CN108336108A - A kind of touch-control display panel and touch control display apparatus - Google Patents
A kind of touch-control display panel and touch control display apparatus Download PDFInfo
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- CN108336108A CN108336108A CN201710123475.3A CN201710123475A CN108336108A CN 108336108 A CN108336108 A CN 108336108A CN 201710123475 A CN201710123475 A CN 201710123475A CN 108336108 A CN108336108 A CN 108336108A
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- Prior art keywords
- touch
- layer
- out wire
- display panel
- control display
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/042—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Abstract
The invention discloses a kind of touch-control display panel and touch control display apparatus to improve product yield with to avoid the phenomenon that poor contact is generated when binding region, signal lead-out wire and touch sensor lead-out wire are bound with integrated circuit component.Specifically, when integrated circuit component is electrically connected by conducting resinl with signal lead-out wire and touch sensor lead-out wire, conducting resinl includes conducting particles, and conducting particles can just play electric action when being compressed into the 80% of its diameter.In compared with prior art, in binding region in the embodiment of the present invention, distance of the touch sensor lead-out wire apart from upper surface of base plate, the difference of distance with signal lead-out wire apart from upper surface of base plate, less than the 80% of conducting particles diameter, when being electrically connected with signal lead-out wire and touch sensor lead-out wire by conducting resinl so as to avoid integrated circuit component, generate poor contact the phenomenon that, improve product yield.
Description
Technical field
The present invention relates to technical field of touch control more particularly to a kind of touch-control display panels and touch control display apparatus.
Background technology
Currently, the Organic Light Emitting Diode (Organic Light Emitting Diode, OLED) of integrated touch function
Display screen becomes high-end intellectual product instantly and pursues the hot spot used.
In the prior art, the device with touch function is arranged in OLED display device, being formed has touch-control and show
Show the touch-control display panel of function.Wherein, the degree of integration difference according to touch control component and display panel can divide into two major classes type.
The type that touch control component is made in the outer surface of display panel is known as external labeling type (On-cell) touch-control display panel, degree of integration
Relatively low and thickness is larger；Touch control component is directly made in referred to as embedded (In-ce11) touch-control of type of the inside of display panel
Display panel, degree of integration is more high and thick, and degree is smaller.
Wherein, referring to Fig. 1, in a kind of touch-control display panel that the prior art provides, including array substrate 10, it is arranged in battle array
Organic luminous layer 11 on row substrate 10, the touch control electrode for being arranged on organic luminous layer 11 and insulating with organic luminous layer
Layer 12, touch control electrode layer 12 is connected to the ic core being arranged in array substrate frame region by touch control electrode lead-out wire 14
Piece 13.Array substrate 10 further includes display device (not shown) for showing image information and is electrically connected with display device
The display signal lead-out wire 105 connect, display signal lead-out wire 15 extend to frame region.Wherein, for realizing the touch-control of touch-control
Electrode outlet line 14 and display signal lead-out wire 15 for display are connected to IC chip 13 by conducting resinl.
In addition, further including insulating layer 16 in frame region, between touch control electrode lead-out wire 14 and array substrate 10, to avoid touch-control
Electrode outlet line 14 and display signal lead-out wire 15 are aoxidized and are corroded, wherein further include organic film in insulating layer 16, into one
Step increases the stress of frame region.But insulating layer 16 is but so that side of the touch control electrode lead-out wire 14 far from array substrate
Difference in height between side of the display signal lead-out wire far from array substrate increases.
Therefore, referring to Fig. 1, difference in height mistake between the display signal lead-out wire due to touching signals lead-out wire and for display
Greatly so that IC chip 13 the phenomenon that poor contact occurs in binding, to influence the effect of display or touch-control.
Invention content
A kind of touch-control display panel of present invention offer and touch control display apparatus, with to avoid in binding region, signal is drawn
The phenomenon that line and touch sensor lead-out wire generate poor contact when being bound with integrated circuit component, improves product yield.
An embodiment of the present invention provides a kind of touch-control display panel, there is display area and adjacent with the display area
Binding region；The touch-control display panel includes：Substrate, the substrate include the upper surface of base plate being oppositely arranged and substrate following table
Face；It is set to the thin film transistor (TFT) that the upper surface of base plate side is arranged in array, and is electrically connected with the thin film transistor (TFT)
Signal lead-out wire, the signal lead-out wire extends to the binding region；It is set to the touch of the upper surface of base plate side
Sensor, and the touch sensor lead-out wire that is electrically connected with the touch sensor, the touch sensor lead-out wire extend
To the binding region；And it is set to the integrated circuit component of the binding region, the integrated circuit component passes through conduction
Glue is electrically connected with the signal lead-out wire and the touch sensor lead-out wire, and the conducting resinl includes conducting particles；Wherein,
Thickness of the touch sensor lead-out wire far from the upper surface of base plate of substrate described in one lateral extent of the substrate is d1, the letter
Number thickness of the lead-out wire far from the upper surface of base plate of substrate described in one lateral extent of the substrate is d2, conductive particle in the conducting resinl
A diameter of d3 of son, the relationship of d1, d2, d3 meet condition：D1-d2 ＜ d3*80%.
Correspondingly, the embodiment of the present invention additionally provides a kind of touch control display apparatus, including provided in an embodiment of the present invention
A kind of touch-control display panel.
