CN108269722B - A kind of 15 note cathode assemblies of multiple-beam klystron and preparation method thereof - Google Patents
A kind of 15 note cathode assemblies of multiple-beam klystron and preparation method thereof Download PDFInfo
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- CN108269722B CN108269722B CN201711346102.9A CN201711346102A CN108269722B CN 108269722 B CN108269722 B CN 108269722B CN 201711346102 A CN201711346102 A CN 201711346102A CN 108269722 B CN108269722 B CN 108269722B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J23/00—Details of transit-time tubes of the types covered by group H01J25/00
- H01J23/02—Electrodes; Magnetic control means; Screens
- H01J23/04—Cathodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
- H01J9/04—Manufacture of electrodes or electrode systems of thermionic cathodes
- H01J9/042—Manufacture, activation of the emissive part
Abstract
The invention discloses the 15 note cathode assemblies and preparation method of a kind of multiple-beam klystron, it includes: cathode substructure (1), are spaced 15 cathode emitters (2) being uniformly embedded on cathode substructure (1) in aperture；It is suppressed between cathode substructure (1) back side and cathode support cylinder (3) tungsten powder agglomates (4), tungsten powder agglomates (4) is fixed by 15 emitters (2)；Heating heated filament is equipped in cathode support cylinder (3)；Cathode emitter (2) is equipped with step, is positioned by step, guarantees that cathode emitter (2) and cathode substructure (1) plane coincide.The present invention provides cathode assembly, reasonable in design, and precision is high, it is possible to provide the about 25A/cm in homogeneous tube environment2Above the cathode current emission.The preparation method of cathode assembly of the present invention, process operability is strong, processes the precision height being prepared, and superior performance can get the high cathode assembly of emission current densities.
Description
Technical field
The present invention relates to a kind of multiple-beam klystrons, and in particular to a kind of 15 note cathode assemblies of multiple-beam klystron and its adds
Work preparation method.
Background technique
Multiple-beam klystron is on the basis of high-power klystron, forever by many electrons' system technology, broadband technology, periodic reversal
Magnetic focusing and high emission density cathode etc. are combined together and a kind of novel HIGH-POWERED MICROWAVES vacuum electronic device for growing up
Part.It has the advantages that perveance is high, operating voltage is low, volume weight is small, bandwidth, frequency and high gain.Preparation has height
One of the technical issues of cathode assembly of emission is most critical substantially can using more overlay film impregnated cathode at present
Meet its needs.The continuous development due to military electronic technique is etched, what complete machine proposed device has been that comprehensive high-performance is wanted
It asks.Therefore, the cathode assembly as vacuum electron device heart, while guaranteeing the design of its electric parameter, it is necessary to consider it
Structure design, to meet reliability, consistency and the safety when work.
Multi-injection cathode is generally divided into two classes by size and structure: big multi-injection cathode and small multi-injection cathode, the former is will be each
Emit injection body to separate；The latter is to process many small emitters by special technique on each surface of emission, and with certain
Shape and aligned transfer.
But there is presently no the research reports in terms of multi-injection cathode preparation.
Summary of the invention
Goal of the invention: It is an object of the present invention to solve the deficiency of the existing technology and provide a kind of reasonable in design, essences
Degree is high, the high cathode assembly of emission current densities.Another object of the present invention is to provide 15 note cathodes of the multiple-beam klystron
The preparation for processing of component.
Technical solution: in order to achieve the goal above, the technical solution used in the present invention are as follows:
A kind of 15 note cathode assemblies of multiple-beam klystron, it includes: cathode substructure, and interval is uniformly embedded into cathode substructure
15 cathode emitters in upper aperture；Tungsten powder agglomates, tungsten powder agglomates are suppressed between the cathode substructure back side and cathode support cylinder
15 emitters are fixed；Heating heated filament is equipped in cathode support cylinder；
The cathode emitter is equipped with step, is positioned by step, guarantees cathode emitter and cathode substructure plane
It coincide.
Preferably, 15 note cathode assemblies of above-described multiple-beam klystron, cathode substructure are spaced on outer ring
10 cathode emitters are uniformly embedded into, inner ring interval has been uniformly embedded into 5 cathode emitters.Preferably, described
Cathode emitter diameter is 2.2mm.
Preferably, 15 note cathode assemblies of above-described multiple-beam klystron, cathode substructure, which is equipped with 3, to be determined
Position hole.
