CN108270147A - A kind of laser aid and its light extraction method - Google Patents
A kind of laser aid and its light extraction method Download PDFInfo
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- CN108270147A CN108270147A CN201611254519.8A CN201611254519A CN108270147A CN 108270147 A CN108270147 A CN 108270147A CN 201611254519 A CN201611254519 A CN 201611254519A CN 108270147 A CN108270147 A CN 108270147A
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- light
- laser aid
- cavity surface
- laser
- light extraction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/185—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only horizontal cavities, e.g. horizontal cavity surface-emitting lasers [HCSEL]
- H01S5/187—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only horizontal cavities, e.g. horizontal cavity surface-emitting lasers [HCSEL] using Bragg reflection
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
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- Optical Integrated Circuits (AREA)
Abstract
The embodiment of the invention discloses a kind of laser aid, the complexity of light path alignment when encapsulating required bulk for reducing, and reducing encapsulation.The device includes：On piece laser；The on piece laser includes light extraction Cavity surface, reflects Cavity surface and ridge waveguide；The normal of the corresponding light direction of the ridge waveguide and the light extraction Cavity surface is into target angle, so that refraction is generated when the light extraction Cavity surface exports, and the light after the refraction is perpendicular to the cleavage surface of the laser aid along the light that the ridge waveguide direction is propagated.
Description
Technical field
The present invention relates to photoelectron technical field more particularly to a kind of laser aid and its light extraction methods.
Background technology
Integreted phontonics are the trend of photoelectricity development, are expected to substantially reduce photonic system cost and improve its performance.Monolithic collection
Into two kinds of effective ways for hybrid integrated being realization integreted phontonics, the former is in same substrate (such as indium phosphide (chemical formula：
InP) substrate) on the optical device for realizing different function, and realize interconnection；The latter is then that suitable material system is selected to make
Different optical devices integrates different components by modes such as pressure welding, bondings, and passes through passive coupling and realize optical interconnection.Due to not
Same optical device can select respective suitable material with more mature technique to realize, hybrid integrated has flexibility ratio height,
The characteristics of of low cost.In hybrid integrated, most of optical device can be used that of low cost, technique is more mature (with complementary metal
Oxide semiconductor (COMS Complementary Metal Oxide Semiconductor) process compatible) silicon (chemistry
Formula：Si) optical platform, such as passive wave guide, MMI couplers, modulator.But since Si is indirect bandgap material, luminous efficiency is low,
Therefore be not suitable for doing light source.And three-five material can make efficient light source, various types of three-five laser such as methods
Fabry-Perot-type (FP, Fabry-perot) laser, distributed feed-back (DFB, Distributed Feedback) laser, distribution
Glug reflection (DBR, Distributed Bragg Reflector) laser etc. has succeeded commercialization for many years.
A kind of typical method for realizing three-five laser and Si optical device hybrid integrateds is to paste the surface made
Dress laser aid lose money instead of making money on Si optical devices, the metal pad of the two is in contact, by heating and melting metal pad and cool down
Mode welds laser and Si optical chips.Surface mount laser aid generally makes laser on a semiconductor substrate, and leads to
Cross one passive wave guide being made of other materials of single-chip integration behind laser of the techniques such as selective etch；So as to laser
Light out be directly coupled to passive wave guide exported or with other Optical Device Couplings.
But it is its front cavity surface because etching quality problems that surface mount laser aid, which has a problem that, causes to exist certain
Reflection so that laser aid is susceptible to more longitudinal modes, so as to cause mode hopping in hot operation.
Surface mount laser aid of the prior art to solve the above-mentioned problems, end face reflection is reduced using oblique Cavity surface
Influence to laser aid performance, it is specific as shown in Figure 1.
But the meeting of the structure of the surface mount laser aid in above-mentioned Fig. 1 causes light direction and cleavage surface out of plumb,
It is i.e. not parallel with chip edge, it needs larger space that can just be packaged, tilts light path when light extraction also increases encapsulation and be aligned
Complexity.
