CN108326280A - A kind of ultra-thin sapphire glass cutting diamond cutting cutter and preparation method thereof - Google Patents
A kind of ultra-thin sapphire glass cutting diamond cutting cutter and preparation method thereof Download PDFInfo
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- CN108326280A CN108326280A CN201711492495.4A CN201711492495A CN108326280A CN 108326280 A CN108326280 A CN 108326280A CN 201711492495 A CN201711492495 A CN 201711492495A CN 108326280 A CN108326280 A CN 108326280A
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- 238000005520 cutting process Methods 0.000 title claims abstract description 65
- 239000010432 diamond Substances 0.000 title claims abstract description 46
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 46
- 239000011521 glass Substances 0.000 title claims abstract description 41
- 229910052594 sapphire Inorganic materials 0.000 title claims abstract description 30
- 239000010980 sapphire Substances 0.000 title claims abstract description 30
- 238000002360 preparation method Methods 0.000 title claims abstract description 27
- 229910052751 metal Inorganic materials 0.000 claims abstract description 54
- 239000002184 metal Substances 0.000 claims abstract description 53
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 239000000843 powder Substances 0.000 claims abstract description 25
- 238000003825 pressing Methods 0.000 claims abstract description 24
- 239000010936 titanium Substances 0.000 claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000004411 aluminium Substances 0.000 claims abstract description 19
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 19
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 19
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052747 lanthanoid Inorganic materials 0.000 claims abstract description 18
- 150000002602 lanthanoids Chemical class 0.000 claims abstract description 18
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 18
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims abstract description 17
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000005245 sintering Methods 0.000 claims abstract description 13
- 238000010438 heat treatment Methods 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims description 6
- 239000004615 ingredient Substances 0.000 claims description 5
- 238000007873 sieving Methods 0.000 claims description 3
- 238000005452 bending Methods 0.000 description 9
- 238000000227 grinding Methods 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000012797 qualification Methods 0.000 description 3
- 229910052761 rare earth metal Inorganic materials 0.000 description 3
- 238000005204 segregation Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000006477 desulfuration reaction Methods 0.000 description 1
- 230000023556 desulfurization Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005469 granulation Methods 0.000 description 1
- 230000003179 granulation Effects 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000010406 interfacial reaction Methods 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- B22F1/0003—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
- B22F2005/001—Cutting tools, earth boring or grinding tool other than table ware
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Powder Metallurgy (AREA)
Abstract
The invention discloses a kind of ultra-thin sapphire glass cutting diamond cutting cutter and preparation method thereof, it is cold-pressed after the mixture of Metal Substrate carcass, graphite powder and diamond is sieved and obtains cold pressing green body；The Metal Substrate carcass includes copper powder, glass putty, cobalt powder, titanium valve, aluminium powder, lanthanoid metal；It is sintered cold pressing green body to obtain formed body；The temperature of the sintering processes is 600~700 DEG C, and the time is 25~35 minutes, and heating rate is 25~35 DEG C/min；Formed body obtains ultra-thin sapphire glass cutting diamond cutting cutter by processing and can be used for the very high sapphire cutting of hardness, in particular for ultra-thin sapphire, can avoid cutting damage, raising yield.
Description
Technical field
The invention belongs to cutter technical fields, and in particular to a kind of ultra-thin sapphire glass cutting diamond cutting cutter
And preparation method thereof.
Background technology
Sapphire with excellent machinery and optical characteristics due to being applied in electronic product, such as protection cap
It is applied in mobile phone to utilize characteristic protective glass head mould group that is wear-resisting, resisting and hand applied in camera lens module or as protecgulum
Machine.However, since sapphire hardness is very high (9 grades of hardness), processing difficulties, such as even if using advanced nano laser into
In addition row cutting uses diameter specifications for 0.25mm diamond fretsaws also due to hot melt problem generates microcrack in cut surface
Although cutting sapphire energy dicing, cutting piece rate is relatively low, and surface line marker is deep, influences chip qualification yield.
Invention content
The invention discloses a kind of ultra-thin sapphire glass cutting diamond cutting cutter and preparation method thereof, can be used for hard
It spends very high sapphire cutting and can avoid cutting damage in particular for ultra-thin sapphire, improve yield.
