CN108301592A - A kind of more overheat pore passage structure heating floors - Google Patents
A kind of more overheat pore passage structure heating floors Download PDFInfo
- Publication number
- CN108301592A CN108301592A CN201710018435.2A CN201710018435A CN108301592A CN 108301592 A CN108301592 A CN 108301592A CN 201710018435 A CN201710018435 A CN 201710018435A CN 108301592 A CN108301592 A CN 108301592A
- Authority
- CN
- China
- Prior art keywords
- oak
- overheat
- heating
- bottom plate
- duct
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/04—Flooring or floor layers composed of a number of similar elements only of wood or with a top layer of wood, e.g. with wooden or metal connecting members
- E04F15/045—Layered panels only of wood
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D13/00—Electric heating systems
- F24D13/02—Electric heating systems solely using resistance heating, e.g. underfloor heating
- F24D13/022—Electric heating systems solely using resistance heating, e.g. underfloor heating resistances incorporated in construction elements
- F24D13/024—Electric heating systems solely using resistance heating, e.g. underfloor heating resistances incorporated in construction elements in walls, floors, ceilings
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F2290/00—Specially adapted covering, lining or flooring elements not otherwise provided for
- E04F2290/02—Specially adapted covering, lining or flooring elements not otherwise provided for for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets
- E04F2290/023—Specially adapted covering, lining or flooring elements not otherwise provided for for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets for heating
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Chemical & Material Sciences (AREA)
- Thermal Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Floor Finish (AREA)
Abstract
The present invention relates to one kind overheating pore passage structure heating floor more, is the class sandwich-like structure that one group of equal thickness strip pine by oak face laminate, oak bottom plate and clamping between oak face laminate and oak bottom plate is constituted;One group of strip pine, which is mutually parallel, arranged for interval and to be cooperatively formed multiple tracks with oak face laminate and oak bottom plate and is mutually parallel the overheat duct at interval, further includes infrared silk.More overheat pore passage structure heating floors in the present invention are formed in the interior thereof the independent overheat duct of multiple tracks structure, the heat that infrared silk generates not only is conducted by wooden, the principle of convection current can be also generated using air heats to be conducted in ground intralamellar part by air, promote heat to be uniformly distributed in floor whole interior, improves heated impression.
Description
Technical field
The present invention relates to a kind of heating floors, and in particular to a kind of more overheat pore passage structure heating floors.
Background technology
In recent every winter, in China North China, thick and heavy haze is shrouded in the overhead of the earth always, has seriously encroached on the people
The health of the masses.The reason in part for investigation shows to cause haze is the unclean discharge of fire coal due to central heating, is controlled
Haze just will must first change existing heating mode, carry out cleaning heating.
Have more money heating floors currently on the market, but be laid on the ground being utilized in before installation floor substantially more or
The mode that the heater strip of the sinuous arrangement of sandwiched generates heat inside floor.But due to it is wooden be not good thermal conductor, pass through
It is still to be bonded the arrangement trend of heating wire that infrared imaging, which can see the temperature trace on ground, and heat supply is not uniform enough, causes office
Portion is too high or too low for temperature.Can only be the laying density for increasing heating wire if being intended to improve for thermal uniformity in a traditional way, to
Cost increase.
Invention content
The technical problem to be solved by the present invention is to:It is proposed that a kind of that heat supply can be improved is equal without increasing heating wire laying density
More passage of heat structure heatings floor of even property.
The technical solution that the present invention proposes to solve above-mentioned technical problem is:A kind of more overheat pore passage structure heating floors,
It is one group of equal thickness item by oak face laminate, oak bottom plate and clamping between oak face laminate and oak bottom plate
The class sandwich-like structure that shape pine is constituted;
One group of strip pine is mutually parallel arranged for interval and to be cooperatively formed more with oak face laminate and oak bottom plate
Road is mutually parallel the overheat duct at interval, and the both ends open in the overheat duct is located at the both sides of the heating floor;
The side of the heating floor offers assembly card slot at least together, and the other side of the heating floor is convexly equipped at least
Assembly trip together, the assembly card slot pass through from the one end open in the overheat duct;
Further include infrared heating silk, is recessed inwardly at the slot bottom of the assembly card slot and is formed with one of heating wire storage tank, work as phase
Infrared heating silk the heating wire is locked at when the assembly trip of the adjacent heating floor is fitted in the assembly card slot to hold
It sets in slot.
