CN108270147A - A kind of laser aid and its light extraction method - Google Patents

A kind of laser aid and its light extraction method Download PDF

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CN108270147A
CN108270147A CN201611254519.8A CN201611254519A CN108270147A CN 108270147 A CN108270147 A CN 108270147A CN 201611254519 A CN201611254519 A CN 201611254519A CN 108270147 A CN108270147 A CN 108270147A
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light
cavity surface
laser
laser aid
ridge waveguide
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CN108270147B (en
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陈开胜
陈宏民
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Huawei Technologies Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/20Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/10Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/185Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only horizontal cavities, e.g. horizontal cavity surface-emitting lasers [HCSEL]
    • H01S5/187Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only horizontal cavities, e.g. horizontal cavity surface-emitting lasers [HCSEL] using Bragg reflection

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

本发明实施例公开了一种激光装置,用于减小了封装所需的空间尺寸,并降低封装时光路对准的复杂度。该装置包括:片上激光器;所述片上激光器包括出光腔面,反射腔面及脊波导;所述脊波导对应的出光方向与所述出光腔面的法线成目标角度,以使得沿着所述脊波导方向传播的光线在所述出光腔面输出时产生折射,且所述折射后的光线垂直于所述激光装置的解理面。

The embodiment of the invention discloses a laser device, which is used for reducing the space size required for packaging and reducing the complexity of optical path alignment for packaging. The device includes: an on-chip laser; the on-chip laser includes a light exit cavity surface, a reflective cavity surface and a ridge waveguide; the light exit direction corresponding to the ridge waveguide forms a target angle with the normal of the light exit cavity surface, so that along the The light propagating in the direction of the ridge waveguide is refracted when it is output from the surface of the light exit cavity, and the refracted light is perpendicular to the cleavage plane of the laser device.

Description

一种激光装置及其出光方法A kind of laser device and light output method thereof

技术领域technical field

本发明涉及光电子技术领域,尤其涉及一种激光装置及其出光方法。The invention relates to the field of optoelectronic technology, in particular to a laser device and a light emitting method thereof.

背景技术Background technique

光子集成是光电发展的趋势,有望大大降低光子系统成本并提高其性能。单片集成与混合集成是实现光子集成的两种有效方法,前者是在同一个衬底(如磷化铟(化学式:InP)衬底)上用实现不同功能的光器件,并实现互联;后者则是选用合适的材料体系来制作不同的光器件,通过压焊、键合等方式集成不同器件,并通过无源耦合实现光互联。由于不同的光器件可以选用各自合适的材料与较为成熟的工艺来实现,混合集成具有灵活度高,成本低廉的特点。混合集成中,大部分光器件可采用成本低廉、工艺较为成熟(与互补金属氧化物半导体(COMS Complementary Metal Oxide Semiconductor)工艺兼容)的硅(化学式:Si)光平台,如无源波导、MMI耦合器、调制器等。但由于Si是间接带隙材料,发光效率低,因此不适合做光源。而三五族材料可以制作高效率的光源,各种类型的三五族激光器如法布里-珀罗(FP,Fabry-perot)激光器,分布反馈(DFB,Distributed Feedback)激光器,分布拉格反射(DBR,Distributed Bragg Reflector)激光器等均已成功商用多年。Photonic integration is a trend in the development of optoelectronics, which is expected to greatly reduce the cost of photonic systems and improve their performance. Monolithic integration and hybrid integration are two effective methods to realize photonic integration. The former is to use optical devices with different functions on the same substrate (such as indium phosphide (chemical formula: InP) substrate) and realize interconnection; the latter The latter is to select a suitable material system to make different optical devices, integrate different devices through pressure welding, bonding, etc., and realize optical interconnection through passive coupling. Since different optical devices can be realized by selecting appropriate materials and relatively mature processes, hybrid integration has the characteristics of high flexibility and low cost. In hybrid integration, most optical devices can use silicon (chemical formula: Si) optical platforms with low cost and relatively mature technology (compatible with COMS Complementary Metal Oxide Semiconductor (COMS Complementary Metal Oxide Semiconductor) technology), such as passive waveguide, MMI coupling devices, modulators, etc. However, since Si is an indirect bandgap material and has low luminous efficiency, it is not suitable as a light source. And III-V materials can make high-efficiency light sources, various types of III-V lasers such as Fabry-Perot (FP, Fabry-perot) lasers, distributed feedback (DFB, Distributed Feedback) lasers, distributed Lagg reflection ( DBR, Distributed Bragg Reflector) lasers have been successfully commercialized for many years.

一种实现三五族激光器与Si光器件混合集成的典型方法是将已制作好的表面贴装激光装置倒贴在Si光器件上,两者的金属焊盘相接触,通过加热融化金属焊盘并冷却的方式将激光器与Si光芯片焊接。表面贴装激光装置一般在半导体衬底上制作激光器,并通过选择性刻蚀等工艺在激光器后面单片集成一个由其他材料组成的无源波导;从而激光器出来的光直接耦合到无源波导进行输出或与其他光器件耦合。A typical method for realizing hybrid integration of Group III and V lasers and Si optical devices is to attach the manufactured surface mount laser device upside down on the Si optical device, the metal pads of the two are in contact, and the metal pads are melted by heating and The cooling method welds the laser and the Si optical chip. Surface-mount laser devices generally manufacture lasers on semiconductor substrates, and monolithically integrate a passive waveguide composed of other materials behind the laser through selective etching and other processes; thus, the light from the laser is directly coupled to the passive waveguide for further processing. output or coupled with other optical devices.