The present invention has the beneficial effect that：
An embodiment of the present invention provides a kind of touch-control display panel and touch control display apparatus, specifically, integrated circuit component
When being electrically connected with signal lead-out wire and touch sensor lead-out wire by conducting resinl, conducting resinl includes conducting particles, and conductive
Particle can just play electric action when being compressed into the 80% of its diameter.In compared with prior art, in the embodiment of the present invention
Binding region, distance of the touch sensor lead-out wire apart from upper surface of base plate, with signal lead-out wire apart from upper surface of base plate away from
From difference, be less than conducting particles diameter 80%, pass through conducting resinl and signal lead-out wire so as to avoid integrated circuit component
When being electrically connected with touch sensor lead-out wire, generate poor contact the phenomenon that, improve product yield.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram for touch-control display panel that the prior art provides；
Fig. 2 (a) and Fig. 2 (b) is respectively a kind of structural schematic diagram of touch-control display panel provided in an embodiment of the present invention；
Fig. 3 is the structural schematic diagram of second of touch-control display panel provided in an embodiment of the present invention；
Fig. 4 is a kind of vertical view of touch sensor provided in an embodiment of the present invention；
Fig. 5 is the structural schematic diagram of the third touch-control display panel provided in an embodiment of the present invention；
Fig. 6 is the structural schematic diagram of the 4th kind of touch-control display panel provided in an embodiment of the present invention；
Fig. 7 is the structural schematic diagram of the 5th kind of touch-control display panel provided in an embodiment of the present invention；
Fig. 8 (a), Fig. 8 (b) and Fig. 8 (c) are respectively three of the 6th kind of touch-control display panel provided in an embodiment of the present invention
Structural schematic diagram；
Fig. 9 (a), Fig. 9 (b) and Fig. 9 (c) are respectively three of the 7th kind of touch-control display panel provided in an embodiment of the present invention
Structural schematic diagram；
Figure 10 is the structural schematic diagram of the 8th kind of touch-control display panel provided in an embodiment of the present invention.
Specific implementation mode
To make the objectives, technical solutions, and advantages of the present invention clearer, below in conjunction with attached drawing to the present invention make into
It is described in detail to one step, it is clear that described embodiments are only a part of the embodiments of the present invention, rather than whole implementation
Example.Based on the embodiments of the present invention, obtained by those of ordinary skill in the art without making creative efforts
All other embodiment, shall fall within the protection scope of the present invention.
A kind of touch-control display panel of present invention offer and touch control display apparatus, with to avoid in binding region, signal is drawn
The phenomenon that line and touch sensor lead-out wire generate poor contact when being bound with integrated circuit component, improves product yield.
Below in conjunction with the accompanying drawings, to the specific implementation of touch-control display panel provided in an embodiment of the present invention and touch control display apparatus
Mode is described in detail.
The thickness of each film layer and shape do not reflect that actual proportions, purpose are schematically illustrate the content of present invention in attached drawing.
The structure of touch-control display panel provided in an embodiment of the present invention is described below in detail.Referring to Fig. 2 (a), the present invention is real
A kind of touch-control display panel of example offer is provided, there is the display area A and binding region B adjacent with display area；Along Fig. 2
(a) direction of a-a1 is cut in, obtains schematic cross-section shown in Fig. 2 (b), referring to Fig. 2 (b), touch-control display panel packet
It includes：Substrate 01, substrate 01 include the upper surface of base plate 011 being oppositely arranged and base lower surface 012；It is set to upper surface of base plate
The thin film transistor (TFT) 02 that 011 side is arranged in array, and the signal lead-out wire 03 that is electrically connected with thin film transistor (TFT) 02, signal draws
Outlet 03 extends to binding region B；It is set to the touch sensor 04 of 011 side of upper surface of base plate, and and touch sensor
The touch sensor lead-out wire 05 of 04 electrical connection, touch sensor lead-out wire 05 extend to binding region B；And it is set to and ties up
Determine the integrated circuit component 06 of region B, integrated circuit component 06 passes through conducting resinl 07 and signal lead-out wire 03 and touch sensor
Lead-out wire 05 is electrically connected, and conducting resinl 07 includes conducting particles 071.
Wherein, the thickness of upper surface of base plate 011 of the touch sensor lead-out wire 05 far from one lateral extent substrate of substrate is d1,
The thickness of upper surface of base plate 011 of the signal lead-out wire 03 far from one lateral extent substrate of substrate is d2, conducting particles in conducting resinl 07
071 a diameter of d3, the relationship of d1, d2, d3 meet condition：D1-d2 ＜ d3*80%.
Usually, the conducting resinl in the embodiment of the present invention is aeolotropic conductive, which is a kind of for electronics
The conductive glue of component package has unidirectional (up rightness is connected, parallel to be not turned on) conductive and the fixed function of gluing.It is conductive
Glue includes the conducting particles of monolayer distribution.The mechanism that it is connected in simple terms, after applying suitable pressure to glue, conductive particle
Son can be deformed under the pressure between upper layer and lower layer, when conducting particles be depressed into less than or equal to diameter itself 80% it
Afterwards, which has electric action, therefore conducting resinl has electric action, by integrated circuit component and signal lead-out wire with
And touch sensor lead-out wire is electrically connected.
In compared with prior art, in binding region in the embodiment of the present invention, touch sensor lead-out wire is apart from substrate upper table
The distance in face, the difference of the distance with signal lead-out wire apart from upper surface of base plate are less than the 80% of conducting particles diameter, to keep away
When having exempted from integrated circuit component and being electrically connected with signal lead-out wire and touch sensor lead-out wire by conducting resinl, poor contact is generated
The phenomenon that, improve product yield.
In order to further illustrate the present invention embodiment provide touch-control display panel, below for display area structure into
Row detailed description.
In some optional realization methods, in the display area of touch-control display panel, referring to Fig. 2 (b), in substrate upper table
Thin film transistor (TFT) 02 is provided on face 011, wherein thin film transistor (TFT) 02 according to far from upper surface of base plate direction, include successively：
Semiconductor active layer 021, wherein semiconductor active layer 021 include shape by doped N-type foreign ion or p type impurity ion
At source region and drain region, and the impurity that undopes between source region and drain region channel region；
Gate insulating layer 022, gate metal layer 023 and interlayer insulating film 024 are formed on semiconductor active layer 021, and exhausted in interlayer
The figure of source electrode 025 and drain electrode 026 is formed in edge layer 024, source electrode 025 and drain electrode 026 pass through gate insulating layer 022 and layer respectively
Between source region and drain region in contact hole electrical connection semiconductor active layer in insulating layer 024.It should be noted that figure
2 (b) illustratively illustrates a kind of film layer structure of the thin film transistor (TFT) of top gate type, and the present disclosure applies equally to bottom gate thin films
The other kinds of thin film transistor (TFT) such as transistor, the present invention are not particularly limited the concrete structure type of thin film transistor (TFT).
