CN108281524A - Full-color flexibility RGB panels of one kind and preparation method thereof - Google Patents
Full-color flexibility RGB panels of one kind and preparation method thereof Download PDFInfo
- Publication number
- CN108281524A CN108281524A CN201810065658.9A CN201810065658A CN108281524A CN 108281524 A CN108281524 A CN 108281524A CN 201810065658 A CN201810065658 A CN 201810065658A CN 108281524 A CN108281524 A CN 108281524A
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- China
- Prior art keywords
- rgb
- full
- flip chip
- color
- red fluorescence
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/14—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
Abstract
The invention discloses a kind of full-color flexibility RGB panels, electron transfer layer including luminous material layer and on the luminous material layer, LED luminescent layers on the electron transfer layer, the LED luminescent layers use Flip chip blue dies (6), Flip chip blue dies (6) the surface spraying green emitting phosphor and red fluorescence powder, the LED luminescent layers are equipped with cover-plate glass, using Flip chip blue dies (6), in its surface spraying green emitting phosphor and red fluorescence powder, it is set to send out corresponding green and red, it arranges in pairs or groups existing blue dies, realize full-color effect.
Description
Technical field
The present invention relates to LED light source technical fields, more particularly to a kind of full-color flexibility RGB panels and preparation method thereof.
Background technology
For Flip chip chips in addition to blue dies, the chip of red green is seldom, with needing routing if formal dress chip,
The reliability of routing is very poor on flexible panel, and flexible base board is to realize the photochromic of other colors, it appears compare limitation, it is existing
Flexible finished product is substantially adds yellow fluorescent powder to excite sent out white light by Flip chip blue dies, without full-color rgb light
Color.
Invention content
To overcome disadvantages mentioned above, the purpose of the present invention is to provide a kind of full-color flexibility RGB panels and preparation method thereof, adopt
It is set to send out corresponding green and red in its surface spraying green emitting phosphor and red fluorescence powder with Flip chip blue dies
Color, existing blue dies of arranging in pairs or groups, realizes full-color effect.
In order to reach object above, the technical solution adopted by the present invention is：A kind of full-color flexibility RGB panels, including shine
Material layer and the electron transfer layer on the luminous material layer, the LED luminescent layers on the electron transfer layer, the LED
Luminescent layer uses Flip chip blue dies, the Flip chip blue dies surface spraying green emitting phosphors and red fluorescence
Powder, the LED luminescent layers are equipped with cover-plate glass.
Further, it is respectively equipped with corresponding RGB three primary colors filter coating on the Flip chip blue dies.
Further, the green emitting phosphor is different with the thickness of red fluorescence powder, and the green emitting phosphor and red
Fluorescent powder includes overlapping region, and the overlapping region is used to form secondary colour.
Further, the thickness of the red fluorescence powder is twice of thickness of the green emitting phosphor.
Further, the thickness of the red fluorescence powder is 2.5-10nm, and the thickness of the green light emitting layer is 5-10nm.
A kind of production method of full-color flexibility RGB panels, includes the following steps：
S1, Flip chip blue dies are prepared on the electron transport layer, and spray on Flip chip blue dies green
Color fluorescent powder and red fluorescence powder form RGB three primary colors illuminators；
S2, red filter film, green filter film, blue filter film are prepared in the bottom surface of cover-plate glass, forms RGB three primary colors
Filter coating；
S3, cover-plate glass and Flip chip blue dies are bonded to each other, then are packaged.
The full-color flexibility RGB panels of one kind provided by the invention and its manufacturing method, using on Flip chip blue dies
Green emitting phosphor and red fluorescence powder are sprayed, so that it is sent out corresponding green and red, is matched with Flip chip blue dies
Realize full-color effect.
Description of the drawings
Fig. 1 is the structural diagram of the present invention.
In figure：
1- luminous material layers；2- electron transfer layers；3- green emitting phosphors；4- red fluorescence powders；5- cover-plate glass；6-Flip
Chip blue dies.
Specific implementation mode
The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that advantages and features of the invention energy
It is easier to be readily appreciated by one skilled in the art, so as to make a clearer definition of the protection scope of the present invention.
Shown in attached drawing 1, the full-color flexibility RGB panels of one kind in the present embodiment, including luminous material layer 1 and positioned at sending out
Electron transfer layer 2 on optical material layer 1, the LED luminescent layers on electron transfer layer 2, LED luminescent layers are using Flip chip blues
Chip 6,6 surface spraying green emitting phosphor 3 of Flip chip blue dies and red fluorescence powder 4, LED luminescent layers are equipped with cover board
Glass 5.
Corresponding RGB three primary colors filter coating is respectively equipped on RGB three primary colors illuminators.
Green emitting phosphor 3 is different with the thickness of red fluorescence powder 4, and green emitting phosphor 3 and red fluorescence powder 4 include overlapping
Region, overlapping region are used to form secondary colour.
The thickness of red fluorescence powder 4 is twice of the thickness of green emitting phosphor 3.