The preparation for processing of 15 note cathode assemblies of multiple-beam klystron of the present invention, comprising the following steps:
A, the design and processing of part
The design and processing of cathode substructure (1):
The dimensional accuracy of 15 apertures on cathode substructure is designed as 0.01 ± 0.001mm；The position essence of 15 apertures
Degree requires to be zero tolerance of diametrical direction, and circumferencial direction is uniformly distributed；By the position precision of 3 location holes and 15 apertures be Φ 0.02 ±
0.002mm；Cathode substructure is clamped on boring work table top, 15 apertures and 3 location holes are successively processed using drill bit；
B, the processing of cathode assembly
First according to calculating, the tungsten powder that compacting needs is weighed；It successively will be after cathode substructure and the assembling of cathode support cylinder
It is inverted on pressing mold bottom plate, then cathode emitter is respectively put into 15 apertures of cathode substructure, then in cathode substructure
Periphery puts on compacting cavity plate；Compacting cavity plate plays simultaneously carries out position positioning action to cathode substructure and cathode support cylinder；
Then tungsten powder is poured between the bottom surface of cathode substructure and cathode support cylinder, first uses cylindrical pre- pressing mold by tungsten
Molybdenum powder material tentatively flattens；Then will compacting upper mould cover on tungsten powder, the compacting upper mold be equipped with on cathode substructure
Quantity and 15 equal sized apertures；In pressing process, cathode emitter will not be suppressed；
C, hydraulic press is then used, applies 3~4MPa pressure, pressure maintaining 10~20 seconds, tungsten powder is compacted, tungsten is obtained
Powder agglomates to be fixed 15 emitters by the tungsten powder agglomates being compacted, and cathode substructure and cathode support cylinder is connected and fixed；
D, then heating heated filament is assembled in cathode support cylinder, is then encapsulated into diode, taken out on pretreatment platform
Vacuum is to P≤3 × 10-5Pa is powered to heating heated filament, cathode assembly is made to be gradually heated to 1200 DEG C, guarantees vacuum degree P in the process
≤3×10-5Pa obtains 15 note cathode assemblies after keeping the temperature 20~30min.
Preferably, the preparation for processing of 15 note cathode assemblies of above-described multiple-beam klystron, positioning
Core bar passes through pressing mold bottom plate, compacting cavity plate and compacting upper mold and realizes positioning.It can guarantee to suppress the hole in upper mold and cathode substructure
On hole centering.
Preferably, the preparation for processing of 15 note cathode assemblies of above-described multiple-beam klystron, pressing mold
3 positioning pins for being positioned to cathode substructure are inlaid on bottom plate.
Preferably, the preparation for processing of 15 note cathode assemblies of above-described multiple-beam klystron, it is described
Compacting cavity plate and suppress upper mold between outer circumferential position be equipped with trimmer, can effectively guarantee powder pressure by adjusting piece
The consistency of thickness of system.
Preferably, the preparation for processing of 15 note cathode assemblies of above-described multiple-beam klystron, step C
Using hydraulic press, applies 4MPa pressure, pressure maintaining 10 seconds, tungsten powder is compacted, obtains tungsten powder agglomates.
Preferably, the preparation for processing of 15 note cathode assemblies of above-described multiple-beam klystron, cathode
Emitter need to be by leaching salt treatment, specific steps are as follows: and aluminate is ground into powder, 80 meshes is crossed, is tuned into paste with celloidin,
It is applied to above cathode emitter, dries, drying is placed in hydrogen furnace, and annealing in hydrogen atmosphere is handled at 1690 DEG C~1760 DEG C, makes aluminic acid
Salt immerses in cathode emitter (inside is in cavernous structure, there is all multiple holes), takes out after cooling.It is greatly improved emissivity
Energy.
The compacting screening experiment of tungsten powder agglomates:
The quality of tungsten powder, pressure, time are the key parameters of powder pressing, in order to filter out optimal parameter, this
Invention has carried out campaign.The compacting test of 11 groups of different parameters has been carried out altogether, and test data summarizes as shown in table 1.
1 engineer testing data statistics of table
It is as follows according to the above test result analysis:
1. stereomicroscope observation: overall surface is in order；
2. with tweezers to the surface applied force of compacting cake: the compacting cake of 4MPa only has lesser pit, and 3MPa and
2.5MPa relatively weak；Tapped with hammer and drill bit to compacting cake surface: the compacting cake of 4MPa only has fritter cake to fall at edge,
But it is whole still fine.