但是表面贴装激光装置存在一个问题是其前腔面因刻蚀质量问题,导致存在一定的反射,使得激光装置在高温工作时,容易出现多纵模,从而导致跳模。However, there is a problem with the surface mount laser device that the front cavity surface has certain reflections due to the quality of the etching, which makes the laser device prone to multiple longitudinal modes when it works at high temperature, resulting in mode hopping.

现有技术中的表面贴装激光装置为了解决上述问题,采用斜腔面来减少端面反射对激光装置性能的影响,具体如图1所示。In order to solve the above-mentioned problems, the surface-mounted laser device in the prior art adopts an inclined cavity surface to reduce the influence of end face reflection on the performance of the laser device, as shown in FIG. 1 .

但是上述图1中的表面贴装激光装置的结构的会使得出光方向与解理面不垂直,即与芯片边缘不平行,需要较大的空间才能进行封装,倾斜出光也增加了封装时光路对准的复杂度。However, the structure of the surface mount laser device in Figure 1 above makes the light output direction not perpendicular to the cleavage plane, that is, not parallel to the edge of the chip, requiring a large space for packaging, and the inclined light output also increases the optical path of the package. standard complexity.

发明内容Contents of the invention

本发明实施例提供了一种激光装置及其出光方法,用于减小封装所需的空间尺寸,降低封装时光路对准的复杂度。Embodiments of the present invention provide a laser device and a light extraction method thereof, which are used to reduce the space size required for packaging and reduce the complexity of optical path alignment in packaging.

有鉴于此,本发明实施例第一方面提供了一种激光装置,包括:片上激光器;该片上激光器包括出光腔面,反射腔面及脊波导;In view of this, the first aspect of the embodiment of the present invention provides a laser device, including: an on-chip laser; the on-chip laser includes a light exit cavity surface, a reflective cavity surface, and a ridge waveguide;

脊波导对应的出光方向与出光腔面的法线成目标角度,以使得沿着脊波导方向传播的光线在出光腔面输出时产生折射,且折射后的光线垂直于激光装置的解理面。The light output direction corresponding to the ridge waveguide forms a target angle with the normal of the optical cavity surface, so that the light propagating along the ridge waveguide direction is refracted when output from the optical cavity surface, and the refracted light is perpendicular to the cleavage plane of the laser device.

本发明实施例中的激光装置中的脊波导和出光腔面能够倾斜设置,通过对目标角度的设置,能够使得激光装置的出光方向垂直于解理面,减小了封装所需的空间尺寸,并降低了封装时光路对准的复杂度。The ridge waveguide and the light exit cavity surface in the laser device in the embodiment of the present invention can be arranged obliquely. By setting the target angle, the light exit direction of the laser device can be perpendicular to the cleavage plane, reducing the space size required for packaging. And it reduces the complexity of packaging optical path alignment.

结合本发明实施例第一方面,在本发明实施例第一方面的第一种实现方式中,激光装置还包括:无源波导;With reference to the first aspect of the embodiments of the present invention, in the first implementation manner of the first aspect of the embodiments of the present invention, the laser device further includes: a passive waveguide;

无源波导与脊波导耦合连接,使得沿着脊波导方向传播的光线,在出光腔面输出时产生的折射,且折射后的光线沿着无源波导传播;The passive waveguide and the ridge waveguide are coupled and connected, so that the light propagating along the ridge waveguide is refracted when it is output on the surface of the light exit cavity, and the refracted light propagates along the passive waveguide;

无源波导对应的出光方向垂直于激光装置的解理面。The light output direction corresponding to the passive waveguide is perpendicular to the cleavage plane of the laser device.

本发明实施例中从出光腔面输出的折射光可以通过无源波导进行传输,提高了方案的灵活性。In the embodiment of the present invention, the refracted light output from the surface of the light exit cavity can be transmitted through the passive waveguide, which improves the flexibility of the solution.

结合本发明第一方面的第一种实现方式,在本发明实施例提供的第一方面的第二种实现方式中,该激光装置用于贴装在基板上。With reference to the first implementation manner of the first aspect of the present invention, in the second implementation manner of the first aspect provided by the embodiment of the present invention, the laser device is used for mounting on a substrate.

本发明实施例中的激光装置可以贴装在基板上,通过无源波导与基板进行消逝波耦合输出。The laser device in the embodiment of the present invention can be mounted on the substrate, and the evanescent wave coupling output with the substrate is performed through the passive waveguide.

结合本发明实施例第一方面的第一种实现方式,在本发明实施例第一方面的第三种实现方式中,无源波导为向下刻蚀氮化硅形成的条形波导。With reference to the first implementation manner of the first aspect of the embodiments of the present invention, in a third implementation manner of the first aspect of the embodiments of the present invention, the passive waveguide is a strip waveguide formed by etching down silicon nitride.

本发明实施例提供了一种无源波导的具体结构,提高了方案的可实现性。The embodiment of the present invention provides a specific structure of the passive waveguide, which improves the feasibility of the solution.