Further, the infrared heating silk is described in its longitudinal direction around forming multiple heating rings being sequentially connected
Heating ring is turned round folded and is bundled into the figure of eight that the lines flow smoothly, and the curvature at any one place of the figure of eight is respectively less than 0.05mm-1,
The heating ring is placed in the one end open in the overheat duct.
Further, it is coated with one layer of heat-conducting layer in the inner circumferential wall in the overheat duct, the heat-conducting layer is by photosensitive
Epoxy resin cures after being uniformly coated on after ultra violet lamp, evenly dispersed in the epoxy resin to have polymethyl
Acid glycidyl ester modified graphene.
Further, oak face laminate, oak bottom plate and one group of strip pine before clamping through over-richness 17%-
Drying and processing after 18% NH4H2PO4 solution impregnates 24 hours, oak face laminate, oak bottom plate and described one after drying
The water content of group strip pine is 10%-14%.
The beneficial effects of the invention are as follows:
More overheat pore passage structure heating floors in the present invention are formed in the interior thereof the independent overheat duct of multiple tracks structure, heating wire
The heat of generation is not only conducted by wooden, can also be generated using air heats the principle of convection current come by air on floor
Inside conduction, promotes heat to be uniformly distributed in floor whole interior, improves heated impression.
In addition, it also is coated with heat-conducting layer on the inner wall in overheat duct, it can be rapidly in overheat duct by heat-conducting layer
The interior heating space for forming a uniformity of temperature profile, may advantageously facilitate being evenly distributed with for heat.
It is worth mentioning that:Floor in the present invention uses quality more loose using scleroid oak as face layer
Soft pine plays feel soft comfortable hard scratch-resistant effect again as interlayer.
Description of the drawings
More overheat pore passage structure heating floors of the present invention are described further below in conjunction with the accompanying drawings.
Fig. 1 is the structural schematic diagram of more overheat pore passage structure heating floors in the present invention.
Specific implementation mode
According to Fig. 1, more overheat pore passage structure heating floors in the present invention, are by oak face laminate 1, oak bottom
The class sandwich-like that the one group of equal thickness strip pine 3 of plate 2 and clamping between oak face laminate 1 and oak bottom plate 2 is constituted
Structure.
One group of strip pine 3 is mutually parallel arranged for interval and cooperatively forms multiple tracks with oak face laminate 1 and oak bottom plate 2
Be mutually parallel the overheat duct 4 at interval, and the both ends open in overheat duct 4 is located at the both sides on infrared heating floor.
The side of heating floor offers assembly card slot 5 at least together, and the other side of heating floor is convexly equipped at least one
The assembly trip 6 in road, assembly card slot 5 pass through from the one end open in overheat duct 4.
It further include infrared heating silk(It is not shown in figure), assemble and be recessed inwardly at the slot bottom of card slot 5 and be formed with one of fever
Infrared heating silk is locked at fever by silk storage tank 7 when the assembly trip 6 of adjacent heating floor is fitted in assembly card slot 5
In silk storage tank 7.
Infrared heating silk in its longitudinal direction around forming multiple heating rings being sequentially connected, heating ring turn round it is folded and be bundled at
The curvature of the figure of eight that the lines flow smoothly, any one place of the figure of eight is respectively less than 0.05mm-1, heating ring, which is placed on, overheats duct 4
One end open in.
It overheats and is coated with one layer of heat-conducting layer in the inner circumferential wall in duct 4(It is not shown in figure), heat-conducting layer is by photosensitive epoxy
Resin cures after being uniformly coated on after ultra violet lamp, evenly dispersed in epoxy resin to have polymethylacrylic acid shrink sweet
Grease modified graphene.
Oak face laminate 1, oak bottom plate 2 and one group of strip pine 3 are before clamping through over-richness 17%-18%'s
Drying and processing after NH4H2PO4 solution impregnates 24 hours, oak face laminate 1, oak bottom plate 2 and one group of strip pine 3 after drying
Water content be 10%-14%.
