CN108298122B - Whole-stack packaging method for liquid crystal display panel - Google Patents
Whole-stack packaging method for liquid crystal display panel Download PDFInfo
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- CN108298122B CN108298122B CN201810081829.7A CN201810081829A CN108298122B CN 108298122 B CN108298122 B CN 108298122B CN 201810081829 A CN201810081829 A CN 201810081829A CN 108298122 B CN108298122 B CN 108298122B
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- heat
- liquid crystal
- packaging bag
- crystal panel
- stack
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B23/00—Packaging fragile or shock-sensitive articles other than bottles; Unpacking eggs
- B65B23/20—Packaging plate glass, tiles, or shingles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B53/00—Shrinking wrappers, containers, or container covers during or after packaging
- B65B53/02—Shrinking wrappers, containers, or container covers during or after packaging by heat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D71/00—Bundles of articles held together by packaging elements for convenience of storage or transport, e.g. portable segregating carrier for plural receptacles such as beer cans or pop bottles; Bales of material
- B65D71/06—Packaging elements holding or encircling completely or almost completely the bundle of articles, e.g. wrappers
- B65D71/08—Wrappers shrunk by heat or under tension, e.g. stretch films or films tensioned by compressed articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
Abstract
The invention provides a whole-stack packaging method of a liquid crystal panel, which comprises the following steps: firstly, providing a pallet, arranging an open-ended heat-shrinkable packaging bag on the pallet, and covering the pallet with the bottom of the heat-shrinkable packaging bag; then stacking a liquid crystal panel on the bottom of the heat-shrinkable packaging bag to form a liquid crystal panel stack, lifting the upper edge corresponding to the opening of the heat-shrinkable packaging bag, and completely wrapping the liquid crystal panel stack in the heat-shrinkable packaging bag; heat-sealing and cutting the heat-shrinkable packaging bag wrapped with the liquid crystal panel stack by using heat-sealing and cutting equipment to form a sealed packaging bag to be heat-shrunk; and finally, shrinking the sealing packaging bag to be tightly attached to the liquid crystal panel stack in a thermal shrinkage process through thermal shrinkage equipment.
Description
Technical Field
The invention relates to the technical field of liquid crystal panel manufacturing, in particular to a whole-stack packaging method of a liquid crystal panel.
Background
Generally, the TFT LCD panel process can be divided into front-stage Array, middle-stage Cell and back-stage LCM module processes, wherein the Array process mainly manufactures the thin film transistors on the glass. The Cell segment process mainly uses the glass of the TFTArray as the substrate, combines it with the color filter, fills the liquid crystal on the glass substrate, and then cuts it into the required size. The rear-section LCM process completes the assembly of the panel cut by the Cell section and other elements such as a backlight module, a circuit board, a frame and the like, and then can be externally delivered to a liquid crystal display terminal factory for the assembly of the whole machine. Therefore, Open Cell refers to a finished product in which a panel factory completes Cell segment assembly but does not complete LCM assembly.
Open Cell stack packaging is currently damp-proof and dust-proof by adopting a winding film and top cover film mode. As shown in fig. 1, the conventional Open Cell stack packaging wrapping film + top cover film method uses materials including: the corner protective sleeve 101, the PE film 102, the PP packing belt 103, the pallet label 104, the pallet 105, the mildew-proof paper 106 and the like have the problems of low production efficiency, poor sealing effect and multiple material types.
Disclosure of Invention
The invention provides a whole-stack packaging method of a liquid crystal panel, which can improve the production efficiency, enhance the sealing effect, reduce the material types and reduce the cost.
In order to solve the above problems, the technical scheme provided by the invention is as follows:
the invention provides a whole-stack packaging method of a liquid crystal panel, which comprises the following steps:
step S1, providing a pallet, arranging a heat-shrinkable packaging bag with an opening on the pallet, and covering the pallet with the bottom of the heat-shrinkable packaging bag;
s2, stacking a liquid crystal panel on the bottom of the heat-shrinkable packaging bag to form a liquid crystal panel stack, lifting the upper edge corresponding to the opening of the heat-shrinkable packaging bag, and completely wrapping the liquid crystal panel stack in the heat-shrinkable packaging bag;
step S3, heat-sealing and cutting the heat-shrinkable packaging bag wrapped with the liquid crystal panel stack through heat-sealing and cutting equipment to form a sealed packaging bag to be heat-shrunk;
and step S4, shrinking the sealing packaging bag to be tightly attached to the liquid crystal panel stack in a thermal shrinkage process through thermal shrinkage equipment.
According to a preferred embodiment of the present invention, the heat-shrinkable packaging bag has a single-side opening, and the aperture of the opening is larger than the size of the liquid crystal panel.
