CN108330317A - A kind of high-performance copper ferrophosphor(us) and preparation method thereof - Google Patents
A kind of high-performance copper ferrophosphor(us) and preparation method thereof Download PDFInfo
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- CN108330317A CN108330317A CN201810466995.9A CN201810466995A CN108330317A CN 108330317 A CN108330317 A CN 108330317A CN 201810466995 A CN201810466995 A CN 201810466995A CN 108330317 A CN108330317 A CN 108330317A
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/05—Mixtures of metal powder with non-metallic powder
Abstract
The present invention provides a kind of high-performance copper ferrophosphor(us), the ingredient of the high-performance copper ferrophosphor(us) is：The Fe of 1~1.15wt%；The P of 0.01~0.04wt%；Surplus is Cu and inevitable impurity；Crystallite dimension≤30nm of the high-performance copper ferrophosphor(us).The present invention provides a kind of preparation methods of high-performance copper ferrophosphor(us), including：Copper powder, iron powder and phosphorus powder are subjected to ball milling, obtain Nanometer Copper ferrophosphor(us) powder；The Nanometer Copper ferrophosphor(us) powder is subjected to cold moudling, obtains green body；The green body is sintered under stress, obtains high-performance copper ferrophosphor(us).High-performance copper ferrophosphor(us) provided by the invention has nanostructure, can generate refined crystalline strengthening, high-performance copper ferrophosphor(us) provided by the invention has good tensile strength and conductivity simultaneously.The experimental results showed that intensity >=600MPa of high-performance copper ferrophosphor(us) provided by the invention, conductivity >=80%IACS.
Description
Technical field
The present invention relates to technical field of alloy more particularly to a kind of high-performance copper ferrophosphor(us) and preparation method thereof.
Background technology
Cu-Fe-P systems alloy dosage in terms of circuit lead frame material is maximum, accounts for 65% or more.Cu-Fe-P systems
Alloy can be divided into two major classes by performance characteristics：The first is highly conductive class alloy, is made of 99% or more copper, is precipitated
The intermetallic compound of hardening is Fe2P.Such alloy property is generally conductivity (80~90) %IACS, and tensile strength exists
For 400MPa hereinafter, typical represent alloy as KFC, alloying component is (mass fraction, %) Cu-0.1~0.15Fe-0.03P.The
Two kinds are intensity class alloy in middle conduction, and the Typical Representative of such alloy is C194, and alloying component is (mass fraction, %)
The disperse phase of Cu-2.3Fe-Zn-0.03P, precipitation strength are intermetallic compound Fe2P and simple substance Fe, the conductivity of such alloy
Can be more than 60%IACS, tensile strength is within the scope of 500~600MPa.
Lead frame plays a part of supporting chip, connection circuit and heat dissipation in IC interior, to ensure integrated electricity
The reliability and durability on road have higher requirement to high-performance copper ferrophosphor(us) lead material, how to realize simultaneously high-strength
(600MPa or more) is spent with high conductance (80%IACS or more) into urgent problem.High-strength highly-conductive high-performance is obtained at present
The approach of copper and iron phosphorus alloy has：First, introducing more trace alloying elements, such as Zn, Sn, Mg, solution strengthening is realized；Second is that shape
Become and strengthen, by carrying out cold plastic deformation to copper alloy to improve its intensity, hardness.
Alloy strength can be properly increased by adding more trace alloying elements, but there is also many problems simultaneously, according to conjunction
Aurification is theoretical, and the degree of alloying is higher, and the intensity of alloy is higher, but conductivity is relatively low；If conductivity increases, intensity
It then reduces, reaches the conductivity of 80%IACS or more therefore, it is difficult to meet simultaneously and have both the requirement of 600MPa or more intensity.
Also, type and its existence form in the alloy and Effect study are added very for the 4th and 4th or more constituent element at present
It is insufficient.