It adopts the following technical scheme that：
A kind of preparation method of ultra-thin sapphire glass cutting diamond cutting cutter, includes the following steps：
（1）Cold pressing obtains cold pressing green body after the mixture of Metal Substrate carcass, graphite powder and diamond is sieved；The Metal Substrate tire
Body includes copper powder, glass putty, cobalt powder, titanium valve, aluminium powder, lanthanoid metal；
（2）It is sintered cold pressing green body to obtain formed body；The temperature of the sintering processes is 600~700 DEG C, and the time is
25~35 minutes, heating rate was 25~35 DEG C/min；
（3）Formed body obtains ultra-thin sapphire glass cutting diamond cutting cutter by processing.
The invention also discloses a kind of preparation methods of diamond cutting cutter formed body, include the following steps：
（1）Cold pressing obtains cold pressing green body after the mixture of Metal Substrate carcass, graphite powder and diamond is sieved；The Metal Substrate tire
Body includes copper powder, glass putty, cobalt powder, titanium valve, aluminium powder, lanthanoid metal；
（2）It is sintered cold pressing green body to obtain diamond cutting cutter formed body；The temperature of the sintering processes is 600
~700 DEG C, the time is 25~35 minutes, and heating rate is 25~35 DEG C/min.
The invention also discloses a kind of diamond cutting cutter preparation methods of cold pressing green body, include the following steps：
（1）Cold pressing obtains cold pressing green body after the mixture of Metal Substrate carcass, graphite powder and diamond is sieved；The Metal Substrate tire
Body includes copper powder, glass putty, cobalt powder, titanium valve, aluminium powder, lanthanoid metal.
In above-mentioned technical proposal, the mass percent of each ingredient is as follows in Metal Substrate carcass：
Copper (Cu) powder 40~50%
Tin (Sn) powder 25~45%
Cobalt (Co) powder 5~15%
Titanium (Ti) powder 2~6%
Aluminium (Al) powder 4~8%
Lanthanoid metal 1~3%
The joint of titanium and aluminium of the present invention is added, and provides enough energy for the interfacial reaction of titanium and diamond, can strengthen carcass,
It can also improve wetting and bonding of the carcass to diamond simultaneously；The especially addition of rare earth element can effectively reduce alloy
Fusing point, while rare earth element also have very strong deoxidation, desulfurization, denitrification, play the role of inhibit oxygen, sulphur, segregation；With it is existing
There are cutter to compare, the product bending strength of preparation increases by 20%, and hardness increases by 15%, and bending strength and hardness increase, and can subtract
Few beat, tool marks are narrower, and 1.0-1.03 times can be reduced to by 1.15 times of conventional knife thickness.
In above-mentioned technical proposal, the copper powder technical conditions are：
The glass putty technical conditions are：
| Sn(≮) | Color | Specific surface area（m2/g） | Grain size μm | Bulk density g/cm3 | Crystal form |
| 99.9% | Black | 45. 3 | 10-15 | 0.42 | It is spherical |
In above-mentioned technical proposal, the mass ratio of Metal Substrate carcass, graphite powder and diamond is（78~83）∶（2~4）∶（15~
25）, the preferably grain size of diamond is 5~20 μm, and concentration is too low to cause cutter cutting force insufficient, and excessive concentration can cause to cut
It cuts the back of the body and collapses excessive, which ensures that blade has and good self-sharpening and have both longer service life.
In above-mentioned technical proposal, the sieving is sieved to cross 80 mesh sieve successively with 200 mesh, and the number for preferably crossing 200 mesh sieve is 4
Secondary, repeatedly sieving can not only be played the role of increasing batch mixing uniformity, and can play good granulation.
In above-mentioned technical proposal, the temperature of the cold pressing is room temperature, and the time is 25~35 seconds, and pressure is 3.5 tons/cm2, can
To ensure to be cold-pressed green body dense uniform tight.
In above-mentioned technical proposal, the temperature of the sintering processes is 650 DEG C, and the time is 30 minutes, heating rate is 30 DEG C/
min；The excessively high segregation that can cause tin of sintering temperature and spilling, while keeping relatively low heating rate low also for preventing
The segregation of melting point metals such as aluminium and tin and spilling, while ensureing the uniformity of ingredient.
