CN108330317A - A kind of high-performance copper ferrophosphor(us) and preparation method thereof - Google Patents

Abstract

The invention provides a high-performance copper-iron-phosphorus alloy. The composition of the high-performance copper-iron-phosphorus alloy is: 1-1.15wt% Fe; 0.01-0.04wt% P; the balance is Cu and unavoidable impurities ; The grain size of the high-performance copper-iron-phosphorus alloy is ≤30nm. The invention provides a method for preparing a high-performance copper-iron-phosphorus alloy, comprising: ball milling copper powder, iron powder and phosphorus powder to obtain nano-copper-iron-phosphorus alloy powder; cold-pressing the nano-copper-iron-phosphorus alloy powder molding to obtain a green body; and sintering the green body under pressure to obtain a high-performance copper-iron-phosphorus alloy. The high-performance copper-iron-phosphorus alloy provided by the invention has a nanostructure and can produce fine-grain strengthening. The high-performance copper-iron-phosphorus alloy provided by the invention has good tensile strength and electrical conductivity at the same time. Experimental results show that the strength of the high-performance copper-iron-phosphorus alloy provided by the invention is ≥600 MPa, and the electrical conductivity is ≥80% IACS.

Description

A kind of high-performance copper-iron-phosphorus alloy and preparation method thereof

technical field

The invention relates to the field of alloy technology, in particular to a high-performance copper-iron-phosphorus alloy and a preparation method thereof.

Background technique

Cu-Fe-P alloys are used in the largest amount in integrated circuit lead frame materials, accounting for more than 65%. Cu-Fe-P alloys can be divided into two categories according to their performance characteristics: the first is high-conductivity alloys, which are composed of more than 99% copper elements, and the precipitation hardening intermetallic compound is Fe ₂ P. The properties of this type of alloy are generally electrical conductivity (80-90)% IACS, tensile strength below 400MPa, a typical representative alloy is KFC, and the alloy composition is (mass fraction, %) Cu-0.1-0.15Fe-0.03P. The second type is medium-conductivity and medium-strength alloys. The typical representative of this type of alloy is C194. Its alloy composition is (mass fraction, %) Cu-2.3Fe-Zn-0.03P, and the dispersed phase of precipitation strengthening is intermetallic compound Fe. ₂ P and elemental Fe, the electrical conductivity of this type of alloy can exceed 60% IACS, and the tensile strength is in the range of 500-600MPa.

The lead frame plays the role of supporting the chip, connecting the circuit and dissipating heat inside the integrated circuit. In order to ensure the reliability and durability of the integrated circuit, there are higher requirements for high-performance copper-iron-phosphorus alloy lead materials. How to achieve high strength at the same time (above 600MPa) and high conductivity (above 80% IACS) have become urgent problems to be solved. At present, there are two ways to obtain high-strength, high-conductivity and high-performance copper-iron-phosphorus alloys: one is to introduce more trace alloy elements, such as Zn, Sn, Mg, etc., to achieve solid solution strengthening; the other is deformation strengthening, through cold plastic deformation of copper alloys Thereby improving its strength and hardness.

Adding more trace alloying elements can properly increase the strength of the alloy, but at the same time there are many problems. According to the alloying theory, the higher the degree of alloying, the higher the strength of the alloy, but the electrical conductivity is lower; if the electrical conductivity increases, The strength is lowered, so it is difficult to meet the requirements of an electrical conductivity of 80% IACS or higher and a strength of 600 MPa or higher at the same time. Moreover, there is currently insufficient research on the types of addition of the fourth and above components and their existence forms and functions in the alloy.

Deformation strengthening is one of the common strengthening methods for copper alloys. The strength and hardness of copper alloys are improved by cold plastic deformation. According to Taylor's dislocation hardening theory, the main mode of plastic deformation of metals is dislocation movement. The cold deformation causes a large number of dislocations to increase in the alloy, and they intersect each other during the movement to form cutovers, which hinder the movement of dislocations and reduce the mobility of dislocations. After interacting with each other, many dislocations are entangled together to form dislocation accumulation, which makes the movement of dislocations very difficult, thereby improving the strength of Cu alloy. However, since the Cu-Fe-P alloy undergoes dynamic recovery and dynamic recrystallization when it is deformed at room temperature, although the dislocations increase rapidly in the initial stage, the dislocation density will not increase significantly during the continuous deformation process, and the deformation of the solid alloy The strengthening effect is limited, and it is generally used together with solid solution strengthening and precipitation strengthening. And, because the method for preparing Cu-Fe-P alloy is still traditional smelting and casting equipment, how to solve its easy oxidation under non-vacuum melting and casting conditions and how to improve the secondary processing performance of the alloy (such as punching, etching, welding, Anti-oxidation, etc.) is still a technical problem in this field.