Invention content
An embodiment of the present invention provides a kind of laser aid and its light extraction method, for reducing the space ruler needed for encapsulation
It is very little, the complexity of light path alignment when reducing encapsulation.
In view of this, first aspect of the embodiment of the present invention provides a kind of laser aid, including：On piece laser；The piece
Upper laser includes light extraction Cavity surface, reflects Cavity surface and ridge waveguide；
The corresponding light direction of ridge waveguide and the normal of light extraction Cavity surface are into target angle, so that being passed along ridge waveguide direction
The light broadcast generates refraction when light extraction Cavity surface exports, and the light after refraction is perpendicular to the cleavage surface of laser aid.
Ridge waveguide in laser aid and light extraction Cavity surface in the embodiment of the present invention can be obliquely installed, by target angle
The setting of degree enables to the light direction of laser aid to reduce the bulk needed for encapsulation, and drop perpendicular to cleavage surface
The complexity of light path alignment during low encapsulation.
With reference to the embodiment of the present invention in a first aspect, in the first realization method of first aspect of the embodiment of the present invention, swash
Electro-optical device further includes：Passive wave guide；
Passive wave guide is connect with ridge waveguide-coupled so that along the light that ridge waveguide direction is propagated, is exported in light extraction Cavity surface
When the refraction that generates, and the light after reflecting is propagated along passive wave guide；
The corresponding light direction of passive wave guide is perpendicular to the cleavage surface of laser aid.
The refraction light exported in the embodiment of the present invention from light extraction Cavity surface can be transmitted by passive wave guide, the side of improving
The flexibility of case.
With reference to the first realization method of first aspect present invention, the second of first aspect provided in an embodiment of the present invention
In kind realization method, which is used to be mounted on substrate.
Laser aid in the embodiment of the present invention can be mounted on substrate, and evanescent waves are carried out by passive wave guide and substrate
Coupling output.
With reference to the first realization method of first aspect of the embodiment of the present invention, in the third of first aspect of the embodiment of the present invention
In kind realization method, passive wave guide is the slab waveguide that downward etch silicon nitride is formed.
An embodiment of the present invention provides a kind of concrete structures of passive wave guide, improve the realizability of scheme.
With reference to the embodiment of the present invention in a first aspect, the first of first aspect and the third realization method in any one
Realization method, in the 4th kind of realization method of first aspect of the embodiment of the present invention, the corresponding light direction of ridge waveguide perpendicular to
Reflect Cavity surface.
Ridge waveguide in the embodiment of the present invention can improve the reflectivity on piece laser chamber perpendicular to reflection Cavity surface.
With reference to the embodiment of the present invention in a first aspect, the first of first aspect and the third realization method in any one
Realization method in the 5th kind of realization method of first aspect of the embodiment of the present invention, reflects Cavity surface and light extraction Cavity surface passes through depth
Etching technics is formed.
An embodiment of the present invention provides a kind of concrete modes for forming Cavity surface, improve the realizability of scheme.
With reference to the embodiment of the present invention in a first aspect, the first of first aspect and the third realization method in any one
Realization method in the 6th kind of realization method of first aspect of the embodiment of the present invention, covers in light extraction Cavity surface and reflection Cavity surface
There is dense matter.
Cavity surface in the embodiment of the present invention can completely cut off air covered with dense matter, prevent caused by Cavity surface from aoxidizing
Damage.
With reference to the embodiment of the present invention in a first aspect, the first of first aspect and the third realization method in any one
Realization method, in the 7th kind of realization method of first aspect of the embodiment of the present invention, on piece laser further includes metallic mirror.
With reference to the embodiment of the present invention in a first aspect, the first of first aspect and the third realization method in any one
Realization method, in the 8th kind of realization method of first aspect of the embodiment of the present invention, ridge waveguide uses periodic rectangular slot structure,
Form the Bragg grating of distributed feed-back.