3. to 1,2,3,4,9 progress wire cuttings one, to cut open be two: cake body does not occur and scatters phenomenon, only No. 1 cake is from cathode block
Middle entirety is fallen down；
Conclusion (of pressure testing):
The tungsten powder agglomates for the multi-injection cathode being had excellent performance can be suppressed with 4MPa, 10 seconds pressing parameters；And it reduces
Pressure, extension dwell time cannot improve pressed density；
And the firing that the present invention also carries out different temperatures and different time to pressed tungsten powder agglomates is tested, experiment knot
Fruit shows that hardness is higher after 1200 DEG C, sintering in 20 minutes, has passed through various envlronmental vibration tests, has met requirement.
According to the above screening technology test the experimental results showed that, the optimal compacting sintering technological parameter of tungsten powder agglomates are as follows: P=
4MPa, pressure maintaining 10 seconds, powder quality 1.75g, 1200 DEG C kept the temperature 20 minutes.
Cathode assembly provided by the invention, using porous cathode pedestal and the combination of the cathode emitter with positioning step is tied
Structure, it is ensured that cathode emitter and cathode substructure level coincide, and can avoid cathode side transmitting, guarantee emission of cathode electricity
Sub- uniformity.
In preparation process of the present invention, the present invention designs porous compacting tool set by many experiments, and when compacting can avoid 15
Cathode emitter is realized that W-Mo powder compacting is stronger, is more uniformly stressed.
It is consistent that multi-injection cathode temperature can be improved using the structure of back side compacting tungsten powder agglomates in cathode assembly molding of the present invention
Property, for W-Mo powder after 1200 DEG C of processing, intensity is high, can satisfy the shock resistance of cathode assembly.
The utility model has the advantages that the 15 note cathode assemblies and its processing technology and the prior art of multiple-beam klystron provided by the invention
Compared to having the advantage that
15 note cathode assemblies of multiple-beam klystron provided by the invention, reasonable in design, precision is high, and current emission is close
Degree is high, it is possible to provide the about 25A/cm in homogeneous tube environment2Above the cathode current emission, the development for more note vacuum devices provide by force
Strong support.
The processing method of 15 note cathode assemblies of multiple-beam klystron provided by the invention, is filtered out most by many experiments
Good processing step, process operability is strong, processes the precision height being prepared, and superior performance can get emission current densities
High cathode assembly.
Tolerance, the precision of strict control key part that the present invention passes through rational design mating parts；Fully consider structure
With the convenience of operation, designs and be prepared for precision height, easy-operating compacting tool set；It is tested by failure test and Metallographic Analysis
Card obtains the key parameter (quality, pressure and dwell time of powder etc.) of tungsten powder agglomates compacting；The compacting of final application mold
Multi-injection cathode component out has excellent performance.
Detailed description of the invention
Fig. 1 is structural schematic diagram when 15 note cathode assemblies of multiple-beam klystron provided by the invention are overlooked.
Fig. 2 is the structural schematic diagram of 15 note cathode assembly longitudinal sections of multiple-beam klystron provided by the invention.
Fig. 3 is the structural representation for the compacting tool set that 15 note cathode assemblies of multiple-beam klystron provided by the invention are processed
Figure.
Specific embodiment
In the following with reference to the drawings and specific embodiments, the present invention is furture elucidated, it should be understood that these embodiments are merely to illustrate
It the present invention rather than limits the scope of the invention, after the present invention has been read, those skilled in the art are to of the invention each
The modification of kind equivalent form falls within the application range as defined in the appended claims.
Embodiment 1
As depicted in figs. 1 and 2,15 note cathode assemblies of a kind of multiple-beam klystron, it includes: cathode substructure 1, and interval is equal
Even 15 cathode emitters 2 being embedded on cathode substructure 1 in aperture；It is suppressed between 1 back side of cathode substructure and cathode support cylinder 3
There is tungsten powder agglomates 4, tungsten powder agglomates 4 is fixed by 15 emitters 2；Heating heated filament is equipped in cathode support cylinder 3；On cathode substructure 1
Equipped with 3 location holes.
The cathode emitter 2 is equipped with step, is positioned by step, guarantees that cathode emitter 2 and cathode substructure 1 are flat
Face coincide.
15 note cathode assemblies of above-described multiple-beam klystron are spaced on the outer ring of cathode substructure 1 and have been uniformly embedded into
10 cathode emitters 2, inner ring interval have been uniformly embedded into 5 cathode emitters 2.