In some optional realization methods, the signal lead-out wire 03 in the embodiment of the present invention is electrically connected with thin film transistor (TFT)
Connect, signal lead-out wire 03 include the scan line being connect with the gate metal layer of thin film transistor (TFT) 023 or with thin film transistor (TFT)
The data line that source electrode 025 connects, optionally, signal lead-out wire 03 include connecting with the gate metal layer of thin film transistor (TFT) 023 simultaneously
The scan line connect and the data line being connect with the source electrode 025 of thin film transistor (TFT).
In some optional realization methods, referring to Fig. 2 (b), the touch-control display panel in the embodiment of the present invention further includes：
The luminescent device 08 being arranged between thin film transistor (TFT) 02 and touch sensor 04, and cover the thin-film package of luminescent device 08
Layer 09, touch sensor 04 is located at side of the thin-film encapsulation layer 09 far from substrate.Wherein, luminescent device 08 is according to brilliant far from film
The direction of body pipe 02 includes successively：First electrode layer 081, pixel defining layer 082, luminescent layer 083 and the second electrode lay 084.Its
In, first electrode layer 081 and source electrode 025 or drain electrode 026 be electrically connecteds that (first electrode layer 081 026 is electrically connected with draining in Fig. 2 (b)
It connects).Wherein, luminescent layer can be formed by low molecular weight organic material or high molecular material, and luminescent layer includes organic emission layer, also
May include in hole injection layer (HIL), hole transmission layer (HTL), electron transfer layer (ETL) and electron injecting layer (EIL)
It is at least one.Wherein, first electrode layer and the second electrode lay can be transparent electrode, or be reflecting electrode.First electrode layer
For transparent electrode when, may include tin indium oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO) or indium oxide (In2O3)
Deng；When first electrode layer is reflecting electrode, reflecting layer can be by Ag, magnesium (Mg), Al, Pt, Pd, Au, Ni, Nd, iridium (Ir), Cr
Or their mixture is formed, and ITO, IZO, ZnO or In2O3 etc. can be formed on the reflecting layer；The second electrode lay
For transparent electrode when, may include such as lithium (Li), calcium (Ca), lithium fluoride/calcium (LiF/Ca), lithium fluoride/aluminium (LiF/Al), aluminium
(Al), the compound of magnesium (Mg) or combination thereof, can also by evaporate embryo deposit on the light-emitting layer, and such as ITO,
The transparent electrode forming material of IZO, ZnO or In2O3 etc. can be deposited in the compound；When second electrode is reflecting electrode
When, it can be by using Li, Ca, LiF/Ca, LiF/Al, Al, Mg or their mixture to evaporate in the whole surface of substrate
To form the second electrode lay.It should be noted that in embodiment provided by the invention, thin-film encapsulation layer is located at touch sensor
It is illustrated for side far from substrate, in other optional realization methods, it is aobvious that touch sensor can be integrated in touch-control
Show that panel other positions, such as touch sensor can be integrated in luminescent device 08.
Optionally, luminescent device 08 is arranged in array, and each luminescent device 08 is electrically connected with a thin film transistor (TFT) 02.
Thin-film encapsulation layer 09 covers luminescent device 08, with to avoid luminescent device 08, by outside air or moisture damage, and film seals
Fill the display area that layer 09 covers touch-control display panel.Thin-film encapsulation layer 09 is located at 08 top of luminescent device, and thin-film encapsulation layer is protected
Take care of hair photosphere and other thin layers from outside moisture and oxygen etc. influence.Optionally, thin-film encapsulation layer includes inorganic layer and organic
Layer or inorganic layer and organic layer are staggeredly stacked.
In some optional realization methods, further include in touch-control display panel：It is arranged in the source of thin film transistor (TFT) 02
Passivation layer 010 between pole 025 and 026 place film layer of drain electrode and luminescent device 08 and planarization layer 211.Wherein, luminescent device
First electrode layer 081 in 08 passes through the used via for wearing passivation layer 010 and planarization layer 211 and the drain electrode in thin film transistor (TFT) 02
026 electrical connection.Wherein, planarization layer 211 is arranged between passivation layer 010 and first electrode layer 081, and pixel defining layer 082 is set
It sets between first electrode layer 081 and luminescent layer 083, and pixel defining layer 082 is arranged above planarization layer 211 and covers
The fringe region of first electrode layer 081.Planarization layer 211 includes acryl, polyimides (PI) or benzocyclobutene (BCB) etc.
Organic layer.Pixel defining layer includes polyimides (PI), polyamide, benzocyclobutene (BCB), acryl resin or phenolic aldehyde tree
The organic material of fat etc..Electrode dielectric layer is made by organic material or inorganic material makes.
Referring to Fig. 3, optionally, touch sensor provided in an embodiment of the present invention includes：Electrode dielectric layer 041, first leads
Electric layer 042 and the second conductive layer 043, electrode dielectric layer 041 is between the first conductive layer 042 and the second conductive layer 043.Its
In, touch sensor includes the touch-control of the touch drive electrode and touch-control sensing electrode or different layer structure setting of same layer setting
Driving electrodes and touch-control sensing electrode are only carried out by taking the touch drive electrode of same layer setting and touch-control sensing electrode as an example in Fig. 3
It draws and illustrates, but be not limited to the structure that Fig. 3 includes.
On the one hand, the first conductive layer 042 in touch sensor includes touch drive electrode and the touch-control sense of mutually insulated
It includes bridge conducting wire to answer electrode, the second conductive layer 043, wherein touch sensor lead-out wire includes being electrically connected with touch drive electrode
The touch drive electrode lead-out wire connect and the touch-control sensing electrode outlet line being electrically connected with touch-control sensing electrode.Specifically, it is formed
In a kind of optional realization method of the structure of touch sensor, touch drive electrode is formed on the surface of thin-film encapsulation layer first
With touch-control sensing electrode, electrode dielectric layer then is formed in touch drive electrode and touch-control sensing electrode, it is finally exhausted in electrode
Bridge conducting wire is formed in edge layer, wherein the area for forming electrode dielectric layer only includes bridge region.Touch shown in Figure 4
The overlooking structure diagram of sensor, wherein the first conductive layer includes touch drive electrode 0421 and the touch-control sense of mutually insulated
It, for connecting adjacent touch-control sensing electrode 0422, further includes being driven for insulating layer touch-control to answer electrode 0422, the second conductive layer 043
The electrode dielectric layer 041 of moving electrode 0421 and touch-control sensing electrode 0422.Wherein, Fig. 4 is only the schematic diagram of one embodiment, this
The touch-control display panel that inventive embodiments provide is not limited to the structure of touch sensor shown in Fig. 4.