In above-mentioned technical proposal, the processing includes deburring, inner hole outer circularity processing, the thinned processing in end face, is machined to figure
Paper desired size precision checks that meeting drawing requirement obtains qualified cutter.
The invention also discloses the ultra-thin sapphire glass cutting diamond cutting cutter prepared according to above-mentioned preparation method,
The cutting demand that ultra-thin 175 μm of sapphire glass can be met has that hold is strong, goes out under the premise of meeting processing quality
The features such as sword degree is high and service life is long, speed can reach 5mm/s, the cutting machine speed of mainshaft 20K RPM when test uses, batch
Amount uses stay in grade, no breaking, spark phenomenon to occur.
The invention also discloses a kind of diamond cutting cutter Metal Substrate carcasses；In the Metal Substrate carcass Metal Substrate carcass
The mass percent of each ingredient is as follows：
Copper (Cu) powder 40~50%
Tin (Sn) powder 25~45%
Cobalt (Co) powder 5~15%
Titanium (Ti) powder 2~6%
Aluminium (Al) powder 4~8%
Lanthanoid metal 1~3%.
The present invention devises new metal composite formula, and the intensity of cutter can be improved using intermetallic synergy
With hardness, avoids metallic element from being precipitated in conjunction with the addition of rare earth element, graphite powder, Ke Yiti are especially added when preparing green body
The self lubricity of high final products more mainly inhibits the oxidation of lanthanoid metal, coordinates sintering parameter, prevents the excessive oxygen of lanthanoid metal
Change, while a small amount of existing lanthana can provide high intensity.
Specific implementation mode
In the present invention, copper powder technical conditions are：
Glass putty technical conditions are：
| Sn(≮) | Color | Specific surface area（m2/g） | Grain size μm | Bulk density g/cm3 | Crystal form |
| 99.9% | Black | 45. 3 | 10-15 | 0.42 | It is spherical |
The grain size of diamond is 5~20 μm；Remaining raw material does not limit.
Embodiment one
A kind of diamond cutting cutter Metal Substrate carcass, component and mass content are as follows：
Copper powder 50%
Glass putty 27%
Cobalt powder 6%
Titanium valve 6%
Aluminium powder 8%
Lanthanoid metal 3%
The preparation method of ultra-thin sapphire glass cutting diamond cutting cutter, includes the following steps：
（1）Material mixes：According to the above ratio, the copper powder being precisely weighed, glass putty, cobalt powder, titanium valve, aluminium powder, lanthanoid metal are put into three
It ties up in batch mixer, is pre-mixed 2 hours, obtains metal matrix；Then graphite powder, diamond are added, is mixed 10 hours, 80 mesh are crossed
It is placed in after sieve spare in drier ware；The mass ratio of Metal Substrate carcass, graphite powder and diamond is 80: 3: 17；
（2）Compression moulding：To stock up 200 mesh screens, sieve 4 times, it is ensured that then material not conglomeration slowly puts into mold, turn
Moving mold and with doctor blade, puts upper press ring, is positioned on the compacting platform of grinding wheel hydraulic machine together with mold, applies at room temperature
3.5 tons/cm of pressure2, pressurize 30 seconds, to which cold pressing green body be made；
（3）Sinter molding：The green body being cold-pressed is placed into sintering furnace together, 30 DEG C/min of heating rate together with mold, is risen
Temperature keeps the temperature 0.5 hour to 650 DEG C of final sintering temperature, cools to room temperature taking-up with the furnace, spare after deburring；
（4）Endoporus and Excircle machining：The green body of sinter molding is added to be placed in special fixture, fixture clamping and internal and external grinding machine are used
Amesdial adjusts precision, selects grinding wheel, feed velocity and rotating speed, and saw blade inside and outside circle is machined to drawing requirement size essence
Degree；
（5）Processing is thinned in Double End：Green body after inside and outside circle is processed is placed in Double End and is thinned in machine, fixes frock clamp,
Pressure, rotating speed and thinned abrasive disc are selected, drawing requirement dimensional accuracy is machined to, inspection meets drawing requirement and obtains qualification
Ultra-thin sapphire glass cutting use diamond cutting cutter.
