CN108284284A - Plasma processing and its plasma treatment cavity - Google Patents
Plasma processing and its plasma treatment cavity Download PDFInfo
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- CN108284284A CN108284284A CN201810237646.XA CN201810237646A CN108284284A CN 108284284 A CN108284284 A CN 108284284A CN 201810237646 A CN201810237646 A CN 201810237646A CN 108284284 A CN108284284 A CN 108284284A
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- cavity
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- cylinder
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Plasma Technology (AREA)
- Arc Welding In General (AREA)
Abstract
A kind of plasma processing of present invention offer and its plasma treatment cavity, the plasma treatment cavity includes the first cavity, second cavity, sliding equipment, fixed plate and cylinder, first inside cavity is provided with first electrode, second inside cavity is provided with second electrode, sliding equipment includes sliding rail and sliding block, sliding block respectively with the first cavity, second cavity is fixedly connected, sliding rail is slided relative to sliding block along the longitudinal direction, fixed plate is fixedly connected with sliding rail, it is provided with first through hole in the middle part of fixed plate, cylinder is fixedly connected with fixed plate, the piston rod of cylinder is fixedly connected with the first cavity.Plasma treatment cavity is provided on the feeding machine of the plasma processing, flexible circuit board enters inside laser hole drilling system after progress laser drill, it enters back into and carries out plasma treatment inside plasma processing chamber body, and then plasma cleaning processing is carried out to the brill dirt in flexible circuit plate hole, workflow is succinctly efficient, and treatment effeciency is high.
Description
Technical field
The present invention relates to plasma processing techniques fields, at a kind of plasma processing and its plasma
Manage cavity.
Background technology
The outer surface of Double side soft circuit board is made of copper product, and wherein interbed is Kapton, and traditional is soft
Circuit board process flow is first to carry out laser drill to flexible circuit plate material, is formed in circuit board surface after laser drill several
A size is the blind hole or through-hole of 25 to 100 microns of sizes.Wherein, referring to Fig. 1, existing processing flexible circuit coiled material
Plasma-Laser drilling device is an individual vacuum cavity, framework 1 that there are one settings, and blowing area is provided in framework 1
2, laser drilling porose area 3 and receiving section 4, blowing area 2 are used to be put into the flexible circuit board for needing to drill, and laser drilling porose area 3 is used for
Laser drill is carried out to flexible circuit board, rewinding of the receiving section 4 for flexible circuit board is handled, to realize to flexible circuit board
Laser drill processing.
Laser is this type when " ray " is irritated by external and increase a kind of strength light beam excited under energy
Light be mapped to workpiece after will produce three kinds of phenomenons, that is, reflect, absorb, penetrate.Wherein, the main function of laser drill is quickly to remove
Baseplate material to be processed is removed, is mainly cut off by photo-thermal ablation and photochemistry.
However, after completing the laser drill processing of flexible circuit board, residual of the Kapton after laser ablation
Object can be adhered to the bottom hole of the blind hole either hole wall of hole wall or through-hole.It is therefore desirable to operating personnel by flexible circuit board from etc.
Ion device is taken out, and carries out plasma cleans to the brill dirt in flexible circuit plate hole, flow is cumbersome, and working efficiency is low.
Invention content
The main object of the present invention, which is to provide, a kind of dirty to the brill in flexible circuit plate hole can carry out plasma cleans
Plasma treatment cavity.
It is a further object of the present invention to provide a kind of can not only laser drill but also can be to soft have been carried out to flexible circuit board
The dirty plasma processing for carrying out plasma cleans of brill in circuit board apertures.
For the main purpose for realizing above-mentioned, a kind of plasma treatment cavity provided by the invention, including the first cavity, first
Inside cavity has the first cavity, and first electrode is provided in the first cavity；Second cavity, the second inside cavity have the second sky
Chamber is provided with second electrode in the second cavity；Sliding equipment, sliding equipment include sliding rail and sliding block, and sliding block is respectively with first
Cavity, the second cavity are fixedly connected, and sliding rail is slided relative to sliding block along the longitudinal direction；Fixed plate, fixed plate is fixed with sliding rail to be connected
It connects, first through hole is provided in the middle part of fixed plate；Cylinder, the first end of cylinder are fixedly connected with the first end of fixed plate, cylinder
Piston rod is fixedly connected across first through hole with the first cavity.