Ridge waveguide in the embodiment of the present invention can form the Bragg grating of distributed feed-back, have the latent of single longitudinal mode output
Power, and with higher side mode suppression ratio.
Second aspect of the embodiment of the present invention provides a kind of light extraction method of laser aid, including：
Laser aid startup power supply；
Laser aid exports the light of the cleavage surface perpendicular to laser aid.
As can be seen from the above technical solutions, the embodiment of the present invention has the following advantages：
Laser aid in the embodiment of the present invention includes on piece laser, and on piece laser includes light extraction Cavity surface, reflection cavity
Face and ridge waveguide, ridge waveguide and light extraction Cavity surface can be obliquely installed, and allow the method for the corresponding light direction of ridge waveguide and light extraction Cavity surface
Line by the setting to target angle, enables to the light that laser generates to be propagated along ridge waveguide direction into target angle,
Refraction is generated when light extraction Cavity surface exports, and the light after reflecting vertically with the cleavage surface of laser aid, i.e. laser aid goes out
Light direction is perpendicular to cleavage surface.Since the light direction of laser aid is perpendicular to cleavage surface, the space ruler needed for encapsulation is reduced
It is very little, and when reducing encapsulation light path alignment complexity.
Description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, required use in being described below to embodiment
Attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the present invention.
Fig. 1 is one embodiment schematic diagram of laser aid in the prior art；
Fig. 2 is one embodiment schematic diagram of laser aid in the embodiment of the present invention；
Fig. 3 is another embodiment schematic diagram of laser aid in the embodiment of the present invention；
Fig. 4 is the light path schematic diagram of laser aid in the embodiment of the present invention；
Fig. 5 is one embodiment flow chart of the light extraction method of laser aid in the embodiment of the present invention.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.
Term " first ", " second ", " third " " in description and claims of this specification and above-mentioned attached drawing
The (if present)s such as four " are the objects for distinguishing similar, and specific sequence or precedence are described without being used for.It should manage
The data that solution uses in this way can be interchanged in the appropriate case, so that the embodiment of the present invention described herein for example can be to remove
Sequence other than those for illustrating or describing herein is implemented.In addition, term " comprising " and " having " and theirs is any
Deformation, it is intended that cover it is non-exclusive include, for example, containing the process of series of steps or unit, method, system, production
Product or equipment are not necessarily limited to those steps or unit clearly listed, but may include not listing clearly or for this
The intrinsic other steps of processes, method, product or equipment or unit a bit.
An embodiment of the present invention provides a kind of laser aid and its light extraction method, for reducing the space ruler needed for encapsulation
It is very little, and when reducing encapsulation light path alignment complexity.The laser aid in the embodiment of the present invention is first introduced below, and Fig. 2 is this hair
The one embodiment for the laser aid that bright embodiment provides, the laser aid include：On piece laser 201, the on piece laser
Including light extraction Cavity surface 2011, Cavity surface 2012 and ridge waveguide 2013 are reflected；
The normal of 2013 corresponding light direction of ridge waveguide and light extraction Cavity surface 2011 is into target angle so that along ridge waveguide
The light that direction is propagated generates refraction when light extraction Cavity surface exports, and the light after refraction is perpendicular to the cleavage surface of laser aid.
It should be understood that just propagated along wave guide direction, therefore the light that on piece laser generates, it can be along ridge waveguide 2013
It propagates, refraction can be generated by reaching when light extraction Cavity surface 2011 exports, and the direction for reflecting light at this time is determined by target angle, the present invention
Ridge waveguide and light extraction Cavity surface can be obliquely installed in embodiment, by the setting to ridge waveguide and light extraction Cavity surface to target angle into
Row adjustment, you can so that cleavage surface of the refraction light perpendicular to laser aid.Specifically, the angle and target of the refraction light of output
Angle should meet following relationship：
Wherein θ1For the angle between the light in ridge waveguide and the normal of light extraction Cavity surface, i.e. target angle, and θ1It is not equal to
0, θ2For the angle between the normal of refracted light and light extraction Cavity surface, and θ2Not equal to 0, n21Be light from light extraction Cavity surface output after
The ratio between the refractive index of the medium of entrance and the refractive index of ridge waveguide 2013.