According to a preferred embodiment of the present invention, in step S2, a protective substrate is disposed on the bottom of the heat-shrinkable packaging bag, and the liquid crystal panel is stacked on the protective substrate.
According to a preferred embodiment of the present invention, the protection substrate is groove-shaped, and includes a substrate bottom and a protection sidewall surrounding the substrate bottom, and at least a portion of the liquid crystal panel is embedded in the protection substrate.
According to a preferred embodiment of the present invention, a gasket is disposed between two adjacent liquid crystal panels of the liquid crystal panel stack, and the gasket is uniformly distributed on the surface or the edge of the liquid crystal panel.
According to a preferred embodiment of the present invention, after the stacking of the liquid crystal panels is completed, a protective cover plate matched with the protective substrate is disposed on the stack of liquid crystal panels.
According to a preferred embodiment of the present invention, the heat-shrinkable packaging bag is pulled up from the opening to wrap the stack of liquid crystal panels and the protective cover, and the heat-shrinkable packaging bag is maintained in a stretched state.
According to a preferred embodiment of the present invention, the step S3 includes: and heat-sealing and cutting the heat-shrinkable packaging bag in the stretching state by using the heat-sealing and cutting equipment, wherein the corresponding position of the heat-shrinkable packaging bag, which is away from the liquid crystal panel stack by a preset distance section, is used as a heat-sealing site, and the heat-shrinkable packaging bag transversely penetrates through the whole heat-shrinkable packaging bag.
According to a preferred embodiment of the present invention, the step S4 is followed by the following steps:
and step S5, after the thermal shrinkage process, packing the packed liquid crystal panel stack by a PP packing belt.
According to a preferred embodiment of the present invention, the size of the stack of liquid crystal panels is smaller than or equal to the maximum size that can be accommodated when the heat-shrinkable packaging bag is closed.
The invention has the beneficial effects that: compared with the packaging method of the liquid crystal panel in the prior art, the whole-stack packaging method of the liquid crystal panel is characterized in that a heat-shrinkable packaging bag with a single-side opening is placed on the pallet by adopting the characteristic that the heat-shrinkable packaging bag (POF) shrinks under heating, the liquid crystal panel is stacked in the heat-shrinkable packaging bag, after the liquid crystal panel stack is formed, the heat-shrinkable packaging bag is lifted up from the opening manually or by a manipulator, the liquid crystal panel stack is cut off after being wrapped, and then the heat-shrinkable packaging bag is heated by a heat compressor to completely wrap the liquid crystal panel stack, so that the heat-shrinkable packaging process flow is completed. The invention adopts a heat shrink packaging process to replace a film winding process, provides an Open Cell whole stack product packaging process with simple operation and good sealing effect, can improve the production efficiency and the sealing effect, and saves the cost at the same time.
Drawings
In order to illustrate the embodiments or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the invention, and it is obvious for a person skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic diagram of a conventional packaging method of whole opencell stack packaging winding film and top cover film;
fig. 2 to fig. 4 are schematic diagrams illustrating a process of a stack-packing method of liquid crystal panels according to the present invention;
fig. 5 is a flowchart of a method for packaging a stack of liquid crystal panels according to the present invention.
Detailed Description
The following description of the various embodiments refers to the accompanying drawings that illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in the present invention, such as [ upper ], [ lower ], [ front ], [ rear ], [ left ], [ right ], [ inner ], [ outer ], [ side ], are only referring to the directions of the attached drawings. Accordingly, the directional terms used are used for explanation and understanding of the present invention, and are not used for limiting the present invention. In the drawings, elements having similar structures are denoted by the same reference numerals.
The invention aims at the technical problems of low production efficiency, poor sealing effect and multiple material types of the existing whole-stack packaging method of the liquid crystal display panel, and the embodiment can solve the defects.
The method for packaging a stack of liquid crystal panels according to an embodiment of the present invention is described in detail below with reference to the accompanying drawings.
As shown in fig. 1, a flowchart of a method for packaging a stack of liquid crystal panels according to an embodiment of the present invention includes the following steps:
step S1, providing a pallet, arranging a heat-shrinkable packaging bag with an opening on the pallet, and covering the pallet with the bottom of the heat-shrinkable packaging bag;
s2, stacking a liquid crystal panel on the bottom of the heat-shrinkable packaging bag to form a liquid crystal panel stack, lifting the upper edge corresponding to the opening of the heat-shrinkable packaging bag, and completely wrapping the liquid crystal panel stack in the heat-shrinkable packaging bag;
step S3, heat-sealing and cutting the heat-shrinkable packaging bag wrapped with the liquid crystal panel stack through heat-sealing and cutting equipment to form a sealed packaging bag to be heat-shrunk;
and step S4, shrinking the sealing packaging bag to be tightly attached to the liquid crystal panel stack in a thermal shrinkage process through thermal shrinkage equipment.
