CN108250518A - A kind of computer mainframe shell material and preparation method thereof - Google Patents
A kind of computer mainframe shell material and preparation method thereof Download PDFInfo
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- CN108250518A CN108250518A CN201810174134.3A CN201810174134A CN108250518A CN 108250518 A CN108250518 A CN 108250518A CN 201810174134 A CN201810174134 A CN 201810174134A CN 108250518 A CN108250518 A CN 108250518A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
- C08L9/06—Copolymers with styrene
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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Abstract
The invention discloses a kind of computer mainframe shell materials and preparation method thereof, include the raw material of following parts by weight meter：35 45 parts of butadiene-styrene rubber, 20 30 parts of makrolon, 20 30 parts of epoxy resin, 10 20 parts of kaolin, 8 15 parts of mullite, 8 15 parts of light weight calcium, 5 12 parts of calcium fluosilicate, 6 15 parts of glass fibre, 8 15 parts of carbon nano-fiber, 8 15 parts of carbon nanotube, 5 10 parts of nm-class boron nitride, 5 10 parts of nanometer silicon carbide, 38 parts of nano aluminium oxide, 38 parts of nano tin dioxide, 38 parts of nano zine oxide, 5 12 parts of graphene, 36 parts of silane coupling agent, 2.8 4.5 parts of antioxidant, 1.5 3.2 parts of curing agent, 1.2 2.8 parts of lubricant, 10 15 parts of 2.1 3.6 parts of fire retardant and ethyl alcohol；Host housing material of the present invention has good anti-aging property, mechanical shock resistance and heat conductivility.
Description
Technical field
The present invention relates to calculate field of machining technology, and in particular to a kind of computer mainframe shell material and its preparation side
Method.
Background technology
Main frame, which refers to, to be used to place mainboard and the container of other critical pieces in computer hardware system
(Mainframe).CPU, memory, hard disk, CD-ROM drive, power supply and other input and output controller and interface are generally included, such as
USB controller, video card, network interface card, sound card etc..In mainframe box commonly referred to as in set, it is and logical except the mainframe box
Frequently referred to peripheral hardware (such as display, keyboard, mouse, external hard drive, external CD-ROM drive).In general, host itself (after loading onto software)
It has been a computer system for being capable of independent operating, the computer that server etc. has special purpose usually only has host, do not have
There are other peripheral hardwares.
At present, most of computer mainframe shell material in the market be PVC material, the tool of this main frame
Energy, corrosion resistance and heat conductivility are poor, larger impact force can not be born, when also host internal element can not be operated
The heat brought is discharged in time, be easy to cause main frame high temperature, there are some potential safety problemss.
Invention content
For problems of the prior art, the present invention provides a kind of computer mainframe shell materials, are related to calculating
There is good anti-aging property and resistance to mechanical to rush for field of machining technology, host housing material stable in physicochemical property of the present invention
Performance is hit, and with good thermal conductivity and thermal diffusivity, safe to use, preparation method is simple, easy large-scale production.
In order to achieve the above object, the present invention is achieved through the following technical solutions：
A kind of computer mainframe shell material includes the raw material of following parts by weight meter：
35-45 parts of butadiene-styrene rubber, 20-30 parts of makrolon, 20-30 parts of epoxy resin, 10-20 parts of kaolin, mullite
8-15 parts, 8-15 parts of light weight calcium, 5-12 parts of calcium fluosilicate, 6-15 parts of glass fibre, 8-15 parts of carbon nano-fiber, carbon nanotube 8-
15 parts, 5-10 parts of nm-class boron nitride, 5-10 parts of nanometer silicon carbide, 3-8 parts of nano aluminium oxide, 3-8 parts of nano tin dioxide, nano oxygen
Change 3-8 parts of zinc, 5-12 parts of graphene, 3-6 parts of silane coupling agent, 2.8-4.5 parts of antioxidant, 1.5-3.2 parts of curing agent, lubricant
10-15 parts of 1.2-2.8 parts, 2.1-3.6 parts of fire retardant and ethyl alcohol.
