lead line 05 is disposed in the groove 101.
In some alternative implementations, the first insulating layer is the same material and the same thickness as any one of the planarization layer, the pixel defining layer and the passivation layer. Specifically, in the same process, the same film layer may be etched through an etching process, so that when the planarization layer is formed in the touch display area, the first insulating layer is formed above the film layer of the signal outgoing line in the binding area, and the material and the thickness of the formed first insulating layer are the same as those of the planarization layer. Or, in the same process, the same film layer may be etched through an etching process, so that when the pixel defining layer is formed in the touch display region, the first insulating layer is formed above the film layer where the signal outgoing line of the binding region is located, and the material and the thickness of the formed first insulating layer are the same as those of the pixel defining layer. In the same process, the same film layer can be etched through an etching process, so that when a passivation layer is formed in the touch display area, a first insulating layer is formed on the film layer where the signal leading-out wire of the binding area is located, and the material and the thickness of the formed first insulating layer are the same as those of the passivation layer.
In some optional implementations, when the material and the thickness of the first insulating layer are the same as those of any one of the planarization layer, the pixel defining layer, and the passivation layer, and the thickness is the same, a groove is provided in a region of the first insulating layer that does not overlap the signal lead-out line, wherein, since the thickness of the planarization layer and the thickness of the pixel defining layer are both greater than the thickness of the passivation layer, when the groove is provided in the planarization layer or the pixel defining layer, the depth of the groove is greater than the depth of the groove in the passivation layer.
In some optional implementation manners, when the groove is formed in the planarization layer, the pixel definition layer, or the passivation layer, an etching process may be used to etch the region where the outgoing line of the touch sensor is to be formed, so as to form the groove, and the depth of the groove may be set according to an actual situation. For example, the groove may be formed by etching the first insulating layer so that the groove becomes a via hole penetrating the first insulating layer or a groove not penetrating the first insulating layer. And is not particularly limited herein.
Optionally, the groove of the first insulating layer may be a via hole penetrating through the passivation layer, the planarization layer, and/or the pixel defining layer, and a touch sensor outgoing line is formed at the via hole, so that a side of the touch sensor outgoing line away from the substrate is at the same height as a side of the signal outgoing line away from the substrate.
It should be noted that the projections of the signal outlet and the touch sensor outlet in the binding region do not overlap. When the first insulating layer is formed above the signal outgoing line, the first insulating layer right above the signal outgoing line needs to be etched, so that the signal outgoing line is exposed.
For example, the first insulating layer is only a double-layer structure, but not limited to the first insulating layer.
Specifically, the first insulating layer 30 is formed in the same process as any two of the passivation layer 010, the planarization layer 211, and the pixel defining layer 082. For example, when the passivation layer 010 and the planarization layer 211 are formed in the touch display panel, the first insulating layer is formed over the film layer where the signal lead-out line of the binding region is located, and thus, the first insulating layer of the binding region is formed simultaneously with the passivation layer and the planarization layer of the display region of the touch display panel. Alternatively, when the planarization layer 211 and the pixel definition layer 082 are formed in the display region of the touch display panel, the first insulating layer is formed above the film layer where the signal lead-out line of the binding region is located, and therefore, the first insulating layer of the binding region is formed simultaneously with the planarization layer 211 and the pixel definition layer 082 in the display region of the touch display panel. Alternatively, when the passivation layer 010 and the planarization layer 211 are formed in the display region of the touch display panel, the first insulating layer is formed over the film layer where the signal lead line of the bonding region is located, and thus the first insulating layer of the bonding region is formed simultaneously with the passivation layer 010 and the planarization layer 211 in the display region of the touch display panel.
Referring to fig. 9(a), 9(b) and 9(c), the first insulating layer 30 has a double-layer structure, and in the bonding region, sequentially includes: a substrate 01, a second insulating layer 31, a signal lead 03, a first insulating layer 30, and a touch sensor lead 05. The second insulating layer 31 has a two-layer structure, and is formed in the same process as the gate insulating layer 022 and the interlayer insulating layer 024 in the display region. Here, referring to fig. 9(a), the first insulating layer 30 is formed simultaneously with the passivation layer 010 and the planarization layer 211 of the display region of the touch display panel, and the passivation layer 010 and the planarization layer 211 of the binding region are provided with a groove 101 in which the touch sensor lead line 05 is disposed. Referring to fig. 9(b), the first insulating layer 30 is formed simultaneously with the planarization layer 211 and the pixel definition layer 082 of the display region of the touch display panel, and the planarization layer 211 and the pixel definition layer 082 of the binding region have a groove 101 disposed therein, and the touch sensor outlet 05 is disposed within the groove 101. Referring to fig. 9(c), the first insulating layer 30 is formed simultaneously with the pixel defining layer 082 and the passivation layer 010 of the display region of the touch display panel, and a groove 101 is provided in the pixel defining layer 082 and the passivation layer 010 of the binding region, and the touch sensor lead line 05 is disposed in the groove 101.
