CN108242582A - A kind of DGS wave filters, printed circuit board and filter - Google Patents
A kind of DGS wave filters, printed circuit board and filter Download PDFInfo
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- CN108242582A CN108242582A CN201611207733.8A CN201611207733A CN108242582A CN 108242582 A CN108242582 A CN 108242582A CN 201611207733 A CN201611207733 A CN 201611207733A CN 108242582 A CN108242582 A CN 108242582A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
Abstract
The embodiment of the present invention provides a kind of DGS wave filters, printed circuit board and filter, is related to field of communication technology, can improve DGS filter discriminations on multilayer printed circuit board.The DGS wave filters are used to be filtered the signal transmitted on target cabling in the first routing layer in printed circuit board；The DGS wave filters include：The first reference layer and destination layer being oppositely arranged, the destination layer are the interior reference layer different from the first reference layer of printed circuit board or are routing layers different with the first routing layer in printed circuit board；Wherein, DGS plot shape is provided in the first reference layer, the DGS plot shape is symmetrical as symmetry axis using upright projection of the target cabling in the first reference layer；In the periphery of DGS plot shape, the first reference layer and destination layer are provided with N number of ground via, the first reference layer passes through the reference ground regional connectivity in this N number of ground via and destination layer.
Description
Technical field
The present embodiments relate to a kind of field of communication technology more particularly to DGS wave filters, printed circuit board and filtering dresses
It puts.
Background technology
At present, the DGS in printed circuit board (Defected Ground Structure, defect ground structure) wave filter leads to
It is often that tool effigurate ground defect (Defected is etched on the ground connection substrate of printed circuit board interior cabling layer
Ground), such as it is humorous can to form LC using these defect ground structures for double C-type defect ground structure, U-shaped dumbbell defect ground structure
It shakes structure, so as to play filter action to the electric signal transmitted in printed circuit board in certain frequency band.
But for multilayer printed circuit board (printed circuit board i.e. including multiple routing layers and multiple ground connection substrates) shape
Into communication substrate, if only on one layer of ground connection substrate set drawbacks described above ground structure, may result in different ground connection substrates
Between generate resonance phenomena, then, DGS filter discriminations can be then substantially reduced, that is to say, that current DGS filtering
Device is not particularly suited for multilayer printed circuit board.
Invention content
The embodiment of the present invention provides a kind of DGS wave filters, printed circuit board and filter, can improve multilayered printed electricity
DGS filter discriminations on the plate of road.
In order to achieve the above objectives, the embodiment of the present invention adopts the following technical scheme that：
In a first aspect, the embodiment of the present invention provides a kind of DGS wave filters, which is applied to printed circuit board,
The printed circuit board includes：First routing layer, the first reference layer and destination layer, the first reference layer are located at the first routing layer and mesh
Between marking layer, which is the routing layer different from the first routing layer (alternatively, the destination layer is different with the first reference layer
Reference layer)；At this point, the first reference layer and destination layer form DGS wave filters, which is used for mesh in the first routing layer
The signal transmitted on mark cabling is filtered；Wherein, DGS plot shape is provided in the first reference layer, the DGS plot shape is with target cabling
Upright projection in the first reference layer is symmetrical for symmetry axis；In the periphery of DGS plot shape, through the first reference layer and mesh
Mark layer is provided with N (N ＞ 1) a ground via, and the first reference layer is connected by the reference ground region in this N number of ground via and destination layer
It is logical.
As can be seen that for multilayer printed circuit board, in the DGS wave filters provided in the embodiment of the present invention, Ke Yi
Periphery setting N number of ground via of DGS plot shape, and then, by this N number of ground via by the reference between the first reference layer and destination layer
Ground regional connectivity so that the reference potential between the first reference layer and destination layer is identical, so as to reduce different reference layers or cabling
Resonance between layer, to ensure DGS filter discriminations in multilayer printed circuit board.
In a kind of possible design method, the distance between adjacent ground via of any two is not more than DGS wave filters
Maximum functional wavelength 1/4.When the distance between two adjacent ground vias are sufficiently small, this N number of ground via is equivalent to
Hole grid are formd in multilayer printed circuit board, due to this N number of ground, via is arranged on the periphery of DGS plot shape, printed circuit board
Interior DGS plot shape 22 is equivalent to is wrapped up by the hole grid that this N number of ground via is formed, the electromagnetic wave that can be generated to DGS wave filters
It is shielded, so as to the electromagnetic radiation that DGS wave filters is effectively inhibited to generate.
In a kind of possible design method, on the first reference layer, which surrounds the periphery of the DGS plot shape
Form the figure of closing.In this way, DGS plot shape can be by reference ground region adjacent thereto and N number of ground via package of surrounding
It is more complete, the electromagnetic radiation of DGS wave filters generation can be further suppressed.