By said program as it can be seen that plasma treatment cavity has the first cavity and the second cavity, work not yet in cylinder
When, there is gap, flexible circuit board to enter the gap by collecting machine between the first cavity and the second cavity, in the first cavity and
The inside of second cavity is respectively provided with the power electrode there are one with extraneous radio frequency power electric connection, when cylinder receives working signal
When, the first cavity of control is moved up and down and is closed with the second cavity, by the power electrode of inside cavity to flexible circuit board
Carry out plasma cleans processing.
In addition, plasma treatment cavity can be mounted on the feeding machine of laser hole drilling system, by laser hole drilling system
On the basis of add additional a plasma treatment cavity, flexible circuit board, which enters, carries out laser drilling inside laser hole drilling system
Kong Hou is entered back into and is carried out plasma treatment inside plasma processing chamber body, to be carried out to the brill dirt in flexible circuit plate hole
Therefore plasma cleaning processing reduces workflow, improve the efficiency of plasma treatment.
Further embodiment is that the first cavity is electrically connected with plasma power supply, and the first cavity is also associated with gas flowmeter.
Further embodiment is that the second cavity is electrically connected with plasma power supply, and the second cavity is also associated with vacuum pump.
As it can be seen that the first cavity is closed by cylinder operation and the second cavity, the first cavity and the second cavity difference are external etc.
Ion power supply, after plasma power supply provides electric energy i.e. power electrode for the power electrode in cavity to be powered, in two cavitys
Power electrode carries out plasma cleaning processing to the brill dirt in flexible circuit plate hole.
Second containment portion is connected with vacuum pump, before carrying out plasma treatment, can be vacuumized by vacuum pump, with
Reach plasma and generates the vacuum condition needed.In addition, the first containment portion is also associated with gas flowmeter, gas flowmeter is
The instrument of meter gaseous flow can record the gas flow flowed through.
Further embodiment is that cylinder receives working signal to control the longitudinal movement of the first cavity.
As it can be seen that cylinder includes piston rod, control switch, piston and cylinder barrel, piston connect with piston rod and piston slidably
Setting in cylinder barrel, piston is to be done in cylinder barrel and smoothly be reciprocatingly slided by pressure fittings and piston in cylinder, air
The compression of receiving piston in cylinder and improve pressure, to drive the first cavity move up and down.
In order to realize that another object of the present invention, the present invention provide a kind of plasma processing, including laser drill dress
It sets, laser hole drilling system includes feeding machine, laser drilling machine and collecting machine, and feeding machine is fixedly connected with laser drilling machine, is swashed
Light drilling machine is fixedly connected with collecting machine, and plasma apparatus further includes plasma treatment cavity, and plasma processing chamber body, which is located at, to be received
The top of material machine；Plasma treatment cavity includes the first cavity, and the first inside cavity has the first cavity, is arranged in the first cavity
There is first electrode；Second cavity, the second inside cavity have the second cavity, second electrode are provided in the second cavity；Skate machine
Structure, sliding equipment include sliding rail and sliding block, and sliding block is fixedly connected with the first cavity, the second cavity respectively, and sliding rail is square along longitudinal direction
It is slided to relative to sliding block；Fixed plate, fixed plate are fixedly connected with sliding rail, and first through hole is provided in the middle part of fixed plate；Cylinder, gas
The first end of cylinder is fixedly connected with the first end of fixed plate, and the piston rod of cylinder passes through first through hole to fix company with the first cavity
It connects.
Further embodiment is that the first cavity is electrically connected with plasma power supply, and the first cavity is also associated with gas flowmeter.
Further embodiment is that the second cavity is electrically connected with plasma power supply, and the second cavity is also associated with vacuum pump.
Further embodiment is that cylinder receives working signal to control the longitudinal movement of the first cavity.
Further embodiment is that the first idler wheel is provided in feeding machine, the first idler wheel for transmit flexible circuit board to swash
Light drilling machine.
Further embodiment is that the second idler wheel is provided in collecting machine, the second idler wheel for transmit flexible circuit board to etc.
Ion processing cavity.
By said program as it can be seen that plasma processing provided by the invention includes laser hole drilling system and plasma treatment
Cavity, laser hole drilling system are used to carry out laser drill to pending flexible circuit board, by the first idler wheel by flexible circuit
Plate is sent to laser drilling machine and carries out laser drill, is then passed the flexible circuit board after drilling by the second idler wheel of collecting machine
It send to plasma treatment cavity, plasma treatment cavity is used to carry out at plasma cleaning the brill dirt in flexible circuit plate hole
Reason.
