CN108287978A - The optimization method of solder joint design parameter - Google Patents
The optimization method of solder joint design parameter Download PDFInfo
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Abstract
The optimization method of a kind of solder joint design parameter proposed by the present invention, it is intended to can improve Solder Joint for one kind, improve the solder joint design parameter optimization method of welding spot reliability.The technical scheme is that：Using solder joint geometric shape parameter as design object, according to device geometric specifications size and Electronic Assemblies standard, solder joint geometric shape design parameter is chosen；Establish horizontal quadrature experimental design table and Solder Joint characteristic model；Solder Joint feature is extracted, solder joint model is established, using orthogonal experiment method and range analysis method butt welding point design parameter preferably determine the influence sequence in preferred solder joint design parameter butt welding point service life；Solder joint lifetimes regression equation is established using Central Composite design response method；With solder joint lifetimes up to optimization aim, butt welding point design parameter optimizing, optimized parameter is determined using steepest descent method in entire solder joint design parameter space, obtains optimal solder joint design parameter.
Description
Technical field
The invention relates to the optimization methods of microelectronics assewbly solder joint design parameter.
Background technology
With the fast development of microelectronics industry, semiconductor technology microfabrication characteristic size constantly reduces, wafer size
It increases, the port number of the I/O of IC increases severely, and corresponding chip encapsulation technology develops to high density, high reliability and inexpensive direction.
Chip direct interconnection technology COB (chip on board) based on flip chip bonding (Flip-Chip) technique and DCA (direct
Chip attachment) etc. widely paid close attention to.In this kind of interconnection technique, through the solder joint frequently with composite solder structure,
Solder bump is made with high melting point solder i.e. on chip, eutectic solder or lead-free solder are then printed on substrate, using again
Fluid welding technique forms composite welding, realizes the electrically and mechanically connection between chip and substrate.According to liquid solder wetting theory,
The Solder Joints such as least-energy principle correlation theory and method, in known solder materials amount, the feelings of solder property and Solder Joint parameter
Under condition, corresponding Solder Joint can be uniquely determined.The form of solder joint and the relationship of reliability are one in welding spot reliability research
Big hot spot, many studies have shown that the distribution and solder joint thermal cycle of the strain of the mechanical performance of the form butt welding point of solder joint, solder joint stress
Service life have direct contact.
Microelectronics assewbly with encapsulation in solder joint forming process usually in reflow process, solder joint in the form of soldering paste by
Heat is melted, and (metallized pads of such as substrate, the solderable metal surface of microelectronics Packaging, are drawn salient point for metal surface at tie point
Line etc.) wetting and spreading, liquid solder with metallic matrix the interactions such as melt, spread under, solder circle is formed at solder joint
Angle, finally obtains the solid-state solder joint with certain mode of appearance after condensation, realize electronic device (chip) and substrate it is electrical,
Mechanical connection.More than half in microelectronic component failure and assembling are related with the failure of encapsulation.And microelectronics assewbly and encapsulation
In failure, the failure of solder joint is one of the main reasons.Welding spot reliability is the key that the application of microelectronic product success.
Research shows that the influence in ultrasound biomicroscopy UBM UBM layer butt welding point service life is minimum, composite S nPb solder joint thermal cycles are lost
Effect occurs mainly in the solder of low melting point.The silicon chip of device is formed in model, copper pad is temperature independent elastic material
Material, underfill may and glass-epoxy FR4 substrates are assumed to be temperature independent elastic material, and FR4 substrates use
Orthotropy, other are isotropic material.Solder joint is in Thermal Cycling, on the outside of ess-strain in solder joint distance structure
Heart position is farthest, and in entire loading procedure, the position of solder joint most fragile appears in the outermost solder joint lower right corner close to pad
Position；In hot loading procedure, ess-strain range bigger that outside solder joint is subjected to.In Thermal Cycling, the stress of solder joint
Strain varies with temperature and cyclically-varying.It is relatively low in the hot stage stress value of thermal cycle, in the cold stage of thermal cycle
Stress value is higher.In thermal cycle high/low temperature holding stage stress relaxation.Temperature rise period and temperature-fall period butt welding point thermal fatigue life
Influence it is very big, and soak and the influence of low-temperature insulation stage butt welding point thermal fatigue life are relatively small.