In a kind of possible design method, which is through-hole, blind hole or buried via hole.
It in a kind of possible design method, is provided between the first reference layer and destination layer and hollows out layer, this hollows out layer and exists
Upright projection on destination layer is Chong Die with the reference ground region in destination layer.When the depth for hollowing out layer is bigger, to common-mode noise
Inhibiting effect it is more apparent, also, the bandwidth of operation of DGS wave filters is consequently increased.At this point, the reference ground region, hollowing out layer
And inclusion enclave is collectively formed in N number of ground via of DGS plot shape surrounding, for the electromagnetic radiation that DGS wave filters is inhibited to generate.
In a kind of possible design method, which includes the first U-shaped structure and the second U-shaped structure, the first U
Type structure and second U-shaped structure are divided respectively using upright projection of the target cabling in first reference layer as symmetrical axial symmetry
Cloth；Wherein, the opening of first U-shaped structure and the opening of second U-shaped structure are oppositely arranged.
In a kind of possible design method, which includes：With the target cabling in the vertical of first reference layer
Be projected as symmetry axis symmetrical the first c-type structure and the second c-type structure, wherein, the opening of the first c-type structure with this
The opening of two c-type structures is oppositely arranged, which is connected with the second c-type structure by connecting line, the connecting line with
Target cabling is vertical in the upright projection of the first reference layer.
In a kind of possible design method, which includes the first G types structure and the 2nd G type structures, the first G
Type structure and the 2nd G types structure are divided respectively using upright projection of the target cabling in first reference layer as symmetrical axial symmetry
Cloth；Wherein, the opening of the opening and the 2nd G type structures of the first G type structures is oppositely arranged.
As can be seen that the embodiment of the present invention additionally provides three kinds of DGS plot shapes of different shapes, i.e., symmetrical co-deflection G types DGS
Structure, symmetrical C-shaped dumbbell shape DGS structures and symmetrical double-U-shaped DGS structures.
In a kind of possible design method, which is differential lines or single cabling.
Second aspect, the embodiment of the present invention provide a kind of printed circuit board, which includes such as above-mentioned first
The DGS wave filters of any one of aspect.
The third aspect, the embodiment of the present invention provide a kind of filter, which includes such as above-mentioned second aspect
In printed circuit board.
Wherein, technique effect caused by any design method can be found in first aspect in second aspect or the third aspect
Technique effect caused by middle different designs mode, details are not described herein again.
The aspects of the invention or other aspects can more straightforwards in the following description.
Description of the drawings
Fig. 1 is a kind of structure diagram one of printed circuit board provided in an embodiment of the present invention；
Fig. 2 is a kind of structure diagram one for the printed circuit board for being provided with DGS wave filters provided in an embodiment of the present invention；
Fig. 3 is a kind of structure diagram one of DGS plot shape provided in an embodiment of the present invention；
Fig. 4 is a kind of structure diagram two for the printed circuit board for being provided with DGS wave filters provided in an embodiment of the present invention；
Fig. 5 is a kind of structure diagram two of DGS plot shape provided in an embodiment of the present invention；
Fig. 6 is a kind of structure diagram three for the printed circuit board for being provided with DGS wave filters provided in an embodiment of the present invention；
Fig. 7 is a kind of structure diagram three of DGS plot shape provided in an embodiment of the present invention；
Fig. 8 is a kind of structure diagram four of DGS plot shape provided in an embodiment of the present invention；
Fig. 9 is a kind of structure diagram five of DGS plot shape provided in an embodiment of the present invention；
Figure 10 is a kind of structure diagram for the printed circuit board for being provided with DGS wave filters provided in an embodiment of the present invention
Four；
Figure 11 is the simulation result schematic diagram provided in an embodiment of the present invention to being provided with the printed circuit board of DGS wave filters
One；
Figure 12 is a kind of structure diagram for the printed circuit board for being provided with DGS wave filters provided in an embodiment of the present invention
Five；
Figure 13 is the simulation result schematic diagram provided in an embodiment of the present invention to being provided with the printed circuit board of DGS wave filters
Two；
Figure 14 is a kind of structure diagram for the printed circuit board for being provided with DGS wave filters provided in an embodiment of the present invention
Six；
Figure 15 is the simulation result schematic diagram provided in an embodiment of the present invention to being provided with the printed circuit board of DGS wave filters
Three；
Figure 16 is the simulation result schematic diagram provided in an embodiment of the present invention to being provided with the printed circuit board of DGS wave filters
Four；
Figure 17 is the simulation result schematic diagram provided in an embodiment of the present invention to being provided with the printed circuit board of DGS wave filters
Five.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is retouched in detail
It states.
In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more this feature.In the description of the present invention, unless otherwise indicated, " multiple " are meant that two
It is a or more than two.