So a plasma treatment cavity has been fixedly mounted on the top of feeding machine, flexible circuit board initially enters
It after the inside of laser hole drilling system carries out laser drill, enters back into and carries out plasma treatment in plasma processing chamber body, reduce
Workflow, improves the efficiency of plasma treatment.
Description of the drawings
Fig. 1 is the structure chart of current existing Plasma-Laser drilling device.
Fig. 2 is the structural schematic diagram of plasma treatment cavity embodiment of the present invention.
Fig. 3 is the structural schematic diagram that first cavity and the second cavity are closed in plasma treatment cavity embodiment of the present invention.
Fig. 4 is the structural schematic diagram at another visual angle in plasma treatment cavity embodiment of the present invention.
Fig. 5 is the partial sectional view at another visual angle of plasma treatment cavity embodiment of the present invention.
Fig. 6 is the structural schematic diagram of plasma processing embodiment of the present invention.
The invention will be further described with reference to the accompanying drawings and embodiments.
Specific implementation mode
Plasma treatment cavity embodiment：
It is the structure chart of plasma treatment cavity embodiment of the present invention referring to Fig. 2, Fig. 2.The plasma treatment cavity packet of the present invention
The first cavity 42, the second cavity 43, sliding equipment, fixed plate 100 and cylinder 41 are included, sliding equipment includes sliding rail 44 and slides
Block 401, sliding block 401 are fixedly connected with the first cavity 42, the second cavity 43 respectively, and sliding rail 44 is along the longitudinal direction relative to sliding block
401 slidings, fixed plate 100 are fixedly connected with sliding rail 44, and 100 middle part of fixed plate is provided with first through hole, the first end of cylinder 41
It is fixedly connected with the first end of fixed plate 100, the piston rod 410 of cylinder 41 passes through first through hole to fix company with the first cavity 42
It connects.Preferably, cylinder 41 is threadedly coupled with fixed plate 100, and the piston rod 410 of cylinder 41 is threadedly coupled with the first cavity 42.
Cylinder 41 receives working signal to control the longitudinal movement of the first cavity 42, and specifically, cylinder 41 includes piston rod
410, control switch（It is not shown）, piston（It is not shown）And cylinder barrel（It is not shown）, piston is connect with piston rod 410 and piston can be slided
In cylinder barrel, control switch receives the working signal of control mechanism output for dynamic setting, for example, the control mechanism can be with
It is solenoid valve, piston is to be done in cylinder barrel and smoothly be reciprocatingly slided by pressure fittings and piston in cylinder, and air is in cylinder
The compression of interior receiving piston and improve pressure, to drive the first cavity 42 move up and down.
Referring to Fig. 3 to Fig. 5,42 inside of the first cavity has the first cavity, and first electrode 45 is provided in the first cavity, the
Two cavitys, 43 inside has the second cavity, and second electrode 46 is provided in the second cavity.Preferably, the first cavity 42 and the second chamber
Body 43 is made of aluminium alloy or stainless steel material, and first electrode 45 and second electrode 46 are by aluminium alloy or Cu alloy material system
At.Wherein, the size of electrode can be set according to the size of cavity.
First cavity 42 and the second cavity 43 are electrically connected with plasma power supply 50, when flexible circuit board completes laser drill
Afterwards, it is sent to plasma treatment cavity via collecting machine, controlling the first cavity 42 by cylinder 41 moves up and down and the second cavity
43 are closed, and since the first cavity 42 and the second cavity 43 distinguish external plasma power supply 50, plasma power supply 50 is in cavity
Power electrode is provided after electric energy, that is, power electrode is powered, the power electrode in two cavitys to the brill dirt in flexible circuit plate hole into
Row plasma cleaning processing.
Wherein, mating power supply of the plasma power supply 50 as plasma, can by radio frequency power source, impedance matching box and
Impedance power meter forms, and is respectively provided in the first cavity 42 and the second cavity 43 there are one being electrically connected with extraneous plasma power supply 50
Power electrode, when plasma power supply 50 for power electrode provide electric energy i.e. power electrode be powered after, the flexible circuit after drilling
For plate after plasma treatment, the brill dirt in hole will be clean by plasma cleaning.
Preferably, the first cavity 42 is connected with gas flowmeter 51, and the second cavity 43 is connected with vacuum pump 52.Carry out etc.
