CN108262557A - A kind of laser marking machine Atomatic focusing method and focusing mechanism based on optical axis light - Google Patents

A kind of laser marking machine Atomatic focusing method and focusing mechanism based on optical axis light Download PDF

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Publication number
CN108262557A
CN108262557A CN201810224719.1A CN201810224719A CN108262557A CN 108262557 A CN108262557 A CN 108262557A CN 201810224719 A CN201810224719 A CN 201810224719A CN 108262557 A CN108262557 A CN 108262557A
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China
Prior art keywords
optical axis
marking machine
laser marking
laser
displacement device
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CN201810224719.1A
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Chinese (zh)
Inventor
梁宜勇
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Zhejiang University ZJU
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Zhejiang University ZJU
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Priority to CN201810224719.1A priority Critical patent/CN108262557A/en
Publication of CN108262557A publication Critical patent/CN108262557A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046Automatically focusing the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/361Removing material for deburring or mechanical trimming

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Automatic Focus Adjustment (AREA)
  • Measurement Of Optical Distance (AREA)

Abstract

The invention discloses a kind of laser marking machine Atomatic focusing method and focusing mechanism based on optical axis light, by tracking subpoint position on planar array detector image planes of the light pencil by objective lens optical axis of laser marking machine on object, to realize focus function.The light pencil for sending out inside laser marking machine and being emitted through objective lens optical axis, it is radiated at marking subject surface and forms projection hot spot, one planar array detector for having fixed position relationship with object lens, the projection hot spot is imaged and obtains the laser image spot and the deviation of pre-stored location, the axial distance of object lens and marking object is changed by electricity driving displacement device and this deviation is made to be zero, so as to fulfill auto-focusing.The present invention has higher focusing sensitivity and precision, detecting system installation degree of freedom is high, the target point not transverse shifting being tracked in focussing process realizes the auto-focusing without artificial interpretation or intervention with reference to electricity driving displacement device, adapts to the marking object of variform.