结合本发明实施例的第一方面,第一方面的第一及第三种实现方式中的任意一种实现方式,在本发明实施例第一方面的第四种实现方式中,脊波导对应的出光方向垂直于反射腔面。In combination with the first aspect of the embodiments of the present invention, any one of the first and third implementations of the first aspect, in the fourth implementation of the first aspect of the embodiments of the present invention, the corresponding ridge waveguide The light emitting direction is perpendicular to the surface of the reflective cavity.

本发明实施例中的脊波导垂直于反射腔面,能够提高片上激光器腔内的反射率。The ridge waveguide in the embodiment of the present invention is perpendicular to the surface of the reflective cavity, which can improve the reflectivity in the cavity of the on-chip laser.

结合本发明实施例的第一方面,第一方面的第一及第三种实现方式中的任意一种实现方式,在本发明实施例第一方面的第五种实现方式中,反射腔面及出光腔面均通过深刻蚀工艺形成。In combination with the first aspect of the embodiments of the present invention, any one of the first and third implementations of the first aspect, in the fifth implementation of the first aspect of the embodiments of the present invention, the reflective cavity surface and The surface of the light exit cavity is formed by a deep etching process.

本发明实施例提供了一种形成腔面的具体方式,提高了方案的可实现性。The embodiment of the present invention provides a specific way of forming the cavity surface, which improves the feasibility of the solution.

结合本发明实施例的第一方面,第一方面的第一及第三种实现方式中的任意一种实现方式,在本发明实施例第一方面的第六种实现方式中,出光腔面及反射腔面上均覆盖有致密物质。In combination with the first aspect of the embodiments of the present invention, any one of the first and third implementations of the first aspect, in the sixth implementation of the first aspect of the embodiments of the present invention, the light exit cavity surface and The surfaces of the reflective cavity are covered with dense substances.

本发明实施例中的腔面覆盖有致密物质,能够隔绝空气,防止腔面氧化而导致的损坏。The cavity surface in the embodiment of the present invention is covered with a dense substance, which can isolate air and prevent damage caused by oxidation of the cavity surface.

结合本发明实施例的第一方面,第一方面的第一及第三种实现方式中的任意一种实现方式,在本发明实施例第一方面的第七种实现方式中,片上激光器还包括金属反射镜。In combination with the first aspect of the embodiments of the present invention, any one of the first and third implementations of the first aspect, in the seventh implementation of the first aspect of the embodiments of the present invention, the on-chip laser further includes Metal reflector.

结合本发明实施例的第一方面,第一方面的第一及第三种实现方式中的任意一种实现方式,在本发明实施例第一方面的第八种实现方式中,脊波导采用周期性矩形槽结构,形成分布反馈的布拉格光栅。In combination with the first aspect of the embodiments of the present invention, any one of the first and third implementations of the first aspect, in the eighth implementation of the first aspect of the embodiments of the present invention, the ridge waveguide adopts periodic The rectangular groove structure forms a Bragg grating with distributed feedback.

本发明实施例中的脊波导能够形成分布反馈的布拉格光栅,具有单纵模输出的潜力,并具有较高的边模抑制比。The ridge waveguide in the embodiment of the present invention can form a Bragg grating with distributed feedback, has the potential of single longitudinal mode output, and has a higher side mode suppression ratio.

本发明实施例第二方面提供了一种激光装置的出光方法,包括:The second aspect of the embodiment of the present invention provides a method for extracting light from a laser device, including:

激光装置启动电源;Start the power supply of the laser device;

激光装置输出垂直于激光装置的解理面的光。The laser device outputs light perpendicular to the cleavage plane of the laser device.

从以上技术方案可以看出,本发明实施例具有以下优点:It can be seen from the above technical solutions that the embodiments of the present invention have the following advantages:

本发明实施例中的激光装置包括片上激光器,片上激光器包括出光腔面,反射腔面及脊波导,脊波导和出光腔面能够倾斜设置,让脊波导对应的出光方向与出光腔面的法线成目标角度,通过对目标角度的设置,能够使得激光器产生的光线沿着脊波导方向传播,在出光腔面输出时产生折射,且折射后的光线垂直与激光装置的解理面,即激光装置的出光方向垂直于解理面。由于激光装置的出光方向垂直于解理面,减小了封装所需的空间尺寸,并降低了封装时光路对准的复杂度。The laser device in the embodiment of the present invention includes an on-chip laser. The on-chip laser includes a light exit cavity surface, a reflective cavity surface, and a ridge waveguide. The ridge waveguide and the light exit cavity surface can be arranged obliquely, so that the light exit direction corresponding to the ridge waveguide and the normal line of the light exit cavity surface At the target angle, by setting the target angle, the light generated by the laser can be propagated along the direction of the ridge waveguide, refracted when output on the surface of the optical cavity, and the refracted light is perpendicular to the cleavage plane of the laser device, that is, the laser device The light emitting direction is perpendicular to the cleavage plane. Since the light output direction of the laser device is perpendicular to the cleavage plane, the space size required for packaging is reduced, and the complexity of optical path alignment in packaging is reduced.

附图说明Description of drawings

为了更清楚地说明本发明实施例的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例。In order to illustrate the technical solutions of the embodiments of the present invention more clearly, the following will briefly introduce the drawings used in the description of the embodiments. Apparently, the drawings in the following description are only some embodiments of the present invention.