Welding spot reliability is the life of the electronic product formed using surface installation technique.Surface installation technique SMT solder joints
Numerous types and its form are mostly the three-dimensional configuration of complexity, and research difficulty is larger.At present in SMT Solder Joints theoretical research side
Face still has many not perfect places.For example, there is no so far Solder Joint forming computer aided design cad and solder joint heat is tired
The SMT Solder Joint CAD achievements in research that labor reliability of service life CAD integrally combines.It includes outside solder joint that SMT welding spot reliabilities, which depend on,
The factors including geometric shape are seen, wherein forming electronic product generally requires that its assembly and connection solder joint should ensure electrically
Performance is unimpeded, ensures the reliability of mechanical connection again.And it is often solder joint failure to assemble failure.Welding spot reliability is dependent on packet
The factors including solder joint appearance geometric shape are included, such as component welding leg shape, the internal soundness of solder joint.Solder joint it is several
What form is an important factor for influencing SMT welding spot reliabilities.So-called Solder Joint parameter refers to the geometry after welding spot forming
The design technologies parameter such as form and associated pad radius, solder volume.Under temperature cycling load effect, due to member
The coefficient of thermal expansion (CTE) of device, solder joint and substrate mismatches and causes to generate thermal stress strain inside solder joint, so as to cause weldering
The thermal fatigue failure of point.This thermal fatigue failure phenomenon is especially prominent for no pin SMT components.To PBGA solder joints
In thermal fatigue life analytic process, first according to Solder Joint design parameter, Solder Joint is obtained using welding spot forming software, so
After consider further that PBGA pad arrays, on the basis of being influenced on key spot welds in array, the Solder Joint that will obtain.It is soft using shaping
The typical PBGA Solder Joints that part obtains are converted to finite element analysis model, are welded to key using Nonlinear finite element analysis
Point carries out stress-strain analysis, obtains the maximum equivalent strain value inside solder joint, is obtained by low cyclic thermal fatigue life calculation formula
To the thermal fatigue life of solder joint.
Currently, for mixed solder joints, can be followed to all no standard of entire packaging technology from material is designed into again, solder joint can
It will more be protruded by sex chromosome mosaicism.The optimization of butt welding point design parameter mainly obtains Solder Joint parameter by orthogonal
Various combination, then by data analysing method choose one of which combination, the parameter strictly speaking obtained in this way is preferred
Rather than optimize.
Invention content
The object of the present invention is to provide one kind capable of improving Solder Joint, and the solder joint design parameter for improving welding spot reliability is excellent
Change method.
The present invention realizes that the technical solution of above-mentioned purpose is：A kind of optimization method of solder joint design parameter, feature
It is to include the following steps：
1) using solder joint geometric shape parameter as design object, according to device geometric specifications size and Electronic Assemblies standard IPC-
A-610E CN and surface mount pad design standard IPC-SM-782 choose solder joint geometric shape design parameter；With orthogonal
Test principle, the solder joint design parameter value range recommended according to IPC design standards are arranged, are set in conjunction with uniform test design method
Number of parameters and each parameter level are counted, and establishes horizontal quadrature experimental design table and Solder Joint characteristic model accordingly；
2) Solder Joint feature is extracted, establishes solder joint model, butt welding point model carries out thermal stress strain analysis, with solder joint
Service life theoretical calculation thermal fatigue life of solder joint is carried out excellent using orthogonal experiment method and range analysis method butt welding point design parameter
Choosing determines the influence sequence in preferred solder joint design parameter butt welding point service life；
3) Central Composite design response method is applied to establish solder joint lifetimes regression equation；
4) with solder joint lifetimes up to optimization aim, butt welding point design parameter is sought in entire solder joint design parameter space
It is excellent, it determines optimized parameter using steepest descent method, obtains optimal solder joint design parameter.