The present invention's is not limited to the above embodiment, and the technical solution of above-mentioned each embodiment of the invention can be handed over each other
Fork combination form new technical solution, in addition it is all using equivalent replacement formed technical solution, all fall within the present invention claims guarantor
It protects in range.
Claims (4)
1. a kind of more overheat pore passage structure heating floors, it is characterised in that:It is to be existed by oak face laminate, oak bottom plate and clamping
The class sandwich-like structure that one group of equal thickness strip pine between oak face laminate and oak bottom plate is constituted;
One group of strip pine is mutually parallel arranged for interval and to be cooperatively formed more with oak face laminate and oak bottom plate
Road is mutually parallel the overheat duct at interval, and the both ends open in the overheat duct is located at the both sides of the heating floor;
The side of the heating floor offers assembly card slot at least together, and the other side of the heating floor is convexly equipped at least
Assembly trip together, the assembly card slot pass through from the one end open in the overheat duct;
Further include infrared heating silk, is recessed inwardly at the slot bottom of the assembly card slot and is formed with one of heating wire storage tank, work as phase
Infrared heating silk is locked at the infrared heating when assembly trip of the adjacent heating floor is fitted in the assembly card slot
In silk storage tank.
2. according to claim 1 overheat pore passage structure heating floor more, it is characterised in that:The infrared heating silk is grown at it
It turns round folded and is bundled into the figure of eight that the lines flow smoothly, institute upwards about multiple heating rings being sequentially connected, the heating ring is formed in degree side
The curvature for stating any one place of the figure of eight is respectively less than 0.05mm-1, one end that the heating ring is placed on the overheat duct is opened
In mouthful.
3. according to claim 2 overheat pore passage structure heating floor more, it is characterised in that:The week in the overheat duct is inwardly
Be coated with one layer of heat-conducting layer on wall, the heat-conducting layer be by curing after ultra violet lamp after photosensitive epoxy resin even spread and
At evenly dispersed in the epoxy resin to have poly (glycidyl methacrylate) modified graphene.
4. according to claim 3 overheat pore passage structure heating floor more, it is characterised in that:Oak face laminate, oak bottom
Plate and one group of strip pine are before clamping after the NH4H2PO4 solution of over-richness 17%-18% impregnates 24 hours at drying
Reason, the water content of oak face laminate, oak bottom plate and one group of strip pine is 10%-14% after drying.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710018435.2A CN108301592A (en) | 2017-01-11 | 2017-01-11 | A kind of more overheat pore passage structure heating floors |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710018435.2A CN108301592A (en) | 2017-01-11 | 2017-01-11 | A kind of more overheat pore passage structure heating floors |
Publications (1)
Publication Number | Publication Date |
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CN108301592A true CN108301592A (en) | 2018-07-20 |
Family
ID=62871436
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201710018435.2A Pending CN108301592A (en) | 2017-01-11 | 2017-01-11 | A kind of more overheat pore passage structure heating floors |
Country Status (1)
Country | Link |
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CN (1) | CN108301592A (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN203160632U (en) * | 2013-04-07 | 2013-08-28 | 赵盛源 | Non-deformation heating floor |
CN203549999U (en) * | 2013-11-26 | 2014-04-16 | 吴家敏 | Self-heating floor |
CN105038412A (en) * | 2015-09-06 | 2015-11-11 | 江南大学 | Photosensitive graphene preparing method and ultraviolet light curing conductive ink |
-
2017
- 2017-01-11 CN CN201710018435.2A patent/CN108301592A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN203160632U (en) * | 2013-04-07 | 2013-08-28 | 赵盛源 | Non-deformation heating floor |
CN203549999U (en) * | 2013-11-26 | 2014-04-16 | 吴家敏 | Self-heating floor |
CN105038412A (en) * | 2015-09-06 | 2015-11-11 | 江南大学 | Photosensitive graphene preparing method and ultraviolet light curing conductive ink |
Non-Patent Citations (2)
Title |
---|
宋小平等: "《实用化学品配方手册》", 30 March 1993 * |
郭文满等: "《聚合物/碳基导热复合材料研究进展》", 《塑料》 * |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
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RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180720 |