Therefore, how to obtain a high-performance copper-iron-phosphorus alloy with both high strength and high conductivity has become an urgent problem to be solved by those skilled in the art.

Contents of the invention

In view of this, the object of the present invention is to provide a high-performance copper-iron-phosphorus alloy and a preparation method thereof. The high-performance copper-iron-phosphorus alloy prepared by the method provided by the present invention has both high strength and high electrical conductivity.

The invention provides a high-performance copper-iron-phosphorus alloy. The composition of the high-performance copper-iron-phosphorus alloy is:

1～1.15wt% Fe;

0.01-0.04wt% P;

The balance is Cu and unavoidable impurities;

The grain size of the high-performance copper-iron-phosphorus alloy is ≤30nm.

Preferably, the grain size of the high-performance copper-iron-phosphorus alloy is 15-30 nm.

Preferably, the tensile strength of the high-performance copper-iron-phosphorus alloy is ≥600 MPa, and the electrical conductivity of the high-performance copper-iron-phosphorus alloy is ≥80% IACS.

The invention provides a method for preparing the high-performance copper-iron-phosphorus alloy described in the above technical solution, comprising:

Ball milling copper powder, iron powder and phosphorus powder to obtain nano-copper-iron-phosphorus alloy powder;

cold pressing the nano-copper-iron-phosphorus alloy powder to obtain a green body;

The green body is sintered under pressure to obtain a high-performance copper-iron-phosphorus alloy.

Preferably, the particle size of the nano-copper-iron-phosphorus alloy powder is 5-15 nm.

Preferably, the ball-to-material ratio in the ball milling process is (10～20):4;

The rotating speed of the ball mill is 1000～1100 rpm;

The time of the ball milling is 3-6 hours.

Preferably, the pressure of the cold press forming is 100-500MPa;

The holding time of the cold pressing is 1-6 minutes.

Preferably, the sintering is performed under a protective atmosphere.

Preferably, the sintering temperature is 500-700° C.; the sintering time is 2-10 minutes.

Preferably, the pressure of the sintering under pressure is 100-200T.

Compared with the prior art, the present invention uses copper powder, iron powder and phosphorus powder as raw materials, and utilizes high-energy ball milling and pressure-assisted activation sintering methods to prepare a high-strength, high-conductivity high-performance copper-iron-phosphorus alloy with a nanostructure. The performance index of metal materials will increase with the increase of grain refinement. The essence of fine grain strengthening is to increase the grain boundary to effectively hinder the movement of dislocations, because the arrangement of atoms on the grain boundary is disordered, impurities are enriched, and crystal defects The density is very high, and the grain orientation on both sides of the grain boundary is also different. These factors hinder the movement of dislocations from one grain to another. The finer the grain, the larger the total volume of the grain boundary. The greater the resistance, the higher the strength of the material. The crystal size decreases and the strength of the alloy increases. Since the grain refinement only increases the crystal interface, the lattice distortion caused is small and has little effect on the electrical conductivity. Refining the grains can improve the electrical conductivity of the material while increasing the strength of the material. The invention obtains high-performance copper-iron-phosphorus alloy with ultrafine nanostructure through high-energy ball milling and in-situ activation sintering technology.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other examples improved or modified by those skilled in the art belong to the protection scope of the present invention.

The invention provides a high-performance copper-iron-phosphorus alloy, the composition of which is:

1～1.15wt% Fe;

0.01-0.04wt% P;

The balance is Cu and unavoidable impurities.

In the present invention, the mass content of the Fe is preferably 1-1.1%; the mass content of the P is preferably 0.02-0.03%; the mass content of the inevitable impurities is preferably ≤0.005%.

In the present invention, the high-performance copper-iron-phosphorus alloy is a nanostructured copper-iron-phosphorus alloy. In the present invention, the grain size of the high-performance copper-iron-phosphorus alloy is preferably ≤30 nm, more preferably 15-30 nm.

