CN108250993B - A kind of no substrate low-temp reaction type Hot melt adhesive tape and its with glue and preparation method - Google Patents
A kind of no substrate low-temp reaction type Hot melt adhesive tape and its with glue and preparation method Download PDFInfo
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- CN108250993B CN108250993B CN201810064741.4A CN201810064741A CN108250993B CN 108250993 B CN108250993 B CN 108250993B CN 201810064741 A CN201810064741 A CN 201810064741A CN 108250993 B CN108250993 B CN 108250993B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/06—Polyurethanes from polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
Abstract
The present invention discloses the formula and preparation method of a kind of no substrate low-temp reaction type Hot melt adhesive tape, the adhesive tape is made of no substrate dry glue with two-sided release film or release paper, glue is made of 100-150 parts of thermoplastic polyurethanes, 50-150 parts of rosin glycerides, 1-40 parts of blocked crosslinkers, 1-10 parts of moistening flatting agents, 1-10 parts of deaeration agent, 1-10 parts of rheological agents, 0.1-5 parts of antiager, 100-400 parts of ketones and esters mixed solvent, and drying winding is cut after being coated on ground.By the deblocking temperature of design of crosslinked agent and the softening point of resin, which may be implemented storage and transportation at room temperature, and can realize 2-3N/mm under lower heating temperature (90-110 DEG C), lower pressurization pressure (1-2 bar)2Adhesive strength.Through the above way, the present invention is able to solve the problem of existing low-temperature hot melt adhesive adhesive strength is low, low-temp reaction type hot melt adhesive needs special storage and transportation condition, the raw material carrying cost that electronic device manufacturer can greatly be reduced, meets the bonding requirements of micro-element in current electronic product.
Description
Technical field
The invention discloses a kind of no substrate low-temp reaction type Hot melt adhesive tape and its with the formula and preparation method of glue, belong to
In adhesive field.
Background technique
Hot melt adhesive is that one kind does not have viscosity or sticky adhesive that is very low and occurring viscosity after the heating at normal temperature,
Reactive hot melt adhesive and non-reactive hot melt adhesive can be divided into again.Non-reactive hot melt adhesive, under hot melt state after the heating, performance
Pressure sensitive adhesive characteristic out applies certain pressure at this time, can be bonded adherend, and to be cooled to after room temperature, colloid reverts to again
Inviscid or low viscous solid.Reactive hot melt adhesive under hot melt state after the heating, in addition to showing pressure sensitive adhesive characteristic, also has
Have reactivity so that the cohesion degree of colloid further enhances, while with the functional group reactions such as the hydroxyl on adherend surface, substantially
Degree improves adhesion.The temperature used according to hot melt adhesive, and low form (60-110 DEG C), middle warm type (110- can be divided into
140 DEG C), high temperature modification (140 DEG C or more) several classes.
Hot melt adhesive be widely used in weaving, clothes, shoes industry, medicine, papermaking, bookbinding, in electronics industry, such as artificial leather
Manufacture largely use polyurethanes hot melt adhesive.In electronics industry, yields is improved to reduce the difficulty of contraposition work, also greatly
Scale is bonded all kinds of precise parts using hot melt adhesive.
Common hot melt adhesive currently on the market, mostly occurs with block form, and preparatory heating melting is needed when use, is set to sizing
It is standby more demanding.And Reactive hot melt adhesive generally requires to be sealed, and needs quickly to use behind Kaifeng, to the personal skill of sizing personnel
It can be more demanding.And the current developing direction of electronics industry is small size, thin layer, precise treatment, it is small that part is glued area
It requires high to sizing equipment and is difficult to be resistant to high temperature, therefore application of traditional hot melt adhesive in electronics industry has received
Larger limitation.Threshold is applied in order to reduce hot melt adhesive in electronics industry, such as TESA, 3M Deng great factory is being developed, pushed away
Wide Hot melt adhesive tape product.