Specifically, as shown in fig. 2, a pallet 201 is provided for carrying the liquid crystal panel to be packaged; set up a unilateral open-ended pyrocondensation wrapping bag 202 on the pallet 201, just the bottom of pyrocondensation wrapping bag 202 covers pallet 201, the opening aperture of pyrocondensation wrapping bag 202 is greater than the liquid crystal display panel size, it is preferred, the opening aperture is greater than the scope of pallet 201 is convenient for liquid crystal display panel high efficiency puts into in the pyrocondensation wrapping bag 202, avoid the opening is too little and influence the packaging process.
As shown in fig. 3, after the heat-shrinkable packaging bag 302 is placed on the pallet 301, the liquid crystal panel is stacked on the bottom of the heat-shrinkable packaging bag 302 to form a liquid crystal panel stack 303. The stacking mode of the liquid crystal panels can be as follows: the liquid crystal panels are placed in a three-dimensional mode and stacked transversely, or the liquid crystal panels are placed horizontally and stacked longitudinally; or a combination of the two methods, etc., and the stacking method is designed according to the actual situation, and is not limited herein. After the stacking is finished, the upper edge corresponding to the opening of the heat-shrinkable packaging bag 302 is lifted in a manual or mechanical arm mode, the liquid crystal panel stack 303 is completely wrapped in the heat-shrinkable packaging bag 302, and the heat-shrinkable packaging bag 302 is kept in a stretching state. The size of the liquid crystal panel stack 303 is smaller than or equal to the maximum size that can be accommodated when the heat-shrinkable packaging bag 302 is closed.
In another embodiment, a protective substrate is disposed on the bottom of the heat-shrinkable packaging bag 302, and the liquid crystal panel is stacked on the protective substrate. Preferably, the protective substrate is groove-shaped, and includes a substrate bottom and a protective sidewall surrounding the substrate bottom, and the corner region of the liquid crystal panel is at least embedded in the protective substrate. A gasket is arranged between two adjacent liquid crystal panels of the liquid crystal panel stack 303, and the gasket is uniformly distributed on the surface or the edge of the liquid crystal panel to prevent the corners of the liquid crystal panels from being damaged or abraded mutually. After the liquid crystal panels are stacked, a protective cover plate matched with the protective substrate is arranged on the liquid crystal panel stack 303 and used for protecting the corner area of the liquid crystal panel stack 303. The protective sidewall of the protective substrate may extend to be in conformity with the height of the liquid crystal panel stack 303, thereby protecting the liquid crystal panel stack 303 in all directions.
As shown in fig. 4, after the palletizing is completed, the upper edge of the heat-shrinkable packing bag 401 corresponding to the opening is lifted to completely wrap the stack of liquid crystal panels 402. And (3) heat-sealing and cutting the heat-shrinkable packaging bag 401 in a stretching state by using heat-sealing and cutting equipment, wherein the corresponding position of the heat-shrinkable packaging bag 401, which is away from the liquid crystal panel stack 402 by a preset distance section, is a heat-sealing site 403, and the heat-shrinkable packaging bag transversely penetrates through the whole heat-shrinkable packaging bag 401 to form a sealed packaging bag to be heat-shrunk. The heat-seal sites 403 are set according to actual conditions, and are not too close to the liquid crystal panel stack 402, so that the tension on two sides of the heat-shrinkable packaging bag 401 is prevented from affecting the sealing performance of the sealed packaging bag to be heat-shrunk; and meanwhile, the distance is not too far so as to avoid the waste of materials. The heat sealing and cutting equipment is common equipment in the prior art, and the heat sealing and cutting mode is also a common mode and is not described again here.
And adopting a thermal shrinkage device to shrink the sealing packaging bag in a thermal shrinkage process until the sealing packaging bag is tightly attached to the liquid crystal panel stack. The thermal shrinkage equipment can be a small table type thermal shrinkage packaging machine or a floor type large thermal shrinkage packaging machine and the like, and can be selected according to the size of the actual liquid crystal panel. And after the thermal shrinkage process is finished, packaging the packaged liquid crystal panel stack by using a PP packaging belt. The PP packing belt surrounds the packed liquid crystal panel stack and can be packed in a cross shape or a # -shaped shape.