In the prior art, the operating mode of touch sensor is mutual capacitance type and self-capacitance, and illustratively, the present invention is real
It applies example and there is provided herein a kind of touch sensor of mutual capacitance type and a kind of touch sensor of self-capacitance.The embodiment of the present invention
In the touch sensor of the mutual capacitance type of offer, including touch drive electrode and touch-control sensing electrode, touch drive electrode and touch
Electric field is formed between control induction electrode, for detecting touch control operation.Self-capacitance touch sensor provided in an embodiment of the present invention
In, including touch control electrode, touch control electrode independent detection touch control operation.In the touch sensor of mutual capacitance type, touch sensor
In the first conductive layer 042 include touch drive electrode, the second conductive layer 043 include touch-control sensing electrode；Touch sensor draws
Outlet 05 includes the touch drive electrode lead-out wire being electrically connected with touch drive electrode and is electrically connected with touch-control sensing electrode tactile
Control induction electrode lead-out wire.Alternatively, the first conductive layer 042 in touch sensor includes touch-control sensing electrode, the second conductive layer
043 includes touch drive electrode；Touch sensor lead-out wire 05 includes the touch drive electrode being electrically connected with touch drive electrode
Lead-out wire and the touch-control sensing electrode outlet line being electrically connected with touch-control sensing electrode.In the touch sensor of self-capacitance, the
One conductive layer 042 and the second conductive layer 043 include touch control electrode, touch control electrode independent detection touch control operation, touch sensor
Lead-out wire 05 includes the touch control electrode lead-out wire being electrically connected with the touch control electrode in the first conductive layer 042 and the second conductive layer 043.
According to the structure of the display area of above-mentioned touch-control display panel, below for binding region structure further from each
Kind situation is described.The embodiment of the present invention illustratively provides three kinds of embodiments of the structure of binding region herein.
Situation one：
Referring to Fig. 5, the binding region B of touch-control display panel provided in an embodiment of the present invention, touch sensor lead-out wire 05
Region includes successively according to the direction far from substrate 01：First insulating layer 30 and touch sensor lead-out wire 05.Signal draws
03 region of outlet only includes according to the direction far from substrate 01：Signal lead-out wire 03.
Specifically, the first insulating layer 30 in the embodiment of the present invention can be that one layer of structure or multilayered structure form.This
Only with insulating layer include that single layer structure is either illustrated for double-layer structure or three-decker in inventive embodiments.
Further, the first insulating layer 30 is single layer structure, and the first insulating layer 30 and passivation layer 010, planarization layer 211, pixel are fixed
Any one layer among adopted layer 082 is formed in same procedure.Alternatively, the first insulating layer 30 includes double-layer structure, two layers of knot
Structure is formed with arbitrary two layers among passivation layer 010, planarization layer 211, pixel defining layer 082 in same procedure respectively.
Alternatively, the first insulating layer 30 include three-decker, three-decker respectively with passivation layer 010, planarization layer 211, pixel defining layer
082 forms in same procedure.
Situation two：
Referring to Fig. 6, the binding region B of touch-control display panel provided in an embodiment of the present invention, touch sensor lead-out wire 05
Region includes successively according to the direction far from substrate 01：Second insulating layer 31, the first insulating layer 30 and touch sensor draw
Outlet 05.03 region of signal lead-out wire only includes according to the direction far from substrate 01：Second insulating layer 31 and signal are drawn
Line 03.
Specifically, the first insulating layer 30 in the embodiment of the present invention can be that one layer of structure or multilayered structure form.This
Only with insulating layer include that single layer structure is either illustrated for double-layer structure or three-decker in inventive embodiments.
Further, the first insulating layer 30 is single layer structure, and the first insulating layer 30 and passivation layer 010, planarization layer 211, pixel are fixed
Any one layer among adopted layer 082 is formed in same procedure.Alternatively, the first insulating layer 30 includes double-layer structure, two layers of knot
Structure is formed with arbitrary two layers among passivation layer 010, planarization layer 211, pixel defining layer 082 in same procedure respectively.
Alternatively, the first insulating layer 30 include three-decker, three-decker respectively with passivation layer 010, planarization layer 211, pixel defining layer
082 forms in same procedure.
Second insulating layer in the embodiment of the present invention may include single layer structure or double-layer structure.Specifically, second absolutely
Edge layer 31 is formed with any one layer in gate insulating layer 022, interlayer insulating film 024 in same procedure；Alternatively, second is exhausted
Edge layer 31 include double-layer structure, double-layer structure respectively with gate insulating layer 022, interlayer insulating film 024 in same procedure shape
At.
Accordingly one and the touch-control display panel in situation two structure, meet formula to realize：D1-d2 ＜
D3*80% can be improved the first insulating layer, you can groove, general and touch sensor to be arranged in the first insulating layer
Lead-out wire is arranged in groove.So that a lateral extent upper surface of base plate of the touch sensor lead-out wire far from substrate, with letter
Difference in height between a number lateral extent thereon plate of the lead-out wire far from substrate is less than the 80% of conducting particles diameter.
In some optional realization methods, the setting of the depth of groove it is larger so that touch sensor lead-out wire
The thickness of 05 upper surface of base plate 011 far from one lateral extent substrate of substrate, with signal lead-out wire 03 far from one lateral extent base of substrate
The thickness of the upper surface of base plate 011 of plate is equal.I.e.：D1=d2, it is shown in Figure 7.Alternatively, drawing being used to form touch sensor
The region of outlet etches away the first insulating layer, so that a lateral extent substrate of the touch sensor lead-out wire far from substrate
Difference in height is not present between upper surface, with a lateral extent thereon plate of the signal lead-out wire far from substrate.
It is carried out below by specific embodiment and in conjunction with attached drawing to the structure of the binding region of touch-control display panel detailed
Description.It should be noted that the embodiment that the embodiment of the present invention is based only upon in situation two is specifically described.