The cutter self-sharpening of preparation is extremely strong, and cutting blade is crisp and sharp, can meet ultra-thin 175 μm of sapphire glass
Cutting demand, under the premise of meeting processing quality, the service life can reach 300 meters, be 2 times of the prior art, when test uses
Speed can reach 5mm/s, cutting machine speed of mainshaft 20K RPM, in batches use stay in grade, fraction defective≤0.2%, no breaking,
Spark phenomenon occur, while with existing cutter（Our company's previous generation products）It compares, the product bending strength of preparation increases
20%, hardness increases by 15%, due to stronger bending strength and brittle property, runs at high speed down and effectively reduces beat, and tool marks control more
It is narrow, 1.01 times of knife thickness.
Embodiment two
A kind of diamond cutting cutter Metal Substrate carcass, component and mass content are as follows：
Copper powder 42%
Glass putty 34%
Cobalt powder 11%
Titanium valve 5%
Aluminium powder 6%
Lanthanoid metal 2%
The preparation method of ultra-thin sapphire glass cutting diamond cutting cutter, includes the following steps：
（2）Material mixes：According to the above ratio, the copper powder being precisely weighed, glass putty, cobalt powder, titanium valve, aluminium powder, lanthanoid metal are put into three
It ties up in batch mixer, is pre-mixed 2 hours, obtains metal matrix；Then graphite powder, diamond are added, is mixed 10 hours, 80 mesh are crossed
It is placed in after sieve spare in drier ware；The mass ratio of Metal Substrate carcass, graphite powder and diamond is 82: 2: 16；
（2）Compression moulding：To stock up 200 mesh screens, sieve 4 times, it is ensured that then material not conglomeration slowly puts into mold, turn
Moving mold and with doctor blade, puts upper press ring, is positioned on the compacting platform of grinding wheel hydraulic machine together with mold, applies at room temperature
3.5 tons/cm of pressure2, pressurize 30 seconds, to which cold pressing green body be made；
（3）Sinter molding：The green body being cold-pressed is placed into sintering furnace together, 30 DEG C/min of heating rate together with mold, is risen
Temperature keeps the temperature 0.5 hour to 650 DEG C of final sintering temperature, cools to room temperature taking-up with the furnace, spare after deburring；
（4）Endoporus and Excircle machining：The green body of sinter molding is added to be placed in special fixture, fixture clamping and internal and external grinding machine are used
Amesdial adjusts precision, selects grinding wheel, feed velocity and rotating speed, and saw blade inside and outside circle is machined to drawing requirement size essence
Degree；
（5）Processing is thinned in Double End：Green body after inside and outside circle is processed is placed in Double End and is thinned in machine, fixes frock clamp,
Pressure, rotating speed and thinned abrasive disc are selected, drawing requirement dimensional accuracy is machined to, inspection meets drawing requirement and obtains qualification
Ultra-thin sapphire glass cutting use diamond cutting cutter.
The cutter self-sharpening of preparation is extremely strong, and cutting blade is crisp and sharp, can meet ultra-thin 175 μm of sapphire glass
Cutting demand, under the premise of meeting processing quality, the service life can reach 300 meters, be 2 times of the prior art, when test uses
Speed can reach 5mm/s, cutting machine speed of mainshaft 20K RPM, in batches use stay in grade, fraction defective≤0.2%, no breaking,
Spark phenomenon occurs, while compared with existing cutter, and the product bending strength of preparation increases by 18%, and hardness increases by 15%, due to
Stronger bending strength and brittle property, run at high speed down and effectively reduce beat, and tool marks control narrower, 1.03 times of knife thickness.
Comparative example one
The component and mass content of Metal Substrate carcass are as follows：
Copper powder 50%
Glass putty 29%
Cobalt powder 6%
Titanium valve 7%
Aluminium powder 8%
Remaining is consistent with embodiment one, and 175 μm of sapphire glass of cutting ultra thin, under the premise of meeting processing quality, the service life reaches
To 200 meters, speed can reach 5mm/s, the cutting machine speed of mainshaft 20K RPM when test uses, and use stay in grade in batches, no
Yield 0.6%, while compared with existing cutter, the product bending strength of preparation increases by 3%, and hardness increases by 1%, 1.09 times of knife thickness.
