CN108299779A - 一种用作电子封装材料的金刚石-铝复合材料 - Google Patents

一种用作电子封装材料的金刚石-铝复合材料 Download PDF

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CN108299779A
CN108299779A CN201710434894.9A CN201710434894A CN108299779A CN 108299779 A CN108299779 A CN 108299779A CN 201710434894 A CN201710434894 A CN 201710434894A CN 108299779 A CN108299779 A CN 108299779A
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diamond
powder
nano
composite material
polyacrylate
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Yu Qinghuang
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Yu Qinghuang
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08K3/02—Elements
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
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    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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Abstract

本发明公开了一种用作电子封装材料的金刚石‑铝复合材料。该金刚石‑铝复合材料，由纳米金刚石粉、纳米铝粉和聚丙烯酸酯经反复熔融和冷却制成，熔融和冷却6个循环。所述纳米金刚石粉、纳米铝粉和聚丙烯酸酯的重量份之比为9:14:28。本发明提供的金刚石‑铝复合材料具有优异的导热性能，可以用作制备电子封装材料。

Description

一种用作电子封装材料的金刚石-铝复合材料
技术领域
本发明属于电子材料领域，具体涉及一种用作电子封装材料的金刚石-铝复合材料。
背景技术
随着微电子和信息技术的迅猛发展，电子器件集成度迅速提高，产品小型化、轻便化和高性能化已经成为必然的发展趋势，在此情况下，传统封装材料已经难以满足新时期的性能需求，因此研究和开发综合性能更为优异的新型电子封装材料就成为相关领域发展所面临的关键问题。作为电子封装材料，首先要求具有优异的热物理性能，包括高的热导率和适当的热膨胀系数，实现热量的高效传递和缓解热应力的不良影响；同时封装材料还需要对电子器件起到支持和保护作用，因此也需要满足一定的力学性能要求，以便于功能器件的整体结构设计。金刚石具有极高的热导率以及低的热膨胀系数，同时力学性能优异；金属铝则具有低密度、高热导率、成型能力强的优点；理论上，选择金刚石颗粒作为增强相而金属铝为基体得到的复合材料，可以获得理想的综合性能。因此，金刚石颗粒增强铝基复合材料成为新一代电子封装材料的研究热点。
发明内容
本发明的目的在于提供一种用作电子封装材料的金刚石-铝复合材料。
本发明通过下面技术方案实现：
一种金刚石-铝复合材料，由纳米金刚石粉、纳米铝粉和聚丙烯酸酯经反复熔融和冷却制成，熔融和冷却4-8个循环。
优选地，所述纳米金刚石粉、纳米铝粉和聚丙烯酸酯的重量份之比为9:13-15:26-30。
优选地，所述纳米金刚石粉、纳米铝粉和聚丙烯酸酯的重量份之比为9:14:28。
上述金刚石-铝复合材料用作电子封装材料的用途。
本发明技术效果：
本发明提供的金刚石-铝复合材料具有优异的导热性能，可以用作制备电子封装材料。
具体实施方式
下面结合实施例具体介绍本发明的实质性内容。
实施例1
一种金刚石-铝复合材料，由纳米金刚石粉、纳米铝粉和聚丙烯酸酯经反复熔融和冷却制成，熔融和冷却6个循环。
所述纳米金刚石粉、纳米铝粉和聚丙烯酸酯的重量份之比为9:14:28。
实施例2
一种金刚石-铝复合材料，由纳米金刚石粉、纳米铝粉和聚丙烯酸酯经反复熔融和冷却制成，熔融和冷却6个循环。
所述纳米金刚石粉、纳米铝粉和聚丙烯酸酯的重量份之比为9:13:26。
实施例3
一种金刚石-铝复合材料，由纳米金刚石粉、纳米铝粉和聚丙烯酸酯经反复熔融和冷却制成，熔融和冷却6个循环。
所述纳米金刚石粉、纳米铝粉和聚丙烯酸酯的重量份之比为9:15:30。
实施例4
一种金刚石-铝复合材料，由纳米金刚石粉、纳米铝粉和聚丙烯酸酯经反复熔融和冷却制成，熔融和冷却6个循环。
所述纳米金刚石粉、纳米铝粉和聚丙烯酸酯的重量份之比为9:14:27。
实施例5
一种金刚石-铝复合材料，由纳米金刚石粉、纳米铝粉和聚丙烯酸酯经反复熔融和冷却制成，熔融和冷却6个循环。
所述纳米金刚石粉、纳米铝粉和聚丙烯酸酯的重量份之比为9:14:29。
本发明提供的金刚石-铝复合材料具有优异的导热性能，可以用作制备电子封装材料。

Claims (4)

1.一种金刚石-铝复合材料，其特征在于：由纳米金刚石粉、纳米铝粉和聚丙烯酸酯经反复熔融和冷却制成，熔融和冷却4-8个循环。
2.根据权利要求1所述的金刚石-铝复合材料，其特征在于：所述纳米金刚石粉、纳米铝粉和聚丙烯酸酯的重量份之比为9:13-15:26-30。
3.根据权利要求2所述的金刚石-铝复合材料，其特征在于：所述纳米金刚石粉、纳米铝粉和聚丙烯酸酯的重量份之比为9:14:28。
4.权利要求1-3任一所述金刚石-铝复合材料用作电子封装材料的用途。
CN201710434894.9A 2017-06-10 2017-06-10 一种用作电子封装材料的金刚石-铝复合材料 Withdrawn CN108299779A (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3945564A1 (en) * 2020-07-27 2022-02-02 Google LLC Thermal interface material and method for transferring heat

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3945564A1 (en) * 2020-07-27 2022-02-02 Google LLC Thermal interface material and method for transferring heat

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