In some alternative implementations, the first insulating layer is the same material and the same thickness as any two layers of the planarization layer, the pixel defining layer and the passivation layer. Specifically, in the same process, the same film layer may be etched through an etching process, so that when the planarization layer and the passivation layer are formed in the touch display region, the first insulating layer is formed above the film layer of the signal outgoing line of the binding region, and the material and the thickness of the first insulating layer formed in this way are the same as those of the planarization layer and the passivation layer. Or, in the same process, the same film layer may be etched through an etching process, so that when the pixel defining layer and the planarization layer are formed in the touch display area, the first insulating layer is formed above the film layer where the signal outgoing line of the binding area is located, and the material and the thickness of the first insulating layer formed in this way are the same as those of the pixel defining layer and the planarization layer. In the same process, the same film layer can be etched through an etching process, so that when a passivation layer and a pixel definition layer are formed in a touch display area, a first insulating layer is formed on the film layer where a signal leading-out wire of a binding area is located, and the material and the thickness of the formed first insulating layer are the same as those of the passivation layer and the pixel definition layer.
In some optional implementations, when any two of the material and the thickness of the first insulating layer and the material and the thickness of the planarization layer, the pixel defining layer, and the passivation layer are the same, a groove is provided in a region of the first insulating layer that does not overlap the signal lead line, wherein, since the thickness of the planarization layer and the thickness of the pixel defining layer are both greater than the thickness of the passivation layer, when the first insulating layer is formed simultaneously with the planarization layer and the pixel defining layer, and the groove is formed in the first insulating layer, the depth of the groove penetrates at least through the pixel defining layer, such that a difference in height between the touch sensor lead line and the signal lead line is less than 80% of the diameter of the conductive particle.
In some optional implementation manners, when the grooves are formed in the planarization layer, the pixel defining layer and/or the passivation layer, an etching process may be used to etch the region where the outgoing line of the touch sensor is to be formed, so as to form the grooves, and the depth of the grooves may be set according to actual conditions. For example, the groove may be formed by etching the first insulating layer so that the groove becomes a via hole penetrating the first insulating layer or a groove not penetrating the first insulating layer. And is not particularly limited herein.
Optionally, the groove of the first insulating layer may be a via hole penetrating through the passivation layer, the planarization layer, and/or the pixel defining layer, and a touch sensor outgoing line is formed at the via hole, so that a side of the touch sensor outgoing line away from the substrate is at the same height as a side of the signal outgoing line away from the substrate.
It should be noted that the projections of the signal outlet and the touch sensor outlet in the binding region do not overlap. When the first insulating layer is formed above the signal outgoing line, the first insulating layer right above the signal outgoing line needs to be etched, so that the signal outgoing line is exposed.
For example, the detailed description will be given only by taking the first insulating layer as a three-layer structure, but the first insulating layer is not limited to the three-layer structure.
Specifically, the first insulating layer 30 includes a three-layer structure, and each layer is formed in the same process as three layers of the passivation layer 010, the planarization layer 211, and the pixel defining layer 082. That is, when the passivation layer 010, the planarization layer 211, and the pixel definition layer 082 are formed in the display region of the touch display panel, the passivation layer 010, the planarization layer 211, and the pixel definition layer 082 are simultaneously formed in the binding region of the touch display panel, so that the first insulating layer of the binding region of the touch display panel is simultaneously formed with the passivation layer, the planarization layer, and the pixel definition layer of the touch display panel.
Referring to fig. 10, the first insulating layer 30 in the touch display panel is a three-layer structure, and sequentially includes, in the binding region, in a direction away from the substrate: a substrate 01, a second insulating layer 31, a signal lead 03, a first insulating layer 30, and a touch sensor lead 05. The second insulating layer 31 has a two-layer structure, and is formed in the same process as the gate insulating layer 022 and the interlayer insulating layer 024 in the display region. The first insulating layer 30 is formed simultaneously with the passivation layer 010, the planarization layer 211, and the pixel defining layer 082 of the display area of the touch display panel, and a groove 101 is formed in the first insulating layer, and the touch sensor lead line 05 is disposed in the groove.
In some optional implementations, the first insulating layer is the same material and the same thickness as the planarization layer, the pixel defining layer and the passivation layer. Therefore, the thickness of the first insulating layer is the sum of the three thicknesses of the planarization layer, the pixel defining layer and the passivation layer, and in order to make the height difference between the side of the touch sensor lead wire away from the substrate and the upper surface of the substrate and the side of the signal lead wire away from the substrate less than 80% of the diameter of the conductive particles, a groove 101 is provided in the first insulating layer and penetrates through at least the pixel defining layer 082 and the planarization layer 211.