It should also be understood that light can be coupled out after the output of light extraction Cavity surface 2011 by optical fiber or lens or other modes
Come, i.e., the medium can be optical fiber, can be air or other, this is not limited here.
Laser aid in the embodiment of the present invention includes on piece laser, and on piece laser includes light extraction Cavity surface, reflection cavity
Face and ridge waveguide, ridge waveguide and light extraction Cavity surface can be obliquely installed, and allow the method for the corresponding light direction of ridge waveguide and light extraction Cavity surface
Line by the setting to target angle, enables to the light that laser generates to be propagated along ridge waveguide direction into target angle,
Refraction is generated when light extraction Cavity surface exports, and the light after reflecting vertically with the cleavage surface of laser aid, i.e. laser aid goes out
Light direction is perpendicular to cleavage surface.Since the light direction of laser aid is perpendicular to cleavage surface, the space ruler needed for encapsulation is reduced
It is very little, and when reducing encapsulation light path alignment complexity.
Based on the corresponding embodiments of above-mentioned Fig. 2, the light that on piece laser generates can also export by other means, under
Face is described in detail the laser aid in the embodiment of the present invention for wherein several, referring to Fig. 3, the embodiment of the present invention
Another embodiment of middle laser aid includes：On piece laser 301 and passive wave guide 302；
On piece laser 301 includes light extraction Cavity surface 3011, reflects Cavity surface 3012 and ridge waveguide 3013, light extraction Cavity surface 3011
In one end that on piece laser is docked with passive wave guide, reflection Cavity surface 3012 is located at the other end not docked with passive wave guide；Ridge
Waveguide 3013 is of coupled connections with passive wave guide 302, and the normal of the light direction of ridge waveguide 3013 and light extraction Cavity surface 3011 is into mesh
Mark angle so that the light propagated along 3013 direction of ridge waveguide generates refraction, and the light after refraction when light extraction Cavity surface exports
Line is propagated along passive wave guide 302；
302 corresponding light direction of passive wave guide is perpendicular to the cleavage surface of laser aid.In the embodiment of the present invention, due to light
It can be propagated along wave guide direction, i.e., the light that on piece laser 301 generates can be transmitted along 3013 direction of ridge waveguide, reach emitting cavity
In face 3011, then Butt-coupling to passive wave guide 302, after optical transport to passive wave guide, it can be passed along the direction of passive wave guide 302
It broadcasts, and the light that passive wave guide 302 exports can carry out evanescent waves with other chips and couple, it can also be from the cleavage surface of laser aid
Output, can also export, this is not limited here by other means.
It should be understood that the light that on piece laser 301 generates, which is reached when light extraction Cavity surface 3011 exports, can generate refraction, and roll at this time
The direction for penetrating light determines by the position of target angle and passive wave guide 302, and the embodiment of the present invention is in order to enable light after refraction
It can be exported perpendicular to cleavage surface, then need perpendicular to cleavage surface to place passive wave guide 302, then by 3013 He of ridge waveguide
The setting of light extraction Cavity surface 3011 is adjusted target angle, so that the light after refraction is along 302 direction of passive wave guide
Cleavage surface perpendicular to laser aid exports.That is, the light in ridge waveguide 3013 is as incident light, passive wave guide 302
In light as refraction light, the law of refraction is met for interface with light extraction Cavity surface 3011, it is specific as shown in Figure 4.Then passive wave guide
The light of middle transmission needs to meet following relationship with target angle：
Wherein θ1For the angle between the light in ridge waveguide and the normal of light extraction Cavity surface, i.e. target angle, and θ1It is not equal to
0, θ2For the angle between the light in passive wave guide and the normal of light extraction Cavity surface, and θ2Not equal to 0, n21Folding for passive wave guide
Penetrate the ratio between rate and the refractive index of ridge waveguide 3013.