In the present invention, the tensile strength of the high-performance copper-iron-phosphorus alloy is preferably ≥600 MPa. In the present invention, the electrical conductivity of the high-performance copper-iron-phosphorus alloy is preferably ≥80% IACS. The high-performance copper-iron-phosphorus alloy provided by the invention has both good tensile strength and electrical conductivity.

The invention utilizes ball milling and pressure sintering techniques to prepare a high-strength and high-conductivity copper-iron-phosphorus alloy with a nanostructure through fine-grain strengthening. The invention provides a method for preparing the high-performance copper-iron-phosphorus alloy described in the above technical solution, comprising:

Ball milling copper powder, iron powder and phosphorus powder to obtain nano-copper-iron-phosphorus alloy powder;

cold pressing the nano-copper-iron-phosphorus alloy powder to obtain a green body;

The green body is sintered under pressure to obtain a high-performance copper-iron-phosphorus alloy.

The present invention has no special restrictions on the types and sources of the copper powder, iron powder and phosphor powder, and the copper powder, iron powder and phosphor powder well-known to those skilled in the art can be used, which can be purchased from the market. The present invention does not have special limitation to the particle size of described copper powder, iron powder and phosphorus powder, adopts the conventional particle size of copper powder, iron powder and phosphorus powder well-known to those skilled in the art. the above powder.

In the present invention, the amount and purity of the copper powder, iron powder and phosphorus powder should meet the content ratio of each component in the high-performance copper-iron-phosphorus alloy described in the above technical solution.

In the present invention, the ball milling is preferably performed in the presence of a protective gas, and the protective gas is preferably an inert gas, such as argon. In the present invention, the ball milling equipment is preferably a ball milling tank. In the present invention, the ball-to-material ratio in the ball milling process is preferably (10-20):4, more preferably (12-18):4, more preferably (14-16):4, most preferably 15 :4. In the present invention, the rotational speed of the ball mill (the rotational speed of the ball mill used during ball milling) is preferably 1000 to 1100 rpm, more preferably 1020 to 1080 rpm, more preferably 1040 to 1070 rpm, more preferably It is 1050 ~ 1060 rpm. In the present invention, the ball milling time is preferably 3-6 hours, more preferably 4-5 hours. In the present invention, an anti-forging agent is preferably added during the ball milling process, and the addition of the anti-forging agent can make the ball milling more fully, and at the same time avoid the agglomeration of various powders during the ball milling process, so that the various powders can be mixed more evenly; The anti-forging agent is preferably acetone.

In the present invention, the nano-copper-iron-phosphorus alloy powder is obtained after the ball milling; the particle size of the nano-copper-iron-phosphorus alloy powder is preferably 5-15 nm, more preferably 8-12 nm, and most preferably 10 nm.

In the present invention, the pressure of the cold press forming is preferably 100-500 MPa, more preferably 200-400 MPa, most preferably 250-350 MPa. In the present invention, the holding time during the cold press forming process is preferably 1-6 minutes, more preferably 2-5 minutes, and most preferably 3-4 minutes.

In the present invention, the sintering temperature is preferably 500-700°C, more preferably 550-650°C, most preferably 580-620°C; the sintering time is preferably 2-10min, more preferably 3-8min , most preferably 4 to 6 minutes. In the present invention, low-temperature short-time sintering at 500-700°C for 2-10 minutes is a kind of solid-phase sintering. Since the above-mentioned high-performance copper-iron-phosphorus alloy has reached the nanometer level, the specific surface area is increased and the activity is high. During the sintering process The activation energy required for diffusion is low, and the hindering effect of defects and grain boundaries becomes weaker. Therefore, various alloy powders can be sintered and formed without melting during the sintering process. The invention adopts low-temperature sintering technology to obtain alloys with higher density block, thus ensuring its excellent performance. In the present invention, the pressure during the sintering process is preferably 100-200T, more preferably 120-180T, more preferably 140-160T, and most preferably 150T. The sintering under pressure of the present invention can avoid pores or defects in the prepared high-performance copper-iron-phosphorus alloy, make the alloy have good compactness, and ensure the performance of the alloy. In the present invention, the sintering is preferably performed under a protective atmosphere, such as argon.

In the present invention, the method of said sintering is preferably:

After the green body is kept at the sintering temperature and kept warm, it is taken out and put into a hot mold to pressurize to obtain a high-performance copper-iron-phosphorus alloy.