It before ion processing, can be vacuumized by vacuum pump 52, the vacuum condition needed, gas flowmeter are generated to reach plasma
51 be the instrument of meter gaseous flow, can record the gas flow flowed through.
So plasma treatment cavity of the invention has the first cavity 42 and the second cavity 43, it is in just in cylinder 41
When beginning working condition, there is gap, flexible circuit board to enter the sky by collecting machine between the first cavity 42 and the second cavity 43
Gap is respectively provided with the power electrode there are one with extraneous radio frequency power electric connection in the inside of the first cavity 42 and the second cavity 43.
In the present embodiment, when cylinder 41 receives working signal, the piston in cylinder 41 is pushed by air pressure so that piston rod 410
It stretches out, moved down to the first cavity 42 of control and is closed with the second cavity 43, pass through the power electrode pair of inside cavity
Flexible circuit board carries out plasma cleans processing.Wherein, after flexible circuit board after plasma treatment completes rewinding processing, gas
Cylinder 41 restores original operating state, and piston rod 410 is retracted, and divides with the second cavity 43 to which the first cavity 42 of control is moved up
It opens.
In addition, plasma treatment cavity can be mounted on the feeding machine of laser hole drilling system, by laser hole drilling system
On the basis of add additional a plasma treatment cavity, flexible circuit board, which enters, carries out laser drilling inside laser hole drilling system
Kong Hou is entered back into and is carried out plasma treatment inside plasma processing chamber body, to be carried out to the brill dirt in flexible circuit plate hole
Plasma cleaning processing reduces workflow, improves the efficiency of plasma treatment.
Plasma processing embodiment：
It is the structural schematic diagram of plasma processing embodiment of the present invention referring to Fig. 6, Fig. 6.At plasma provided by the invention
It includes laser hole drilling system to manage equipment, and laser hole drilling system includes feeding machine 10, laser drilling machine 20 and collecting machine 30, blowing
Machine 10 is fixedly connected with laser drilling machine 20, and laser drilling machine 20 is fixedly connected with collecting machine 30, and plasma apparatus further includes
Ion processing cavity 40, plasma treatment cavity 40 are located at the top of collecting machine 30.Wherein, it is provided with the first rolling in feeding machine 30
Wheel 101, the first idler wheel 101 are provided with multiple second rollings for transmitting flexible circuit board to laser drilling machine 20 in collecting machine 30
Wheel 301, multiple second idler wheels 301 are used for flexible circuit board for transmitting flexible circuit board to plasma treatment cavity 40
Rewinding processing.
Plasma treatment cavity 40 includes the first cavity 42, the second cavity 43, sliding equipment, fixed plate 100 and cylinder
41, sliding equipment includes sliding rail 44 and sliding block 401, and sliding block 401 is fixedly connected with the first cavity 42, the second cavity 43 respectively,
Sliding rail 44 is slided relative to sliding block 401 along the longitudinal direction, and fixed plate 100 is fixedly connected with sliding rail 44,100 middle part setting of fixed plate
There are first through hole, the first end of cylinder 41 to be fixedly connected with the first end of fixed plate 100, the piston rod 410 of cylinder 41 passes through the
One through-hole is fixedly connected with the first cavity 42.
Cylinder 41 receives working signal to control the longitudinal movement of the first cavity 42, and specifically, cylinder 41 includes piston rod
410, control switch, piston and cylinder barrel, piston is connect with piston rod 410 and piston is slidably disposed in cylinder barrel, and control is opened
Close the working signal for receiving the output of a control mechanism, for example, the control mechanism can be solenoid valve, piston be in cylinder by
Pressure fittings and piston will be done in cylinder barrel smoothly to reciprocatingly slide, air in cylinder the compression of receiving piston and improve pressure
Power, to drive the first cavity 42 to move up and down.
The inside of first cavity 42 has the first cavity, is provided with first electrode 45 in the first cavity, inside the second cavity 43
With the second cavity, second electrode 46 is provided in the second cavity.Preferably, the first cavity 42 and the second cavity 43 are closed by aluminium
Gold or stainless steel material are made, and first electrode 45 and second electrode 46 are made of aluminium alloy or Cu alloy material.Wherein, electrode
Size can be set according to the size of cavity.