Hot melt adhesive tape is that traditional hot melt adhesive is fabricated to adhesive tape type products by squeezing out or being coated with, and is remaining hot melt
The characteristic of glue simultaneously, also has easily advantage cross cutting processing, be easily glued.In Process of Applying Glue, it is only necessary to after preheating adherend
With adhesive tape pressurizing attaching, bonding can be realized, be not necessarily to dedicated hot glue equipment, fitting is reheated after can also aligning, is substantially reduced
Difficulty of processing improves yields, welcome by vast electronics processor.
But there is also deficiencies for Hot melt adhesive tape: often bonding force is relatively low for non-reactive Hot melt adhesive tape, it is difficult to reach enough viscous
Connect intensity；And reaction type hot-fusible adhesive tape can obtain higher adhesion, but there are contradictions with sizing for its preservation --- low temperature is anti-
Answer type that must be sealed with air exclusion, storage and transportation is inconvenient, and the sizing activity duration is short to be difficult to practical application；High temperature response type heat
Melten gel is easy to save, but is glued temperature height, and electronic device is difficult to bear.At present on the market common reaction type hot-fusible adhesive tape mostly with
It based on high temperature type, while needing that higher pressure is cooperated to be glued, application region is also confined to the gold of tolerable higher temperature
Belong on part.Meanwhile existing Hot melt adhesive tape production method, Extrusion can obtain 100 μm or more of dry glue thickness, but
Production needs high-temperature fusion raw material, can crosslinking agent be reacted, therefore is only used for production non-reactive Hot melt adhesive tape；Wet process applies
Cloth can be coated at low temperature, and crosslinking agent will not be activated reaction, but be difficult to obtain 50 μm or more of dry glue thickness, therefore can only
Produce 50 μm or reaction type hot-fusible adhesive tape below.And the final adhesive strength of hot melt adhesive, be directly with glue is thick and reactivity
Directly proportional, it may be assumed that thick glue sticking intensity is greater than thin glue, and response type adhesive strength is greater than non-reactive.Hot melt adhesive common at present
Band is not only difficult to take into account glue thickness and reactivity, but also is difficult to take into account reactivity and sizing temperature.To solve the above problems, current market
Wet coating after main low-temp reaction type Hot melt adhesive tape is directly mixed using curing agent with thermoplastic elastomer (TPE), product are necessary
Using low-temp. refrigerator store and transport, and using when need to complete every operation in a very short period of time, production equipment, storage and transportation are set
Standby requirement that will be very harsh with use environment, substantially increases the production cost of relevant enterprise.Therefore, market is urgently obtained
It is a kind of can stable storage and transportation, the new type low temperature reaction type hot-fusible adhesive tape that arbitrarily handles when using at room temperature.
Summary of the invention
Object of the present invention is in view of the above technical problems, provide the low-temp reaction type Hot melt adhesive tape and its system of a kind of no substrate
Preparation Method, 100 μm or more of dry glue thickness can not only be obtained by reaching, but also can have reactivity, while can also be at low temperature
Be activated reaction, and can stablize storage under the conditions of conventional storage and transportation.
The Hot melt adhesive tape is made of no substrate dry glue and two-sided release film or release paper, and wherein dry glue can be stablized at room temperature
Storage and transportation does not need isolation air or steam.The dry glue is made of following raw materials and obtains after drying with the glue of parts by weight preparation
It arrives: 100-150 parts of thermoplastic polyurethanes, 50-150 parts of rosin glycerides, 1-40 parts of blocked crosslinkers, 1-10 parts of profit
Wet levelling agent, 1-10 parts of defoaming agent, 1-10 parts of rheological agent, 0.1-5 parts of antiagers, 100-400 parts of solvents.
The thermoplastic polyurethane is polyester-type thermoplastic polyurethane, and softening point is 85-140 DEG C.
Preferably, the thermoplastic polyurethane include at least softening point be 85-95 DEG C and softening point be 120-140 DEG C this two
Kind.