In the present invention, the sintering temperature is consistent with the sintering temperature described in the above technical solution, which will not be repeated here. In the present invention, the time for keeping warm is preferably 2-6 minutes, more preferably 3-5 minutes. In the present invention, the temperature of the hot mold is preferably consistent with the sintering temperature, that is, 500-700°C. In the present invention, the pressurized pressure is consistent with the pressure in the sintering process described in the above technical solution, and will not be repeated here. In the present invention, the pressurization time is preferably 2-3 minutes.

In the present invention, after the sintering is completed, the obtained sintered product is preferably polished to obtain a high-performance copper-iron-phosphorus alloy.

The method provided by the invention obtains a high-performance copper-iron-phosphorus alloy with high strength, high hardness and high electrical conductivity through high-energy ball milling and pressure-assisted activation sintering technology. Compared with the prior art, the present invention uses copper powder, iron powder and phosphorus powder as raw materials, and utilizes high-energy ball milling and pressure-assisted activation sintering methods to prepare a high-strength, high-conductivity high-performance copper-iron-phosphorus alloy with a nanostructure. Where heterogeneous atoms, dislocations and point defects in the crystal destroy the periodicity of the crystal lattice, electron waves are scattered and hindered, reducing conductivity. The performance index of metal materials will increase with the increase of grain refinement. The essence of strengthening is to increase the grain boundary to effectively hinder the movement of dislocations, because the arrangement of atoms on the grain boundary is disordered, the impurities are enriched, and the defect density of the crystal is very high. Large, and the grain orientation on both sides of the grain boundary is also different, these factors hinder the movement of dislocations from one grain to another, the finer the grain, the larger the total volume of the grain boundary, the resistance to dislocation The larger the value, the stronger the material. The crystal size decreases and the strength of the alloy increases. Since the grain refinement only increases the crystal interface, the lattice distortion caused is small and has little effect on the electrical conductivity. Grain refinement can improve the plasticity of the material while improving the strength of the material. After the grain is refined, the stress concentration caused by the dislocation accumulation at the grain boundary can be effectively alleviated when the material is deformed, and the initiation of cracks is delayed. A large amount of deformation can be achieved before fracture. The invention obtains high-performance copper-iron-phosphorus alloy with ultrafine nanostructure through high-energy ball milling and in-situ activation sintering technology.

The invention obtains the nano-copper-iron-phosphorus alloy with high strength, high hardness and high conductivity through high-energy ball milling and pressure-assisted activation sintering technology. The high-performance copper-iron-phosphorus alloy provided by the invention has a grain size of ≤30nm, a tensile strength of ≥600MPa, and an electrical conductivity of ≥80% IACS, which improves the performance of the traditional copper-iron-phosphorus alloy and has broad market prospects.

The raw materials used in the following examples of the present invention are commercially available products.

Example 1

Put 39.596g of copper powder, 0.4g of iron powder and 0.004g of phosphorus powder into a ball mill jar with a ball-to-material ratio of 15:4, add 0.2mL of acetone as an anti-forging agent, and perform ball milling for 4 hours to obtain the particle size 10nm mixed metal powder;

Cold pressing the mixed metal powder at 410 MPa for 1 minute to obtain a green body;

Put the green body in a high-temperature furnace, keep it warm at 650°C for 3 minutes under the condition of argon, take out the green body and put it into a hot mold at 650°C, pressurize to 350MPa and keep the pressure for 2 minutes, and polish the obtained sintered product. A high-performance copper-iron-phosphorus alloy is obtained.

According to the GB/T 1423-1996 "Testing Method for Density of Precious Metals and Their Alloys" standard, the density of the high-performance copper-iron-phosphorus alloy prepared in Example 1 of the present invention was tested. Performance The relative density of the copper-iron-phosphorus alloy is 99.2%, and the density is relatively high.

According to the GB/T 6394-2002 "Measurement Method for Metal Average Grain Size" standard, test the grain size of the high-performance copper-iron-phosphorus alloy prepared in Example 1 of the present invention. The grain size of the high-performance copper-iron-phosphorus alloy is 20nm.

According to the standard of GB/T 228.1-2010 "Metal Material Tensile Test Part 1: Room Temperature Test Method", the tensile strength of the high-performance copper-iron-phosphorus alloy prepared in Example 1 of the present invention is tested, and the test result is that the present invention implements The tensile strength of the high-performance copper-iron-phosphorus alloy prepared in Example 1 is 611MPa.