The present invention has the advantages that compared with the prior art.
The present invention extracts Solder Joint feature on the basis of Solder Joint theory；Butt welding point model carries out thermal stress strain
Analysis, with solder joint lifetimes theoretical calculation thermal fatigue life of solder joint；It is set using orthogonal experiment method and range analysis method butt welding point
Parameter is counted to carry out preferably determining its influence sequence to the service life；Then determine that its service life returns with Central Composite design response method
Return equation, and use steepest descent method butt welding point design parameter optimizing in entire parameter space, on the basis of preferred, passes through
Central complex design method finally obtains optimal design parameter.
The complete flow forms a kind of new solder joint design parameter optimization method, and the solder joint parameter obtained is each
The globally optimal solution that the entire design space of parameter obtains, and the parameter that existing method obtains is several water in each parameter
The solution selected on flat.SMT Solder Joints are closely related with solder joint performance and mechanical behavior, the variation of Solder Joint, namely
The geometric parameter of solder joint dependency structure changes, and stress distribution and the variation of solder joint will be directly affected, to change the performance of solder joint
And mechanical behavior, influence welding spot reliability.
Description of the drawings
It elaborates to the present invention below against attached drawing.
Fig. 1 is solder joint design parameter optimization method flow diagram of the present invention.
Specific implementation mode
Refering to fig. 1.In the embodiment of solder joint design parameter optimization method described below, Solder Joint feature carries
It takes, the stress-strain analysis of butt welding point model, thermal fatigue life of solder joint calculate and design parameter is preferred and solder joint heat fatigue is followed
The technologies such as ring analysis and optimization carry out solder joint design parameter optimization, can realize in the steps below：
1) according to type of device, the acceptable standard IPC-A-610E CN and surface mount pad of Electronic Assemblies are set
Meter standard IPC-SM-782 chooses solder joint design parameter.Solder joint design parameter include pad width, length of bonding pad, stand-off height,
Solder joint volume and pad diameter etc.；With principle of orthogonal test, the solder joint design parameter value model recommended according to IPC design standards
(data are more, and details can consult above-mentioned standard) is enclosed, in conjunction with document[2]：2011. Beijing:China Machine Press, Min Ya can
《Experimental design (DOE) application guide[M]》In uniform test design method, arrange, design parameter number and each parameter level, one
As take the design technologies parameters such as length of bonding pad, pad width, clearance height, solder joint height and soldering paste volume, and establish three accordingly
The horizontal horizontal quadrature experimental design table of factor five is based on Solder Joint theory for horizontal quadrature experimental design table, takes three
Design technology parameter equidistantly takes five values as number of levels as three factors within the scope of each design technology parameter value,
Solder joint three dimensional fundamental form state is obtained, Solder Joint characteristic model is established.Solder Joint generally refers to component's feet and printing electricity
Road plate (PCB) pad solder junction, molten solder sprawl the attainable geometric dimension of institute along metal surface moistening, and with gold
The contact angle and solder fillet form of metal surface.Based on document[1], 1998. Zhejiang University, Zhou Dejian《SMT Solder Joints are theoretical
And cad technique research[D]》The Solder Joint Virtual molding of offer is theoretical, by U.S.'s Minnestota universities national science and several
The Surface Evolver of what Structure Calculation and Visualization Study center Kenneth, professor's A.Brakke research and development are soft
Part extracts and obtains the three-dimensional configuration geometric shape characteristic parameter i.e. three-dimensional configuration coordinate value of Solder Joint of solder joint.