Comparative example two
It is added without graphite powder, the mass ratio of Metal Substrate carcass and diamond is 85: 15；Remaining is consistent with embodiment one, and cutting is super
Thin 175 μm of sapphire glass, under the premise of meeting processing quality, the service life reaches 190 meters, and speed can reach when test uses
5mm/s, cutting machine speed of mainshaft 20K RPM, use stay in grade in batches, fraction defective 0.7%, while compared with existing cutter,
The product bending strength of preparation increases by 5%, and hardness increases by 3%, 1.11 times of knife thickness.
Comparative example three
The component and mass content of Metal Substrate carcass are as follows：
Copper powder 45%
Glass putty 36%
Cobalt powder 11%
Aluminium powder 6%
Lanthanoid metal 2%
Remaining is consistent with embodiment one, and 175 μm of sapphire glass of cutting ultra thin, under the premise of meeting processing quality, the service life reaches
To 220 meters, speed can reach 5mm/s, the cutting machine speed of mainshaft 20K RPM when test uses, and use stay in grade in batches, no
Yield 0.4%, while compared with existing cutter, the product bending strength of preparation increases by 5%, and hardness increases by 2%, 1.08 times of knife thickness.
Claims (10)
1. a kind of preparation method of ultra-thin sapphire glass cutting diamond cutting cutter, includes the following steps：
（1）Cold pressing obtains cold pressing green body after the mixture of Metal Substrate carcass, graphite powder and diamond is sieved；The Metal Substrate tire
Body includes copper powder, glass putty, cobalt powder, titanium valve, aluminium powder, lanthanoid metal；
（2）It is sintered cold pressing green body to obtain formed body；The temperature of the sintering processes is 600~700 DEG C, and the time is
25~35 minutes, heating rate was 25~35 DEG C/min；
（3）Formed body obtains ultra-thin sapphire glass cutting diamond cutting cutter by processing.
2. a kind of preparation method of diamond cutting cutter formed body, includes the following steps：
（1）Cold pressing obtains cold pressing green body after the mixture of Metal Substrate carcass, graphite powder and diamond is sieved；The Metal Substrate tire
Body includes copper powder, glass putty, cobalt powder, titanium valve, aluminium powder, lanthanoid metal；
（2）It is sintered cold pressing green body to obtain diamond cutting cutter formed body；The temperature of the sintering processes is 600
~700 DEG C, the time is 25~35 minutes, and heating rate is 25~35 DEG C/min.
3. a kind of diamond cutting cutter preparation method of cold pressing green body, includes the following steps：
（1）Cold pressing obtains cold pressing green body after the mixture of Metal Substrate carcass, graphite powder and diamond is sieved；The Metal Substrate tire
Body includes copper powder, glass putty, cobalt powder, titanium valve, aluminium powder, lanthanoid metal.
4. according to the preparation method described in claim 1,2 or 3, which is characterized in that the quality of each ingredient in Metal Substrate carcass
Percentage is as follows：
Copper powder 40~50%
Glass putty 25~45%
Cobalt powder 5~15%
Titanium valve 2~6%
Aluminium powder 4~8%
Lanthanoid metal 1~3%.
5. according to the preparation method described in claim 1,2 or 3, which is characterized in that Metal Substrate carcass, graphite powder and diamond
Mass ratio be（78~83）∶（2~4）∶（15~25）；The grain size of the diamond is 5~20 μm.
6. according to the preparation method described in claim 1,2 or 3, which is characterized in that it is described sieving for successively cross 80 mesh sieve with
200 mesh sieve；The temperature of the cold pressing is room temperature, and the time is 25~35 seconds, and pressure is 3.5 tons/cm2。
7. preparation method according to claim 1 or 2, which is characterized in that the temperature of the sintering processes is 650 DEG C,
Time is 30 minutes, and heating rate is 30 DEG C/min.
8. a kind of diamond cutting cutter Metal Substrate carcass；The quality hundred of each ingredient in the Metal Substrate carcass Metal Substrate carcass
Score is as follows：
Copper powder 40~50%
Glass putty 25~45%
Cobalt powder 5~15%
Titanium valve 2~6%
Aluminium powder 4~8%
Lanthanoid metal 1~3%.