Preferably, include the raw material of following parts by weight meter：40 parts of butadiene-styrene rubber, 26 parts of makrolon, 25 parts of epoxy resin,
16 parts of kaolin, 12 parts of mullite, 12 parts of light weight calcium, 10 parts of calcium fluosilicate, 12 parts of glass fibre, 12 parts of carbon nano-fiber, carbon
13 parts of nanotube, 8 parts of nm-class boron nitride, 7 parts of nanometer silicon carbide, 6 parts of nano aluminium oxide, 7 parts of nano tin dioxide, nano zine oxide
6 parts, 8 parts of graphene, 4.5 parts of silane coupling agent, 3.4 parts of antioxidant, 2.6 parts of curing agent, 2.2 parts of lubricant, 3.2 parts of fire retardant
With 13 parts of ethyl alcohol.
Preferably, the silane coupling agent is double-(2- (triethoxysilane) propyl)-tetrasulfide, γ-metering system
The combination of one or more of acryloxypropylethoxysilane trimethoxy silane, double-(γ-triethoxy silicon substrate propyl) tetrasulfide.
Preferably, the antioxidant is N, N- six methines double -3 (- 4 hydroxy phenyl of 3,5 di-t-butyl) propionamides, 1,3,
5- tri- (3,5 tertiary butyl-4-hydroxy benzyl) trimethylbenzene, 4- hydroxy-dodecanoic acids anilid, 4- hydroxyoctadecanoic acid acyls replace
The combination of one or more of aniline.
Preferably, the curing agent is the combination of one or both of maleic anhydride and phthalic anhydride.
Preferably, the lubricant is the combination of one or more of molybdenum disulfide, graphite, talcum powder and tungsten disulfide.
Preferably, the fire retardant is in deca-BDE, tetrabromobisphenol A, decabromodiphenylethane and Brominated Polystyrene
One or more of combine.
A kind of preparation method of above computer host housing material is also disclosed in the present invention, specifically, including following
Step：
(1) each raw material is weighed according to above-mentioned parts by weight；
(2) kaolin, mullite, light weight calcium, calcium fluosilicate, glass fibre are ground into 150-300 mesh powders respectively,
Then it is uniformly mixed to get mixture N1, it is spare；
(3) butadiene-styrene rubber, makrolon, epoxy resin are mixed, agitating and heating melting obtains mixture N2, spare；
(4) by the carbon nano-fiber of mixture N1 and mixture N2 and above-mentioned parts by weight, carbon nanotube, nm-class boron nitride,
Nanometer silicon carbide, nano aluminium oxide, nano tin dioxide, nano zine oxide, graphene, silane coupling agent, ethyl alcohol are uniformly mixed, and are thrown
Enter and be kneaded into mixer, 200-220 degrees Celsius of melting temperature, mixing time 20-30 minutes is standby to get mixture N3
With；
(5) antioxidant, curing agent, lubricant and fire retardant are added in into mixture N3, in 180-200 degrees celsius
Under, it puts into mixer and is kneaded 10-15 minutes to get mixing material, it is spare；
(6) mixing material is put into double screw extruder, extruder grain, pellet is injected in 80-98 degrees Celsius of mold,
Extrusion forming, under the pressure of 70-80Mpa, pressurize 20-30 minutes, cooled to room temperature is demoulded to get the computer
Host housing material.
The present invention has following advantageous effect：
(1) host housing material stable in physicochemical property of the present invention has good anti-aging property and mechanical shock resistance
Can, and with good thermal conductivity and thermal diffusivity, safe to use, preparation method is simple, easy large-scale production.
(2) added with carbon nanotube in raw material of the present invention, carbon nanotube has good heat transfer property, and CNTs has very
Big draw ratio, thus its heat exchange performance alongst is very high, in addition, carbon nanotube has higher thermal conductivity,
Micro carbon nanotube is adulterated in the material, can improve the thermal conductivity and heat dissipation performance of material.