Optionally, the groove of the first insulating layer may be a via hole penetrating through the passivation layer, the planarization layer, and the pixel defining layer, and a touch sensor outgoing line is formed at the via hole, so that a distance from one side of the touch sensor outgoing line away from the substrate to the upper surface of the substrate is equal to a height from one side of the signal outgoing line away from the substrate to the upper surface of the substrate.
It should be noted that the projections of the signal outlet and the touch sensor outlet in the binding region do not overlap. When the first insulating layer is formed above the signal outgoing line, the first insulating layer right above the signal outgoing line needs to be etched, so that the signal outgoing line is exposed.
It should be noted that the signal outgoing line in the embodiment of the present invention includes a data line and/or a scan line electrically connected to the thin film transistor, or other signal lines required to be connected to the integrated circuit element.
In summary, the embodiment of the invention achieves the following beneficial effects:
1. according to the touch display panel provided by the embodiment of the invention, in the binding region, the difference value between the distance from the touch sensor outgoing line to the upper surface of the substrate and the distance from the signal outgoing line to the upper surface of the substrate is less than 80% of the diameter of the conductive particles, so that when the touch sensor outgoing line and the signal outgoing line are bound with the integrated circuit element through the conductive adhesive, the conductive particles in the conductive adhesive are compressed to be within 80% of the diameter of the conductive particles, the phenomenon of poor contact when the integrated circuit element is electrically connected with the signal outgoing line and the touch sensor outgoing line through the conductive adhesive is avoided, and the product yield is improved.
2. In some optional implementation manners, in the touch display panel provided in the embodiment of the present invention, the groove is formed in the first insulating layer, so that a distance between one side of the touch sensor outgoing line, which is far away from the substrate, and the upper surface of the substrate is less than 80% of a diameter of the conductive particle, and a height difference between one side of the touch sensor outgoing line, which is far away from the substrate, and the upper surface of the substrate is less than that of the signal outgoing line, which is far away from the substrate, and the upper surface of the substrate, so that good binding between the signal.
3. In some optional implementation manners, the first insulating layer of the touch display panel provided in the embodiments of the present invention includes a single-layer or double-layer structure, so that the parasitic capacitance between the touch electrode outgoing line and the signal outgoing line is further reduced, and no additional process step is required for each layer of structure.
4. In some optional implementation manners, in the touch display panel provided in the embodiment of the present invention, the via hole penetrating through the first insulating layer is disposed in the first insulating layer, so that a distance from one side of the outgoing line of the touch sensor, which is far away from the substrate, to the upper surface of the substrate is equal to a height from one side of the outgoing line of the signal, which is far away from the substrate, to the upper surface of the substrate, and a purpose of good binding is further ensured.
Based on the same inventive concept, an embodiment of the present invention provides a touch display device, including any one of the touch display panels provided in the embodiments of the present invention. Optionally, the touch display device provided by the embodiment of the invention is a touch display device including an OLED light emitting unit.
The touch display panel and the touch display device provided by the embodiment of the invention are provided with a display area and a binding area adjacent to the display area; the touch display panel includes: the substrate comprises a substrate upper surface and a substrate lower surface which are oppositely arranged; the thin film transistors are arranged on one side of the upper surface of the substrate in an array mode, and the signal outgoing lines are electrically connected with the thin film transistors and extend to the binding region; the touch sensor lead-out wire is electrically connected with the touch sensor and extends to the binding area; the integrated circuit element is arranged in the binding area and is electrically connected with the signal outgoing line and the touch sensor outgoing line through conductive adhesive, and the conductive adhesive comprises conductive particles; the thickness of the lead wire of the touch sensor away from the upper surface of the substrate is d1, the thickness of the signal lead wire away from the upper surface of the substrate is d2, the diameter of the conductive particles in the conductive adhesive is d3, and the relation among d1, d2 and d3 satisfies the following conditions: d1-d2 < d3 x 80%. Specifically, when the integrated circuit element is electrically connected to the signal lead-out wire and the touch sensor lead-out wire through the conductive adhesive, the conductive adhesive includes conductive particles, and the conductive particles can perform a conductive function when being compressed to 80% of the diameter of the conductive particles. Compared with the prior art, in the embodiment of the invention, in the binding region, the difference value between the distance from the touch sensor outgoing line to the upper surface of the substrate and the distance from the signal outgoing line to the upper surface of the substrate is less than 80% of the diameter of the conductive particles, so that the phenomenon of poor contact when the integrated circuit element is electrically connected with the signal outgoing line and the touch sensor outgoing line through the conductive adhesive is avoided, and the product yield is improved.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims (17)

1. A touch display panel is provided with a display area and a binding area adjacent to the display area;
the touch display panel includes:
the substrate comprises a substrate upper surface and a substrate lower surface which are oppositely arranged;
the thin film transistors are arranged on one side of the upper surface of the substrate in an array mode, and the signal outgoing lines are electrically connected with the thin film transistors and extend to the binding region;
the touch sensor lead-out wire is electrically connected with the touch sensor and extends to the binding region; and
the integrated circuit element is arranged in the binding area and is electrically connected with the signal outgoing line and the touch sensor outgoing line through conductive adhesive, and the conductive adhesive comprises conductive particles; wherein the content of the first and second substances,
within the binding region: the thickness of the touch sensor lead wire far away from the substrate from the upper surface of the substrate is d1, the thickness of the signal lead wire far away from the substrate from the upper surface of the substrate is d2, the diameter of the conductive particles in the conductive adhesive is d3, and the relationship among d1, d2 and d3 satisfies the following conditions:
d1-d2＜d3*80％。
2. the touch display panel of claim 1, wherein d1 is d 2.