And theoretically wish 3013 center of ridge waveguide on thickness direction, 302 center of passive wave guide and light extraction Cavity surface 3011
Normal in the same plane, but actually due to fabrication error, ridge ripple guiding center, passive wave guide center and the normal of light extraction Cavity surface
It is not fully coplanar, but this has no effect on the realization of above-mentioned laser aid.
It should also be understood that in embodiments of the present invention, when making above-mentioned laser aid, on piece can be first made on substrate
Laser 301 makes the Cavity surface of on piece laser 301 by semiconductor technology, then makes one on piece laser rear portion again
It is a by the material passive wave guide 302 that is formed of the refractive index less than substrate.It can certainly make by other means above-mentioned sharp
Electro-optical device, this is not limited here.
It should also be understood that laser aid can be mounted on substrate in the embodiment of the present invention, which can be plane light wave
Road or silicon optical chip or other substrates for containing optical waveguide are led back to, this is not limited here.Specifically, in laser aid
Electrode is coplanar, and laser aid can be with face-down bonding on substrate by these coplanar electrodes.And after being mounted on substrate, piece
The light of upper laser output is coupled to by Butt-coupling to passive wave guide, then by evanescent waves in the optical waveguide of substrate, by
This realizes hybrid integrated.Certain on piece laser aid can also be mounted on substrate by other means, do not limited herein specifically
It is fixed.It should also be understood that the bar shaped that the passive wave guide in the embodiment of the present invention can be downward etching silicon carbide or other media are formed
Waveguide or the waveguide of other shapes, this is not limited here.Further, it in order to avoid oxidation, can also be covered above
Silica or other media.
Laser aid in the embodiment of the present invention includes on piece laser, and on piece laser includes light extraction Cavity surface, reflection cavity
Face and ridge waveguide, ridge waveguide and light extraction Cavity surface can be obliquely installed, and allow the method for the corresponding light direction of ridge waveguide and light extraction Cavity surface
Line by the setting to target angle, enables to the light that laser generates to be propagated along ridge waveguide direction into target angle,
Refraction is generated when light extraction Cavity surface exports, and the light after reflecting vertically with the cleavage surface of laser aid, i.e. laser aid goes out
Light direction is perpendicular to cleavage surface.Since the light direction of laser aid is perpendicular to cleavage surface, the space ruler needed for encapsulation is reduced
It is very little, and when reducing encapsulation light path alignment complexity.
Secondly, the laser aid in the embodiment of the present invention can be mounted on substrate, realize hybrid integrated.
Again, the concrete structure of a variety of passive wave guides is provided in the embodiment of the present invention, improves the flexibility of scheme.
Based on the corresponding embodiments of above-mentioned Fig. 2 or Fig. 3, in another embodiment of laser aid provided in an embodiment of the present invention
In, ridge waveguide is perpendicular to reflection Cavity surface.It should be understood that the reflection Cavity surface can be cambered surface or face directly, do not make herein specifically
It limits.
Ridge waveguide can improve reflectivity perpendicular to reflection Cavity surface in the embodiment of the present invention.
Based on any one embodiment in above-mentioned multiple embodiments, in the another of laser aid provided in an embodiment of the present invention
In one embodiment, on piece laser further includes metallic mirror, and light extraction Cavity surface and reflection Cavity surface are formed by deep etching process, and
Dense matter is all covered in light extraction Cavity surface and reflection Cavity surface.It should be understood that the dense matter can be silica or other
Substance, thickness are 2 microns or other numerical value, and this is not limited here.
The embodiment of the present invention makes the Cavity surface of laser by deep etching process, covered with dense matter in Cavity surface, and
Using metal as mirror surface, can effectively completely cut off air, avoid Cavity surface aoxidize caused by catastrophic damage, so as to fulfill
Non-airtight encapsulates, and enormously simplifies packaging technology, improves package quality and reduces cost.