Preferably, softening point mass fraction shared by 85-95 DEG C of thermoplastic polyurethane is in the thermoplastic polyurethane
45-90%。
Preferably, at least a kind of tensile strength of the thermoplastic polyurethane is 20-30 MPa.
Preferably, the thermoplastic polyurethane include hydroxyl, carboxyl, in amido three classes active group any one or
It is a variety of.
The softening point of the rosin glycerides is 80-160 DEG C.
The blocked crosslinkers is the isocyanates that sodium hydrogensulfite blocks or nitrogen pyridine blocks.
Preferably, the blocked crosslinkers is TDI, HDI, PAPI or L-75 of sodium hydrogensulfite sealing end.
Preferably, the minimum deblocking temperature of the blocked crosslinkers is 80-90 DEG C.
The moistening flatting agent is selected from acrylic acid modified organic silicon wetting agent or fluorine carbon wetting agent.
The defoaming agent is organic silicon deaeration agent.
The rheological agent is shear shinning type rheological agent.
The antiager is pentaerythritol esters antioxidant.
The solvent includes ketones solvent and two components of esters solvent, and wherein ketones solvent is selected from acetone, butanone, hexamethylene
Any one or more in ketone；Esters solvent in methyl acetate, ethyl acetate or butyl acetate any one or it is more
Kind.
Preferably, ketones solvent mass fraction is 70-95% in the solvent.
The preparation method of above-mentioned no substrate low-temp reaction type Hot melt adhesive tape glue, includes the following steps:
(1) mixing: weighing each component raw material according to material composition and proportion speed described in one of claim 1 ~ 8,
Under conditions of stirring rate is 100-350 rpm, thermoplastic polyurethane is dissolved in ketones solvent, rosin glycerides are dissolved in
In esters solvent, to both mix after completely dissolution, antiager, rheological agent, moistening flatting agent, defoaming agent are sequentially added later
And blocked crosslinkers, stir evenly to obtain mixture；
(2) deaeration: deaeration processing is carried out to the mixture in step (1) using deaeration machine is stirred under vacuum, vacuum degree is set
For -0.070 ~ -0.080 MPa, 15 ~ 50 rpm of stirring rate, inclined heated plate 15-35 minutes.It is obtained without base after deaeration
Material low-temp reaction type Hot melt adhesive tape glue.
Using the preparation of above-mentioned glue without substrate low-temp reaction type Hot melt adhesive tape, the glue including ground and coated substrates surface
The glue-line that water is formed, it is characterised in that: the ground is two-sided release film or double-sided release paper, the thickness of glue-line after glue dries
For 0.020-0.135 mm.
Preferably, the two-sided release film is the PET that the release substance of clear PET film double spread organic silicon-type is formed
Two-sided release film, remaining adhesion rate >=85%, with a thickness of 0.010-0.180 mm, the off-type force in glue face to be coated is 15-30
Gf/inch, another side off-type force are 3-10 gf/inch.
Preferably, the double-sided release paper be the release substance of paper material double spread organic silicon-type formed it is two-sided from
Type paper, remaining adhesion rate >=85%, with a thickness of 0.070-0.180 mm, the off-type force in glue face to be coated is 15-30 gf/
Inch, another side off-type force are 3-10 gf/inch.
Meanwhile the present invention also provides a kind of preparation methods of no substrate low-temp reaction type Hot melt adhesive tape, comprising the following steps:
(1) comma scraper will be used without substrate low-temp reaction type Hot melt adhesive tape glue described in one of claim 1 ~ 8
Or anilox roll or slit squeeze out or the mode of curtain coating, is uniformly coated to the high off-type force face of ground, be coated with dry measure with a thickness of
0.020-0.135 mm passes through drying tunnel with the linear velocity of 1.5-5 m/min after gluing and dries.
(2) adhesive tape after drying is directly wound, and cuts into standard breadth and is heated to get to no substrate low-temp reaction type
Adhesive tape.