3. The touch display panel of claim 1,
in the binding region, the region where the outgoing line of the touch sensor is located sequentially comprises the following components in the direction away from the substrate: a first insulating layer and a touch sensor lead-out wire.
4. The touch display panel according to claim 3, further comprising:
the touch sensor comprises a light-emitting device arranged between the thin film transistor and the touch sensor, and a thin film packaging layer covering the light-emitting device, wherein the touch sensor is positioned on one side of the thin film packaging layer, which is far away from the substrate; wherein the content of the first and second substances,
the light emitting device sequentially comprises in a direction away from the thin film transistor: the pixel structure comprises a first electrode layer, a pixel definition layer, a light emitting layer and a second electrode layer.
5. The touch display panel according to claim 4, further comprising:
a passivation layer and a planarization layer sequentially disposed between the thin film transistor and the light emitting device.
6. The touch display panel of claim 5,
the first insulating layer is formed in the same process as any one of the passivation layer, the planarization layer, and the pixel defining layer.
7. The touch display panel of claim 5,
the first insulating layer includes a two-layer structure formed in the same process with any two of the passivation layer, the planarization layer, and the pixel defining layer, respectively.
8. The touch display panel of claim 5,
the first insulating layer includes a three-layer structure, and the three-layer structure is formed in the same process as the passivation layer, the planarization layer, and the pixel defining layer, respectively.
9. The touch display panel according to any one of claims 6 to 8,
the first insulating layer of the binding region is provided with a groove, and the outgoing line of the touch sensor is arranged in the groove.
10. The touch display panel of claim 3,
in the binding region, a second insulating layer is arranged between the film layer where the first insulating layer is located and the substrate;
in the binding region, the region where the signal outgoing line is located sequentially includes, in a direction away from the substrate: a second insulating layer and a signal lead-out wire.
11. The touch display panel of claim 10,
the thin film transistor sequentially comprises in a direction away from the substrate: the semiconductor device comprises a semiconductor film layer, a grid electrode insulating layer, a grid electrode metal layer, an interlayer insulating layer and a source drain metal layer.
12. The touch display panel of claim 11,
the second insulating layer is formed in the same process as any one of the gate insulating layer and the interlayer insulating layer; alternatively, the first and second electrodes may be,
the second insulating layer comprises a two-layer structure, and the two-layer structure is formed in the same process with the gate insulating layer and the interlayer insulating layer respectively.
13. The touch display panel of claim 1, wherein the signal outlet comprises a data line and/or a scan line.
14. The touch display panel according to claim 1, wherein the touch sensor comprises an electrode insulating layer, a first conductive layer, and a second conductive layer, and wherein the electrode insulating layer is located between the first conductive layer and the second conductive layer.
15. The touch display panel according to claim 14, wherein the first conductive layer comprises a bridge wire, and the second conductive layer comprises a touch driving electrode and a touch sensing electrode insulated from each other;
the touch sensor outgoing line comprises a touch driving electrode outgoing line electrically connected with the touch driving electrode and a touch sensing electrode outgoing line electrically connected with the touch sensing electrode.
16. The touch display panel of claim 14,
the first conducting layer comprises a touch driving electrode, and the second conducting layer comprises a touch sensing electrode; or, the first conductive layer includes a touch sensing electrode, and the second conductive layer includes a touch driving electrode;
the touch sensor outgoing line comprises a touch driving electrode outgoing line electrically connected with the touch driving electrode and a touch sensing electrode outgoing line electrically connected with the touch sensing electrode.
17. A touch display device comprising the touch display panel of any one of claims 1-16.
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