Based on any one embodiment in above-mentioned multiple embodiments, in the another of laser aid provided in an embodiment of the present invention
In one embodiment, ridge waveguide uses periodic rectangular slot structure, forms the Bragg grating of distributed feed-back.
Ridge waveguide in the embodiment of the present invention can form the Bragg grating of distributed feed-back, have the latent of single longitudinal mode output
Power, and touch inhibition ratio with high side.
The laser aid in the embodiment of the present invention is described above, the laser aid in the embodiment of the present invention is described below,
The light extraction method in the embodiment of the present invention is described below, please refers to 5, the light extraction method packet of laser aid in the embodiment of the present invention
It includes：
501st, laser aid startup power supply；
When laser aid needs output light, the power supply of starter first.It should be understood that the laser dress in the embodiment of the present invention
It puts including at least one on piece laser, which includes light extraction Cavity surface, reflects Cavity surface and ridge waveguide, wherein, ridge ripple
The normal of corresponding light direction and light extraction Cavity surface is led into target angle.It should also be understood that the laser aid in the embodiment of the present invention
It can also include passive wave guide, which connect with ridge waveguide-coupled, and the corresponding light direction of the passive wave guide is vertical
With the cleavage surface of laser aid.
502nd, laser aid output is perpendicular to the light of the cleavage surface with the laser aid.
After power initiation, on piece laser generates light, and light is propagated along ridge waveguide, and refraction is generated when reaching light extraction Cavity surface,
According to the setting of target angle, light continues to propagate according to the law of refraction along the direction of passive wave guide, defeated by passive wave guide
Go out, the light of output is perpendicular to the cleavage surface of laser aid.
The light of the output of laser aid in the embodiment of the present invention is reduced perpendicular to the cleavage surface of chip needed for encapsulation
Bulk, and when reducing encapsulation light path alignment complexity.
It is apparent to those skilled in the art that for convenience and simplicity of description, the system of foregoing description,
The specific work process of device and unit can refer to the corresponding process in preceding method embodiment, and details are not described herein.
In several embodiments provided herein, it should be understood that disclosed system, device and method can be with
It realizes by another way.For example, the apparatus embodiments described above are merely exemplary, for example, the unit
It divides, only a kind of division of logic function can have other dividing mode, such as multiple units or component in actual implementation
It may be combined or can be integrated into another system or some features can be ignored or does not perform.Another point, it is shown or
The mutual coupling, direct-coupling or communication connection discussed can be the indirect coupling by some interfaces, device or unit
It closes or communicates to connect, can be electrical, machinery or other forms.
The unit illustrated as separating component may or may not be physically separate, be shown as unit
The component shown may or may not be physical unit, you can be located at a place or can also be distributed to multiple
In network element.Some or all of unit therein can be selected according to the actual needs to realize the mesh of this embodiment scheme
's.
In addition, each functional unit in each embodiment of the present invention can be integrated in a processing unit, it can also
That each unit is individually physically present, can also two or more units integrate in a unit.Above-mentioned integrated list
The form that hardware had both may be used in member is realized, can also be realized in the form of SFU software functional unit.
If the integrated unit is realized in the form of SFU software functional unit and is independent product sale or uses
When, it can be stored in a computer read/write memory medium.Based on such understanding, technical scheme of the present invention is substantially
The part to contribute in other words to the prior art or all or part of the technical solution can be in the form of software products
It embodies, which is stored in a storage medium, is used including some instructions so that a computer
Equipment (can be personal computer, server or the network equipment etc.) performs the complete of each embodiment the method for the present invention
Portion or part steps.And aforementioned storage medium includes：USB flash disk, mobile hard disk, read-only memory (English full name：Read-Only
Memory, english abbreviation：ROM), random access memory (English full name：Random Access Memory, english abbreviation：
RAM), the various media that can store program code such as magnetic disc or CD.
The above, the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although with reference to before
Embodiment is stated the present invention is described in detail, it will be understood by those of ordinary skill in the art that：It still can be to preceding
The technical solution recorded in each embodiment is stated to modify or carry out equivalent replacement to which part technical characteristic；And these
Modification is replaced, the spirit and scope for various embodiments of the present invention technical solution that it does not separate the essence of the corresponding technical solution.