For example, being only described in detail so that the first insulating layer is single layer structure as an example, but it is not limited to the first insulating layer only
For single layer structure.
In some optional realization methods, the first insulating layer 30 and passivation layer 010, planarization layer 211, pixel defining layer
Any one layer among 082 is formed in same procedure.For example, when forming passivation layer 010 in touch-control display panel, tying up
Determine to form passivation layer on the substrate in region, therefore, the first insulating layer of binding region and the passivation layer of touch-control display panel are simultaneously
It is formed.Alternatively, when the display area of touch-control display panel forms planarization layer, planarization is formed on the substrate of binding region
Layer, therefore, the first insulating layer of binding region and the planarization layer of touch-control display panel are formed simultaneously.Alternatively, being shown in touch-control
While the display area of panel forms pixel defining layer, pixel defining layer is formed on the substrate of binding region, therefore, binding
The pixel defining layer of first insulating layer in region and the display area of touch-control display panel is formed simultaneously.
Referring to Fig. 8 (a), Fig. 8 (b) and Fig. 8 (c), the first insulating layer 30 in touch-control display panel is single layer structure, is being tied up
Determine region includes successively according to the direction far from substrate：Substrate 01, second insulating layer 31, signal lead-out wire 03, the first insulating layer
30 and touch sensor lead-out wire 05.Wherein, second insulating layer 31 include double-layer structure, and with the gate insulating layer of display area
022, interlayer insulating film 024 is formed in same procedure.Wherein, referring to Fig. 8 (a), the first insulating layer 30 and touch-control display surface
The passivation layer 010 of the display area of plate is formed simultaneously, and fluted 101 are arranged in the first insulating layer 30, and touch sensor is drawn
Line 05 is arranged in groove.Referring to Fig. 8 (b), the planarization layer 211 of the first insulating layer 30 and the display area of touch-control display panel
It is formed simultaneously, and fluted 101 is arranged in the first insulating layer 30, touch sensor lead-out wire 05 is arranged in groove 101.Referring to
Fig. 8 (c), the first insulating layer 30 and the pixel defining layer 082 of the display area of touch-control display panel are formed simultaneously, and the first insulation
Fluted 101 are arranged in layer 30, touch sensor lead-out wire 05 is arranged in groove 101.
In some optional realization methods, the first insulating layer and appointing among planarization layer, pixel defining layer, passivation layer
Anticipating, layer of material is identical, thickness is identical.Specifically, in same manufacturing process, same film layer can be etched by etching technics,
When to form planarization layer in touch display area, first is formed above the film layer described in the signal lead-out wire of binding region
Insulating layer, the material and thickness of the first insulating layer formed in this way are identical as the material of planarization layer, thickness.Alternatively, same
In one manufacturing process, same film layer can be etched by etching technics, to form pixel defining layer in touch display area
When, the first insulating layer is formed where the signal lead-out wire in binding region above film layer, the material of the first insulating layer formed in this way
Material and thickness are identical as the material of pixel defining layer, thickness.In same manufacturing process, it can be etched by etching technics same
One film layer, when to form passivation layer in touch display area, film layer shape where the signal lead-out wire in binding region
At the first insulating layer, the material and thickness of the first insulating layer formed in this way are identical as the material of passivation layer, thickness.
In some optional realization methods, when the material of the first insulating layer, thickness and planarization layer, pixel defining layer,
When arbitrary layer of material among passivation layer is identical, thickness is identical, in the first insulating layer with the nonoverlapping area of signal lead-out wire
Groove is arranged in domain, wherein since the thickness of planarization layer and the thickness of pixel defining layer are all higher than the thickness of passivation layer, because
This, when groove being arranged in planarization layer or pixel defining layer, the depth of groove is more than the depth of the groove in passivation layer.
It, can when groove is set in planarization layer, pixel defining layer or passivation layer in some optional realization methods
It is performed etching in the region that will form touch sensor lead-out wire with the technique using etching, forms groove, the depth of the groove
Degree can be set according to actual conditions.For example, can be when etching the first insulating layer formation groove so that groove, which becomes, to be passed through
Wear the via of the first insulating layer, or the groove not through the first insulating layer.It is not specifically limited herein.
Optionally, the groove of the first insulating layer can be the mistake through passivation layer, planarization layer and/or pixel defining layer
Hole, and touch sensor lead-out wire is formed at via, so that a lateral extent of the touch sensor lead-out wire far from substrate
Upper surface of base plate is equal with the height of a lateral extent upper surface of base plate of the signal lead-out wire far from substrate.
It should be noted that signal lead-out wire and touch sensor lead-out wire are not overlapped in the projection of binding region.And
When forming the first insulating layer above signal lead-out wire, needs to perform etching the first insulating layer right over signal lead-out wire, make
It is exposed to obtain signal lead-out wire.
For example, be only described so that the first insulating layer is double-layer structure as an example, but it is only bilayer to be not limited to the first insulating layer
Structure.
Specifically, the first insulating layer 30 and arbitrary two among passivation layer 010, planarization layer 211, pixel defining layer 082
Layer is formed in same procedure.For example, when forming passivation layer 010 and planarization layer 211 in touch-control display panel, binding
The first insulating layer is formed above film layer where the signal lead-out wire in region, therefore, the first insulating layer and touch-control of binding region are aobvious
The passivation layer and planarization layer for showing the display area of panel are formed simultaneously.Alternatively, the display area in touch-control display panel is formed
When planarization layer 211, pixel defining layer 082, the first insulating layer is formed where the signal lead-out wire in binding region above film layer,
Therefore, the planarization layer 211 of the display area of the first insulating layer and touch-control display panel of binding region, pixel defining layer 082
It is formed simultaneously.Alternatively, touch-control display panel display area formed passivation layer 010, planarization layer 211, when, in binding region
Signal lead-out wire where form the first insulating layer above film layer, therefore, the first insulating layer and the touch-control display surface of binding region
Passivation layer 010, the planarization layer 211 of the display area of plate are formed simultaneously.