(3) there is extraordinary heat-conductive characteristic added with graphene, graphene in raw material of the present invention.Pure is flawless
The thermal conductivity factor of single-layer graphene is up to 5300W/mK, is the highest carbon material of thermal conductivity factor so far, can improve calculating
The heat conductivility of machine host material.
Specific embodiment
The specific embodiment of the present invention is further described with reference to embodiment, following embodiment is only used for more
Technical scheme of the present invention is clearly demonstrated, and is not intended to limit the protection scope of the present invention and limits the scope of the invention.
Embodiment 1
A kind of computer mainframe shell material includes the raw material of following parts by weight meter：
35 parts of butadiene-styrene rubber, 20 parts of makrolon, 20 parts of epoxy resin, 10 parts of kaolin, 8 parts of mullite, light weight calcium 8
Part, 5 parts of calcium fluosilicate, 6 parts of glass fibre, 8 parts of carbon nano-fiber, 8 parts of carbon nanotube, 5 parts of nm-class boron nitride, nanometer silicon carbide
5 parts, 3 parts of nano aluminium oxide, 3 parts of nano tin dioxide, 3 parts of nano zine oxide, 5 parts of graphene, 3 parts of silane coupling agent, antioxidant
10 parts of 2.8 parts, 1.5 parts of curing agent, 1.2 parts of lubricant, 2.1 parts of fire retardant and ethyl alcohol.
Silane coupling agent is double-(2- (triethoxysilane) propyl)-tetrasulfide and double-(γ-triethoxy silicon substrate third
Base) tetrasulfide is according to mass ratio 1:1 mixing composition.
Antioxidant is N, double -3 (- 4 hydroxy phenyl of the 3,5 di-t-butyl) propionamides of six methines of N-.
Curing agent is maleic anhydride.
Lubricant is molybdenum disulfide.
Fire retardant is deca-BDE.
A kind of preparation method of above computer host housing material is also disclosed in the present embodiment, specifically, including with
Lower step：
(1) each raw material is weighed according to above-mentioned parts by weight；
(2) kaolin, mullite, light weight calcium, calcium fluosilicate, glass fibre are ground into 150 mesh powders respectively, then
It is uniformly mixed to get mixture N1, it is spare；
(3) butadiene-styrene rubber, makrolon, epoxy resin are mixed, agitating and heating melting obtains mixture N2, spare；
(4) by the carbon nano-fiber of mixture N1 and mixture N2 and above-mentioned parts by weight, carbon nanotube, nm-class boron nitride,
Nanometer silicon carbide, nano aluminium oxide, nano tin dioxide, nano zine oxide, graphene, silane coupling agent, ethyl alcohol are uniformly mixed, and are thrown
Enter and be kneaded into mixer, 200 degrees Celsius of melting temperature, mixing time 20 minutes is spare to get mixture N3；
(5) antioxidant, curing agent, lubricant and fire retardant are added in into mixture N3, under 180 degrees celsius, is thrown
Enter to be kneaded 10 minutes in mixer to get mixing material, it is spare；
(6) mixing material is put into double screw extruder, extruder grain, pellet is injected in 80 degrees Celsius of mold, squeezed
Molded, under the pressure of 70Mpa, pressurize 20 minutes, cooled to room temperature is demoulded to get the computer mainframe shell
Material.
Embodiment 2
A kind of computer mainframe shell material includes the raw material of following parts by weight meter：
45 parts of butadiene-styrene rubber, 30 parts of makrolon, 30 parts of epoxy resin, 20 parts of kaolin, 15 parts of mullite, light weight calcium 15
Part, 12 parts of calcium fluosilicate, 15 parts of glass fibre, 15 parts of carbon nano-fiber, 15 parts of carbon nanotube, nm-class boron nitride 10 part, nanometer
10 parts of silicon carbide, 8 parts of nano aluminium oxide, 8 parts of nano tin dioxide, 8 parts of nano zine oxide, 12 parts of graphene, silane coupling agent 6
Part, 4.5 parts of antioxidant, 3.2 parts of curing agent, 2.8 parts of lubricant, 3.6 parts of fire retardant and 15 parts of ethyl alcohol.