Working hardening is common one of the reinforcing means of copper alloy, by carrying out cold plastic deformation to copper alloy to improve
Its intensity and hardness.According to Taylor dislocation Hardening Theories, the major way that metal is plastically deformed is dislocation motion.Cold change
Shape makes to generate a large amount of dislocation increment inside alloy, and hands over cut each other during the motion, forms cutover, hinders the fortune of dislocation
It is dynamic, so that the mobility of dislocation is reduced.After many dislocation interactions, entangled formation dislocation pile up makes the movement of dislocation
Become very difficult, to improve the intensity of Cu alloys.But since Cu-Fe-P alloys are in deformation at room temperature, it may occur that dynamic
Reply and dynamic recrystallization, although increasing comparatively fast in starting stage dislocation, being to continue with deformation process Dislocations density will not be bright
It is aobvious to increase, Gu the working hardening effect of alloy is limited, generally it is used in conjunction with solution strengthening and precipitation strength.Moreover, because system
The method of standby Cu-Fe-P alloys is still traditional melting and Casting Equipment, how to solve it under the conditions of antivacuum founding easily
Oxidation and the suitability for secondary processing (be such as punched, etch, weld, is anti-oxidant) for how improving alloy are still the technology of this field
Problem.
Therefore, how to obtain a kind of while there is high intensity and highly conductive high-performance copper ferrophosphor(us) to become this field skill
Art personnel's urgent problem to be solved.
Invention content
In view of this, the purpose of the present invention is to provide a kind of high-performance copper ferrophosphor(us) and preparation method thereof, the present invention
High-performance copper ferrophosphor(us) that the method for offer is prepared while there is high intensity and high conductivity.
The present invention provides a kind of high-performance copper ferrophosphor(us), the ingredient of the high-performance copper ferrophosphor(us) is：
The Fe of 1~1.15wt%；
The P of 0.01~0.04wt%；
Surplus is Cu and inevitable impurity；
Crystallite dimension≤30nm of the high-performance copper ferrophosphor(us).
Preferably, the crystallite dimension of the high-performance copper ferrophosphor(us) is 15~30nm.
Preferably, tensile strength >=600MPa of the high-performance copper ferrophosphor(us), the high-performance copper ferrophosphor(us)
Conductivity >=80%IACS.
The present invention provides a kind of preparation methods of the high-performance copper ferrophosphor(us) described in above-mentioned technical proposal, including：
Copper powder, iron powder and phosphorus powder are subjected to ball milling, obtain Nanometer Copper ferrophosphor(us) powder；
The Nanometer Copper ferrophosphor(us) powder is subjected to cold moudling, obtains green body；
The green body is sintered under stress, obtains high-performance copper ferrophosphor(us).
Preferably, the granularity of the Nanometer Copper ferrophosphor(us) powder is 5~15nm.
Preferably, the ratio of grinding media to material in the mechanical milling process is (10~20):4；
The rotating speed of the ball milling is 1000~1100 revs/min；
The time of the ball milling is 3~6 hours.
Preferably, the pressure of the cold moudling is 100~500MPa；
The dwell time of the cold moudling is 1~6min.
Preferably, the sintering carries out under protective atmosphere.
Preferably, the temperature of the sintering is 500~700 DEG C；The time of the sintering is 2~10min.
Preferably, the pressure being sintered under stress is 100~200T.
Compared with prior art, the present invention is lived using copper powder, iron powder and phosphorus powder as raw material using high-energy ball milling and pressure auxiliary
Change sintering method, prepares the high intensity with nanostructure, highly conductive high-performance copper ferrophosphor(us).The performance of metal material
Index can be improved with the raising of degree of grain refinement, and the essence of refined crystalline strengthening is the fortune for increasing crystal boundary and effectively hindering dislocation
Dynamic, because the atomic arrangement on crystal boundary is disorderly, the defect concentration of impurity enriched, crystal is very big, and the crystal grain position of crystal boundary both sides to
Also different, these factors hinder dislocation from a crystal grain to another grain movement, and crystal grain is thinner, and crystal boundary total volume is got over
Greatly, also bigger to the resistance of dislocation, the intensity of material is higher.Crystalline size reduces, and alloy strength improves, due to crystal grain refinement
Only grain boundary is made to increase, caused distortion of lattice is small, and the influence to conductivity is little.Crystal grain thinning can be strong in raising material
The electric conductivity of material is improved while spending.The present invention is obtained by high-energy ball milling and in-situ activation sintering technology with ultra-fine
The high-performance copper ferrophosphor(us) of nanostructure.