Referring to Fig. 9 (a), Fig. 9 (b) and Fig. 9 (c), the first insulating layer 30 is double-layer structure, in binding region, according to separate
The direction of substrate includes successively：Substrate 01, second insulating layer 31, signal lead-out wire 03, the first insulating layer 30 and touch sensor
Lead-out wire 05.Wherein, second insulating layer 31 include double-layer structure, and with the gate insulating layer of display area 022, interlayer insulating film
024 forms in same procedure.Wherein, referring to Fig. 9 (a), the first insulating layer 30 and the display area of touch-control display panel
Passivation layer 010 and planarization layer 211 are formed simultaneously, and are arranged in the passivation layer 010 of binding region and planarization layer 211 fluted
101, touch sensor lead-out wire 05 is arranged in groove.Referring to Fig. 9 (b), the first insulating layer 30 is aobvious with touch-control display panel
The planarization layer 211 and pixel defining layer 082 for showing region are formed simultaneously, and the planarization layer 211 and pixel definition of binding region
Fluted 101 are arranged in layer 082, touch sensor lead-out wire 05 is arranged in groove 101.Referring to Fig. 9 (c), the first insulating layer
30 are formed simultaneously with the pixel defining layer 082 and passivation layer 010 of the display area of touch-control display panel, and the pixel of binding region
Fluted 101 are arranged in definition layer 082 and passivation layer 010, touch sensor lead-out wire 05 is arranged in groove 101.
In some optional realization methods, the first insulating layer and appointing among planarization layer, pixel defining layer, passivation layer
Materials at two layers of anticipating is identical, thickness is identical.Specifically, in same manufacturing process, same film layer can be etched by etching technics,
When to form planarization layer and passivation layer in touch display area, above the film layer described in the signal lead-out wire of binding region
The first insulating layer is formed, material, the thickness of the material and thickness and planarization layer and passivation layer of the first insulating layer formed in this way
It is identical.Alternatively, in same manufacturing process, same film layer can be etched by etching technics, in touch display area
When forming pixel defining layer and planarization layer, the first insulating layer is formed where the signal lead-out wire in binding region above film layer,
The material and thickness of the first insulating layer formed in this way are identical as the material of pixel defining layer and planarization layer, thickness.Same
In one manufacturing process, same film layer can be etched by etching technics, to form passivation layer and picture in touch display area
When plain definition layer, film layer where the signal lead-out wire in binding region forms the first insulating layer, and first formed in this way is absolutely
The material and thickness of edge layer are identical as passivation layer and the material of pixel defining layer, thickness.
In some optional realization methods, when the material of the first insulating layer, thickness and planarization layer, pixel defining layer,
When arbitrary materials at two layers among passivation layer is identical, thickness is identical, in the first insulating layer with the nonoverlapping area of signal lead-out wire
Groove is arranged in domain, wherein since the thickness of planarization layer and the thickness of pixel defining layer are all higher than the thickness of passivation layer, because
This, is when the first insulating layer is formed simultaneously with planarization layer and pixel defining layer, when forming groove in the first insulating layer, groove
Depth at least run through pixel defining layer so that difference in height between touch sensor lead-out wire and signal lead-out wire is less than conduction
The 80% of particle diameter.
In some optional realization methods, when groove is set in planarization layer, pixel defining layer and/or passivation layer,
The technique that etching may be used performs etching in the region that will form touch sensor lead-out wire, forms groove, the groove
Depth can be set according to actual conditions.For example, can be when etching the first insulating layer formation groove so that groove becomes
Through the via of the first insulating layer, or not through the groove of the first insulating layer.It is not specifically limited herein.
Optionally, the groove of the first insulating layer can be the mistake through passivation layer, planarization layer and/or pixel defining layer
Hole, and touch sensor lead-out wire is formed at via, so that a lateral extent of the touch sensor lead-out wire far from substrate
Upper surface of base plate is equal with the height of a lateral extent upper surface of base plate of the signal lead-out wire far from substrate.
It should be noted that signal lead-out wire and touch sensor lead-out wire are not overlapped in the projection of binding region.And
When forming the first insulating layer above signal lead-out wire, needs to perform etching the first insulating layer right over signal lead-out wire, make
It is exposed to obtain signal lead-out wire.
For example, being only described in detail so that the first insulating layer is three-decker as an example, but it is not limited to the first insulating layer and is
Three-decker.
Specifically, the first insulating layer 30 include three-decker, and each layer with passivation layer 010, planarization layer 211, as
Three layers in plain definition layer 082 form in same procedure.That is, forming passivation layer in the display area of touch-control display panel
010, when planarization layer 211, pixel defining layer 082, passivation layer 010, flat is formed simultaneously in the binding region of touch-control display panel
Smoothization layer 211, pixel defining layer 082 so that the first insulating layer and touch-control display panel of the binding region of touch-control display panel
Passivation layer, planarization layer, pixel defining layer be formed simultaneously.
Referring to Figure 10, the first insulating layer 30 in touch-control display panel is three-decker, in binding region according to far from base
The direction of plate includes successively：Substrate 01, second insulating layer 31, signal lead-out wire 03, the first insulating layer 30 and touch sensor draw
Outlet 05.Wherein, second insulating layer 31 include double-layer structure, and with the gate insulating layer of display area 022, interlayer insulating film
024 forms in same procedure.Passivation layer 010, the planarization layer of first insulating layer 30 and touch-control display panel display area
211, pixel defining layer 082 is formed simultaneously, and fluted 101 are arranged in the first insulating layer, and touch sensor lead-out wire 05 is arranged
In groove.
In some optional realization methods, the first insulating layer and planarization layer, the material of pixel defining layer, three layers of passivation layer
Expect that identical, thickness is identical.Therefore, the thickness of the first insulating layer be planarization layer, pixel defining layer, passivation layer threeply degree it
With, in order to enable a lateral extent upper surface of base plate of the touch sensor lead-out wire far from substrate, with signal lead-out wire far from substrate
A lateral extent upper surface of base plate between difference in height be less than conducting particles diameter 80%, groove is set in the first insulating layer
101, and the groove at least runs through pixel defining layer 082 and planarization layer 211.
Optionally, the groove of the first insulating layer can be the via through passivation layer, planarization layer and pixel defining layer, and
Touch sensor lead-out wire is formed at via, so that on a lateral extent substrate of the touch sensor lead-out wire far from substrate
Surface, it is equal with the height of a lateral extent upper surface of base plate of the signal lead-out wire far from substrate.