Silane coupling agent is γ-methacryloxypropyl trimethoxy silane.
Antioxidant is 4- hydroxy-dodecanoic acids anilid and 4- hydroxyoctadecanoic acids anilid according to mass ratio 1:1 is mixed
It is combined into.
Curing agent is phthalic anhydride.
Lubricant is graphite and talcum powder according to mass ratio 2:1 mixing composition.
Fire retardant is tetrabromobisphenol A and decabromodiphenylethane according to mass ratio 1:3 mixing compositions.
A kind of preparation method of above computer host housing material is also disclosed in the present embodiment, specifically, including with
Lower step：
(1) each raw material is weighed according to above-mentioned parts by weight；
(2) kaolin, mullite, light weight calcium, calcium fluosilicate, glass fibre are ground into 300 mesh powders respectively, then
It is uniformly mixed to get mixture N1, it is spare；
(3) butadiene-styrene rubber, makrolon, epoxy resin are mixed, agitating and heating melting obtains mixture N2, spare；
(4) by the carbon nano-fiber of mixture N1 and mixture N2 and above-mentioned parts by weight, carbon nanotube, nm-class boron nitride,
Nanometer silicon carbide, nano aluminium oxide, nano tin dioxide, nano zine oxide, graphene, silane coupling agent, ethyl alcohol are uniformly mixed, and are thrown
Enter and be kneaded into mixer, 220 degrees Celsius of melting temperature, mixing time 30 minutes is spare to get mixture N3；
(5) antioxidant, curing agent, lubricant and fire retardant are added in into mixture N3, under 200 degrees celsius, is thrown
Enter to be kneaded 15 minutes in mixer to get mixing material, it is spare；
(6) mixing material is put into double screw extruder, extruder grain, pellet is injected in 98 degrees Celsius of mold, squeezed
Molded, under the pressure of 80Mpa, pressurize 30 minutes, cooled to room temperature is demoulded to get the computer mainframe shell
Material.
Embodiment 3
A kind of computer mainframe shell material includes the raw material of following parts by weight meter：
40 parts of butadiene-styrene rubber, 26 parts of makrolon, 25 parts of epoxy resin, 16 parts of kaolin, 12 parts of mullite, light weight calcium 12
Part, 10 parts of calcium fluosilicate, 12 parts of glass fibre, 12 parts of carbon nano-fiber, 13 parts of carbon nanotube, 8 parts of nm-class boron nitride, nano-sized carbon
7 parts of SiClx, 6 parts of nano aluminium oxide, 7 parts of nano tin dioxide, 6 parts of nano zine oxide, 8 parts of graphene, 4.5 parts of silane coupling agent,
13 parts of 3.4 parts of antioxidant, 2.6 parts of curing agent, 2.2 parts of lubricant, 3.2 parts of fire retardant and ethyl alcohol.
Silane coupling agent is γ-methacryloxypropyl trimethoxy silane and double-(γ-triethoxy silicon substrate third
Base) tetrasulfide is according to mass ratio 2:3 mixing compositions.
Antioxidant is N, double -3 (- 4 hydroxy phenyl of the 3,5 di-t-butyl) propionamides of six methines of N- and (3,5 uncles of 1,3,5- tri-
Butyl -4- hydroxybenzyls) trimethylbenzene is according to mass ratio 1:1 mixing composition.
Curing agent is maleic anhydride and phthalic anhydride according to mass ratio 3:2 mixing compositions.
Lubricant is molybdenum disulfide and tungsten disulfide according to mass ratio 2:1 mixing composition.
Fire retardant is decabromodiphenylethane and Brominated Polystyrene according to mass ratio 3:2 mixing compositions.