Claims (10)
1. a kind of laser aid, which is characterized in that including：On piece laser；
The on piece laser includes light extraction Cavity surface, reflects Cavity surface and ridge waveguide；
The corresponding light direction of ridge waveguide and the normal of the light extraction Cavity surface are into target angle, so that along the ridge ripple
The light for leading direction propagation generates refraction when the light extraction Cavity surface exports, and the light after the refraction is perpendicular to the laser
The cleavage surface of device.
2. laser aid according to claim 1, which is characterized in that described device further includes：Passive wave guide；
The passive wave guide is connect with ridge waveguide-coupled so that along the light that the ridge waveguide direction is propagated, in the light extraction
Refraction is generated when Cavity surface exports, and the light after the refraction is propagated along the passive wave guide；
The corresponding light direction of the passive wave guide is perpendicular to the cleavage surface of the laser aid.
3. laser aid according to claim 2, which is characterized in that the laser aid is used to be mounted on substrate.
4. laser aid according to claim 2, which is characterized in that the passive wave guide is formed for downward etch silicon nitride
Slab waveguide.
5. laser aid according to any one of claim 1 to 4, which is characterized in that the corresponding light extraction of the ridge waveguide
Direction is perpendicular to the reflection Cavity surface.
6. laser aid according to any one of claim 1 to 4, which is characterized in that the light extraction Cavity surface and described anti-
Cavity surface is penetrated to be formed by deep etching process.
7. laser aid according to any one of claim 1 to 4, which is characterized in that the light extraction Cavity surface and described anti-
It penetrates and dense matter is all covered in Cavity surface.
8. laser aid according to any one of claim 1 to 4, which is characterized in that the on piece laser further includes
Metallic mirror.
9. laser aid according to any one of claim 1 to 4, which is characterized in that the ridge waveguide is using periodically
Rectangular groove structure forms the Bragg grating of distributed feed-back.
10. a kind of light extraction method of laser aid, which is characterized in that including：
The laser aid startup power supply；
The laser aid output is perpendicular to the light of the cleavage surface of the laser aid.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115207766A (en) * | 2022-07-12 | 2022-10-18 | 杭州泽达半导体有限公司 | Linear beam laser and packaged laser array |
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|---|---|---|---|---|
| GB2353898A (en) * | 1999-08-25 | 2001-03-07 | Bookham Technology Ltd | A semiconductor laser amplifier using waveguides |
| CN1658453A (en) * | 2004-02-18 | 2005-08-24 | 中国科学院半导体研究所 | Hybrid integrated tunable semiconductor laser |
| CN103346477A (en) * | 2013-06-28 | 2013-10-09 | 中国科学院半导体研究所 | External cavity laser with lateral coupling planar waveguide grating |
| CN106058641A (en) * | 2015-04-09 | 2016-10-26 | 国际商业机器公司 | Semiconductor chip and method of configuring same |
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2016
- 2016-12-30 CN CN201611254519.8A patent/CN108270147B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2353898A (en) * | 1999-08-25 | 2001-03-07 | Bookham Technology Ltd | A semiconductor laser amplifier using waveguides |
| CN1658453A (en) * | 2004-02-18 | 2005-08-24 | 中国科学院半导体研究所 | Hybrid integrated tunable semiconductor laser |
| CN103346477A (en) * | 2013-06-28 | 2013-10-09 | 中国科学院半导体研究所 | External cavity laser with lateral coupling planar waveguide grating |
| CN106058641A (en) * | 2015-04-09 | 2016-10-26 | 国际商业机器公司 | Semiconductor chip and method of configuring same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115207766A (en) * | 2022-07-12 | 2022-10-18 | 杭州泽达半导体有限公司 | Linear beam laser and packaged laser array |
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| CN108270147B (en) | 2019-08-20 |
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