Specific implementation mode
The technical scheme in the embodiments of the invention will be clearly and completely described below, it is clear that described implementation
Example is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is common
Technical staff it is improved or retouching all other example, shall fall within the protection scope of the present invention.
The present invention provides a kind of high-performance copper ferrophosphor(us), ingredient is：
The Fe of 1~1.15wt%；
The P of 0.01~0.04wt%；
Surplus is Cu and inevitable impurity.
In the present invention, the mass content of the Fe is preferably 1~1.1%；The mass content of the P is preferably 0.02~
0.03%；The mass content of the inevitable impurity is preferably≤0.005%.
In the present invention, the high-performance copper ferrophosphor(us) is the copper and iron phosphorus alloy of nanostructure.In the present invention, described
The crystallite dimension of high-performance copper ferrophosphor(us) preferably≤30nm, more preferably 15~30nm.
In the present invention, the high-performance copper ferrophosphor(us) tensile strength preferably >=600MPa.In the present invention, described
The conductivity of high-performance copper ferrophosphor(us) preferably >=80%IACS.High-performance copper ferrophosphor(us) provided by the invention has good simultaneously
Good tensile strength and conductivity.
The present invention utilizes ball powder-grinding and pressure sintering technology, and the height with nanostructure is prepared by refined crystalline strengthening
Strong height leads copper and iron phosphorus alloy.The present invention provides a kind of preparation sides of the high-performance copper ferrophosphor(us) described in above-mentioned technical proposal
Method, including：
Copper powder, iron powder and phosphorus powder are subjected to ball milling, obtain Nanometer Copper ferrophosphor(us) powder；
The Nanometer Copper ferrophosphor(us) powder is subjected to cold moudling, obtains green body；
The green body is sintered under stress, obtains high-performance copper ferrophosphor(us).
The present invention does not have the type of the copper powder, iron powder and phosphorus powder and source special limitation, using art technology
Copper powder, iron powder and phosphorus powder known to personnel can be bought by market and be obtained.The present invention is to the copper powder, iron powder and phosphorus powder
Granularity does not have special limitation, using the regular particle size of copper powder well known to those skilled in the art, iron powder and phosphorus powder, such as may be used
Using commercially available micron-sized above-mentioned powder.
In the present invention, the dosage and purity of the copper powder, iron powder and phosphorus powder meet the height described in above-mentioned technical proposal
The content ratio of each ingredient in performance copper and iron phosphorus alloy.
In the present invention, the ball milling preferably carries out in the presence of protective gas, and the protective gas is preferably
Inert gas, such as argon gas.In the present invention, the equipment of the ball milling is preferably ball grinder.In the present invention, the mechanical milling process
In ratio of grinding media to material be preferably (10~20)：4, more preferably (12~18)：4, more preferably (14~16)：4, most preferably 15:
4.In the present invention, the rotating speed (rotating speed of the ball mill used when ball milling) of the ball milling is preferably 1000~1100 revs/min, more
Preferably 1020~1080 revs/min, more preferably 1040~1070 revs/min, more preferably 1050~1060 revs/min.In this hair
In bright, the time of the ball milling is preferably 3~6 hours, more preferably 4~5 hours.In the present invention, in the mechanical milling process
It is preferably added to anti-forging agent, anti-forging agent, which is added, can make the more abundant of ball milling, while avoid the knot of various powders in mechanical milling process
Block makes the more uniform of various powder mixing；The anti-forging agent is preferably acetone.