It should be noted that signal lead-out wire and touch sensor lead-out wire are not overlapped in the projection of binding region.And
When forming the first insulating layer above signal lead-out wire, needs to perform etching the first insulating layer right over signal lead-out wire, make
It is exposed to obtain signal lead-out wire.
It should be noted that the signal lead-out wire in the embodiment of the present invention includes the data line being electrically connected with thin film transistor (TFT)
And/or the signal wire that scan line or other needs are connect with integrated circuit component.
To sum up, what the embodiment of the present invention reached has the beneficial effect that：
1, the touch-control display panel provided in the embodiment of the present invention, in binding region, touch sensor lead-out wire is apart from base
The distance of plate upper surface, the difference of the distance with signal lead-out wire apart from upper surface of base plate are less than the 80% of conducting particles diameter,
So that touch sensor lead-out wire and signal lead-out wire be with integrated circuit component by conducting resinl when being bound, in conducting resinl
Conducting particles be compressed within the 80% of conducting particles diameter, so as to avoid integrated circuit component pass through conducting resinl with letter
When number lead-out wire and touch sensor lead-out wire are electrically connected, the phenomenon that generating poor contact, product yield is improved.
2, in some optional realization methods, the touch-control display panel that is provided in the embodiment of the present invention passes through first absolutely
Groove is set in edge layer so that a lateral extent upper surface of base plate of the touch sensor lead-out wire far from substrate, with signal lead-out wire
Difference in height between a lateral extent thereon plate far from substrate is less than the 80% of conducting particles diameter, to ensure that signal
Good binding between lead-out wire and touch sensor lead-out wire and integrated circuit component, improves product yield.
3, in some optional realization methods, in the first insulating layer of touch-control display panel provided in the embodiment of the present invention
Including single layer or double-layer structure, to further reduce the parasitism electricity between touch control electrode lead-out wire and signal lead-out wire
Hold, and every layer of structure is not necessarily in addition increase processing step.
4, in some optional realization methods, the touch-control display panel that is provided in the embodiment of the present invention passes through first absolutely
Setting runs through the via of the first insulating layer in edge layer, so that a lateral extent substrate of the touch sensor lead-out wire far from substrate
Upper surface, it is equal with the height of a lateral extent upper surface of base plate of the signal lead-out wire far from substrate, it is good to further ensure binding
Good purpose.
Based on same invention thought, an embodiment of the present invention provides a kind of touch control display apparatus, including the embodiment of the present invention
Any of the above-described kind of the touch-control display panel provided.Optionally, touch control display apparatus provided in an embodiment of the present invention is to include
The touch control display apparatus of OLED light emitting unit.
A kind of touch-control display panel and touch control display apparatus provided in an embodiment of the present invention, have display area and with display
The adjacent binding region in region；Touch-control display panel includes：Substrate, substrate include under the upper surface of base plate and substrate being oppositely arranged
Surface；It is set to the thin film transistor (TFT) that upper surface of base plate side is arranged in array, and the signal being electrically connected with thin film transistor (TFT)
Lead-out wire, signal lead-out wire extend to binding region；It is set to the touch sensor of upper surface of base plate side, and is passed with touching
The touch sensor lead-out wire of sensor electrical connection, touch sensor lead-out wire extend to binding region；And it is set to binding area
The integrated circuit component in domain, integrated circuit component are electrically connected by conducting resinl with signal lead-out wire and touch sensor lead-out wire,
Conducting resinl includes conducting particles；Wherein, upper surface of base plate of the touch sensor lead-out wire far from one lateral extent substrate of substrate
Thickness is d1, and the thickness of upper surface of base plate of the signal lead-out wire far from one lateral extent substrate of substrate is d2, conductive particle in conducting resinl
A diameter of d3 of son, the relationship of d1, d2, d3 meet condition：D1-d2 ＜ d3*80%.Specifically, integrated circuit component is by leading
When electric glue is electrically connected with signal lead-out wire and touch sensor lead-out wire, conducting resinl includes conducting particles, and conducting particles exists
When being compressed into the 80% of its diameter, electric action can be just played.In compared with prior art, in binding area in the embodiment of the present invention
Domain, distance of the touch sensor lead-out wire apart from upper surface of base plate, the difference of the distance with signal lead-out wire apart from upper surface of base plate
Value is less than the 80% of conducting particles diameter, passes through conducting resinl and signal lead-out wire and touch so as to avoid integrated circuit component
Sensor lead-out wire be electrically connected when, generate poor contact the phenomenon that, improve product yield.
Obviously, various changes and modifications can be made to the invention without departing from essence of the invention by those skilled in the art
God and range.In this way, if these modifications and changes of the present invention belongs to the range of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to include these modifications and variations.
Claims (17)
1. a kind of touch-control display panel has display area and the binding region adjacent with the display area；
The touch-control display panel includes：
Substrate, the substrate include the upper surface of base plate and base lower surface being oppositely arranged；
It is set to the thin film transistor (TFT) that the upper surface of base plate side is arranged in array, and is electrically connected with the thin film transistor (TFT)
Signal lead-out wire, the signal lead-out wire extends to the binding region；
It is set to the touch sensor of the upper surface of base plate side, and the touch sensing being electrically connected with the touch sensor
Device lead-out wire, the touch sensor lead-out wire extend to the binding region；And
It is set to the integrated circuit component of the binding region, the integrated circuit component is drawn by conducting resinl and the signal
Line and touch sensor lead-out wire electrical connection, the conducting resinl includes conducting particles；Wherein,
Thickness of the touch sensor lead-out wire far from the upper surface of base plate of substrate described in one lateral extent of the substrate is d1, institute
It is d2 to state thickness of the signal lead-out wire far from the upper surface of base plate of substrate described in one lateral extent of the substrate, is led in the conducting resinl
A diameter of d3 of charged particle, the relationship of d1, d2, d3 meet condition：
D1-d2 ＜ d3*80%.
2. touch-control display panel according to claim 1, which is characterized in that d1=d2.
3. touch-control display panel according to claim 1, which is characterized in that
In the binding region, touch sensor lead-out wire region is wrapped successively according to the direction far from the substrate
It includes：First insulating layer and touch sensor lead-out wire.