2) it according to above-mentioned Solder Joint parameter, is established using the general ANSYS finite element softwares of ANSYS companies of U.S. exploitation
Its finite element analysis model, and apply boundary condition and thermal cycling loads, carry out solder joint heat, mechanical stress strain analysis.Analysis
SMT solder joints are within the entire thermal cycle period, and heat, mechanical stress strain rule, with document[3], A R.An equivalent
strain/Coffin-Manson approach to multiaxial fatigue and life prediction in
superelastic Nitinol medical devices[Z]The solder joint lifetimes in are theoretical, tired using Coffin-Manson heat
Labor calculation formula calculates the heat fatigue cycle life of solder joint：
Wherein：NfFor the average life span of thermal fatigue failure；Δ r is shearing strain range；εf=0.325 is fatigue ductility coefficient；
C is fatigue toughness index；F is thermal cycling frequencies.
On this basis, using document[4], 2009. Beijing:Publishing house of the Renmin University of China, is based on MI when hornet
The modern Practical Statistic of NITAB[G]The range analysis method in, butt welding point thermal stress strain and thermal fatigue life are solved,
Obtain the thermal fatigue life value of solder joint.According to the size order of the very poor value Ri of each solder joint design parameter, solder joint design is obtained
The primary and secondary sequence of parameter butt welding point aging effects；Meanwhile with the cycle life of solder joint up to target, obtaining the design of SMT solder joints
Horizontal quadrature is tested every group of design technology parameter pair in table by the preferred horizontal combination of parameter, i.e. design technology parameter combination value
The thermal fatigue life answered is denoted as Y1, in range analysis, solder joint design parameter butt welding point aging effects sequence criterion is：
yxjFor under x=i factors, number of levels is the life value corresponding to j.
Wherein：RiFor in orthogonal arrage the i-th row factor it is very poor,
3) document is used[5], 2013. Beijing:Chinese people publishing house, when horse peak, build Liu for weeks and pass ice《Six Sigma pipe
Reason statistics guide：MINITAB instructions[G].》In heart composite design response method, using statistical analysis in Six Sigma
MINITAB softwares[6], 2012. Beijing:Higher Education Publishing House, Wu Lingyun .MINITAB softwares introduction：The system of practicality most easy to learn
Meter analysis study course[M].[G]The solder joint lifetimes regression equation using solder joint design parameter as dependent variable is established.Equation is as follows：
The first, linear relationship：
Second, linear+quadratic relationship：
The third, linear+reciprocation：
4th kind, complete secondary relationship：
Wherein：Y is thermal fatigue life function, β0For constant term parameter, βiFor the Monomial coefficient of x, βiiFor the quadratic term of x
Coefficient, ε are global error, and k is solder joint design parameter number, x1,x2,x3,…,xkRespectively represent solder joint design parameter.
The determination of regression equation is mainly the predicted value according to the R-Sq in statistical analysis MINITAB softwares in Six Sigma
And observed value, take optimal solder joint design parameter horizontal (cannot list one by one).R-Sq (prediction) and R-Sq (adjustment) be for
Total effect of regression equation is measured, specifically, R-Sq (prediction) is the ability weighed regression equation and explain observation data variation,
It is the ratio that regression sum of square accounts for total sum of squares of deviations, and it is better that value numerical value is fitted closer to 1 representative model；R-Sq (is adjusted
It is whole) it is to be used for modified R-Sq (prediction), the influence brought for considering model total item increase, R-Sq (prediction) and R-Sq (are adjusted
It is whole) both numerical value it is closer, illustrate that models fitting is better, selection is using being fitted best model.