In the present invention, Nanometer Copper ferrophosphor(us) powder is obtained after the ball milling；The Nanometer Copper ferrophosphor(us) powder
Granularity is preferably 5~15nm, more preferably 8~12nm, most preferably 10nm.
In the present invention, the pressure of the cold moudling is preferably 100~500MPa, more preferably 200~400MPa, most
Preferably 250~350MPa.In the present invention, the dwell time during the cold moudling is preferably 1~6min, more preferably
For 2~5min, most preferably 3~4min.
In the present invention, the temperature of the sintering is preferably 500~700 DEG C, more preferably 550~650 DEG C, most preferably
580~620 DEG C；The time of the sintering is preferably 2~10min, more preferably 3~8min, most preferably 4~6min.This hair
The bright low-temperature short-time that 2~10min is carried out at 500~700 DEG C is sintered to a kind of solid-phase sintering, due to above-mentioned gained high-performance copper
Ferrophosphor(us) has reached nanoscale, and specific surface area increases, and activity is higher, and the activation energy that needs are spread in sintering process is relatively low, lacks
Fall into and the obstruction effect of crystal boundary die down, thus in sintering process various alloy powders do not occur melting can sinter molding, this
Invention obtains the alloy block with higher densification using low-temperature sintering technology, to ensure that its excellent performance.
In the present invention, the pressure in the sintering process is preferably 100~200T, more preferably 120~180T, more preferably 140~
160T, most preferably 150T.The present invention is sintered the high-performance copper ferrophosphor(us) production that can avoid being prepared under stress
Angry hole or defect make alloy have good compactness, ensure the performance of alloy.In the present invention, described be sintered is preferably
It is carried out under protective atmosphere, such as argon gas.
In the present invention, the method for the sintering is preferably：
It takes out to be put into mold heat after the green body is kept the temperature at a sintering temperature and pressurize, obtain the conjunction of high-performance copper and iron phosphorus
Gold.
In the present invention, the sintering temperature is consistent with the temperature being sintered described in above-mentioned technical proposal, and details are not described herein.
In the present invention, the time of the heat preservation is preferably 2~6min, more preferably 3~5min.In the present invention, the mold heat
Temperature it is preferably consistent with sintering temperature, i.e., 500~700 DEG C.In the present invention, the pressure and above-mentioned technical proposal of the pressurization
Pressure in the sintering process is consistent, and details are not described herein.In the present invention, the time of the pressurization is preferably 2~3min.
In the present invention, preferably obtained sintered product is processed by shot blasting after the completion of the sintering, obtains high-performance
Copper and iron phosphorus alloy.
Method provided by the invention is obtained by high-energy ball milling and pressure helper activity sintering technology with high-strength
The high-performance copper ferrophosphor(us) of degree, high rigidity and high conductance.Compared with prior art, the present invention is with copper powder, iron powder and phosphorus powder
Raw material prepares the high intensity with nanostructure, highly conductive height using high-energy ball milling and pressure helper activity sintering method
Performance copper and iron phosphorus alloy.Foreign atom, dislocation and point defect in crystal make the place that crystal lattice is periodically destroyed, electricity
Wavelet is produced inhibition by scattering, reduces electric conductivity.The performance indicator of metal material can be with degree of grain refinement
It improves and improves, the essence of reinforcing is the movement for increasing crystal boundary and effectively hindering dislocation, miscellaneous because the atomic arrangement on crystal boundary is disorderly
Matter is enriched with, and the defect concentration of crystal is very big, and the crystal grain position of crystal boundary both sides hinders dislocation from one to also difference, these factors
For crystal grain to another grain movement, crystal grain is thinner, and crystal boundary total volume is bigger, also bigger to the resistance of dislocation, the intensity of material
It is higher.Crystalline size reduces, and alloy strength improves, since crystal grain refinement only makes grain boundary increase, caused distortion of lattice
Small, the influence to conductivity is little.Crystal grain thinning can improve the plasticity of material while improving the strength of materials, due to crystal grain
After refinement, stress concentration when material deforms caused by grain boundaries dislocation pile up can be effectively relieved, and crackle has been postponed
Larger deflection may be implemented before material fracture in germinating.The present invention is obtained by high-energy ball milling and in-situ activation sintering technology
High-performance copper ferrophosphor(us) with superfine nano structure.