图1是现有技术中激光装置的一个实施例示意图;Fig. 1 is a schematic diagram of an embodiment of a laser device in the prior art;

图2是本发明实施例中激光装置的一个实施例示意图;Fig. 2 is a schematic diagram of an embodiment of a laser device in an embodiment of the present invention;

图3是本发明实施例中激光装置的另一实施例示意图;3 is a schematic diagram of another embodiment of the laser device in the embodiment of the present invention;

图4是本发明实施例中激光装置的光路示意图;4 is a schematic diagram of the optical path of a laser device in an embodiment of the present invention;

图5是本发明实施例中激光装置的出光方法的一个实施例流程图。Fig. 5 is a flow chart of an embodiment of the light extraction method of the laser device in the embodiment of the present invention.

具体实施方式Detailed ways

下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

本发明的说明书和权利要求书及上述附图中的术语“第一”、“第二”、“第三”“第四”等(如果存在)是用于区别类似的对象,而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换,以便这里描述的本发明的实施例例如能够以除了在这里图示或描述的那些以外的顺序实施。此外,术语“包括”和“具有”以及他们的任何变形,意图在于覆盖不排他的包含,例如,包含了一系列步骤或单元的过程、方法、系统、产品或设备不必限于清楚地列出的那些步骤或单元,而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它步骤或单元。The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the present invention and the above drawings are used to distinguish similar objects and not necessarily Describe a specific order or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances such that the embodiments of the invention described herein are, for example, capable of practice in sequences other than those illustrated or described herein. Furthermore, the terms "comprising" and "having", as well as any variations thereof, are intended to cover a non-exclusive inclusion, for example, a process, method, system, product or device comprising a sequence of steps or elements is not necessarily limited to the expressly listed instead, may include other steps or elements not explicitly listed or inherent to the process, method, product or apparatus.

本发明实施例提供了一种激光装置及其出光方法,用于减小封装所需的空间尺寸,并降低封装时光路对准的复杂度。下面先介绍本发明实施例中的激光装置,图2为本发明实施例提供的激光装置的一个实施例,该激光装置包括:片上激光器201,该片上激光器包括出光腔面2011,反射腔面2012及脊波导2013;Embodiments of the present invention provide a laser device and a light extraction method thereof, which are used to reduce the space size required for packaging and reduce the complexity of optical path alignment in packaging. First introduce the laser device in the embodiment of the present invention below, Fig. 2 is an embodiment of the laser device provided by the embodiment of the present invention, this laser device comprises: on-chip laser device 201, this on-chip laser device comprises optical cavity surface 2011, reflective cavity surface 2012 and Ridge Waveguide 2013;

脊波导2013对应的出光方向与出光腔面2011的法线成目标角度,使得沿着脊波导方向传播的光线在出光腔面输出时产生折射,且折射后的光线垂直于激光装置的解理面。The light output direction corresponding to the ridge waveguide 2013 forms a target angle with the normal of the optical cavity surface 2011, so that the light propagating along the ridge waveguide direction is refracted when output from the optical cavity surface, and the refracted light is perpendicular to the cleavage plane of the laser device .

应理解,光是沿着波导方向传播的,因此片上激光器产生的光,会沿着脊波导2013传播,到达出光腔面2011输出时会产生折射,而此时折射光的方向由目标角度决定,本发明实施例中脊波导和出光腔面能够倾斜设置,通过对脊波导和出光腔面的设置对目标角度进行调整,即可以使得折射光垂直于激光装置的解理面。具体地,输出的折射光的角度与目标角度应满足如下关系:It should be understood that light propagates along the direction of the waveguide, so the light generated by the on-chip laser will propagate along the ridge waveguide 2013, and will be refracted when it reaches the output cavity surface 2011, and the direction of the refracted light is determined by the target angle. In the embodiment of the present invention, the ridge waveguide and the light exit cavity surface can be arranged obliquely, and the target angle can be adjusted by setting the ridge waveguide and the light exit cavity surface, so that the refracted light can be perpendicular to the cleavage plane of the laser device. Specifically, the angle of the output refracted light and the target angle should satisfy the following relationship:

其中θ1为脊波导中的光线与出光腔面的法线之间的夹角,即目标角度,且θ1不等于0,θ2为折射光线与出光腔面的法线之间的夹角,且θ2不等于0,n21为光线从出光腔面输出后进入的介质的折射率与脊波导2013的折射率之比。Where θ 1 is the angle between the light in the ridge waveguide and the normal of the cavity surface, that is, the target angle, and θ 1 is not equal to 0, and θ 2 is the angle between the refracted light and the normal of the cavity surface , and θ 2 is not equal to 0, n 21 is the ratio of the refractive index of the medium into which the light enters after outputting from the surface of the optical cavity to the refractive index of the ridge waveguide 2013 .

还应理解,光线从出光腔面2011输出后,可以通过光纤,或透镜或其他方式耦合出来,即该介质可以是光纤,可以是空气或其他,具体此处不作限定。It should also be understood that after the light is output from the light exit cavity surface 2011, it may be coupled out through an optical fiber, a lens or other means, that is, the medium may be an optical fiber, air or other, which is not limited here.