4) solder joint regression equation is applied, with 104Solder joint lifetimes up to optimization aim within period, in solder joint design parameter
In respective parameter space, using document[7], 2010. Beijing:Chemical Industry Press, the still bright modern mechanicals of Yin Guofu beams are excellent
Change design method[G]In steepest descent method solve the optimal level of each design parameter, obtain optimal solder joint design parameter, ask
Solution preocess is as follows：
(1) f (x)=- y (x) is enabled, wherein x=(x1,x2,x3,…,xn), y (x) is regression equation, and n is design parameter
Number, it is assumed that x(o)=base value, base value are one group of initial value of each design parameter of solder joint, select iteration precision ε=0.001 (ε>0),
It is iterations to enable k=0, k；
(2) it calculates：
Wherein,
(3) if | | Δ f (x(k))||<ε, then iteration stopping, x(k)As required optimal solution corresponds to solder joint lifetimes and is denoted as
Y2, otherwise turn following (4)；
(4) one-dimensional optimal step size λ is soughtK, make
f(x(k)-λKΔf(x(k)))=minf (x(k)-λΔf(x(k)))
Wherein：Step-length λ >=0；
(5) x is enabled(k+1)=x(k)-λKΔf(x(k)), k=k+1 is enabled, is turned (2)；
(6) if Y1>Y2, turn (1) modification iteration precision ε；Otherwise, Y2As solder joint MaLS corresponds to solder joint design ginseng
Number x(k)As solder joint design parameter space optimal solution.
Wherein：x(k)For the parameter argument value of iteration kth time, YkFor independent variable x(k)Corresponding strain magnitude, λkIt is optimal
Step-length, | | Δ f (x(k)) | | it is iteration error.
(7) by taking ball grid array LBGA device solder joints as an example, committed step is as follows：
1. it is horizontal as follows to provide three factor of LBGA solder joints five：
2. providing LBGA device solder joint design parameters combination orthogonal arrage：
3. the Solder Joint coordinate value for providing part combination number is as follows：Combination number 1：
| X-coordinate | Y coordinate | Z coordinate |
| 0.000000000 | 0.000000000 | 0.000000000 |
| 0.027500000 | 0.000000000 | 0.000000000 |
| 0.042215839 | -0.000000000 | 0.007707548 |
| 0.047533620 | -0.000000000 | 0.022894213 |
| 0.042242382 | 0.000000000 | 0.038108495 |
| 0.027500000 | 0.000000000 | 0.046000000 |
| 0.000000000 | 0.000000000 | 0.046000000 |
Combination number 15：
4. according to Solder Joint coordinate value, establish model and carry out the calculating of heat fatigue ess-strain and analysis, obtains following each
The strain value and its thermal fatigue life of group key spot welds：
5. using range analysis method, the influence degree and preferred result for obtaining the design parameter butt welding point service life are respectively：
Influence degree is followed successively by from big to small：Solder joint height>Pad diameter>Soldering paste volume；It is preferred that combined result is：A5B5C4, the 25th
Group, i.e. pad diameter 0.59mm, ball height 0.49mm, soldering paste volume 0.276577mm3；Its corresponding solder joint lifetimes is
1838.87 all.
6. using central complex design method, the regression relation between thermal fatigue life of solder joint and design parameter is established, is provided
The R-Sq values (predicted value and adjusted value) of each regression equation
| Response relation classification | R-Sq (prediction) | R-Sq (adjustment) |
| Linearly | 90.99% | 93.25% |
| Linearly+square | 94.29% | 96.76% |
| Linearly+reciprocation | 95.90% | 97.21% |
| Complete secondary relationship | 98.94% | 99.39% |
7. being that complete secondary relationship is led to solder joint lifetimes up to optimization aim according to the regression relation that R-Sq values determine
Crossing the optimal value of the parameter that steepest descent method obtains is respectively：Pad diameter 0.59mm, ball height 0.49mm, soldering paste volume
0.271mm3；Its corresponding solder joint lifetimes is 2012 periods.
8. the preferably corresponding solder joint lifetimes of parameter are less than the service life that optimization obtains, so in entire solder joint design parameter space
In optimal value of the parameter be respectively：Pad diameter 0.59mm, ball height 0.49mm, soldering paste volume 0.271mm3, corresponding solder joint
Service life is 2012 periods.