Preferably, the drying tunnel is four sections, every section of temperature and air supply parameter are as follows: first segment is lower air-supply, temperature 50-60
℃；Second segment is exhausting in lower air-supply, and supply air temperature is 70-80 DEG C；Third section is exhausting in lower air-supply, supply air temperature 90-
110℃；4th section is up-draught, and supply air temperature is 70-80 DEG C.Third section drying tunnel is 20-60 s by the time.
In conclusion (90-110 DEG C) can be swashed at a lower temperature the invention has the advantages that 1) Sizing Conditions are mild
Living, the hot pressing time needed is short, and biasing strength is low；2) adhesive strength is high, and glue thickness can achieve 100 μm or more, curing agent deblocking
It fastly, can strong bond affixed object；3) storage and transportation condition is simple, without special equipments such as refrigerator, refrigerator vehicles, saves enterprise's large number of equipment
With transportation cost.
Specific embodiment
Below in conjunction with specific embodiment, technical scheme is described further.
Embodiment 1.
Thermoplastic polyurethane resin A1,85-95 DEG C of softening point temperature, 20 MPa of tensile strength, have hydroxyl, 45 parts；Heat
Plastic polyurethane Resin A 2,130-135 DEG C of softening point temperature, 30 MPa of tensile strength, have carboxyl, 55 parts；Rosin glycerides
B1,85-95 DEG C of softening point, 35 parts；Rosin glycerides B2,145-160 DEG C of softening point temperature, 15 parts；20 parts of solvent acetone, butanone
50 parts, 15 parts of methyl acetate, 15 parts of ethyl acetate；The TDI of sodium hydrogensulfite sealing end, minimum 80 DEG C of deblocking temperature, 10 parts；Profit
1 part of wet levelling agent；Antiager is 5 parts；1 part of defoaming agent；3 parts of rheological agent.
Under conditions of stirring rate is 100-350 rpm, by polyurethane resin A1 and A2 swelling in ketones solvent, pine
Fragrant glyceride B1 and B2 swelling in esters solvent, will above-mentioned solution mix after be sufficiently stirred after moistening flatting agent, anti-ageing is added
Agent, defoaming agent and rheological agent are eventually adding the TDI of sodium hydrogensulfite sealing end, continue deaeration after mixing evenly and handle.Deaeration parameter
For vacuum degree -0.070 ~ -0.075 MPa, stirring rate 15-25 rpm, the time 15 minutes, that is, obtain without substrate low-temp reaction
Type Hot melt adhesive tape glue.
It is coated with when coating using comma scraper, slit gap is arranged 280 μm, and double-sided release paper is substrate, remaining adhesion rate
85-87%, thickness 0.175-0.180 mm, cloth cover off-type force 15-30 gf/inch to be coated, uncoated face off-type force 3-7 gf/
inch.It four sections of drying tunnel, sets gradually and blows 0-60 DEG C under first segment；Second segment is exhausting in lower air-supply, supply air temperature 70-80
℃；Third section is exhausting in lower air-supply, and supply air temperature is 90-110 DEG C；4th section is up-draught, and supply air temperature is 90-100 DEG C.
Third section drying tunnel is 20 s by the time.The finished products of adhesive tapes for being cut into 200 mm breadth is wound after drying tunnel out.
When fitting, hot pressing temperature sets 110 DEG C, and 3 bar of pressure, 30 s of time, affixed object is aluminium sheet, and peel strength is reachable
2 N/mm²。
Embodiment 2.