Embodiment 2
The preparation for processing of 15 note cathode assemblies of multiple-beam klystron, comprising the following steps:
A, the design and processing of part
The design and processing of cathode substructure 1:
The dimensional accuracy of 15 apertures on cathode substructure (1) is designed as 0.01 ± 0.001mm；The position of 15 apertures
Required precision is zero tolerance of diametrical direction, and circumferencial direction is uniformly distributed；It is Φ 0.02 by the position precision of 3 location holes and 15 apertures
±0.002mm；Cathode substructure 1 is clamped on boring work table top, 15 apertures and 3 positioning are successively processed using drill bit
Hole；
B, the processing of cathode assembly
As shown in figure 3, weighing the tungsten powder 1.75g that compacting needs according to calculating first；Successively by cathode substructure 1 with
Cathode support cylinder 3 is inverted on pressing mold bottom plate 5 after assembling, and cathode hair is then respectively put into 15 apertures of cathode substructure 1
Then beam 2 suppresses cavity plate 6 on the set of 1 periphery of cathode substructure；
Then tungsten powder is poured between the bottom surface of cathode substructure 1 and cathode support cylinder 3, it first will with cylindrical pre- pressing mold
Tungsten powder tentatively flattens；Then compacting upper mold 8 is covered on tungsten powder, the compacting upper mold 8 is equipped with and cathode bottom
Quantity and 15 equal sized apertures on seat 1；Outer circumferential position between the compacting cavity plate 6 and compacting upper mold 8 is equipped with
Trimmer 7.
C, hydraulic press is then used, applies 4MPa pressure, pressure maintaining 10 seconds, tungsten powder is compacted, obtains tungsten powder agglomates 4,
To by the tungsten powder agglomates 4 of compacting that 15 emitters 2 are fixed, and cathode substructure 1 and cathode support cylinder 3 are connected and fixed；
D, then heating heated filament is assembled in cathode support cylinder 3, is then encapsulated into diode, taken out on pretreatment platform
Vacuum is to P≤3 × 10-5Pa is powered to heating heated filament, cathode assembly is made to be gradually heated to 1200 DEG C, guarantees vacuum degree P in the process
≤3×10-5Pa obtains 15 note cathode assemblies after keeping the temperature 20min.
The preparation for processing of 15 note cathode assemblies of multiple-beam klystron of the present invention is worn by positioning core bar 9
Over-voltage baffle plate 5, compacting cavity plate 6 and compacting upper mold 8 realize positioning.And 3 are inlaid on pressing mold bottom plate 5 for cathode substructure
1 positioning pin 10 positioned.
The preparation for processing of 15 note cathode assemblies of multiple-beam klystron of the present invention, cathode emitter 2 are installed
Before, cathode emitter 2 first passes through leaching salt treatment, specific steps are as follows: aluminate is ground into powder, crosses 80 meshes, uses celloidin
It is tuned into paste, is applied to above cathode emitter 2, is dried, drying is placed in hydrogen furnace, at 1690 DEG C~1760 DEG C at annealing in hydrogen atmosphere
Reason immerses aluminate in cathode emitter 2, takes out after cooling.
Performance test: the 15 note cathode assembly tubulatures for taking the present invention to be prepared use, not only dimensional accuracy and geometry essence
Degree meets design requirement, and emitting performance is good, can get about 24A/cm in homogeneous tube environment2Above the cathode current emission,
There is provided strong support to infuse the development of vacuum device more.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also answered
It is considered as protection scope of the present invention.
Claims (6)
1. a kind of preparation for processing of 15 note cathode assemblies of multiple-beam klystron, which comprises the following steps:
A, the design and processing of part
The design and processing of cathode substructure (1):
The dimensional accuracy of 15 apertures on cathode substructure (1) is designed as 0.01 ± 0.001mm；The position precision of 15 apertures
It is required that being zero tolerance of diametrical direction, circumferencial direction is uniformly distributed；By the position precision of 3 location holes and 15 apertures be Φ 0.02 ±
0.002mm；Cathode substructure (1) is clamped on boring work table top, 15 apertures and 3 positioning are successively processed using drill bit
Hole；
B, the processing of cathode assembly
First according to calculating, the tungsten powder that compacting needs is weighed；Successively cathode substructure (1) and cathode support cylinder (3) is assembled
After be inverted on pressing mold bottom plate (5), be then respectively put into cathode emitter (2) in 15 apertures of cathode substructure (1), then
Compacting cavity plate (6) is put in cathode substructure (1) periphery；
Then tungsten powder is poured between the bottom surface of cathode substructure (1) and cathode support cylinder (3), it first will with cylindrical pre- pressing mold
Tungsten powder tentatively flattens；Then compacting upper mold (8) is covered on tungsten powder, the compacting upper mold (8) is equipped with and yin
Quantity and 15 equal sized apertures on pole pedestal (1)；
C, hydraulic press is then used, applies 3~4MPa pressure, pressure maintaining 10~20 seconds, tungsten powder is compacted, obtains tungsten powder agglomates
(4), thus it is by the tungsten powder agglomates (4) of compacting that 15 emitters (2) are fixed, and by cathode substructure (1) and cathode support cylinder
(3) it is connected and fixed；
D, then heating heated filament is assembled in cathode support cylinder (3), is then encapsulated into diode, taken out on pretreatment platform true
Sky is to P≤3 × 10-5Pa, to heating heated filament be powered, so that cathode assembly is gradually heated to 1200 DEG C, in the process guarantee vacuum degree P≤
3×10-5Pa obtains 15 note cathode assemblies after keeping the temperature 20~30min.