Description

A kind of laser marking machine Atomatic focusing method and focusing mechanism based on optical axis light
Technical field
The invention belongs to laser marking machine technical field, more particularly, to a kind of laser marking machine based on optical axis light from Dynamic focusing method and focusing mechanism.
Background technology
Laser marking machine is the technology for stamping permanent marks in a variety of different material surfaces using laser beam.The technology is led to It crosses laser and generates laser beam, by a series of optic deliveries and processing, carry out light beam focusing eventually by optical mirror slip, then High-energy light beam after focusing is deflected into the designated position of body surface to be processed.Laser marking machine can mark various texts Word, symbol and pattern, market application foreground are wide.
Focusing is correctly the premise that laser marking machine obtains clear marking figure.It is existing most of including 3D laser markings Machine generally by inputting thickness, the height equidimension of marking object, then makes laser beam by the means such as manual or electronic again It is i.e. accurate burnt to be focused at marking subject surface, when marking object size is unknown or is difficult to measure, focus operations will become it is cumbersome or It is difficult.
For auto-focusing then without knowing marking object size in advance, it can be automatically by marking object lock in accurate burnt position It puts.The key of auto-focusing is position from defocus, i.e., how to judge whether marking object deviates from focus position.In laser marking machine Upper additional laser rangefinder and to be directed toward marked area be a common methods, when marking subject out of focus, laser range finder can be felt Know the variation of distance, but it has a shortcoming, since its distance measuring light beam is oblique illumination marking object, with focusing into Capable, distance measuring light beam understands transverse shifting in the projected light of marking subject surface, so as to deviate scheduled marked area, when marking pair As if during on-plane surface, this problem is just very serious.The position from defocus of nearly all oblique illumination marking object has this problem.
Invention content
In view of the deficiencies of the prior art, the present invention provides a kind of laser marking machine auto-focusing sides based on optical axis light The light pencil being emitted through objective lens optical axis is utilized in method and focusing mechanism, can guarantee that light pencil projection hot spot does not exist in focussing process Marking subject surface transverse shifting can not only simplify optical system, reduce cost, while have higher focusing sensitivity and essence Degree.
A kind of laser marking machine Atomatic focusing method based on optical axis light, includes the following steps:
(1) it by generating the light pencil across objective lens optical axis inside laser marking machine, is radiated at marking subject surface and generates throwing Shadow hot spot;
(2) by there is the planar array detector of fixed position relationship with object lens, above-mentioned projection hot spot is imaged;
(3) microprocessor system obtains the current location of planar array detector laser image spot, and predeterminated position corresponding with quasi- coke It is compared;
(4) if above-mentioned two positions are misfitted, microprocessor system instruction electricity driving displacement device controls marking object and object lens Between do closer or far from relative motion, contracted position is poor, then goes to above-mentioned steps (3), if above-mentioned two positions coincide, turn To following step (5);
(5) microprocessor system instruction electricity driving displacement device stops the relative motion between marking object and object lens, automatically Focusing is completed.
In step (4), the object lens can with fixed placement, by electricity driving displacement device control marking object closer or far from The relative motion of object lens;Or by marking object fixed placement, object lens are controlled closer or far from marking by electricity driving displacement device The relative motion of object.
The present invention also provides a kind of laser marking machine automatic focusing mechanism based on optical axis light, including:
Laser marking machine, for generating laser or light pencil;
Object lens, positioned at laser marking machine output terminal, for being emitted to mark by parallel laser beam focus or by light pencil It carves on object, generates projection hot spot;
Planar array detector keeps relative space position to fix with object lens, for projection hot spot imaging;
Electricity driving displacement device, for control done between marking object and object lens closer or far from relative motion;
Microprocessor system is connect with planar array detector and electricity driving displacement device, for reading planar array detector laser image spot Current location, electricity driving displacement device is driven to compensate defocus according to the difference of the laser image spot and reserved focus position.
In the present apparatus, light pencil generates projection hot spot through objective lens exit, illumination marking object, and planar array detector is to the projection Hot spot is imaged, and microprocessor system can drive electricity driving displacement device compensation defocus according to the laser image spot, so as to fulfill auto-focusing Target.
In the device, planar array detector keeps space fixed relationship with object lens, and electricity driving displacement device both can be configured to carry Object lens can be configured as carrying marking object.
Preferably, the optical axis of the object lens is overlapped with the light pencil that laser marking machine exports.Ensure thin in focussing process Light beam projecting hot spot is not in marking subject surface transverse shifting so that when to Object Surface and complex surface object marking also not Scheduled marked area can be deviateed.
Preferably, the planar array detector is fixed on the shell of laser marking machine so that the structure of whole device is more Step up to gather, the position between planar array detector and object lens is relatively fixed.
Preferably, the marking object is fixed on the electricity driving displacement device, the control marking pair of electricity driving displacement device As closer or far from object lens.
Preferably, the laser marking machine is fixed on the electricity driving displacement device, electricity driving displacement device control object lens Closer or far from marking object.
Preferably, the microprocessor system be a system based on embedded chip such as MCU, DSP or ARM etc. or PC machine.It can read the image information of planar array detector and processing obtains current facula position.Microprocessor system advances for There are one location information corresponding with quasi- coke, which can guarantee that marking goes out clearly figure.Microprocessor system can incite somebody to action Current facula position is compared with reserved focus position.