Thermoplastic polyurethane resin A1,85-95 DEG C of softening point temperature, 20 MPa of tensile strength, have hydroxyl, 85 parts；
Thermoplastic polyurethane resin A2,130-135 DEG C of softening point temperature, 30 MPa of tensile strength, have carboxyl, 30 parts；Thermoplastic poly
Urethane Resin A 3,120-125 DEG C of softening point temperature, 25 MPa of tensile strength, have amido, 35 parts；Rosin glycerides B3, softening
115-120 DEG C of point, 90 parts；290 parts of solvent butanone, 70 parts of methyl acetate；The HDI of sodium hydrogensulfite sealing end, minimum deblocking temperature
90 DEG C, 30 parts；10 parts of moistening flatting agent；3.5 parts of antiager；10 parts of defoaming agent；10 parts of rheological agent.
Under conditions of stirring rate is 100-350 rpm, polyurethane resin A1, A2 and A3 are swollen in ketones solvent
In, rosin glycerides B3 is swollen in esters solvent, and above-mentioned two groups of solution is added moistening flatting agent, resists after mixing and being sufficiently stirred
Old agent, defoaming agent, rheological agent are eventually adding the HDI of sodium hydrogensulfite sealing end, continue deaeration after mixing evenly and handle.Deaeration ginseng
Number is vacuum degree -0.075 ~ -0.080 MPa, stirring rate 25-35 rpm, the time 25 minutes, that is, is obtained anti-without substrate low temperature
Answer type Hot melt adhesive tape glue.
It is coated with when coating using anilox roll, is base with a thickness of the two-sided release film of 0.175-0.180mm using 40 mesh anilox rolls
Material, remaining adhesion rate 90-92%, cloth cover off-type force 20-30 gf/inch to be coated, uncoated face off-type force 3-7 gf/inch.It dries
Four sections of road sets gradually and blows 0-60 DEG C under first segment；Second segment is exhausting in lower air-supply, and supply air temperature is 70-80 DEG C；Third
Section is exhausting in lower air-supply, and supply air temperature is 90-110 DEG C；4th section is up-draught, and supply air temperature is 90-100 DEG C.Third section
Drying tunnel is 40 s by the time.The finished products of adhesive tapes for being cut into 300 mm breadth is wound after drying tunnel out.
When fitting, hot pressing temperature sets 135 DEG C, and 5 bar of pressure, 30 s of time, affixed object is aluminium sheet, and peel strength is reachable
5 N/mm²。
Embodiment 3.
Thermoplastic polyurethane resin A1, it is 85-95 DEG C of softening point temperature, tensile strength 20 MPa, hydroxyl, 90 parts；Thermoplastic
Property polyurethane resin A3,120-125 DEG C of softening point temperature, 25 MPa of tensile strength, band amido, 30 parts；Thermoplastic polyurethane tree
Rouge A4,135-140 DEG C of softening point temperature, 25 MPa of tensile strength, hydroxyl and carboxyl, 10 parts；Rosin glycerides B1, softening
85-95 DEG C of point, 55 parts；Rosin glycerides B4,107-115 DEG C of softening point, 45 parts；180 parts of solvent butanone, 45 parts of methyl acetate；
The PAPI of sodium hydrogensulfite sealing end, minimum 83 DEG C of deblocking temperature, 40 parts；4 parts of moistening flatting agent；0.1 part of antiager；Defoaming agent 7
Part；1 part of rheological agent.
Under conditions of stirring rate is 100-350 rpm, polyurethane resin A1, A3 and A4 are swollen in ketones solvent
In, rosin glycerides B1 and B4 of the swelling in esters solvent in advance is added after being sufficiently stirred, wetting stream is added after being sufficiently stirred
Flat agent, antiager, defoaming agent, rheological agent are eventually adding the PAPI of sodium hydrogensulfite sealing end, continue at deaeration after mixing evenly
Reason.Deaeration parameter is vacuum degree -0.070 ~ -0.080 MPa, stirring rate 35-50 rpm, the time 35 minutes, that is, is obtained without base
Material low-temp reaction type Hot melt adhesive tape glue.