The thickness of red fluorescence powder 4 is 2.5-10nm, and the thickness of green light emitting layer is 5-10nm.
A kind of production method of full-color flexibility RGB panels, includes the following steps：
S1, Flip chip blue dies 6 are prepared on electron transfer layer 2, and sprayed on Flip chip blue dies 6
Green emitting phosphor 3 and red fluorescence powder 4 form RGB three primary colors illuminators；
S2, red filter film, green filter film, blue filter film are prepared in the bottom surface of cover-plate glass 5, it is former forms RGB tri-
Color filter coating；
S3, cover-plate glass 5 and Flip chip blue dies 6 are bonded to each other, then be packaged.
The technical concepts and features of embodiment of above only to illustrate the invention, its object is to allow be familiar with technique
People understands present disclosure and is implemented, and it is not intended to limit the scope of the present invention, all according to spirit of that invention
The equivalent change or modification that essence is done should all cover within the scope of the present invention.
Claims (6)
1. a kind of full-color flexibility RGB panels, it is characterised in that：Including luminous material layer (1) and it is located at the luminous material layer (1)
On electron transfer layer (2), the LED luminescent layers on the electron transfer layer (2), the LED luminescent layers are blue using Flip chip
Color chip (6), Flip chip blue dies (6) the surface spraying green emitting phosphor (3) and red fluorescence powder (4), it is described
LED luminescent layers are equipped with cover-plate glass (5).
2. the full-color flexibility RGB panels of one kind according to claim 1, it is characterised in that：The Flip chip blue dies
On be respectively equipped with corresponding RGB three primary colors filter coating.
3. the full-color flexibility RGB panels of one kind according to claim 1, it is characterised in that：The green emitting phosphor (3) and red
The thickness of color fluorescent powder (4) is different, and the green emitting phosphor (3) and red fluorescence powder (4) include overlapping region, the coincidence
Region is used to form secondary colour.
4. the full-color flexibility RGB panels of one kind according to claim 1, it is characterised in that：The thickness of the red fluorescence powder (4)
Degree is twice of the thickness of the green emitting phosphor (3).
5. the full-color flexibility RGB panels of one kind according to claim 1, it is characterised in that：The thickness of the red fluorescence powder (4)
Degree is 2.5-10nm, and the thickness of the green light emitting layer is 5-10nm.
6. a kind of production method of full-color flexibility RGB panels according to claim 1, which is characterized in that including walking as follows
Suddenly：
S1, Flip chip blue dies are prepared on electron transfer layer (2), and sprayed on Flip chip blue dies (6)
Green emitting phosphor (3) and red fluorescence powder (4) form RGB three primary colors illuminators；
S2, red filter film, green filter film, blue filter film are prepared in the bottom surface of cover-plate glass (5), forms RGB three primary colors
Filter coating；
S3, cover-plate glass (5) and Flip chip blue dies (6) are bonded to each other, then are packaged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810065658.9A CN108281524A (en) | 2018-01-23 | 2018-01-23 | Full-color flexibility RGB panels of one kind and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810065658.9A CN108281524A (en) | 2018-01-23 | 2018-01-23 | Full-color flexibility RGB panels of one kind and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108281524A true CN108281524A (en) | 2018-07-13 |
Family
ID=62804799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810065658.9A Pending CN108281524A (en) | 2018-01-23 | 2018-01-23 | Full-color flexibility RGB panels of one kind and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108281524A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102214651A (en) * | 2011-05-25 | 2011-10-12 | 映瑞光电科技(上海)有限公司 | LED (light emitting diode) pixel unit device structure and preparation method thereof |
| CN103943662A (en) * | 2014-04-21 | 2014-07-23 | 上海和辉光电有限公司 | Full-color organic light emitting diode structure and manufacturing method thereof |
| CN106898628A (en) * | 2017-04-28 | 2017-06-27 | 深圳市华星光电技术有限公司 | Led display panel |
| US20170186922A1 (en) * | 2015-12-29 | 2017-06-29 | Samsung Electronics Co., Ltd. | Quantum dots, production methods thereof, and electronic devices including the same |
-
2018
- 2018-01-23 CN CN201810065658.9A patent/CN108281524A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102214651A (en) * | 2011-05-25 | 2011-10-12 | 映瑞光电科技(上海)有限公司 | LED (light emitting diode) pixel unit device structure and preparation method thereof |
| CN103943662A (en) * | 2014-04-21 | 2014-07-23 | 上海和辉光电有限公司 | Full-color organic light emitting diode structure and manufacturing method thereof |
| US20170186922A1 (en) * | 2015-12-29 | 2017-06-29 | Samsung Electronics Co., Ltd. | Quantum dots, production methods thereof, and electronic devices including the same |
| CN106898628A (en) * | 2017-04-28 | 2017-06-27 | 深圳市华星光电技术有限公司 | Led display panel |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180713 |
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| RJ01 | Rejection of invention patent application after publication |