Claims (8)
1. a kind of optimization method of solder joint design parameter, it is characterised in that include the following steps：
1) using solder joint geometric shape parameter as design object, according to device geometric specifications size and Electronic Assemblies standard IPC-A-
610E CN and surface mount pad design standard IPC-SM-782 choose solder joint geometric shape design parameter；With orthogonal examination
Principle is tested, according to the solder joint design parameter value range that IPC design standards are recommended, in conjunction with uniform test design method, is arranged, design
Number of parameters and each parameter level, and horizontal quadrature experimental design table and Solder Joint characteristic model are established accordingly；
2) Solder Joint feature is extracted, establishes solder joint model, butt welding point model carries out thermal stress strain analysis, with solder joint lifetimes
Theoretical calculation thermal fatigue life of solder joint is carried out preferably, really using orthogonal experiment method and range analysis method butt welding point design parameter
The influence sequence in fixed preferred solder joint design parameter butt welding point service life；
3) Central Composite design response method is applied to establish solder joint lifetimes regression equation；
4) with solder joint lifetimes up to optimization aim, butt welding point design parameter optimizing, is answered in entire solder joint design parameter space
Determine that optimized parameter obtains optimal solder joint design parameter with steepest descent method.
2. the optimization method of solder joint design parameter as described in claim 1, it is characterised in that solder joint design parameter includes pad
Width, length of bonding pad, stand-off height, solder joint volume and pad diameter.
3. the optimization method of solder joint design parameter as described in claim 1, it is characterised in that be directed to horizontal quadrature experimental design
Table is based on Solder Joint theory, takes three design technology parameters as three factors, within the scope of each design technology parameter value
It equidistantly takes five values as number of levels, obtains solder joint three dimensional fundamental form state, establish Solder Joint characteristic model.
4. the optimization method of solder joint design parameter as described in claim 1, it is characterised in that Solder Joint one is that component draws
Foot and printed circuit board (PCB) pad solder junction, molten solder sprawl the attainable dimensioning of institute along metal surface moistening
Very little and contact angle and solder fillet form with metal surface.
5. the optimization method of solder joint design parameter as described in claim 1, it is characterised in that tired using Coffin-Manson heat
Labor calculation formula calculates the heat fatigue cycle life of solder joint：
Wherein：NfFor the average life span of thermal fatigue failure；Δ r is shearing strain range；εf=0.325 is fatigue ductility coefficient；C is
Fatigue toughness index；F is thermal cycling frequencies.
6. the optimization method of solder joint design parameter as described in claim 1, it is characterised in that design technology parameter combination value, it will
The corresponding thermal fatigue life of every group of design technology parameter is denoted as Y in horizontal quadrature experiment table1, in range analysis, solder joint design ginseng
Counting butt welding point aging effects sequence criterion is：
yxjFor under x=i factors, number of levels is the life value corresponding to j.
Wherein：RiFor in orthogonal arrage the i-th row factor it is very poor,
7. the optimization method of solder joint design parameter as described in claim 1, it is characterised in that solder joint regression equation is applied, with 104
Solder joint lifetimes up to optimization aim within period, in the respective parameter space of solder joint design parameter, using document[7],
2010. Beijing:Chemical Industry Press, the still bright modern mechanicals optimum design method of Yin Guofu beams[G]In steepest descent method ask
The optimal level for solving each design parameter obtains optimal solder joint design parameter.
8. the optimization method of solder joint design parameter as described in claim 1, it is characterised in that in entire solder joint design parameter sky
Between in optimal value of the parameter be respectively：Pad diameter 0.59mm, ball height 0.49mm, soldering paste volume 0.271mm3, corresponding weldering
The point service life is 2012 periods.
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| CN113128171A (en) * | 2019-12-12 | 2021-07-16 | 南通大学 | Optimization method for optimizing wafer level packaging reliability |
| CN111881602A (en) * | 2020-07-17 | 2020-11-03 | 成都工业学院 | Welding parameter optimization method based on minimum energy finite element numerical analysis method |
| CN113408110A (en) * | 2021-06-01 | 2021-09-17 | 深圳佰维存储科技股份有限公司 | Prediction method and device of welding spot temperature, readable storage medium and electronic equipment |
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