The present invention is obtained by high-energy ball milling and pressure helper activity sintering technology with high intensity, high rigidity and height
Conductive Nanometer Copper ferrophosphor(us).Crystallite dimension≤30nm of high-performance copper ferrophosphor(us) provided by the invention, tensile strength >=
600MPa, conductivity >=80%IACS improve the performance of traditional copper ferrophosphor(us), have a vast market foreground.
Raw materials used following embodiment of the present invention is commercial goods.
Embodiment 1
The phosphorus powder of the copper powder of 39.596g, the iron powder of 0.4g and 0.004g is put into ball grinder, ratio of grinding media to material 15:4, add
Enter the acetone of 0.2mL as anti-forging agent, carries out 4 hours ball millings, obtain the mixed metal powder that granularity is 10nm；
The mixed metal powder is subjected to cold moudling in 410MPa pressurizes 1min, obtains green body；
The green body is placed in high temperature furnace, 3min is kept the temperature at 650 DEG C of argon gas condition, green body is taken out and is put into 650 DEG C
In mold heat, 350MPa pressurize 2min are forced into, obtained sintered products are processed by shot blasting, obtains the conjunction of high-performance copper and iron phosphorus
Gold.
According to GB/T 1423-1996《The test method of noble metal and its alloy density》Standard tests the embodiment of the present invention
The density of the 1 high-performance copper ferrophosphor(us) being prepared, testing result are the high-performance copper that the embodiment of the present invention 1 is prepared
The relative density of ferrophosphor(us) is 99.2%, and consistency is higher.
According to GB/T 6394-2002《Metal mean grain size assay method》It is prepared by standard, the test embodiment of the present invention 1
The crystallite dimension of obtained high-performance copper ferrophosphor(us), testing result are the high-performance copper and iron that the embodiment of the present invention 1 is prepared
The crystallite dimension of phosphorus alloy is 20nm.
According to GB/T 228.1-2010《Metal material stretching test part 1：Room temperature test method》Standard, test is originally
The tensile strength for the high-performance copper ferrophosphor(us) that inventive embodiments 1 are prepared, testing result are prepared by the embodiment of the present invention 1
The tensile strength of obtained high-performance copper ferrophosphor(us) is 611MPa.
According to GB/T 6146-2010《Precision electrical resistance alloy method of measuring resistivity》Standard tests the embodiment of the present invention 1
The conductivity for the high-performance copper ferrophosphor(us) being prepared, testing result are the high-performance copper that the embodiment of the present invention 1 is prepared
The conductivity of ferrophosphor(us) is 81%IACS.
Embodiment 2
The phosphorus powder of the copper powder of 39.59g, the iron powder of 0.4g and 0.01g is put into ball grinder, ratio of grinding media to material 15:4, it is added
The acetone of 0.2mL carries out 4 hours ball millings as anti-forging agent, obtains the mixed metal powder that granularity is 15nm；
The mixed metal powder is subjected to cold moudling in 410MPa pressurizes 3min, obtains green body；
The green body is placed in high temperature furnace, 3min is kept the temperature at 650 DEG C of argon gas condition, green body is taken out and is put into 650 DEG C
In mold heat, 350MPa pressurize 3min are forced into, obtained sintered products are processed by shot blasting, obtains the conjunction of high-performance copper and iron phosphorus
Gold.