本发明实施例中的激光装置包括片上激光器,片上激光器包括出光腔面,反射腔面及脊波导,脊波导和出光腔面能够倾斜设置,让脊波导对应的出光方向与出光腔面的法线成目标角度,通过对目标角度的设置,能够使得激光器产生的光线沿着脊波导方向传播,在出光腔面输出时产生折射,且折射后的光线垂直与激光装置的解理面,即激光装置的出光方向垂直于解理面。由于激光装置的出光方向垂直于解理面,减小了封装所需的空间尺寸,并降低了封装时光路对准的复杂度。The laser device in the embodiment of the present invention includes an on-chip laser. The on-chip laser includes a light exit cavity surface, a reflective cavity surface, and a ridge waveguide. The ridge waveguide and the light exit cavity surface can be arranged obliquely, so that the light exit direction corresponding to the ridge waveguide and the normal line of the light exit cavity surface At the target angle, by setting the target angle, the light generated by the laser can be propagated along the direction of the ridge waveguide, refracted when output on the surface of the optical cavity, and the refracted light is perpendicular to the cleavage plane of the laser device, that is, the laser device The light emitting direction is perpendicular to the cleavage plane. Since the light output direction of the laser device is perpendicular to the cleavage plane, the space size required for packaging is reduced, and the complexity of optical path alignment in packaging is reduced.

基于上述图2对应的实施例,片上激光器产生的光线还可以通过其他方式输出,下面以其中几种为例对本发明实施例中的激光装置进行详细说明,请参阅图3,本发明实施例中激光装置的另一实施例包括:片上激光器301及无源波导302;Based on the above-mentioned embodiment corresponding to FIG. 2, the light generated by the on-chip laser can also be output in other ways. The laser device in the embodiment of the present invention will be described in detail below by taking several of them as examples. Please refer to FIG. 3, in the embodiment of the present invention Another embodiment of the laser device includes: an on-chip laser 301 and a passive waveguide 302;

片上激光器301包括出光腔面3011,反射腔面3012及脊波导3013,出光腔面3011位于片上激光器与无源波导对接的一端,反射腔面3012位于未与无源波导对接的另一端;脊波导3013与无源波导302耦合连接,且脊波导3013的出光方向与出光腔面3011的法线成目标角度,使得沿着脊波导3013方向传播的光线在出光腔面输出时产生折射,且折射后的光线沿着无源波导302传播;The on-chip laser 301 includes a light exit cavity surface 3011, a reflective cavity surface 3012 and a ridge waveguide 3013. The light exit cavity surface 3011 is located at one end where the on-chip laser is connected to the passive waveguide, and the reflective cavity surface 3012 is located at the other end that is not connected to the passive waveguide; the ridge waveguide 3013 is coupled to the passive waveguide 302, and the light output direction of the ridge waveguide 3013 forms a target angle with the normal of the light exit cavity surface 3011, so that the light propagating along the direction of the ridge waveguide 3013 is refracted when output from the light exit cavity surface, and after refraction The light propagates along the passive waveguide 302;

无源波导302对应的出光方向垂直于激光装置的解理面。本发明实施例中,由于光会沿着波导方向传播,即片上激光器301产生的光会沿着脊波导3013方向传输,到达出光腔面3011,再对接耦合到无源波导302中,光传输到无源波导后,会沿着无源波导302的方向传播,而无源波导302输出的光可以与其他芯片进行消逝波耦合,也可以从激光装置的解理面输出,还可以通过其他方式输出,具体此处不作限定。The light emitting direction corresponding to the passive waveguide 302 is perpendicular to the cleavage plane of the laser device. In the embodiment of the present invention, since the light will propagate along the waveguide direction, that is, the light generated by the on-chip laser 301 will be transmitted along the ridge waveguide 3013 direction, reach the optical cavity surface 3011, and then be butt-coupled into the passive waveguide 302, and the light will be transmitted to After the passive waveguide, it will propagate along the direction of the passive waveguide 302, and the light output by the passive waveguide 302 can be coupled with other chips by evanescent wave, can also be output from the cleavage plane of the laser device, and can also be output in other ways , not limited here.

应理解,片上激光器301产生的光到达出光腔面3011输出时会产生折射,而此时折射光的方向由目标角度和无源波导302的位置决定,本发明实施例为了使得折射后的光线能够垂直于解理面输出,则需要将无源波导302垂直于解理面放置,再通过对脊波导3013和出光腔面3011的设置对目标角度进行调整,从而使得折射后的光线沿着无源波导302方向垂直于激光装置的解理面输出。也就是说,脊波导3013中的光线作为入射光,无源波导302中的光线作为折射光,以出光腔面3011为界面满足折射定律,具体如图4所示。则无源波导中传输的光线与目标角度需要满足如下关系:It should be understood that the light generated by the on-chip laser 301 will be refracted when it reaches the optical cavity surface 3011 for output. At this time, the direction of the refracted light is determined by the target angle and the position of the passive waveguide 302. In the embodiment of the present invention, the refracted light can be If the output is perpendicular to the cleavage surface, the passive waveguide 302 needs to be placed perpendicular to the cleavage surface, and then the target angle should be adjusted by setting the ridge waveguide 3013 and the light exit cavity surface 3011, so that the refracted light can go along the passive The waveguide 302 is oriented perpendicular to the output of the cleave plane of the laser device. That is to say, the light in the ridge waveguide 3013 is used as the incident light, the light in the passive waveguide 302 is used as the refracted light, and the interface of the optical cavity surface 3011 satisfies the law of refraction, as shown in FIG. 4 . Then the angle between the light transmitted in the passive waveguide and the target needs to satisfy the following relationship:

其中θ1为脊波导中的光线与出光腔面的法线之间的夹角,即目标角度,且θ1不等于0,θ2为无源波导中的光线与出光腔面的法线之间的夹角,且θ2不等于0,n21为无源波导的折射率与脊波导3013的折射率之比。Where θ 1 is the angle between the light in the ridge waveguide and the normal of the exit cavity surface, that is, the target angle, and θ 1 is not equal to 0, and θ 2 is the angle between the light in the passive waveguide and the normal of the exit cavity surface The included angle between, and θ 2 is not equal to 0, n 21 is the ratio of the refractive index of the passive waveguide to the refractive index of the ridge waveguide 3013.