The beneficial effects of the invention are as follows:
1st, the present invention is ingenious for auto-focusing by the instruction feux rouges of most laser marking machine standard configurations, can simplify optics System reduces cost.Certainly it needs additionally to be configured in the case of no or be swashed using the marking through moderately decaying for passing through optical axis Trimmed book body.
2nd, the present invention can guarantee that light pencil is thrown in focussing process since the light pencil being emitted through objective lens optical axis is utilized For shadow hot spot not in marking subject surface transverse shifting, this is very important the marking of Object Surface and complex surface object.
3rd, the present invention is not high to the installation requirement of planar array detector, as long as the light pencil projected light of marking subject surface can be allowed Spot enters detector field of view, and detector keeps constant with the relative position of object lens after installation.
4th, the displacement drive during auto-focusing of the present invention, can both act on object lens, can also act on marking pair As long as both this can perform relative motion, so as to offer convenience to different use target or occasion.
5th, the present invention has higher focusing sensitivity and precision, and the submillimeter focusing that can fully meet laser marking machine will It asks.
6th, disclosure is particularly well suited to size is unknown or be difficult to the marking object measured.
Description of the drawings
Fig. 1 is the embodiment of the present invention schematic diagram;
Fig. 2 is another embodiment schematic diagram of the present invention.
In figure:1. object lens, 2. marking objects, 3. electricity driving displacement devices, 4. microprocessor systems, 5. planar array detectors, 6. Light pencil.
Specific embodiment
The invention will be further described below in conjunction with the accompanying drawings.
Embodiment 1
As shown in Figure 1, the laser marking machine of the present embodiment is vertical structure, including object lens 1, marking object 2, electricity driving displacement Device 3, microprocessor system 4, planar array detector 5 and light pencil 6.Object lens 1 are located at the output terminal of laser marking machine, marking object 2 can follow electricity driving displacement device 3 to move up and down vertically.Planar array detector 5 has fixed position relationship, this implementation with object lens 1 In example, planar array detector 5 and 1 equal remains stationary of object lens.Light pencil 6 can be generated inside laser marking machine, the optical axis through object lens 1 Outgoing, illumination marking object 2, and projection hot spot is generated on marking object 2.
The laser marking machine Atomatic focusing method step of the present embodiment is as follows:
Step 1, by generating the light pencil 6 across 1 optical axis of object lens inside laser marking machine, it is radiated at 2 surface of marking object Generate projection hot spot.
Step 2, planar array detector 5 is imaged above-mentioned projection hot spot.
Step 3, microprocessor system 4 obtains the current location of 5 laser image spot of planar array detector, and corresponding with quasi- coke default Position is compared.Microprocessor system 4 is advanced for there are one location information corresponding with quasi- coke, which can guarantee Marking goes out clearly figure.
Step 4, microprocessor system 4 also controls electricity driving displacement device 3, it is determined according to the comparison result of above-mentioned position Whether electricity driving displacement device 3 drives and driving direction.Electricity driving displacement device 3 by continuous vertical and straight movement to correct above-mentioned alternate position spike, Until the alternate position spike is zero, the also corresponding stop motion of marking object 2 at this time, meaning auto-focusing is completed.
Step 5, laser marking machine can be to carrying out marking based on the region near above-mentioned optical axis ray cast facula position Operation, can the size of marked area depend on the face shape distribution in the region, be subject in region can marking it is clear.
Embodiment 2
As shown in Fig. 2, the laser marking machine of the present embodiment is horizontal type structure, including object lens 1, marking object 2, electricity driving displacement Device 3, microprocessor system 4, planar array detector 5 and light pencil 6.Object lens 1 are located at the output terminal of laser marking machine, marking object 2 static placements, object lens 1 can follow electricity driving displacement device 3 to move horizontally.Planar array detector 5 has fixed position to close with object lens 1 It is that in the present embodiment, when object lens 1 move, planar array detector 5 is also corresponding mobile.Light pencil can be generated inside laser marking machine 6, the optical axis outgoing through object lens 1, illumination marking object 2, and projection hot spot is generated on marking object 2.
The laser marking machine Atomatic focusing method step of the present embodiment is as follows:
Step 1, by generating the light pencil 6 across 1 optical axis of object lens inside laser marking machine, it is radiated at 2 surface of marking object Generate projection hot spot.
Step 2, planar array detector 5 is imaged above-mentioned projection hot spot.Planar array detector 5 has fixed position to close with object lens 1 System, it is meant that when object lens 1 move, planar array detector 5 is also corresponding mobile.
Step 3, microprocessor system 4 obtains the current location of 5 laser image spot of planar array detector, and corresponding with quasi- coke default Position is compared.Microprocessor system 4 is advanced for there are one location information corresponding with quasi- coke, which can guarantee Marking goes out clearly figure.
Step 4, microprocessor system 4 also controls electricity driving displacement device 3, it is determined according to the comparison result of above-mentioned position Whether electricity driving displacement device 3 drives and driving direction.Electricity driving displacement device 3 drives object lens 1 to move horizontally with amendment by continuous Above-mentioned alternate position spike, until the alternate position spike is zero, the also corresponding stop motion of object lens 1 at this time, meaning auto-focusing is completed.
Step 5, laser marking machine can be to carrying out marking based on the region near above-mentioned optical axis ray cast facula position Operation, can the size of marked area depend on the face shape distribution in the region, be subject in region can marking it is clear.