According to method described in embodiment 1, the high-performance copper ferrophosphor(us) that the embodiment of the present invention 2 is prepared is examined
It surveys, testing result is that the relative density for the high-performance copper ferrophosphor(us) that the embodiment of the present invention 2 is prepared is 99.5%, crystal grain
Size is 25nm, tensile strength 594MPa, conductivity 82%IACS.
Embodiment 3
The phosphorus powder of the copper powder of 39.584g, the iron powder of 0.4g and 0.016g is put into ball grinder, ratio of grinding media to material 15:4, add
Enter the acetone of 0.2mL as anti-forging agent, carries out 4 hours ball millings, obtain the mixed metal powder that granularity is 8nm；
The mixed metal powder is subjected to cold moudling in 410MPa pressurizes 3min, obtains green body；
The green body is placed in high temperature furnace, 3min is kept the temperature at 650 DEG C of argon gas condition, green body is taken out and is put into 650 DEG C
In mold heat, 350MPa pressurize 2.5min are forced into, obtained sintered products are processed by shot blasting, obtains high-performance copper and iron phosphorus
Alloy.
According to method described in embodiment 1, the high-performance copper ferrophosphor(us) that the embodiment of the present invention 3 is prepared is examined
It surveys, testing result is that the relative density for the high-performance copper ferrophosphor(us) that the embodiment of the present invention 3 is prepared is 99.6%, crystal grain
Size is 20nm, tensile strength 663MPa, conductivity 80%IACS.
Embodiment 4
The phosphorus powder of the copper powder of 39.596g, the iron powder of 0.4g and 0.004g is put into ball grinder, ratio of grinding media to material 15:4, add
Enter the acetone of 0.2mL as anti-forging agent, carries out 4 hours ball millings, obtain the mixed metal powder that granularity is 13nm；
The mixed metal powder is subjected to cold moudling in 410MPa pressurizes 3min, obtains green body；
The green body is placed in high temperature furnace, 3min is kept the temperature at 600 DEG C of argon gas condition, green body is taken out and is put into 600 DEG C
In mold heat, 350MPa pressurize 2min are forced into, obtained sintered products are processed by shot blasting, obtains the conjunction of high-performance copper and iron phosphorus
Gold.
According to method described in embodiment 1, the high-performance copper ferrophosphor(us) that the embodiment of the present invention 4 is prepared is examined
It surveys, testing result is that the relative density for the high-performance copper ferrophosphor(us) that the embodiment of the present invention 4 is prepared is 99.2%, crystal grain
Size is 22nm, tensile strength 610MPa, conductivity 86%IACS.
Embodiment 5
The phosphorus powder of the copper powder of 39.596g, the iron powder of 0.4g and 0.004g is put into ball grinder, ratio of grinding media to material 15:4, add
Enter the acetone of 0.2mL as anti-forging agent, carries out 4 hours ball millings, obtain the mixed metal powder that granularity is 16nm；
The mixed metal powder is subjected to cold moudling in 410MPa pressurizes 3min, obtains green body；
The green body is placed in high temperature furnace, 3min is kept the temperature at 700 DEG C of argon gas condition, green body is taken out and is put into 700 DEG C
In mold heat, 350MPa pressurize 2.5min are forced into, obtained sintered products are processed by shot blasting, obtains high-performance copper and iron phosphorus
Alloy.
According to method described in embodiment 1, the high-performance copper ferrophosphor(us) that the embodiment of the present invention 5 is prepared is examined
It surveys, testing result is that the relative density for the high-performance copper ferrophosphor(us) that the embodiment of the present invention 5 is prepared is 99.2%, crystal grain
Size is 25nm, tensile strength 630MPa, conductivity 83%IACS.