According to the GB/T 6146-2010 "Measurement Method for Precision Resistance Alloy Resistivity" standard, the electrical conductivity of the high-performance copper-iron-phosphorus alloy prepared in Example 1 of the present invention was tested. Properties The electrical conductivity of the copper-iron-phosphorus alloy is 81% IACS.

Example 2

Put 39.59g of copper powder, 0.4g of iron powder and 0.01g of phosphorus powder into a ball mill jar with a ball-to-material ratio of 15:4, add 0.2mL of acetone as an anti-forging agent, and perform ball milling for 4 hours to obtain the particle size 15nm mixed metal powder;

Cold pressing the mixed metal powder at 410 MPa for 3 minutes to obtain a green body;

Put the green body in a high-temperature furnace, keep it warm at 650°C for 3 minutes under the condition of argon, take out the green body and put it into a hot mold at 650°C, pressurize to 350MPa and keep the pressure for 3 minutes, and polish the obtained sintered product. A high-performance copper-iron-phosphorus alloy is obtained.

According to the method described in Example 1, the high-performance copper-iron-phosphorus alloy prepared in Example 2 of the present invention is detected, and the test result is that the relative density of the high-performance copper-iron-phosphorus alloy prepared in Example 2 of the present invention is 99.5%. , the grain size is 25nm, the tensile strength is 594MPa, and the electrical conductivity is 82%IACS.

Example 3

Put 39.584g of copper powder, 0.4g of iron powder and 0.016g of phosphorus powder into a ball mill jar with a ball-to-material ratio of 15:4, add 0.2mL of acetone as an anti-forging agent, and perform ball milling for 4 hours to obtain the particle size 8nm mixed metal powder;

Cold pressing the mixed metal powder at 410 MPa for 3 minutes to obtain a green body;

Put the green body in a high-temperature furnace, keep it warm at 650°C for 3 minutes under the condition of argon, take out the green body and put it into a hot mold at 650°C, pressurize to 350MPa and keep the pressure for 2.5 minutes, and polish the obtained sintered product , to obtain high-performance copper-iron-phosphorus alloy.

According to the method described in Example 1, the high-performance copper-iron-phosphorus alloy prepared in Example 3 of the present invention was tested, and the test result was that the relative density of the high-performance copper-iron-phosphorus alloy prepared in Example 3 of the present invention was 99.6%. , the grain size is 20nm, the tensile strength is 663MPa, and the electrical conductivity is 80% IACS.

Example 4

Put 39.596g of copper powder, 0.4g of iron powder and 0.004g of phosphorus powder into a ball mill jar with a ball-to-material ratio of 15:4, add 0.2mL of acetone as an anti-forging agent, and perform ball milling for 4 hours to obtain the particle size 13nm mixed metal powder;

Cold pressing the mixed metal powder at 410 MPa for 3 minutes to obtain a green body;

Put the green body in a high-temperature furnace, keep it warm at 600°C for 3 minutes under the condition of argon, take out the green body and put it into a hot mold at 600°C, pressurize to 350MPa and keep the pressure for 2 minutes, and polish the obtained sintered product. A high-performance copper-iron-phosphorus alloy is obtained.

According to the method described in Example 1, the high-performance copper-iron-phosphorus alloy prepared in Example 4 of the present invention was tested, and the test result was that the relative density of the high-performance copper-iron-phosphorus alloy prepared in Example 4 of the present invention was 99.2%. , the grain size is 22nm, the tensile strength is 610MPa, and the electrical conductivity is 86%IACS.

Example 5

Put 39.596g of copper powder, 0.4g of iron powder and 0.004g of phosphorus powder into a ball mill jar with a ball-to-material ratio of 15:4, add 0.2mL of acetone as an anti-forging agent, and perform ball milling for 4 hours to obtain the particle size 16nm mixed metal powder;

Cold pressing the mixed metal powder at 410 MPa for 3 minutes to obtain a green body;

Put the green body in a high-temperature furnace, keep it warm at 700°C for 3 minutes under the condition of argon, take out the green body and put it into a hot mold at 700°C, pressurize to 350MPa and keep the pressure for 2.5 minutes, and polish the obtained sintered product , to obtain high-performance copper-iron-phosphorus alloy.

According to the method described in Example 1, the high-performance copper-iron-phosphorus alloy prepared in Example 5 of the present invention was tested, and the test result was that the relative density of the high-performance copper-iron-phosphorus alloy prepared in Example 5 of the present invention was 99.2%. , the grain size is 25nm, the tensile strength is 630MPa, and the electrical conductivity is 83%IACS.