Claims (9)

1. a kind of laser marking machine Atomatic focusing method based on optical axis light, which is characterized in that include the following steps:
(1) it by generating the light pencil across objective lens optical axis inside laser marking machine, is radiated at marking subject surface and generates projected light Spot;
(2) by there is the planar array detector of fixed position relationship with object lens, above-mentioned projection hot spot is imaged;
(3) microprocessor system obtains the current location of planar array detector laser image spot, and is carried out with accurate burnt corresponding predeterminated position It compares;
(4) if above-mentioned two positions are misfitted, microprocessor system instruction electricity driving displacement device is controlled between marking object and object lens Do closer or far from relative motion, contracted position is poor, then goes to above-mentioned steps (3), if above-mentioned two positions coincide, goes to down State step (5);
(5) microprocessor system instruction electricity driving displacement device stops the relative motion between marking object and object lens, auto-focusing It completes.
2. the laser marking machine Atomatic focusing method according to claim 1 based on optical axis light, which is characterized in that step (4) in, the object lens fixed placement, the electricity driving displacement device control marking object is closer or far from the relative motion of object lens.
3. the laser marking machine Atomatic focusing method according to claim 1 based on optical axis light, which is characterized in that step (4) in, the marking object fixed placement, the electricity driving displacement device control object lens are closer or far from the opposite fortune of marking object It is dynamic.
4. a kind of laser marking machine automatic focusing mechanism based on optical axis light, which is characterized in that including:
Laser marking machine, for generating laser or light pencil;
Object lens, positioned at laser marking machine output terminal, for being emitted to marking pair by parallel laser beam focus or by light pencil As upper, generation projection hot spot;
Planar array detector keeps relative space position to fix with object lens, for projection hot spot imaging;
Electricity driving displacement device, for control done between marking object and object lens closer or far from relative motion;
Microprocessor system is connect with planar array detector and electricity driving displacement device, for reading working as planar array detector laser image spot Front position drives electricity driving displacement device to compensate defocus according to the difference of the laser image spot and reserved focus position.
5. the laser marking machine automatic focusing mechanism according to claim 4 based on optical axis light, which is characterized in that described The optical axis of object lens is overlapped with the light pencil that laser marking machine exports.
6. the laser marking machine automatic focusing mechanism according to claim 4 based on optical axis light, which is characterized in that described Planar array detector is fixed on the shell of laser marking machine.
7. the laser marking machine automatic focusing mechanism according to claim 4 based on optical axis light, which is characterized in that described Marking object is fixed on the electricity driving displacement device, and electricity driving displacement device controls marking object closer or far from object lens.
8. the laser marking machine automatic focusing mechanism according to claim 4 based on optical axis light, which is characterized in that described Laser marking machine is fixed on the electricity driving displacement device, and electricity driving displacement device controls object lens closer or far from marking object.
9. the laser marking machine automatic focusing mechanism according to claim 4 based on optical axis light, which is characterized in that described Microprocessor system is a system or PC machine based on MCU, DSP or ARM.
CN201810224719.1A 2018-03-19 2018-03-19 A kind of laser marking machine Atomatic focusing method and focusing mechanism based on optical axis light Pending CN108262557A (en)

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CN201810224719.1A CN108262557A (en) 2018-03-19 2018-03-19 A kind of laser marking machine Atomatic focusing method and focusing mechanism based on optical axis light

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0613282A (en) * 1992-06-26 1994-01-21 Fujitsu Ltd Autofocus, mask wafer gap measuring method and its equipment
CN104535296A (en) * 2014-12-03 2015-04-22 中国科学院苏州生物医学工程技术研究所 Coaxiality detection and adjusting method of multiple beams
US9215425B1 (en) * 2013-02-04 2015-12-15 Bruker Nano Inc. Camera-aided focusing in optical metrology
CN106964904A (en) * 2016-01-14 2017-07-21 大族激光科技产业集团股份有限公司 A kind of laser marking machine of multiangle visual positioning and its method for laser marking
CN207952926U (en) * 2018-03-19 2018-10-12 浙江大学 A kind of laser marking machine automatic focusing mechanism based on optical axis light

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0613282A (en) * 1992-06-26 1994-01-21 Fujitsu Ltd Autofocus, mask wafer gap measuring method and its equipment
US9215425B1 (en) * 2013-02-04 2015-12-15 Bruker Nano Inc. Camera-aided focusing in optical metrology
CN104535296A (en) * 2014-12-03 2015-04-22 中国科学院苏州生物医学工程技术研究所 Coaxiality detection and adjusting method of multiple beams
CN106964904A (en) * 2016-01-14 2017-07-21 大族激光科技产业集团股份有限公司 A kind of laser marking machine of multiangle visual positioning and its method for laser marking
CN207952926U (en) * 2018-03-19 2018-10-12 浙江大学 A kind of laser marking machine automatic focusing mechanism based on optical axis light

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