4. touch-control display panel according to claim 3, which is characterized in that the touch-control display panel further includes：
The luminescent device being arranged between the thin film transistor (TFT) and the touch sensor, and the covering luminescent device
Thin-film encapsulation layer, the touch sensor are located at side of the thin-film encapsulation layer far from the substrate；Wherein,
The luminescent device includes successively according to far from the direction of the thin film transistor (TFT)：First electrode layer, pixel defining layer, hair
Photosphere and the second electrode lay.
5. touch-control display panel according to claim 4, which is characterized in that the touch-control display panel further includes：
The passivation layer and planarization layer being successively set between the thin film transistor (TFT) and the luminescent device.
6. touch-control display panel according to claim 5, which is characterized in that
First insulating layer is with any one layer among the passivation layer, the planarization layer, the pixel defining layer same
It is formed in one procedure.
7. touch-control display panel according to claim 5, which is characterized in that
First insulating layer includes double-layer structure, the double-layer structure respectively with the passivation layer, planarization layer, described
It is formed in same procedure for arbitrary two layers among pixel defining layer.
8. touch-control display panel according to claim 5, which is characterized in that
First insulating layer includes three-decker, the three-decker respectively with the passivation layer, planarization layer, described
Pixel defining layer is formed in same procedure.
9. according to the touch-control display panel described in any claims of claim 6-8, which is characterized in that
There is first insulating layer of the binding region groove, the touch sensor lead-out wire to be arranged in the groove.
10. touch-control display panel according to claim 3, which is characterized in that
Further include second insulating layer between the binding region, the first insulating layer place film layer and the substrate；
In the binding region, signal lead-out wire region includes successively according to the direction far from the substrate：Second
Insulating layer and signal lead-out wire.
11. touch-control display panel according to claim 10, which is characterized in that
The thin film transistor (TFT) includes successively according to far from the direction of the substrate：Semiconductor film, gate insulating layer, grid gold
Belong to layer, interlayer insulating film and Source and drain metal level.
12. touch-control display panel according to claim 11, which is characterized in that
The second insulating layer is formed with any one layer in the gate insulating layer, interlayer insulating film in same procedure；
Alternatively,
The second insulating layer includes double-layer structure, and the double-layer structure exists with the gate insulating layer, interlayer insulating film respectively
It is formed in same procedure.
13. touch-control display panel according to claim 1, which is characterized in that the signal lead-out wire include data line and/or
Scan line.
14. touch-control display panel according to claim 1, which is characterized in that the touch sensor include electrode dielectric layer,
First conductive layer and the second conductive layer, the electrode dielectric layer is between first conductive layer and second conductive layer.
15. according to touch-control display panel described in claim 14, which is characterized in that first conductive layer includes bridge conducting wire,
Second conductive layer includes the touch drive electrode and touch-control sensing electrode of mutually insulated；
The touch sensor lead-out wire include the touch drive electrode lead-out wire being electrically connected with the touch drive electrode and with
The touch-control sensing electrode outlet line of the touch-control sensing electrode electrical connection.
16. touch-control display panel according to claim 14, which is characterized in that
First conductive layer includes touch drive electrode, and second conductive layer includes touch-control sensing electrode；Alternatively, described
One conductive layer includes touch-control sensing electrode, and second conductive layer includes touch drive electrode；
The touch sensor lead-out wire include the touch drive electrode lead-out wire being electrically connected with the touch drive electrode and with
The touch-control sensing electrode outlet line of the touch-control sensing electrode electrical connection.
17. a kind of touch control display apparatus, including the touch-control display panel described in any claims of claim 1-16.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110658949A (en) * | 2019-08-29 | 2020-01-07 | 武汉华星光电半导体显示技术有限公司 | Touch display panel, preparation method thereof and touch display device |
| CN112086374A (en) * | 2020-09-29 | 2020-12-15 | 武汉天马微电子有限公司 | Display device, preparation method thereof and electronic equipment |
| CN113838871A (en) * | 2021-09-26 | 2021-12-24 | 京东方科技集团股份有限公司 | Display panel and display device |
| CN114185459A (en) * | 2021-12-11 | 2022-03-15 | 武汉华星光电半导体显示技术有限公司 | Touch display panel and electronic device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102103428A (en) * | 2009-12-18 | 2011-06-22 | 群康科技(深圳)有限公司 | Flexible circuit board combining method of touch display device and touch display device |
| CN202003334U (en) * | 2011-01-20 | 2011-10-05 | 豪威先进股份有限公司 | Touch-control device |
| US20160118416A1 (en) * | 2014-10-28 | 2016-04-28 | Semiconductor Energy Laboratory Co., Ltd. | Display device, manufacturing method of display device, and electronic device |
-
2017
- 2017-03-03 CN CN201710123475.3A patent/CN108336108B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102103428A (en) * | 2009-12-18 | 2011-06-22 | 群康科技(深圳)有限公司 | Flexible circuit board combining method of touch display device and touch display device |
| CN202003334U (en) * | 2011-01-20 | 2011-10-05 | 豪威先进股份有限公司 | Touch-control device |
| US20160118416A1 (en) * | 2014-10-28 | 2016-04-28 | Semiconductor Energy Laboratory Co., Ltd. | Display device, manufacturing method of display device, and electronic device |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110658949A (en) * | 2019-08-29 | 2020-01-07 | 武汉华星光电半导体显示技术有限公司 | Touch display panel, preparation method thereof and touch display device |
| CN110658949B (en) * | 2019-08-29 | 2021-08-24 | 武汉华星光电半导体显示技术有限公司 | Touch display panel, preparation method thereof and touch display device |
| CN112086374A (en) * | 2020-09-29 | 2020-12-15 | 武汉天马微电子有限公司 | Display device, preparation method thereof and electronic equipment |
| CN113838871A (en) * | 2021-09-26 | 2021-12-24 | 京东方科技集团股份有限公司 | Display panel and display device |
| CN114185459A (en) * | 2021-12-11 | 2022-03-15 | 武汉华星光电半导体显示技术有限公司 | Touch display panel and electronic device |
| CN114185459B (en) * | 2021-12-11 | 2023-06-27 | 武汉华星光电半导体显示技术有限公司 | Touch display panel and electronic device |
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