The DGS wave filters that the embodiment of the present invention provides can be applied in multilayer printed circuit board, the multilayer printed circuit
Plate includes at least two reference layers and at least two routing layers, and each routing layer corresponds to a reference layer (alternatively, multiple cablings
Layer can correspond to same reference layer), it is provided by the reference layer for the routing layer with reference to earth signal.
Illustratively, when each routing layer uniquely corresponds to a reference layer, as shown in Figure 1, multilayer printed circuit board
Routing layer 11 and reference layer 12 in 100 are arranged alternately successively.That is, multilayer printed circuit board 100 include it is more
A routing layer 11, each routing layer 11 are correspondingly arranged there are one reference layer 12.Also, routing layer 11 and the reference of arbitrary neighborhood
It can be filled between layer 12 by the dielectric layer 13 of insulation.For convenience of illustrating DGS wave filters provided in an embodiment of the present invention, after
It is illustrated by taking the routing layer 11 and reference layer 12 that are arranged alternately successively shown in Fig. 1 as an example in continuous embodiment.
Wherein, routing layer 11 is typically provided with the cabling for carrying electric signal, can specifically be walked by one or more metal
Line is formed, and reference layer 12 is generally used for carrying power supply or with reference to earth signal, the telecommunications of each metal routing carrying in routing layer 11
Number final each input/output (I/O, in/out) interface for leading to printed circuit board 100.
As shown in Fig. 2, DGS wave filters 100 provided in an embodiment of the present invention are used for target cabling in the first routing layer 11a
The signal of upper transmission is filtered.Wherein, which can be differential lines 21, or single cabling, the embodiment of the present invention
This is not intended to be limited in any.
It is illustrated using above-mentioned target cabling as differential lines 21, as shown in Fig. 2, DGS wave filters 100 include：Be oppositely arranged
One reference layer 12a and destination layer 11b, destination layer 11b can be the arbitrary reference in printed circuit board in addition to the first reference layer 12a
Layer, or the arbitrary routing layer in printed circuit board in addition to the first routing layer 11a is (using routing layer 11b as above-mentioned mesh in Fig. 2
Mark layer).
Specifically, DGS plot shape 22 is provided in the first reference layer 12a, as shown in figure 3, the DGS plot shape 22 is with differential lines 21
Upright projection in the first reference layer 12a is symmetrical for symmetry axis.The shape of the DGS plot shape 22 is specifically as follows existing skill
Double C-type defect ground structure or U-shaped dumbbell shape defect ground structure in art, or other defect ground structures, the present invention are follow-up
It will be apparent from embodiment.
Wherein, with reference to shown in Fig. 2 and Fig. 3, in the periphery of DGS plot shape 22, along perpendicular to the direction of the first reference layer 12a,
First reference layer 12a and destination layer 11b are provided with N (N ＞ 1) a ground via 23, as shown in Fig. 2, the first reference layer 12a
It is connected by the reference ground region 24 set in ground via 23 and destination layer 11b.Although each area in each reference layer 12
Domain can be provided with reference to earth signal, still, in embodiments of the present invention, can be projected DGS plot shape 22 in arbitrary reference layer
The region at place is used as with reference to ground region, and in arbitrary routing layer, and the region where can also DGS plot shape be projected is set as
Reference ground region.
It should be noted that in DGS wave filters 100 shown in Fig. 2, ground via 23 by the first reference layer 12a and with
Reference ground region 24 in one layer of adjacent first reference layer 12a routing layer 11b (i.e. destination layer) connects.
It is understood that as shown in figure 4, ground via 23 can also in multilayer routing layer 11 and multilayer reference layer 12
Reference ground regional connectivity.For example, in (a) in Fig. 4, ground via 23 has run through all routing layers 11 of printed circuit board (i.e.
Routing layer 11a, routing layer 11b and routing layer 11c) 11 and all reference layers 12 (i.e. reference layer 12a, reference layer 12b and reference
Layer 12c)；In (b) in Fig. 4, ground via 23 has run through the first reference layer 12a, the destination layer 11b where DGS plot shape 22, with
And the first reference layer 12b between reference layer 12a and destination layer 11b.
That is, above-mentioned ground via 23 can be through-hole, blind hole or buried via hole, the embodiment of the present invention is not restricted this.
By taking (b) in Fig. 4 as an example, when local via 23 is buried via hole, since ground via 23 has only run through the first reference layer
12a, destination layer 11b and reference layer 12b, then, it is not provided with normally connecting up in the routing layer 11c of ground via 23, from
And reduce the influence to the wiring in multilayer printed circuit board.
As can be seen that for multilayer printed circuit board, in the DGS wave filters provided in the embodiment of the present invention, Ke Yi
Periphery setting N number of ground via of DGS plot shape, and then, by this N number of ground via by the reference between different reference layers or routing layer
Ground regional connectivity so that the reference potential in the reference ground region between different reference layers or routing layer is identical, so as to reduce difference
Resonance between reference layer or routing layer, to ensure DGS filter discriminations on multilayer printed circuit board.