且理论上希望厚度方向上脊波导3013中心,无源波导302中心与出光腔面3011的法线在同一平面上,但实际上由于制作误差,脊波导中心,无源波导中心与出光腔面的法线并不完全共面,但这并不影响上述激光装置的实现。In theory, it is hoped that the center of the ridge waveguide 3013 in the thickness direction, the center of the passive waveguide 302 and the normal of the light exit cavity surface 3011 are on the same plane, but in fact, due to manufacturing errors, the center of the ridge waveguide, the center of the passive waveguide and the normal of the light exit cavity surface The normals are not perfectly coplanar, but this does not affect the realization of the laser device described above.

还应理解,在本发明实施例中,在制作上述激光装置时,可以先在衬底上制作片上激光器301,通过半导体工艺制作片上激光器301的腔面,接着再在片上激光器后部制作一个由折射率低于衬底的材料所组成的无源波导302。当然也可以通过其他方式制作上述激光装置,具体此处不作限定。It should also be understood that, in the embodiment of the present invention, when manufacturing the above-mentioned laser device, the on-chip laser 301 can be fabricated on the substrate first, the cavity surface of the on-chip laser 301 can be fabricated through a semiconductor process, and then a rear part of the on-chip laser can be fabricated. The passive waveguide 302 is composed of a material with a lower refractive index than the substrate. Of course, the above laser device can also be manufactured in other ways, which are not limited here.

还应理解,本发明实施例中激光装置可以贴装在基板上,该基板可以是平面光波导回路,或硅光芯片,或其他含有光波导的基板,具体此处不作限定。具体地,激光装置中的电极均共面,激光装置通过这些共面电极可以倒装焊接在基板上。而贴装在基板上之后,片上激光器输出的光通过对接耦合到无源波导中,再通过消逝波耦合到基板的光波导中,由此实现混合集成。当然片上激光装置还可以通过其他方式贴装在基板上,具体此处不作限定。还应理解,本发明实施例中的无源波导可以是向下刻蚀碳化硅或其他介质形成的条形波导,或其他形状的波导,具体此处不作限定。进一步地,为了避免氧化,还可以在上面覆盖二氧化硅或其他介质。It should also be understood that the laser device in the embodiment of the present invention can be mounted on the substrate, and the substrate can be a planar optical waveguide circuit, or a silicon photonics chip, or other substrates containing optical waveguides, which are not limited here. Specifically, the electrodes in the laser device are all coplanar, and the laser device can be flip-chip soldered on the substrate through these coplanar electrodes. After being mounted on the substrate, the light output by the on-chip laser is coupled into the passive waveguide through the butt joint, and then coupled into the optical waveguide of the substrate through the evanescent wave, thus realizing hybrid integration. Of course, the on-chip laser device can also be mounted on the substrate in other ways, which are not specifically limited here. It should also be understood that the passive waveguide in the embodiment of the present invention may be a strip waveguide formed by etching down silicon carbide or other media, or a waveguide of other shapes, which is not specifically limited here. Further, in order to avoid oxidation, it can also be covered with silicon dioxide or other media.

本发明实施例中的激光装置包括片上激光器,片上激光器包括出光腔面,反射腔面及脊波导,脊波导和出光腔面能够倾斜设置,让脊波导对应的出光方向与出光腔面的法线成目标角度,通过对目标角度的设置,能够使得激光器产生的光线沿着脊波导方向传播,在出光腔面输出时产生折射,且折射后的光线垂直与激光装置的解理面,即激光装置的出光方向垂直于解理面。由于激光装置的出光方向垂直于解理面,减小了封装所需的空间尺寸,并降低了封装时光路对准的复杂度。The laser device in the embodiment of the present invention includes an on-chip laser. The on-chip laser includes a light exit cavity surface, a reflective cavity surface, and a ridge waveguide. The ridge waveguide and the light exit cavity surface can be arranged obliquely, so that the light exit direction corresponding to the ridge waveguide and the normal line of the light exit cavity surface At the target angle, by setting the target angle, the light generated by the laser can be propagated along the direction of the ridge waveguide, refracted when output on the surface of the optical cavity, and the refracted light is perpendicular to the cleavage plane of the laser device, that is, the laser device The light emitting direction is perpendicular to the cleavage plane. Since the light output direction of the laser device is perpendicular to the cleavage plane, the space size required for packaging is reduced, and the complexity of optical path alignment in packaging is reduced.

其次,本发明实施例中的激光装置能够贴装在基板上,实现混合集成。Secondly, the laser device in the embodiment of the present invention can be mounted on the substrate to realize hybrid integration.

再次,本发明实施例中提供了多种无源波导的具体结构,提高了方案的灵活性。Thirdly, various specific structures of passive waveguides are provided in the embodiments of the present invention, which improves the flexibility of the solution.