9. product prepared by the preparation method described in claim 1,2 or 3.
10. application of the product in preparing ultra-thin sapphire glass cutting material described in claim 9；Described in claim 8
Application of the diamond cutting cutter with Metal Substrate carcass in preparing ultra-thin sapphire glass cutting material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711492495.4A CN108326280B (en) | 2017-12-30 | 2017-12-30 | Diamond cutting knife for cutting ultrathin sapphire glass and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711492495.4A CN108326280B (en) | 2017-12-30 | 2017-12-30 | Diamond cutting knife for cutting ultrathin sapphire glass and preparation method thereof |
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| Publication Number | Publication Date |
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| CN108326280A true CN108326280A (en) | 2018-07-27 |
| CN108326280B CN108326280B (en) | 2020-06-05 |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109719294A (en) * | 2018-12-30 | 2019-05-07 | 苏州赛尔科技有限公司 | Faraday rotation piece 40 microns of super thin metal binder diamond saw blades and its application |
| CN110154255A (en) * | 2019-04-23 | 2019-08-23 | 长沙华腾智能装备有限公司 | A kind of no Water Cutting diamond tooth shape saw blade and preparation method thereof |
| CN111704391A (en) * | 2020-06-29 | 2020-09-25 | 广东华中科技大学工业技术研究院 | Diamond ceramic composite scribing knife and preparation method thereof |
| CN112756613A (en) * | 2020-12-31 | 2021-05-07 | 苏州赛尔科技有限公司 | Grinding wheel for high-strength and high-hardness ceramic processing and preparation method thereof |
| CN112756614A (en) * | 2020-12-31 | 2021-05-07 | 苏州赛尔科技有限公司 | Grinding wheel for processing hard brittle sapphire glass and preparation method thereof |
| CN114472894A (en) * | 2021-12-31 | 2022-05-13 | 苏州赛尔科技有限公司 | Metal sintering ultrathin cutting knife for silicon wafer cutting and preparation method |
| CN114472895A (en) * | 2021-12-31 | 2022-05-13 | 苏州赛尔科技有限公司 | Metal sintered diamond ultrathin cutting blade for QFN and preparation method thereof |
| CN114472889A (en) * | 2021-12-28 | 2022-05-13 | 苏州赛尔科技有限公司 | Metal bond ultrathin super-precision cutting knife and preparation method thereof |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109719294A (en) * | 2018-12-30 | 2019-05-07 | 苏州赛尔科技有限公司 | Faraday rotation piece 40 microns of super thin metal binder diamond saw blades and its application |
| CN110154255A (en) * | 2019-04-23 | 2019-08-23 | 长沙华腾智能装备有限公司 | A kind of no Water Cutting diamond tooth shape saw blade and preparation method thereof |
| CN111704391A (en) * | 2020-06-29 | 2020-09-25 | 广东华中科技大学工业技术研究院 | Diamond ceramic composite scribing knife and preparation method thereof |
| CN112756613A (en) * | 2020-12-31 | 2021-05-07 | 苏州赛尔科技有限公司 | Grinding wheel for high-strength and high-hardness ceramic processing and preparation method thereof |
| CN112756614A (en) * | 2020-12-31 | 2021-05-07 | 苏州赛尔科技有限公司 | Grinding wheel for processing hard brittle sapphire glass and preparation method thereof |
| CN114472889A (en) * | 2021-12-28 | 2022-05-13 | 苏州赛尔科技有限公司 | Metal bond ultrathin super-precision cutting knife and preparation method thereof |
| CN114472889B (en) * | 2021-12-28 | 2024-02-20 | 苏州赛尔科技有限公司 | Ultra-thin superfinishing cutter with metal binding agent and preparation method |
| CN114472894A (en) * | 2021-12-31 | 2022-05-13 | 苏州赛尔科技有限公司 | Metal sintering ultrathin cutting knife for silicon wafer cutting and preparation method |
| CN114472895A (en) * | 2021-12-31 | 2022-05-13 | 苏州赛尔科技有限公司 | Metal sintered diamond ultrathin cutting blade for QFN and preparation method thereof |
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