Compared with the packaging method of the liquid crystal panel in the prior art, the whole-stack packaging method of the liquid crystal panel is characterized in that a heat-shrinkable packaging bag with a single-side opening is placed on the pallet by adopting the characteristic that the heat-shrinkable packaging bag (POF) shrinks under heating, the liquid crystal panel is stacked in the heat-shrinkable packaging bag, after the liquid crystal panel stack is formed, the heat-shrinkable packaging bag is lifted up from the opening manually or by a manipulator, the liquid crystal panel stack is cut off after being wrapped, and then the heat-shrinkable packaging bag is heated by a heat compressor to completely wrap the liquid crystal panel stack, so that the heat-shrinkable packaging process flow is completed. The invention adopts a heat shrink packaging process to replace a film winding process, provides an Open Cell whole stack product packaging process with simple operation and good sealing effect, can improve the production efficiency and the sealing effect, and saves the cost at the same time.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.
Claims (6)
1. A method for packaging a whole stack of liquid crystal panels is characterized by comprising the following steps:
step S1, providing a pallet, arranging a heat-shrinkable packaging bag with an opening on the pallet, and covering the pallet with the bottom of the heat-shrinkable packaging bag;
step S2, arranging a protective substrate on the bottom of the heat-shrinkable packaging bag, stacking a liquid crystal panel on the protective substrate, forming a liquid crystal panel stack, arranging a protective cover plate matched with the protective substrate on the liquid crystal panel stack, lifting the upper edge corresponding to the opening of the heat-shrinkable packaging bag, completely wrapping the liquid crystal panel stack and the protective cover plate in the heat-shrinkable packaging bag, and keeping the heat-shrinkable packaging bag in a stretched state;
step S3, heat-sealing and cutting the heat-shrinkable packaging bag wrapped with the liquid crystal panel stack through heat-sealing cutting equipment to form a sealed packaging bag to be heat-shrunk, wherein the corresponding position of the heat-shrinkable packaging bag, which is a preset distance section away from the liquid crystal panel stack, is a heat-sealing site, and the corresponding position transversely penetrates through the whole heat-shrinkable packaging bag;
and step S4, shrinking the sealing packaging bag to be tightly attached to the liquid crystal panel stack in a thermal shrinkage process through thermal shrinkage equipment.
2. The packaging method according to claim 1, wherein the heat-shrinkable packaging bag has a single-sided opening, and the opening diameter is larger than the size of the liquid crystal panel.
3. The packaging method according to claim 1, wherein the protective substrate is groove-shaped and includes a substrate bottom and a protective sidewall surrounding the substrate bottom, and at least a portion of the liquid crystal panel is embedded in the protective substrate.
4. The packaging method according to claim 3, wherein a spacer is disposed between two adjacent liquid crystal panels of the stack, and the spacer is uniformly distributed on the surface or edge of the liquid crystal panel.
5. The packaging method according to claim 1, further comprising, after the step S4, the steps of:
and step S5, after the thermal shrinkage process, packing the packed liquid crystal panel stack by a PP packing belt.
6. The packaging method according to claim 1, wherein the size of the stack of liquid crystal panels is equal to or smaller than the maximum size that can be accommodated when the heat-shrinkable packaging bag is closed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810081829.7A CN108298122B (en) | 2018-01-29 | 2018-01-29 | Whole-stack packaging method for liquid crystal display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810081829.7A CN108298122B (en) | 2018-01-29 | 2018-01-29 | Whole-stack packaging method for liquid crystal display panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108298122A CN108298122A (en) | 2018-07-20 |
| CN108298122B true CN108298122B (en) | 2020-05-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810081829.7A Active CN108298122B (en) | 2018-01-29 | 2018-01-29 | Whole-stack packaging method for liquid crystal display panel |
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Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE786721A (en) * | 1971-08-19 | 1973-11-16 | Pechiney Ugine Kuhlmann | IMPROVEMENT IN THE PALLETISATION OF NON-RIGID ELEMENTARY LOADS |
| US3944045A (en) * | 1973-08-31 | 1976-03-16 | Comptex, Inc. | Device for centering a load in a bagging machine |
| FR2360503A1 (en) * | 1976-08-06 | 1978-03-03 | Dupont J | Pallet:less dockside bag handling system - which encloses bags in heat-shrunk thermoplastics sheet complete with lifting slings |
| CN101607619A (en) * | 2008-06-18 | 2009-12-23 | 尚丰精密股份有限公司 | The stowage of circular ring shape goods |
| CN103935547B (en) * | 2014-04-01 | 2015-11-25 | 京东方科技集团股份有限公司 | A kind of display panel packaging facilities |
| CN105752494B (en) * | 2016-04-19 | 2018-11-23 | 深圳市华星光电技术有限公司 | Liquid crystal panel-packaging box and separation pad |
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