基于上述图2或图3对应的实施例,在本发明实施例提供的激光装置的另一实施例中,脊波导垂直于反射腔面。应理解,该反射腔面可以是弧面,也可以是直面,具体此处不作限定。Based on the above embodiment corresponding to FIG. 2 or FIG. 3 , in another embodiment of the laser device provided by the embodiment of the present invention, the ridge waveguide is perpendicular to the reflective cavity surface. It should be understood that the reflective cavity surface may be a curved surface or a straight surface, which is not specifically limited here.

本发明实施例中脊波导垂直于反射腔面,能够提高反射率。In the embodiment of the present invention, the ridge waveguide is perpendicular to the reflective cavity surface, which can improve the reflectivity.

基于上述多个实施例中的任意一个实施例,在本发明实施例提供的激光装置的另一实施例中,片上激光器还包括金属反射镜,出光腔面及反射腔面通过深刻蚀工艺形成,且出光腔面及反射腔面上均覆盖有致密物质。应理解,该致密物质可以是二氧化硅或者其他物质,其厚度为2微米,也可以是其他数值,具体此处不作限定。Based on any one of the above-mentioned multiple embodiments, in another embodiment of the laser device provided by the embodiment of the present invention, the on-chip laser further includes a metal mirror, and the surface of the light exit cavity and the surface of the reflection cavity are formed by a deep etching process, In addition, the surface of the light exit cavity and the surface of the reflective cavity are covered with dense substances. It should be understood that the dense substance may be silicon dioxide or other substances, and its thickness may be 2 microns, or other values, which are not specifically limited here.

本发明实施例通过深刻蚀工艺制作激光器的腔面,在腔面上覆盖有致密物质,且采用金属作为反射镜面,能够有效隔绝空气,避免腔面氧化而导致的灾变性损坏,从而实现非气密性封装,大大简化了封装工艺,提高封装质量并减少成本。In the embodiment of the present invention, the cavity surface of the laser is fabricated by a deep etching process, and the cavity surface is covered with a dense substance, and metal is used as a reflective mirror surface, which can effectively isolate the air and avoid catastrophic damage caused by the oxidation of the cavity surface, thereby realizing non-gas Hermetic packaging greatly simplifies the packaging process, improves packaging quality and reduces costs.

基于上述多个实施例中的任意一个实施例,在本发明实施例提供的激光装置的另一实施例中,脊波导采用周期性矩形槽结构,形成分布反馈的布拉格光栅。Based on any one of the above-mentioned multiple embodiments, in another embodiment of the laser device provided by the embodiment of the present invention, the ridge waveguide adopts a periodic rectangular groove structure to form a Bragg grating with distributed feedback.

本发明实施例中的脊波导能够形成分布反馈的布拉格光栅,具有单纵模输出的潜力,且具有高的边摸抑制比。The ridge waveguide in the embodiment of the present invention can form a Bragg grating with distributed feedback, has the potential of single longitudinal mode output, and has a high side-to-mode suppression ratio.

上面介绍了本发明实施例中的激光装置,下面介绍本发明实施例中的激光装置,下面介绍本发明实施例中的出光方法,请参阅5,本发明实施例中激光装置的出光方法包括:The laser device in the embodiment of the present invention is introduced above, the laser device in the embodiment of the present invention is introduced below, and the light extraction method in the embodiment of the present invention is described below, please refer to 5. The light output method of the laser device in the embodiment of the present invention includes:

501、激光装置启动电源;501. Start the power supply of the laser device;

激光装置需要输出光时,首先启动装置的电源。应理解,本发明实施例中的激光装置包括至少一个片上激光器,该片上激光器包括出光腔面,反射腔面和脊波导,其中,脊波导对应的出光方向与出光腔面的法线成目标角度。还应理解,本发明实施例中的激光装置还可以包括无源波导,该无源波导与脊波导耦合连接,且该无源波导对应的出光方向垂直与激光装置的解理面。When the laser device needs to output light, first turn on the power of the device. It should be understood that the laser device in the embodiment of the present invention includes at least one on-chip laser, and the on-chip laser includes a light exit cavity surface, a reflective cavity surface and a ridge waveguide, wherein the light exit direction corresponding to the ridge waveguide is at a target angle to the normal of the light exit cavity surface . It should also be understood that the laser device in the embodiment of the present invention may also include a passive waveguide, which is coupled to the ridge waveguide, and the light output direction corresponding to the passive waveguide is perpendicular to the cleavage plane of the laser device.

502、激光装置输出垂直于与该激光装置的解理面的光。502. The laser device outputs light perpendicular to the cleavage plane of the laser device.

电源启动后,片上激光器产生光,光沿着脊波导传播,到达出光腔面时产生折射,根据目标角度的设置,光线依据折射定律沿着无源波导的方向继续传播,通过无源波导输出,输出的光垂直于激光装置的解理面。After the power is turned on, the on-chip laser generates light, which propagates along the ridge waveguide and refracts when it reaches the surface of the optical cavity. According to the setting of the target angle, the light continues to propagate along the direction of the passive waveguide according to the law of refraction, and is output through the passive waveguide. The output light is perpendicular to the cleavage plane of the laser device.

本发明实施例中的激光装置的输出的光垂直于芯片的解理面,减小了封装所需的空间尺寸,并降低了封装时光路对准的复杂度。The output light of the laser device in the embodiment of the present invention is perpendicular to the cleavage plane of the chip, which reduces the space size required for packaging and reduces the complexity of optical path alignment in packaging.