Extrusion coated using slit when coating, slit gap is arranged 85 μm, and 0.070-0.075 mm double-sided release paper is base
Material, remaining adhesion rate 91-95%, cloth cover off-type force 15-30 gf/inch to be coated, uncoated face off-type force 7-10 gf/inch.It dries
Four sections of road sets gradually and blows 0-60 DEG C under first segment；Second segment is exhausting in lower air-supply, and supply air temperature is 70-80 DEG C；Third
Section is exhausting in lower air-supply, and supply air temperature is 90-110 DEG C；4th section is up-draught, and supply air temperature is 90-100 DEG C.Third section
Drying tunnel is 40 s by the time.The finished products of adhesive tapes for being cut into 300 mm breadth is wound after drying tunnel out.
When fitting, hot pressing temperature sets 110 DEG C, and 3 bar of pressure, 30 s of time, affixed object is aluminium sheet, and peel strength is reachable
4 N/mm²。
Embodiment 4.
Thermoplastic polyurethane resin A1, it is 85-95 DEG C of softening point temperature, tensile strength 20 MPa, hydroxyl, 135 parts；Heat
Plastic polyurethane Resin A 3,120-125 DEG C of softening point temperature, 25 MPa of tensile strength, band amido, 15 parts；Rosin glycerides B1,
85-95 DEG C of softening point, 80 parts；380 parts of solvent acetone, 20 parts of ethyl acetate；The L-75 of sodium hydrogensulfite sealing end, minimum deblocking temperature
84 DEG C, 20 parts of degree；8 parts of moistening flatting agent；2 parts of antiager；3 parts of defoaming agent；7 parts of rheological agent.
Under conditions of stirring rate is 100-350 rpm, by polyurethane resin A1 and A3 swelling in ketones solvent, fill
Rosin glycerides B1 of the swelling in esters solvent in advance is added after point stirring, moistening flatting agent, anti-ageing is added after being sufficiently stirred
Agent, defoaming agent and rheological agent are eventually adding the L-75 of sodium hydrogensulfite sealing end, continue deaeration after mixing evenly and handle.Deaeration ginseng
Number is vacuum degree -0.070 ~ -0.080 MPa, and stirring rate 20-35 rpm, time 20-30 minute, i.e., acquisition is without substrate low temperature
Reaction type hot-fusible adhesive tape glue.
Cast coat is used when coating, slit gap is arranged 150 μm, and the two-sided release film of 0.010-0.015 mm is substrate,
Remaining adhesion rate 88-91%, cloth cover off-type force 15-30 gf/inch to be coated, uncoated face off-type force 7-10 gf/inch.Drying tunnel
It four sections, sets gradually and blows 0-60 DEG C under first segment；Second segment is exhausting in lower air-supply, and supply air temperature is 70-80 DEG C；Third section
For exhausting in lower air-supply, supply air temperature is 90-110 DEG C；4th section is up-draught, and supply air temperature is 90-100 DEG C.Third section is dried
Road is 35 s by the time.The finished products of adhesive tapes for being cut into 200 mm breadth is wound after drying tunnel out.
When fitting, hot pressing temperature sets 100 DEG C, and 4 bar of pressure, 30 s of time, affixed object is aluminium sheet, and peel strength is reachable
3 N/mm²。
Obviously, above-described embodiment is only part of the invention preferably embodiment, instead of all the embodiments, not thereby
Limit the scope of the patents of the invention.All the equivalent structure or equivalent process transformation made by using the contents of the present specification, or
Other related technical areas directly or indirectly are used in, are included within the scope of the present invention.