Optionally, the distance between adjacent ground via 23 of any two is not more than the maximum functional wave of DGS wave filters 100
Long 1/4.For example, the working frequency range of DGS plot shape 22 is 25GHz-30GHz, that is to say, that the maximum operation frequency of DGS plot shape 22
For 30GHz, when DGS plot shape 22 on 30GHz when working, the wavelength of the electromagnetic wave of radiation is λ (λ ＞ 0), then, arbitrary two
The distance between a adjacent ground via 23 p should be less than or equal to λ/4.
When the distance between two adjacent ground vias 1/4 no more than the maximum functional wavelength of DGS wave filters, this N
A ground via is equivalent to forms hole grid in multilayer printed circuit board, and due to this N number of ground, via is arranged on the outer of DGS plot shape
It encloses, therefore, the DGS plot shape in printed circuit board is equivalent to is wrapped up by the hole grid that this N number of ground via is formed, and DGS can be filtered
The electromagnetic wave that wave device generates is shielded, so as to the electromagnetic radiation that DGS wave filters is effectively inhibited to generate.
Optionally, as shown in Fig. 2, in the first reference layer 12a, above-mentioned N number of ground via 23 can be set to surround DGS plot shape
The figure that 22 periphery is formed forms N number of ground via 23 as shown in Figure 5 for closed figure, in this way, DGS plot shape 22 can be with
By the more complete of N number of ground via 23 of reference ground region 24 adjacent thereto and surrounding package, DGS can be further suppressed
The electromagnetic radiation that wave filter generates.
Further, it can also be set between above-mentioned first reference layer and destination layer and hollow out layer, hollowing out at this time can in layer 31
Filled with dielectric, illustratively, as shown in (a) in Fig. 6, the first reference layer is 12a, and routing layer 11b can be carried out
Processing is hollowed out, formation hollows out a layer 31a, the size of upright projection of the layer 31 on the first reference layer 12a hollowed out, with the first reference layer
The size for the figure that 12a Shangdis via 23 is formed is identical, at this point, destination layer is reference layer 12b；Or such as (b) in Fig. 6
Shown, the first reference layer is 12a, and routing layer 11b and reference layer 12b can be carried out to hollow out processing, and formation hollows out a layer 31b, this
When, destination layer is routing layer 11c, this hollows out upright projection of the layer 31 on destination layer 11c and the reference locality in destination layer 11c
Domain 24 is overlapped；Or as shown in (c) in Fig. 6, the first reference layer is 12a, can to routing layer 11b, reference layer 12b and
Routing layer 11c carries out hollowing out processing, and formation hollows out a layer 31c, at this point, destination layer is reference layer 12c.When the depth for hollowing out layer is bigger
When, it is more apparent to the inhibiting effect of common-mode noise, also, the bandwidth of operation of DGS wave filters is consequently increased.
As can be seen that no matter hollow out how many a reference layers or routing layer, reference ground region in destination layer, hollow out layer and
Inclusion enclave is collectively formed in N number of ground via of DGS plot shape surrounding, for the electromagnetic radiation that DGS wave filters is inhibited to generate.
Optionally, above-mentioned first routing layer be specifically as follows in above-mentioned DGS wave filters positioned at surface layer routing layer (such as Fig. 2,
First routing layer 11a of Fig. 4 or shown in fig. 6), or it is located at the routing layer of bottom in above-mentioned multilayer printed circuit board, also
Can be the arbitrary routing layer for being located at middle layer in above-mentioned multilayer printed circuit board, the embodiment of the present invention is not restricted this.
It should be noted that the DGS wave filters 100 shown in Fig. 2, Fig. 4 and Fig. 6 can be as in printed circuit board
A part, the reference layer 12 of the DGS wave filters 100 shown in Fig. 2, Fig. 4 and Fig. 6 are not necessarily used as the ginseng of printed circuit board
Layer is examined, similar, the routing layer 11 of the DGS wave filters shown in Fig. 2, Fig. 4 and Fig. 6 is not necessarily used as printed circuit board
Routing layer.By taking Fig. 2 as an example, reference layer 12b can be as a reference layer in above-mentioned DGS wave filters 100, still, for DGS
For entire printed circuit board where wave filter 100, in this layer of reference layer 12b in addition to this subregion of reference layer 12b,
Cabling can also be set, i.e. this layers of reference layer 12b can also be used as a routing layer of entire printed circuit board.