First cavity 42 and the second cavity 43 are electrically connected with plasma power supply 50, when flexible circuit board completes laser drill
Afterwards, it is sent to plasma treatment cavity 40 via collecting machine 30, controlling the first cavity 42 by cylinder 41 moves up and down and second
Cavity 43 is closed, and since the first cavity 42 and the second cavity 43 distinguish external plasma power supply 50, plasma power supply 50 is cavity
After interior power electrode provides electric energy, that is, power electrode energization, the power electrode in two cavitys is to the brill in flexible circuit plate hole
Dirt carries out plasma cleaning processing.
Wherein, mating power supply of the plasma power supply 50 as plasma, can by radio frequency power source, impedance matching box and
Impedance power meter forms, and is respectively provided in the first cavity 42 and the second cavity 43 there are one being electrically connected with extraneous plasma power supply 50
Power electrode, when plasma power supply 50 for power electrode provide electric energy i.e. power electrode be powered after, it is soft after laser boring
For circuit board after plasma treatment, the brill dirt in hole will be clean by plasma cleaning.
Preferably, the first cavity 42 is connected with gas flowmeter 51, and the second cavity 43 is connected with vacuum pump 52.Carry out etc.
It before ion processing, can be vacuumized by vacuum pump 52, the vacuum condition needed, gas flowmeter are generated to reach plasma
51 be the instrument of meter gaseous flow, can record the gas flow flowed through.
In the present embodiment, the width of a roll of flexible circuit board is 250 millimeters and 500 millimeters of two kinds of specifications, length are about
100 meters, if dry plate circuit unit can be fabricated to, the length of each circuit unit can be 320 millimeters to 410 millimeters.
In a particular application, first, a roll of flexible circuit board is put into feeding machine 10, is sent to by the first idler wheel 101 sharp
Light drilling machine 20 carries out laser drill, and after the second idler wheel 301 rotates the material for drawing certain length, laser drilling machine 20 starts to soft
Property circuit board punched, for example, the length can be 200 millimeters to 500 millimeters, at this moment, the rolling of the first idler wheel 101 and second
Wheel 301 is static not to be rotated, and after having played the drilling of a unit, the first idler wheel 101 and the rotation of the second idler wheel 301 will have been beaten
The flexible circuit board winding in hole is got up, and by the 30 to the second idler wheel of collecting machine 301, and then enters plasma treatment cavity 40, this
When, plasma treatment cavity 40 has not been entered into operating mode, and the first cavity 42 and the second cavity 43 are in separated position, soft
Circuit board is sent to the gap between the first cavity 42 and the second cavity 43 by the second idler wheel 301, when cylinder 41 receives work letter
Number when, control the first cavity 42 move up and down and be close to be closed with the second cavity 43, pass through the power electrode pair of inside cavity
Flexible circuit board carries out plasma cleans processing.
So plasma processing provided by the invention includes laser hole drilling system and plasma treatment cavity 40, swash
Drill finish aperture apparatus is used to carry out laser drill to pending flexible circuit board, is passed flexible circuit board by the first idler wheel 101
It send to laser drilling machine 20 and carries out laser drill, then by the second idler wheel 301 of collecting machine 30 by the flexible circuit after drilling
Plate is sent to plasma treatment cavity 40, and plasma treatment cavity 40 is used to carry out plasma to the brill dirt in flexible circuit plate hole
Cleaning treatment.
Therefore, be fixedly mounted a plasma treatment cavity 40 in the top of feeding machine 30, flexible circuit board first into
After the inside progress laser drill for entering laser hole drilling system, enters back into and carries out plasma treatment in plasma treatment cavity 40,
Entire workflow is succinctly efficient so that the plasma process system space utilization is reasonable, compact-sized, and treatment effeciency is high.
Finally it is emphasized that the foregoing is merely the preferred embodiment of the present invention, it is not intended to restrict the invention, it is right
For those skilled in the art, the present invention can have various change and change, all within the spirits and principles of the present invention,
Any modification, equivalent substitution, improvement and etc. done, should all be included in the protection scope of the present invention.
Claims (10)
1. plasma treatment cavity, which is characterized in that including：
First cavity, first inside cavity have the first cavity, first electrode are provided in first cavity；
Second cavity, second inside cavity have the second cavity, second electrode are provided in second cavity；
Sliding equipment, the sliding equipment include sliding rail and sliding block, the sliding block respectively with first cavity, described second
Cavity is fixedly connected, and the sliding rail is slided relative to the sliding block along the longitudinal direction；
Fixed plate, the fixed plate are fixedly connected with the sliding rail, and first through hole is provided in the middle part of the fixed plate；
Cylinder, the first end of the cylinder are fixedly connected with the first end of the fixed plate, and the piston rod of the cylinder passes through institute
First through hole is stated to be fixedly connected with first cavity.