2. the preparation for processing of 15 note cathode assemblies of multiple-beam klystron according to claim 1, which is characterized in that
It positions core bar (9) and passes through pressing mold bottom plate (5), compacting cavity plate (6) and compacting upper mold (8) realization positioning.
3. the preparation for processing of 15 note cathode assemblies of multiple-beam klystron according to claim 1, which is characterized in that
3 positioning pins (10) for being positioned to cathode substructure (1) are inlaid on pressing mold bottom plate (5).
4. the preparation for processing of 15 note cathode assemblies of multiple-beam klystron according to claim 1, which is characterized in that
Outer circumferential position between the compacting cavity plate (6) and compacting upper mold (8) is equipped with trimmer (7).
5. the preparation for processing of 15 note cathode assemblies of multiple-beam klystron according to claim 1, which is characterized in that
Step C uses hydraulic press, applies 4MPa pressure, pressure maintaining 10 seconds, tungsten powder is compacted, obtains tungsten powder agglomates (4).
6. the preparation for processing of 15 note cathode assemblies of multiple-beam klystron according to claim 1, which is characterized in that
Cathode emitter (2) is by leaching salt treatment, specific steps are as follows: aluminate is ground into powder, crosses 80 meshes, is tuned into celloidin
Paste is applied to cathode emitter (2) above, and drying, drying is placed in hydrogen furnace, at 1690 DEG C~1760 DEG C at annealing in hydrogen atmosphere
Reason immerses aluminate in cathode emitter (2), takes out after cooling.
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| CN201711346102.9A CN108269722B (en) | 2017-12-15 | 2017-12-15 | A kind of 15 note cathode assemblies of multiple-beam klystron and preparation method thereof |
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| CN108269722B true CN108269722B (en) | 2019-09-27 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01120734A (en) * | 1987-11-04 | 1989-05-12 | Matsushita Electron Corp | Cathode body structure for magnetron |
| CN1354491A (en) * | 2000-11-17 | 2002-06-19 | 中国科学院电子学研究所 | Preparation method of small multiple injection speed regulating pipe cover-film cathode |
| CN201859827U (en) * | 2010-11-11 | 2011-06-08 | 中国电子科技集团公司第十二研究所 | Structure of electron gun of floated grid-controlled multiple-beam klystron |
| CN201893312U (en) * | 2010-12-03 | 2011-07-06 | 安徽华东光电技术研究所 | Multi-injection cathode assembly |
| CN105185675A (en) * | 2015-07-28 | 2015-12-23 | 安徽华东光电技术研究所 | Multi-injection cathode used for ultra-high-power microwave tube, and preparation method thereof |
-
2017
- 2017-12-15 CN CN201711346102.9A patent/CN108269722B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01120734A (en) * | 1987-11-04 | 1989-05-12 | Matsushita Electron Corp | Cathode body structure for magnetron |
| CN1354491A (en) * | 2000-11-17 | 2002-06-19 | 中国科学院电子学研究所 | Preparation method of small multiple injection speed regulating pipe cover-film cathode |
| CN201859827U (en) * | 2010-11-11 | 2011-06-08 | 中国电子科技集团公司第十二研究所 | Structure of electron gun of floated grid-controlled multiple-beam klystron |
| CN201893312U (en) * | 2010-12-03 | 2011-07-06 | 安徽华东光电技术研究所 | Multi-injection cathode assembly |
| CN105185675A (en) * | 2015-07-28 | 2015-12-23 | 安徽华东光电技术研究所 | Multi-injection cathode used for ultra-high-power microwave tube, and preparation method thereof |
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