Further, based on the DGS wave filters provided in Fig. 1-Fig. 6, the embodiment of the present invention additionally provides a variety of not similar shapes
The DGS plot shape 22 of shape, for example, symmetrical co-deflection G type DGS structures shown in Fig. 7, symmetrical C-shaped dumbbell shape DGS knots shown in Fig. 8
Structure and symmetrical double-U-shaped DGS structures shown in Fig. 9, carry out in detail above-mentioned DGS plot shape 22 of different shapes below with reference to attached drawing
Thin elaboration, it is to be understood that the DGS plot shape 22 set in DGS wave filters provided in an embodiment of the present invention can also be it
His arbitrary shape, the embodiment of the present invention are not restricted this.
In a kind of possible design method, the shape of above-mentioned DGS plot shape 22 is as shown in fig. 7, DGS plot shape 22 includes first
G types structure 61 and the 2nd G types structure 62, the first G types structure 61 and the 2nd G types structure 62 are respectively with differential lines 21 in the first reference
The upright projection of layer is symmetrical for symmetry axis.Wherein, the opening phase of the opening and the 2nd G types structure 62 of the first G types structure 61
To setting.
Illustratively, as shown in fig. 7, the line width w of differential lines 21m=0.167mm, the distance s between differential lines 21m=
0.254mm, the thickness (being not shown in Fig. 7) of differential lines 21 is 0.0347mm.
Still as shown in fig. 7, the specific size of DGS plot shape 22 is as follows：On 21 direction of differential lines, the first G type structures
First length of side s of 61 (or the 2nd G types structures 62)1=2.1mm is parallel on 21 direction of differential lines, the first G types structure 61 (or
2nd G types structure 62) the second length of side s2=0.9412mm, the line width s of the first G types structure 61 (or the 2nd G types structure 62)3=
0.18mm (line width that can set 22 any position of DGS plot shape is equal), the first G types structure 61 (or the 2nd G types structure 62) are opened
The distance s of mouth position4=0.842mm, the distance s of aperture position to second length of side5=0.269mm；From aperture position to the first side
The distance s of long extension6=0.18mm, the distance s between the first G types structure 61 and the 2nd G types structure 627=0.4572mm, DGS
The thickness of reference layer (being not shown in Fig. 6) where figure 22 is about 0.0347mm；In addition, it is adjacent to the interval between via 23
P is about 0.4mm, and arbitrarily the spacing j between the length of side nearest apart from DGS plot shape 22 of via 23 is about 0.127mm.
Further, DGS plot shape 22 shown in Fig. 7 can be applied in multilayer printed circuit board 200 shown in Fig. 10.Its
In, multilayer printed circuit board 200 includes 3 layers of routing layer (routing layer A, B and C) and 3 layers of reference layer (reference layer D, E and F), above-mentioned
Differential lines 21 are arranged on routing layer A, and above-mentioned DGS plot shape 22 is arranged on reference layer D, and ground via 23 is sequentially communicated reference layer D, cabling
Layer B, reference layer E, routing layer C and reference layer F.At this point, routing layer B is as destination layer in above-mentioned DGS wave filters 100, reference
For layer D as the first routing layer in above-mentioned DGS wave filters 100, ground via 23 has run through the reference ground region 24 in routing layer B and ginseng
Examine a layer D.
After being emulated to the common mode Insertion Loss that multilayer printed circuit board 200 shown in Fig. 10 generates, obtained simulation result
As shown in figure 11, it can be seen that provided in an embodiment of the present invention compared to the printed circuit board for being not provided with above-mentioned DGS plot shape 22
Printed circuit board 200 can inhibit common mode Insertion Loss in -10dB hereinafter, so as to drop in the 6GHz bandwidth of 25GHz-31GHz or so
The common-mode noise generated during differential signal transmission in low differential lines 21, to ensure the filter of DGS plot shape 22 on multilayer printed circuit board
Wave energy power.
In alternatively possible design method, the shape of above-mentioned DGS plot shape 22 as shown in figure 8, DGS plot shape 22 include with
Differential lines 21 are symmetrically arranged first c-type structure, the 71 and second c-type structure 72 of symmetry axis in the upright projection of the first reference layer,
Wherein, the opening of the opening and the second c-type structure 72 of the first c-type structure 71 is oppositely arranged, and the first c-type structure 71 and the 2nd C
Type structure 72 is connected by connecting line 73, and connecting line 73 is vertical in the upright projection of the first reference layer with differential lines 21, for example, such as
Shown in Fig. 8, connecting line 73 is perpendicular bisector of the differential lines 21 in the upright projection of the first reference layer.
It is similar with DGS plot shape 22 shown in Fig. 7, in DGS plot shape 22 shown in Fig. 8, the line width w of differential lines 21m=
0.167mm, the distance s between differential lines 21m=0.254mm, the thickness (being not shown in Fig. 8) of differential lines 21 is 0.0347mm.