2. plasma treatment cavity according to claim 1, it is characterised in that：
First cavity is electrically connected with plasma power supply, and gas flowmeter is also associated in first cavity.
3. plasma treatment cavity according to claim 2, it is characterised in that：
Second cavity is electrically connected with the plasma power supply, and vacuum pump is also associated in second cavity.
4. plasma treatment cavity according to claim 1 or 2, it is characterised in that：
The cylinder receives working signal to control the longitudinal movement of first cavity.
5. plasma processing, including laser hole drilling system, the laser hole drilling system include feeding machine, laser drilling machine with
And collecting machine, the feeding machine are fixedly connected with laser drilling machine, the laser drilling machine is fixedly connected with the collecting machine,
It is characterized in that：
The plasma apparatus further includes plasma treatment cavity, and the plasma processing chamber body is located at the upper of the collecting machine
Side；
The plasma treatment cavity includes：
First cavity, first inside cavity have the first cavity, first electrode are provided in first cavity；
Second cavity, second inside cavity have the second cavity, second electrode are provided in second cavity；
Sliding equipment, the sliding equipment include sliding rail and sliding block, the sliding block respectively with first cavity, described second
Cavity is fixedly connected, and the sliding rail is slided relative to the sliding block along the longitudinal direction；
Fixed plate, the fixed plate are fixedly connected with the sliding rail, and first through hole is provided in the middle part of the fixed plate；
Cylinder, the first end of the cylinder are fixedly connected with the first end of the fixed plate, and the piston rod of the cylinder passes through institute
First through hole is stated to be fixedly connected with first cavity.
6. plasma processing according to claim 5, it is characterised in that：
First cavity is electrically connected with plasma power supply, and gas flowmeter is also associated in first cavity.
7. plasma processing according to claim 6, it is characterised in that：
Second cavity is electrically connected with the plasma power supply, and vacuum pump is also associated in second cavity.
8. plasma processing according to claim 5 or 6, it is characterised in that：
The cylinder receives working signal to control the longitudinal movement of first cavity.
9. plasma processing according to claim 5 or 6, it is characterised in that：
The first idler wheel is provided in the feeding machine, first idler wheel is for transmitting flexible circuit board to the laser drill
Machine.
10. plasma processing according to claim 5 or 6, it is characterised in that：
The second idler wheel is provided in the collecting machine, second idler wheel is for transmitting the flexible circuit board to the plasma
Process chambers.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810237646.XA CN108284284A (en) | 2018-03-22 | 2018-03-22 | Plasma processing and its plasma treatment cavity |
| TW108107533A TWI689009B (en) | 2018-03-22 | 2019-03-07 | Plasma treatment device and plasma treatment cavity thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810237646.XA CN108284284A (en) | 2018-03-22 | 2018-03-22 | Plasma processing and its plasma treatment cavity |
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| Publication Number | Publication Date |
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| CN108284284A true CN108284284A (en) | 2018-07-17 |
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| CN201810237646.XA Pending CN108284284A (en) | 2018-03-22 | 2018-03-22 | Plasma processing and its plasma treatment cavity |
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| CN (1) | CN108284284A (en) |
| TW (1) | TWI689009B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111318520A (en) * | 2020-04-21 | 2020-06-23 | 昆山索坤莱机电科技有限公司 | Vacuum plasma treatment equipment and treatment cavity thereof |
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| CN106920726A (en) * | 2015-12-24 | 2017-07-04 | 中微半导体设备(上海)有限公司 | Plasma processing apparatus and its cleaning method |
| CN206139608U (en) * | 2016-08-24 | 2017-05-03 | 南京苏曼等离子科技有限公司 | Atmosphere ordinary pressure differential output excitation low temperature plasma glass cleaning device |
| CN106312334A (en) * | 2016-10-25 | 2017-01-11 | 宇龙计算机通信科技(深圳)有限公司 | PCB board drilling method and numerical-control machine tool system |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111318520A (en) * | 2020-04-21 | 2020-06-23 | 昆山索坤莱机电科技有限公司 | Vacuum plasma treatment equipment and treatment cavity thereof |
Also Published As
| Publication number | Publication date |
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| TWI689009B (en) | 2020-03-21 |
| TW201941301A (en) | 2019-10-16 |
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Application publication date: 20180717 |