Example 6

Put 39.596g of copper powder, 0.4g of iron powder and 0.004g of phosphorus powder into a ball mill jar with a ball-to-material ratio of 15:4, add 0.2mL of acetone as an anti-forging agent, and perform ball milling for 5 hours to obtain the particle size 13nm mixed metal powder;

Cold pressing the mixed metal powder at 410 MPa for 3 minutes to obtain a green body;

Put the green body in a high-temperature furnace, keep it warm at 650°C for 3 minutes under the condition of argon, take out the green body and put it into a hot mold at 650°C, pressurize to 350MPa and keep the pressure for 3 minutes, and polish the obtained sintered product. A high-performance copper-iron-phosphorus alloy is obtained.

According to the method described in Example 1, the high-performance copper-iron-phosphorus alloy prepared in Example 6 of the present invention was tested, and the test result was that the relative density of the high-performance copper-iron-phosphorus alloy prepared in Example 6 of the present invention was 99.2%. , the grain size is 23nm, the tensile strength is 775MPa, and the electrical conductivity is 77%IACS.

As can be seen from the above examples, the present invention provides a high-performance copper-iron-phosphorus alloy. The composition of the high-performance copper-iron-phosphorus alloy is: 1-1.15wt% Fe; 0.01-0.04wt% P; the balance is Cu and unavoidable impurities; the grain size of the high-performance copper-iron-phosphorus alloy is ≤30nm. The present invention provides a method for preparing the high-performance copper-iron-phosphorus alloy described in the above technical solution, comprising: ball milling copper powder, iron powder and phosphorus powder to obtain nanometer high-performance copper-iron-phosphorus alloy powder; The high-performance copper-iron-phosphorus alloy powder is cold-pressed to obtain a green body; the green body is sintered under pressure to obtain a high-performance copper-iron-phosphorus alloy. The high-performance copper-iron-phosphorus alloy provided by the invention has a nanostructure and can produce fine-grain strengthening. The high-performance copper-iron-phosphorus alloy provided by the invention has good tensile strength and electrical conductivity at the same time.

What has been described above is only a preferred embodiment of the present invention. It should be pointed out that for those of ordinary skill in the art, some improvements and modifications can also be made without departing from the principles of the present invention. These improvements and modifications It should also be regarded as the protection scope of the present invention.

Claims (10)

1. the ingredient of a kind of high-performance copper ferrophosphor(us), the high-performance copper ferrophosphor(us) is：

The Fe of 1~1.15wt%；

The P of 0.01~0.04wt%；

Surplus is Cu and inevitable impurity；

Crystallite dimension≤30nm of the high-performance copper ferrophosphor(us).

2. high-performance copper ferrophosphor(us) according to claim 1, which is characterized in that the crystalline substance of the high-performance copper ferrophosphor(us) Particle size is 15~30nm.

3. high-performance copper ferrophosphor(us) according to claim 1, which is characterized in that the drawing of the high-performance copper ferrophosphor(us) Stretch intensity >=600MPa, conductivity >=80%IACS of the high-performance copper ferrophosphor(us).

4. a kind of preparation method of high-performance copper ferrophosphor(us) described in claim 1, including：

Copper powder, iron powder and phosphorus powder are subjected to ball milling, obtain Nanometer Copper ferrophosphor(us) powder；

The Nanometer Copper ferrophosphor(us) powder is subjected to cold moudling, obtains green body；

The green body is sintered under stress, obtains high-performance copper ferrophosphor(us).

5. according to the method described in claim 4, it is characterized in that, the granularity of the Nanometer Copper ferrophosphor(us) powder be 5~ 15nm。

6. according to the method described in claim 4, it is characterized in that, the ratio of grinding media to material in the mechanical milling process is (10~20):4；

The rotating speed of the ball milling is 1000~1100 revs/min；

The time of the ball milling is 3~6 hours.

7. according to the method described in claim 4, it is characterized in that, the pressure of the cold moudling is 100~500MPa；

The dwell time of the cold moudling is 1~6min.

8. according to the method described in claim 4, it is characterized in that, the sintering carries out under protective atmosphere.

9. according to the method described in claim 4, it is characterized in that, the temperature of the sintering is 500~700 DEG C；The sintering Time be 2~10min.

10. according to the method described in claim 4, it is characterized in that, the pressure being sintered under stress is 100~200T.