Still as shown in figure 8, the specific size of DGS plot shape 22 is as follows：It is parallel on 21 direction of differential lines, the first c-type structure
First length of side z of 71 (or second c-type structures 72)1=1.8mm, on 21 direction of differential lines, the first c-type structure 71 (or
Second c-type structure 72) the second length of side z2=0.54mm, the third length of side extended perpendicular to second length of side to 73 direction of connecting line
z3=0.43mm, the distance between the third length of side and connecting line 73 z4=0.18mm, the distance between the third length of side and first length of side
z5=0.18mm, the line width z of the first c-type structure 71 (or second c-type structure 72)6=0.18mm, the opening of the first c-type structure 71
Position is to the spacing z between the aperture position of the second c-type structure 727=0.8596mm.
In addition, it is parallel on 21 direction of differential lines, the interval p being adjacent between via 23xAbout 0.3762mm, perpendicular to
On 21 direction of differential lines, the interval p that is adjacent between via 23yAbout 0.3995mm, arbitrarily via 23 is apart from DGS plot shape 22
Spacing j between the nearest length of side is about 0.2286mm.
Further, DGS plot shape 22 shown in Fig. 8 can be applied in the multilayer printed circuit board 300 shown in Figure 12.Its
In, multilayer printed circuit board 300 includes 3 layers of routing layer (routing layer A, B and C) and 3 layers of reference layer (reference layer D, E and F), above-mentioned
Differential lines 21 are arranged on routing layer A, and above-mentioned DGS plot shape 22 is arranged on reference layer D, and ground via 23 is sequentially communicated reference layer D, cabling
Layer B, reference layer E, routing layer C and reference layer F.At this point, routing layer B is as destination layer in above-mentioned DGS wave filters 100, reference
For layer D as the first routing layer in above-mentioned DGS wave filters 100, ground via 23 has run through the reference ground region 24 in routing layer B and ginseng
Examine a layer D.
After being emulated to the common mode Insertion Loss that the multilayer printed circuit board 300 shown in Figure 12 generates, obtained simulation result
As shown in figure 13, it can be seen that provided in an embodiment of the present invention compared to the printed circuit board for being not provided with above-mentioned DGS plot shape 22
Printed circuit board 300 can in the 4.5GHz bandwidth of 24GHz-28.5GHz or so, by common mode Insertion Loss inhibit in -10dB hereinafter, from
And the common-mode noise generated during differential signal transmission in differential lines 21 is reduced, to ensure DGS plot shape 22 on multilayer printed circuit board
Filter capacity.
In alternatively possible design method, the shape of above-mentioned DGS plot shape 22 is as shown in figure 9, DGS plot shape 22 includes the
One U-shaped structure 81 and the second U-shaped structure 82, the first U-shaped structure 81 and the second U-shaped structure 82 are respectively with differential lines 21 in the first ginseng
The upright projection for examining layer is symmetrical for symmetry axis.Wherein, the opening of the first U-shaped structure 81 and the opening of the second U-shaped structure 82
It is oppositely arranged.
In DGS plot shape 22 shown in Fig. 9, the line width w of differential lines 21m=0.244m, the distance s between differential lines 21m=
0.264mm, the thickness (being not shown in Fig. 9) of differential lines 21 is 0.0512mm.
Still as shown in figure 9, the specific size of DGS plot shape 22 is as follows：It is parallel on 21 direction of differential lines, the first U-shaped structure
First length of side u of 81 (or second U-shaped structures 82)1=0.397mm, line width u2=0.476mm；On 21 direction of differential lines,
Second length of side u of the first U-shaped structure 81 (or second U-shaped structure 82)3=2.183mm, line width u4=0.18mm；First U-shaped structure
Spacing u between the aperture position of 81 aperture position to the second U-shaped structure 825=0.192mm.
In addition, the interval p being adjacent between via 23 is about 0.4mm, ground via 23 is set along the periphery of DGS plot shape 22.
Further, DGS plot shape 22 shown in Fig. 9 can be applied in the multilayer printed circuit board 400 shown in Figure 14.Its
In, multilayer printed circuit board 400 includes 3 layers of routing layer (routing layer A, B and C) and 3 layers of reference layer (reference layer D, E and F), above-mentioned
Differential lines 21 are arranged on routing layer A, and above-mentioned DGS plot shape 22 is arranged on reference layer D, and ground via 23 is sequentially communicated reference layer D, cabling
Layer B, reference layer E, routing layer C and reference layer F.At this point, reference layer E is as destination layer in above-mentioned DGS wave filters 100, reference
As the first routing layer in above-mentioned DGS wave filters 100, the routing layer B between reference layer D and reference layer E is hollowed out layer D, is formed
Layer 31 is hollowed out, ground via 23 has run through reference layer E, hollowed out layer 31 and reference layer D.