Claims (14)
1. a kind of no substrate low-temp reaction type Hot melt adhesive tape glue, it is characterised in that: the raw material of the glue forms and weight
Part is as follows:
100-150 parts of thermoplastic polyurethanes, 50-150 parts of rosin glycerides, 1-40 parts of blocked crosslinkers, 1-10 parts of profit
Wet levelling agent, 1-10 parts of defoaming agent, 1-10 parts of rheological agent, 0.1-5 parts of antiagers, 100-400 parts of solvents；
The thermoplastic polyurethane is polyester-type thermoplastic polyurethane, and softening point is 85-140 DEG C；
The softening point of the rosin glycerides is 80-160 DEG C；
The blocked crosslinkers is the isocyanates that sodium hydrogensulfite blocks or nitrogen pyridine blocks；
The moistening flatting agent is selected from acrylic acid modified organic silicon wetting agent or fluorine carbon wetting agent；
The defoaming agent is organic silicon deaeration agent；
The rheological agent is shear shinning type rheological agent；
The antiager is pentaerythritol esters antioxidant；
The solvent includes ketones solvent and two components of esters solvent, and wherein ketones solvent is in acetone, butanone, cyclohexanone
Any one or more；Any one or more of esters solvent in methyl acetate, ethyl acetate or butyl acetate.
2. a kind of no substrate low-temp reaction type Hot melt adhesive tape glue according to claim 1, it is characterised in that: the heat
Plastic polyurethane include at least softening point be 85-95 DEG C and softening point be 120-140 DEG C both.
3. a kind of no substrate low-temp reaction type Hot melt adhesive tape glue according to claim 1 or 2, it is characterised in that: institute
Softening point mass fraction shared by 85-95 DEG C of thermoplastic polyurethane is 45-90% in the thermoplastic polyurethane stated.
4. a kind of no substrate low-temp reaction type Hot melt adhesive tape glue according to claim 1, it is characterised in that: the heat
At least a kind of tensile strength of plastic polyurethane is 20-30 MPa.
5. a kind of no substrate low-temp reaction type Hot melt adhesive tape glue according to claim 1, it is characterised in that: the heat
Plastic polyurethane includes hydroxyl, carboxyl, any one or more in amino three classes active group.
6. a kind of no substrate low-temp reaction type Hot melt adhesive tape glue according to claim 1, it is characterised in that: described
Blocked crosslinkers is TDI, HDI, PAPI or L-75 of sodium hydrogensulfite sealing end.
7. a kind of no substrate low-temp reaction type Hot melt adhesive tape glue according to claim 1, it is characterised in that: described
The minimum deblocking temperature of blocked crosslinkers is 80-90 DEG C.
8. a kind of no substrate low-temp reaction type Hot melt adhesive tape glue according to claim 1, it is characterised in that: described
Ketones solvent mass fraction is 70-95% in solvent.
9. a kind of preparation method of no substrate low-temp reaction type Hot melt adhesive tape glue as described in one of claim 1 ~ 8,
It is characterized in that: including the following steps:
(1) mixing: each component raw material is weighed according to material composition and proportion speed described in one of claim 1 ~ 8, is being stirred
Under conditions of rate is 100-350 rpm, thermoplastic polyurethane is dissolved in ketones solvent, rosin glycerides are dissolved in esters
In solvent, to both mix after completely dissolution, antiager, rheological agent, moistening flatting agent, defoaming agent and envelope are sequentially added later
Closed form crosslinking agent stirs evenly to obtain mixture；
(2) deaeration: using be stirred under vacuum deaeration machine in step (1) mixture carry out deaeration processing, setting vacuum degree be-
0.070 ~ -0.080 MPa, 15 ~ 50 rpm of stirring rate, inclined heated plate 15-35 minutes；It is obtained without substrate after deaeration
Low-temp reaction type Hot melt adhesive tape glue.
10. a kind of nothing prepared without substrate low-temp reaction type Hot melt adhesive tape with glue using as described in one of claim 1 ~ 8
Substrate low-temp reaction type Hot melt adhesive tape, the glue-line formed including ground and the glue on coated substrates surface, it is characterised in that: described
Ground is two-sided release film or double-sided release paper, glue-line with a thickness of 0.020-0.135 mm after glue dries.