A kind of preparation method of above computer host housing material is also disclosed in the present embodiment, specifically, including with
Lower step：
(1) each raw material is weighed according to above-mentioned parts by weight；
(2) kaolin, mullite, light weight calcium, calcium fluosilicate, glass fibre are ground into 220 mesh powders respectively, then
It is uniformly mixed to get mixture N1, it is spare；
(3) butadiene-styrene rubber, makrolon, epoxy resin are mixed, agitating and heating melting obtains mixture N2, spare；
(4) by the carbon nano-fiber of mixture N1 and mixture N2 and above-mentioned parts by weight, carbon nanotube, nm-class boron nitride,
Nanometer silicon carbide, nano aluminium oxide, nano tin dioxide, nano zine oxide, graphene, silane coupling agent, ethyl alcohol are uniformly mixed, and are thrown
Enter and be kneaded into mixer, 210 degrees Celsius of melting temperature, mixing time 26 minutes is spare to get mixture N3；
(5) antioxidant, curing agent, lubricant and fire retardant are added in into mixture N3, under 190 degrees celsius, is thrown
Enter to be kneaded 13 minutes in mixer to get mixing material, it is spare；
(6) mixing material is put into double screw extruder, extruder grain, pellet is injected in 92 degrees Celsius of mold, squeezed
Molded, under the pressure of 75Mpa, pressurize 26 minutes, cooled to room temperature is demoulded to get the computer mainframe shell
Material.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, although with reference to aforementioned reality
Example is applied the present invention is described in detail, it for those skilled in the art, still can be to aforementioned each implementation
Technical solution recorded in example modifies or carries out equivalent replacement to which part technical characteristic.All essences in the present invention
With within principle, any modification, equivalent replacement, improvement and so on should all be included in the protection scope of the present invention god.
Claims (8)
1. a kind of computer mainframe shell material, which is characterized in that including following raw material by weight：Butadiene-styrene rubber 35-
45 parts, 20-30 parts of makrolon, 20-30 parts of epoxy resin, 10-20 parts of kaolin, 8-15 parts of mullite, 8-15 parts of light weight calcium,
5-12 parts of calcium fluosilicate, 6-15 parts of glass fibre, 8-15 parts of carbon nano-fiber, 8-15 parts of carbon nanotube, nm-class boron nitride 5-10
Part, 5-10 parts of nanometer silicon carbide, 3-8 parts of nano aluminium oxide, 3-8 parts of nano tin dioxide, 3-8 parts of nano zine oxide, graphene 5-
12 parts, 3-6 parts of silane coupling agent, 2.8-4.5 parts of antioxidant, 1.5-3.2 parts of curing agent, 1.2-2.8 parts of lubricant, fire retardant
2.1-3.6 10-15 parts of part and ethyl alcohol.
2. computer mainframe shell material according to claim 1, which is characterized in that include the original of following parts by weight meter
Material：40 parts of butadiene-styrene rubber, 26 parts of makrolon, 25 parts of epoxy resin, 16 parts of kaolin, 12 parts of mullite, 12 parts of light weight calcium, fluorine
10 parts of calcium silicates, 12 parts of glass fibre, 12 parts of carbon nano-fiber, 13 parts of carbon nanotube, 8 parts of nm-class boron nitride, nanometer silicon carbide 7
Part, 6 parts of nano aluminium oxide, 7 parts of nano tin dioxide, 6 parts of nano zine oxide, 8 parts of graphene, 4.5 parts of silane coupling agent, antioxidant
13 parts of 3.4 parts, 2.6 parts of curing agent, 2.2 parts of lubricant, 3.2 parts of fire retardant and ethyl alcohol.
3. computer mainframe shell material according to claim 1, which is characterized in that the silane coupling agent is double-(2-
(triethoxysilane) propyl)-tetrasulfide, γ-methacryloxypropyl trimethoxy silane, double-(γ-three ethoxies
Base silicon substrate propyl) combination of one or more of tetrasulfide.
4. computer mainframe shell material according to claim 1, which is characterized in that the antioxidant be N, six first of N-
Base double -3 (- 4 hydroxy phenyl of 3,5 di-t-butyl) propionamides, 1,3,5- tri- (3,5 tertiary butyl-4-hydroxy benzyl) trimethylbenzene, 4-
The combination of one or more of hydroxy-dodecanoic acid anilid, 4- hydroxyoctadecanoic acid anilids.