Embodiment 6
The phosphorus powder of the copper powder of 39.596g, the iron powder of 0.4g and 0.004g is put into ball grinder, ratio of grinding media to material 15:4, add
Enter the acetone of 0.2mL as anti-forging agent, carries out 5 hours ball millings, obtain the mixed metal powder that granularity is 13nm；
The mixed metal powder is subjected to cold moudling in 410MPa pressurizes 3min, obtains green body；
The green body is placed in high temperature furnace, 3min is kept the temperature at 650 DEG C of argon gas condition, green body is taken out and is put into 650 DEG C
In mold heat, 350MPa pressurize 3min are forced into, obtained sintered products are processed by shot blasting, obtains the conjunction of high-performance copper and iron phosphorus
Gold.
According to method described in embodiment 1, the high-performance copper ferrophosphor(us) that the embodiment of the present invention 6 is prepared is examined
It surveys, testing result is that the relative density for the high-performance copper ferrophosphor(us) that the embodiment of the present invention 6 is prepared is 99.2%, crystal grain
Size is 23nm, tensile strength 775MPa, conductivity 77%IACS.
As seen from the above embodiment, the present invention provides a kind of high-performance copper ferrophosphor(us), the high-performance copper and iron phosphorus closes
Gold ingredient be：The Fe of 1~1.15wt%；The P of 0.01~0.04wt%；Surplus is Cu and inevitable impurity；The height
Crystallite dimension≤30nm of performance copper and iron phosphorus alloy.The present invention provides the high-performance copper and iron phosphorus described in a kind of above-mentioned technical proposal
The preparation method of alloy, including：Copper powder, iron powder and phosphorus powder are subjected to ball milling, obtain nanometer high-property copper and iron phosphorus alloy powder；It will
The nanometer high-property copper and iron phosphorus alloy powder carries out cold moudling, obtains green body；The green body is sintered under stress, is obtained
High-performance copper ferrophosphor(us).High-performance copper ferrophosphor(us) provided by the invention has nanostructure, can generate refined crystalline strengthening, this
Invent the high-performance copper ferrophosphor(us) provided has good tensile strength and conductivity simultaneously.
What has been described above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill of the art
For personnel, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (10)
1. the ingredient of a kind of high-performance copper ferrophosphor(us), the high-performance copper ferrophosphor(us) is：
The Fe of 1~1.15wt%；
The P of 0.01~0.04wt%；
Surplus is Cu and inevitable impurity；
Crystallite dimension≤30nm of the high-performance copper ferrophosphor(us).
2. high-performance copper ferrophosphor(us) according to claim 1, which is characterized in that the crystalline substance of the high-performance copper ferrophosphor(us)
Particle size is 15~30nm.
3. high-performance copper ferrophosphor(us) according to claim 1, which is characterized in that the drawing of the high-performance copper ferrophosphor(us)
Stretch intensity >=600MPa, conductivity >=80%IACS of the high-performance copper ferrophosphor(us).
4. a kind of preparation method of high-performance copper ferrophosphor(us) described in claim 1, including：
Copper powder, iron powder and phosphorus powder are subjected to ball milling, obtain Nanometer Copper ferrophosphor(us) powder；
The Nanometer Copper ferrophosphor(us) powder is subjected to cold moudling, obtains green body；
The green body is sintered under stress, obtains high-performance copper ferrophosphor(us).
5. according to the method described in claim 4, it is characterized in that, the granularity of the Nanometer Copper ferrophosphor(us) powder be 5~
15nm。
6. according to the method described in claim 4, it is characterized in that, the ratio of grinding media to material in the mechanical milling process is (10~20):4；
The rotating speed of the ball milling is 1000~1100 revs/min；
The time of the ball milling is 3~6 hours.
7. according to the method described in claim 4, it is characterized in that, the pressure of the cold moudling is 100~500MPa；
The dwell time of the cold moudling is 1~6min.
8. according to the method described in claim 4, it is characterized in that, the sintering carries out under protective atmosphere.
9. according to the method described in claim 4, it is characterized in that, the temperature of the sintering is 500~700 DEG C；The sintering
Time be 2~10min.
10. according to the method described in claim 4, it is characterized in that, the pressure being sintered under stress is 100~200T.
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| Publication number | Priority date | Publication date | Assignee | Title |
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