11. no substrate low-temp reaction type Hot melt adhesive tape according to claim 10, it is characterised in that: described is two-sided release
The two-sided release film of PET that film is formed for the release substance of clear PET film double spread organic silicon-type, remaining adhesion rate >=85%,
With a thickness of 0.010-0.180 mm, the off-type force in glue face to be coated is 15-30 gf/inch, and another side off-type force is 3-10
gf/inch。
12. no substrate low-temp reaction type Hot melt adhesive tape according to claim 10, it is characterised in that: described is two-sided release
The double-sided release paper that paper is formed for the release substance of paper material double spread organic silicon-type, remaining adhesion rate >=85%, with a thickness of
0.070-0.180 mm, the off-type force in glue face to be coated are 15-30 gf/inch, and another side off-type force is 3-10 gf/
inch。
13. the preparation method without substrate low-temp reaction type Hot melt adhesive tape as described in one of claim 10 ~ 12, feature exist
In: the following steps are included:
(1) comma scraper or net will be used without substrate low-temp reaction type Hot melt adhesive tape glue described in one of claim 1 ~ 8
Line roller or slit squeeze out or the mode of curtain coating, is uniformly coated to the high off-type force face of ground, is coated with dry measure with a thickness of 0.020-
0.135 mm passes through drying tunnel with the linear velocity of 1.5-5 m/min after gluing and dries；
(2) adhesive tape after drying is directly wound, and cuts into standard breadth to get to no substrate low-temp reaction type hot melt adhesive
Band.
14. a kind of preparation method of no substrate low-temp reaction type Hot melt adhesive tape according to claim 13, it is characterised in that:
The drying tunnel is four sections, every section of temperature and air supply parameter are as follows: first segment is lower air-supply, and temperature is 50-60 DEG C；Second segment is sent under being
Exhausting on wind, supply air temperature are 70-80 DEG C；Third section is exhausting in lower air-supply, and supply air temperature is 90-110 DEG C；4th section is upper
Blowing, supply air temperature are 70-80 DEG C；Third section drying tunnel is 20-60 s by the time.
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| CN109266242A (en) * | 2018-08-01 | 2019-01-25 | 深圳昌茂粘胶新材料有限公司 | A kind of novel environment-friendly hot melt membrane material and preparation method thereof |
| CN110143074B (en) * | 2019-05-27 | 2021-08-10 | 青艺（福建）烫画科技有限公司 | Environment-friendly heat transfer printing film and preparation method thereof |
| CN110527376A (en) * | 2019-08-07 | 2019-12-03 | 深圳市神漆新材料科技有限公司 | Inner wall of building new material paint and its preparation method and application |
| CN111100592B (en) * | 2019-12-05 | 2021-10-12 | 广东盈通新材料有限公司 | Latent single-component polyurethane hot melt adhesive, preparation method thereof and adhesive film |
| CN111763479B (en) * | 2020-07-13 | 2021-04-06 | 宁波长阳科技股份有限公司 | Thermoplastic polyurethane elastomer film, composite film thereof and preparation method |
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| CN101613586A (en) * | 2009-07-16 | 2009-12-30 | 烟台德邦科技有限公司 | A kind of reaction type polyurethane hot-melt adhesive and preparation method thereof |
| CN103059796A (en) * | 2012-12-24 | 2013-04-24 | 东莞市升宝新材料科技有限公司 | Inflaming retarding water-tolerant polyurethane tackiness agent and preparation method thereof |
| CN104893644A (en) * | 2015-06-09 | 2015-09-09 | 中国科学技术大学 | Solvent type polyurethane structure adhesive and preparation method thereof |
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Patent Citations (3)
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| CN101613586A (en) * | 2009-07-16 | 2009-12-30 | 烟台德邦科技有限公司 | A kind of reaction type polyurethane hot-melt adhesive and preparation method thereof |
| CN103059796A (en) * | 2012-12-24 | 2013-04-24 | 东莞市升宝新材料科技有限公司 | Inflaming retarding water-tolerant polyurethane tackiness agent and preparation method thereof |
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