5. computer mainframe shell material according to claim 1, which is characterized in that the curing agent is maleic acid
The combination of one or both of acid anhydride and phthalic anhydride.
6. computer mainframe shell material according to claim 1, which is characterized in that the lubricant for molybdenum disulfide,
The combination of one or more of graphite, talcum powder and tungsten disulfide.
7. computer mainframe shell material according to claim 1, which is characterized in that the fire retardant is decabrominated dipheny
The combination of one or more of ether, tetrabromobisphenol A, decabromodiphenylethane and Brominated Polystyrene.
It is 8. a kind of such as the preparation method of claim 1-7 any one of them computer mainframe shell materials, which is characterized in that packet
Include following steps：
(1) each raw material is weighed according to above-mentioned parts by weight；
(2) kaolin, mullite, light weight calcium, calcium fluosilicate, glass fibre are ground into 150-300 mesh powders respectively, then
It is uniformly mixed to get mixture N1, it is spare；
(3) butadiene-styrene rubber, makrolon, epoxy resin are mixed, agitating and heating melting obtains mixture N2, spare；
(4) by mixture N1 and mixture N2 and the carbon nano-fiber of above-mentioned parts by weight, carbon nanotube, nm-class boron nitride, nanometer
Silicon carbide, nano aluminium oxide, nano tin dioxide, nano zine oxide, graphene, silane coupling agent, ethyl alcohol are uniformly mixed, and are put into
It is kneaded in mixer, 200-220 degrees Celsius of melting temperature, mixing time 20-30 minutes is spare to get mixture N3；
(5) antioxidant, curing agent, lubricant and fire retardant are added in into mixture N3, under 180-200 degrees celsius, is thrown
Enter to be kneaded 10-15 minutes in mixer to get mixing material, it is spare；
(6) mixing material is put into double screw extruder, extruder grain, pellet is injected in 80-98 degrees Celsius of mold, squeezed
Molding, under the pressure of 70-80Mpa, pressurize 20-30 minutes, cooled to room temperature is demoulded to get the main frame
Sheathing material.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810174134.3A CN108250518A (en) | 2018-03-02 | 2018-03-02 | A kind of computer mainframe shell material and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810174134.3A CN108250518A (en) | 2018-03-02 | 2018-03-02 | A kind of computer mainframe shell material and preparation method thereof |
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| CN108250518A true CN108250518A (en) | 2018-07-06 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110922656A (en) * | 2019-12-10 | 2020-03-27 | 温州科丰汽车零部件有限公司 | Production process of automobile pressure sensor base shell |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102952388A (en) * | 2012-11-30 | 2013-03-06 | 深圳市博恩实业有限公司 | High dielectric constant thermal conductive plastic and preparation method thereof |
| CN104497543A (en) * | 2014-12-08 | 2015-04-08 | 国家电网公司 | Shell of small and special electrical machine and application of shell |
| CN105348653A (en) * | 2015-09-30 | 2016-02-24 | 安徽酷米智能科技有限公司 | High-hardness, wear-resistant and heat-resistant material for cell phone cases |
-
2018
- 2018-03-02 CN CN201810174134.3A patent/CN108250518A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102952388A (en) * | 2012-11-30 | 2013-03-06 | 深圳市博恩实业有限公司 | High dielectric constant thermal conductive plastic and preparation method thereof |
| CN104497543A (en) * | 2014-12-08 | 2015-04-08 | 国家电网公司 | Shell of small and special electrical machine and application of shell |
| CN105348653A (en) * | 2015-09-30 | 2016-02-24 | 安徽酷米智能科技有限公司 | High-hardness, wear-resistant and heat-resistant material for cell phone cases |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110922656A (en) * | 2019-12-10 | 2020-03-27 | 温州科丰汽车零部件有限公司 | Production process of automobile pressure sensor base shell |
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Application publication date: 20180706 |