CN108258098B - 一种无机集成深紫外led封装结构 - Google Patents
一种无机集成深紫外led封装结构 Download PDFInfo
- Publication number
- CN108258098B CN108258098B CN201711428333.4A CN201711428333A CN108258098B CN 108258098 B CN108258098 B CN 108258098B CN 201711428333 A CN201711428333 A CN 201711428333A CN 108258098 B CN108258098 B CN 108258098B
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- Prior art keywords
- deep ultraviolet
- groove
- ultraviolet led
- metal support
- inorganic
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 21
- 229910052751 metal Inorganic materials 0.000 claims abstract description 23
- 239000002184 metal Substances 0.000 claims abstract description 23
- 239000000919 ceramic Substances 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 239000011521 glass Substances 0.000 claims abstract description 12
- 239000010410 layer Substances 0.000 claims description 9
- 230000005855 radiation Effects 0.000 claims description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 claims description 3
- 229910052786 argon Inorganic materials 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 238000002788 crimping Methods 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 239000011241 protective layer Substances 0.000 claims description 3
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 238000007789 sealing Methods 0.000 abstract description 4
- 230000032683 aging Effects 0.000 abstract description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 230000004907 flux Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical group [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 4
- 239000005751 Copper oxide Substances 0.000 description 4
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 4
- 229910000431 copper oxide Inorganic materials 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000000956 alloy Substances 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- 230000001954 sterilising effect Effects 0.000 description 2
- 238000004659 sterilization and disinfection Methods 0.000 description 2
- 230000006750 UV protection Effects 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004332 deodorization Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000004224 protection Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711428333.4A CN108258098B (zh) | 2017-12-26 | 2017-12-26 | 一种无机集成深紫外led封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711428333.4A CN108258098B (zh) | 2017-12-26 | 2017-12-26 | 一种无机集成深紫外led封装结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108258098A CN108258098A (zh) | 2018-07-06 |
CN108258098B true CN108258098B (zh) | 2020-02-07 |
Family
ID=62722848
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201711428333.4A Active CN108258098B (zh) | 2017-12-26 | 2017-12-26 | 一种无机集成深紫外led封装结构 |
Country Status (1)
Country | Link |
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CN (1) | CN108258098B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109592634B (zh) * | 2018-12-07 | 2020-10-09 | 中国科学院上海微系统与信息技术研究所 | 有源基板及其制备方法 |
CN109509824A (zh) * | 2018-12-13 | 2019-03-22 | 佛山市国星光电股份有限公司 | Led器件和灯组阵列 |
CN110400860A (zh) * | 2019-07-23 | 2019-11-01 | 华引芯(武汉)科技有限公司 | 一种uv led全无机密封结构及其制备方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5702273B2 (ja) * | 2009-02-19 | 2015-04-15 | ローム株式会社 | Led照明装置 |
CN103187409A (zh) * | 2011-12-31 | 2013-07-03 | 刘胜 | 基于引线框架的led阵列封装光源模块 |
CN204407358U (zh) * | 2015-01-20 | 2015-06-17 | 佛山市国星光电股份有限公司 | 一种top led支架及其top led器件 |
CN205141014U (zh) * | 2015-11-13 | 2016-04-06 | 广州市鸿利光电股份有限公司 | 一种led封装结构 |
CN205645882U (zh) * | 2016-04-25 | 2016-10-12 | 东莞市凯昶德电子科技股份有限公司 | 用于高清户外显示屏的led支架 |
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2017
- 2017-12-26 CN CN201711428333.4A patent/CN108258098B/zh active Active
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Publication number | Publication date |
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CN108258098A (zh) | 2018-07-06 |
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Effective date of registration: 20200108 Address after: 518107 912, building A2, building A1A2, Guangming science and Technology Park, China Merchants Group, Fenghuang community, Fenghuang street, Guangming District, Shenzhen City, Guangdong Province Applicant after: Shenzhen Shangke Decoration Technology Co., Ltd. Address before: 528226, A8 building, Guangdong new light source base, Luo Cun, Nanhai District, Foshan, Guangdong Applicant before: New light sources re-invent industry center, associating Guangdong, Nanhai District Foshan City |
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