所属领域的技术人员可以清楚地了解到,为描述的方便和简洁,上述描述的系统,装置和单元的具体工作过程,可以参考前述方法实施例中的对应过程,在此不再赘述。Those skilled in the art can clearly understand that for the convenience and brevity of the description, the specific working process of the above-described system, device and unit can refer to the corresponding process in the foregoing method embodiment, which will not be repeated here.

在本申请所提供的几个实施例中,应该理解到,所揭露的系统,装置和方法,可以通过其它的方式实现。例如,以上所描述的装置实施例仅仅是示意性的,例如,所述单元的划分,仅仅为一种逻辑功能划分,实际实现时可以有另外的划分方式,例如多个单元或组件可以结合或者可以集成到另一个系统,或一些特征可以忽略,或不执行。另一点,所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口,装置或单元的间接耦合或通信连接,可以是电性,机械或其它的形式。In the several embodiments provided in this application, it should be understood that the disclosed system, device and method can be implemented in other ways. For example, the device embodiments described above are only illustrative. For example, the division of the units is only a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components can be combined or May be integrated into another system, or some features may be ignored, or not implemented. In another point, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces, and the indirect coupling or communication connection of devices or units may be in electrical, mechanical or other forms.

所述作为分离部件说明的单元可以是或者也可以不是物理上分开的,作为单元显示的部件可以是或者也可以不是物理单元,即可以位于一个地方,或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例方案的目的。The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place, or may be distributed to multiple network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

另外,在本发明各个实施例中的各功能单元可以集成在一个处理单元中,也可以是各个单元单独物理存在,也可以两个或两个以上单元集成在一个单元中。上述集成的单元既可以采用硬件的形式实现,也可以采用软件功能单元的形式实现。In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, each unit may exist separately physically, or two or more units may be integrated into one unit. The above-mentioned integrated units can be implemented in the form of hardware or in the form of software functional units.

所述集成的单元如果以软件功能单元的形式实现并作为独立的产品销售或使用时,可以存储在一个计算机可读取存储介质中。基于这样的理解,本发明的技术方案本质上或者说对现有技术做出贡献的部分或者该技术方案的全部或部分可以以软件产品的形式体现出来,该计算机软件产品存储在一个存储介质中,包括若干指令用以使得一台计算机设备(可以是个人计算机,服务器,或者网络设备等)执行本发明各个实施例所述方法的全部或部分步骤。而前述的存储介质包括:U盘、移动硬盘、只读存储器(英文全称:Read-OnlyMemory,英文缩写:ROM)、随机存取存储器(英文全称:Random Access Memory,英文缩写:RAM)、磁碟或者光盘等各种可以存储程序代码的介质。If the integrated unit is realized in the form of a software function unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the essence of the technical solution of the present invention or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium , including several instructions to make a computer device (which may be a personal computer, a server, or a network device, etc.) execute all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (English full name: Read-OnlyMemory, English abbreviation: ROM), random access memory (English full name: Random Access Memory, English abbreviation: RAM), disk Or various media such as CDs that can store program codes.

以上所述,以上实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。As mentioned above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: it can still understand the foregoing The technical solutions recorded in each embodiment are modified, or some of the technical features are replaced equivalently; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims (10)

1. a kind of laser aid, which is characterized in that including:On piece laser;
The on piece laser includes light extraction Cavity surface, reflects Cavity surface and ridge waveguide;
The corresponding light direction of ridge waveguide and the normal of the light extraction Cavity surface are into target angle, so that along the ridge ripple The light for leading direction propagation generates refraction when the light extraction Cavity surface exports, and the light after the refraction is perpendicular to the laser The cleavage surface of device.
2. laser aid according to claim 1, which is characterized in that described device further includes:Passive wave guide;
The passive wave guide is connect with ridge waveguide-coupled so that along the light that the ridge waveguide direction is propagated, in the light extraction Refraction is generated when Cavity surface exports, and the light after the refraction is propagated along the passive wave guide;
The corresponding light direction of the passive wave guide is perpendicular to the cleavage surface of the laser aid.
3. laser aid according to claim 2, which is characterized in that the laser aid is used to be mounted on substrate.
4. laser aid according to claim 2, which is characterized in that the passive wave guide is formed for downward etch silicon nitride Slab waveguide.
5. laser aid according to any one of claim 1 to 4, which is characterized in that the corresponding light extraction of the ridge waveguide Direction is perpendicular to the reflection Cavity surface.
6. laser aid according to any one of claim 1 to 4, which is characterized in that the light extraction Cavity surface and described anti- Cavity surface is penetrated to be formed by deep etching process.
7. laser aid according to any one of claim 1 to 4, which is characterized in that the light extraction Cavity surface and described anti- It penetrates and dense matter is all covered in Cavity surface.
8. laser aid according to any one of claim 1 to 4, which is characterized in that the on piece laser further includes Metallic mirror.
9. laser aid according to any one of claim 1 to 4, which is characterized in that the ridge waveguide is using periodically Rectangular groove structure forms the Bragg grating of distributed feed-back.
10. a kind of light extraction method of laser aid, which is characterized in that including:
The laser aid startup power supply;
The laser aid output is perpendicular to the light of the cleavage surface of the laser aid.
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