After being emulated to the common mode Insertion Loss that the multilayer printed circuit board 400 shown in Figure 14 generates, obtained simulation result
As shown in figure 15, it can be seen that provided in an embodiment of the present invention compared to the printed circuit board for being not provided with above-mentioned DGS plot shape 22
Printed circuit board 400 can inhibit common mode Insertion Loss in -10dB hereinafter, so as to drop in the 2GHz bandwidth of 20GHz-22GHz or so
The common-mode noise generated during differential signal transmission in low differential lines 21, to ensure the filter of DGS plot shape 22 on multilayer printed circuit board
Wave energy power.
Further, it after the electromagnetic radiation generated to the multilayer printed circuit board 400 shown in Figure 14 emulates, obtains
Simulation result is as shown in figure 16.As can be seen that the printed circuit board of traditional DGS wave filters is provided in compared with the prior art,
Electromagnetic radiation can be reduced 6dB- by printed circuit board 400 provided in an embodiment of the present invention in the bandwidth of 10GHz-30GHz or so
10dB.Wherein, the simulation result schematic diagram that the electromagnetic radiation shown in Figure 16 changes with frequency is apart from printed circuit board ten
Position at rice is provided with to printed circuit board 400 provided in an embodiment of the present invention and in the prior art traditional DGS filters respectively
What the printed circuit board of wave device was emulated.
In addition, to being provided with DGS wave filters provided in an embodiment of the present invention (for example, Fig. 7, Fig. 8 or shown in Fig. 9 DGS are filtered
Wave device) the differential mode Insertion Loss that generates of multilayer printed circuit emulated after, as shown in figure 17, it can be seen that real using the present invention
The differential mode Insertion Loss that the DGS wave filters of example offer generate is applied, in the filtering of 10GHz-35GHz during with being not provided with above-mentioned DGS wave filters
The differential mode Insertion Loss generated in bandwidth is essentially identical, within 0dB to -2dB.
That is, DGS wave filters provided in an embodiment of the present invention can ensure the differential mode Insertion Loss generated in filtering bandwidth
While increase, the common mode Insertion Loss of generation is inhibited in -10dB hereinafter, and reduce the electromagnetic radiation of DGS wave filters generation,
So as to improve the filtering performance of DGS wave filters.
Further, the embodiment of the present invention also provides a kind of printed circuit board, and above-mentioned is may include in the printed circuit board
One DGS wave filter, the printed circuit board can be applied in all kinds of entity devices, and the embodiment of the present invention is not restricted this.
Further, the embodiment of the present invention also provides a kind of filter, for example, communication equipment etc., in the filter
It may include above-mentioned printed circuit board, the embodiment of the present invention is not restricted this.
Above-described specific embodiment has carried out the purpose of the present invention, technical solution and advantageous effect further
It is described in detail, it should be understood that the foregoing is merely the specific embodiment of the present invention, is not intended to limit the present invention
Protection domain, all any modification, equivalent substitution, improvement and etc. on the basis of technical scheme of the present invention, done should all
Including within protection scope of the present invention.
Claims (11)
1. a kind of defect ground structure DGS wave filters, which is characterized in that the DGS wave filters are applied to printed circuit board, the print
Circuit board processed includes：First routing layer, the first reference layer and destination layer, first reference layer are located at first routing layer
Between the destination layer, the destination layer is：The routing layer different from first routing layer, alternatively, with the described first ginseng
Examine the different reference layer of layer；
First reference layer and the destination layer form the DGS wave filters, and the DGS wave filters are used to walk to described first
The signal transmitted on target cabling in line layer is filtered；
Wherein, DGS plot shape is provided in first reference layer, the DGS plot shape is with the target cabling in the described first ginseng
The upright projection examined in layer is symmetrical for symmetry axis；In the periphery of the DGS plot shape, through first reference layer and institute
It states destination layer and is provided with N number of ground via, first reference layer passes through the reference ground in N number of ground via and the destination layer
Regional connectivity, N ＞ 1.
2. DGS wave filters according to claim 1, which is characterized in that the distance between adjacent ground via of any two
No more than the 1/4 of the maximum functional wavelength of the DGS wave filters.
3. DGS wave filters according to claim 1 or 2, which is characterized in that on first reference layer, it is described N number ofly
Via forms the figure of closing around the periphery of the DGS plot shape.
4. DGS wave filters according to any one of claim 1-3, which is characterized in that described ground via is through-hole, blind hole
Or buried via hole.
5. the DGS wave filters according to any one of claim 1-4, which is characterized in that first reference layer and described
It is provided between destination layer and hollows out layer, it is described to hollow out upright projection of the layer on the destination layer and the reference in the destination layer
Ground region is overlapped.
6. DGS wave filters according to any one of claims 1-5, which is characterized in that the DGS plot shape includes the first U
Type structure and the second U-shaped structure, first U-shaped structure using the target cabling first reference layer upright projection as
Symmetry axis is symmetrical, and second U-shaped structure using the target cabling first reference layer upright projection as pair
Claim axial symmetry distribution；
Wherein, the opening of first U-shaped structure and the opening of second U-shaped structure are oppositely arranged.
7. DGS wave filters according to any one of claims 1-5, which is characterized in that the DGS plot shape includes：With institute
Target cabling is stated in the upright projection of the first reference layer first c-type structure symmetrical for symmetry axis and the second c-type knot
Structure,
Wherein, the opening of the opening and the second c-type structure of the first c-type structure is oppositely arranged, the first c-type structure
It is connected with the second c-type structure by connecting line, the connecting line hanging down in first reference layer with the target cabling
It is vertical to deliver directly shadow.
8. DGS wave filters according to any one of claims 1-5, which is characterized in that the DGS plot shape includes the first G
Type structure and the 2nd G type structures, the first G types structure using the target cabling first reference layer upright projection as
Symmetry axis is symmetrical, and second U-shaped structure using the target cabling first reference layer upright projection as pair
Claim axial symmetry distribution；
Wherein, the opening of the opening and the 2nd G type structures of the first G type structures is oppositely arranged.
9. the DGS wave filters according to any one of claim 1-8, which is characterized in that the target cabling is differential lines
Or single cabling.
10. a kind of printed circuit board, which is characterized in that the printed circuit board is included as described in any one of claim 1-9
DGS wave filters.
11. a kind of filter, which is characterized in that the filter includes printed circuit board as claimed in claim 10.
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| CN201611207733.8A CN108242582B (en) | 2016-12-23 | 2016-12-23 | A kind of DGS filter, printed circuit board and filter |
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| CN201611207733.8A CN108242582B (en) | 2016-12-23 | 2016-12-23 | A kind of DGS filter, printed circuit board and filter |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111342178A (en) * | 2020-03-17 | 2020-06-26 | 电子科技大学 | Dielectric integrated defected ground structure device, filter and communication system |
| CN113497637A (en) * | 2020-04-03 | 2021-10-12 | 株式会社村田制作所 | High-frequency module, high-frequency circuit, and communication device |
| CN113497636A (en) * | 2020-04-03 | 2021-10-12 | 株式会社村田制作所 | High-frequency module and communication device |
| WO2022127594A1 (en) * | 2020-12-18 | 2022-06-23 | 青岛海信宽带多媒体技术有限公司 | Optical module |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM312785U (en) * | 2006-11-20 | 2007-05-21 | Weng Min Hang | Planar filter with the defected ground structure |
| KR101375581B1 (en) * | 2013-04-26 | 2014-03-18 | 한밭대학교 산학협력단 | Circuit element and method for tunable defected ground structure |
| CN105006618A (en) * | 2015-08-07 | 2015-10-28 | 南京理工大学 | LTCC-and-DGS-based miniature multi-path filter set |
| CN204793131U (en) * | 2015-07-01 | 2015-11-18 | 安徽大学 | Novel broadband band elimination filter based on DGS |
-
2016
- 2016-12-23 CN CN201611207733.8A patent/CN108242582B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM312785U (en) * | 2006-11-20 | 2007-05-21 | Weng Min Hang | Planar filter with the defected ground structure |
| KR101375581B1 (en) * | 2013-04-26 | 2014-03-18 | 한밭대학교 산학협력단 | Circuit element and method for tunable defected ground structure |
| CN204793131U (en) * | 2015-07-01 | 2015-11-18 | 安徽大学 | Novel broadband band elimination filter based on DGS |
| CN105006618A (en) * | 2015-08-07 | 2015-10-28 | 南京理工大学 | LTCC-and-DGS-based miniature multi-path filter set |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111342178A (en) * | 2020-03-17 | 2020-06-26 | 电子科技大学 | Dielectric integrated defected ground structure device, filter and communication system |
| CN111342178B (en) * | 2020-03-17 | 2021-11-30 | 电子科技大学 | Dielectric integrated defected ground structure device, filter and communication system |
| CN113497637A (en) * | 2020-04-03 | 2021-10-12 | 株式会社村田制作所 | High-frequency module, high-frequency circuit, and communication device |
| CN113497636A (en) * | 2020-04-03 | 2021-10-12 | 株式会社村田制作所 | High-frequency module and communication device |
| US11533806B2 (en) | 2020-04-03 | 2022-12-20 | Murata Manufacturing Co., Ltd. | High-frequency module, high-frequency circuit, and communication device |
| US11831299B2 (en) | 2020-04-03 | 2023-11-28 | Murata Manufacturing Co., Ltd. | High-frequency module and communication device |
| WO2022127594A1 (en) * | 2020-12-18 | 2022-06-23 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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