CN108242406B - Cavity, plastic package body and adhesion detection method - Google Patents
Cavity, plastic package body and adhesion detection method Download PDFInfo
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- CN108242406B CN108242406B CN201611230301.9A CN201611230301A CN108242406B CN 108242406 B CN108242406 B CN 108242406B CN 201611230301 A CN201611230301 A CN 201611230301A CN 108242406 B CN108242406 B CN 108242406B
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- 239000004033 plastic Substances 0.000 title claims abstract description 100
- 238000001514 detection method Methods 0.000 title claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 152
- 239000011347 resin Substances 0.000 claims abstract description 152
- 239000000853 adhesive Substances 0.000 claims abstract description 43
- 230000001070 adhesive effect Effects 0.000 claims abstract description 43
- 230000032798 delamination Effects 0.000 claims description 36
- 238000004806 packaging method and process Methods 0.000 claims description 11
- 238000000926 separation method Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 25
- 239000004065 semiconductor Substances 0.000 abstract description 13
- 239000000758 substrate Substances 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000012858 packaging process Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000002604 ultrasonography Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N19/00—Investigating materials by mechanical methods
- G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
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- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
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- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The application provides a cavity, a plastic package body and a bonding force detection method. In the application, the cavity is used for preparing a plastic package body with a resin bulge part by taking a lead frame as a substrate; the bottom of the cavity is provided with a groove for accommodating resin and a resin bulge formed by the resin and a channel communicated with the groove and used for guiding the resin to the groove, the bottom of the cavity is also provided with a support body for supporting the lead frame, and the support body is provided with a pouring gate communicated with the channel. The method and the device can scientifically and reasonably determine the adhesive force between the resin on the plastic package body and the lead frame, further can quantitatively judge the adhesive degree between the lead frame and the resin lug boss of the plastic package body, and can be used as a means for detecting the adhesive force of the semiconductor plastic package body.
Description
Technical Field
The application relates to the technical field of semiconductor packaging, in particular to a cavity, a plastic package body and a bonding force detection method.
Background
In the semiconductor subsequent packaging process, the lead frame is an essential material for packaging the integrated circuit, and is used as a chip carrier of the integrated circuit to perform the function of conducting connection with the outside, so that the lead frame is required to have high reliability in addition to excellent electric conductivity, heat conductivity, mechanical property, oxidation resistance and corrosion resistance.
When packaging a semiconductor, an epoxy resin is generally used for packaging, and the magnitude of the adhesive force at the interface between the epoxy resin and the lead frame affects the reliability of an IC (Integrated Circuit) and a discrete device to some extent. However, there is no technical means for detecting the magnitude of the adhesive force at the interface of the epoxy resin and the lead frame in the related art.
Disclosure of Invention
In view of the above, embodiments of the present disclosure provide a cavity, a plastic package body and an adhesion detection method for detecting adhesion between a resin of a semiconductor plastic package body and a lead frame.
Some embodiments of the present invention provide a mold cavity for manufacturing a plastic package body having a resin protrusion part using a lead frame as a base, wherein,
the bottom of the cavity is provided with a groove for accommodating resin and the resin boss formed by the resin, and a channel communicated with the groove and used for guiding the resin to the groove, the bottom of the cavity is also provided with a support body for supporting the lead frame, and the support body is provided with a pouring gate communicated with the channel.
In one embodiment of the present application, the bottom surface of the groove may have a first square shape, and the opening of the groove may have a second square shape having a side length greater than that of the first square shape.
In one embodiment of the present application, the slope of the side walls of the groove may be 10 °.
In one embodiment of the present application, the second square may have a side length in a range of 1.5 mm to 2.5 mm.
The embodiment of the application also provides a plastic package body which is prepared by the cavity; the plastic package body includes a lead frame as a base body and the resin boss adhered to the lead frame.
Some embodiments of the present application further provide an adhesion detection method for detecting adhesion between the lead frame and the resin protrusion of the plastic package body, the adhesion detection method includes:
placing the plastic package body on a test board of a thrust machine; wherein one side of the resin bulge part on the plastic package body faces upwards;
the push knife of the push machine takes one side of the resin bulge part as a force application surface and applies push force towards the other opposite side of one side of the resin bulge part; during the application of the pushing force, the value of the pushing force continuously increases from 0 until the pushing blade pushes the resin convex part away from the lead frame;
the pushing force when the pushing blade pushes the resin protrusion away from the lead frame is obtained as the adhesive force.
In one embodiment of the present application, the method may further comprise:
and when the value of the adhesive force is lower than or equal to a first preset threshold value, judging that a separation layer exists between the lead frame and the resin convex part.
In one embodiment of the present application, the method may further comprise:
acquiring ultrasonic instrument scanning images of a set number of plastic packaging bodies and the adhesive force between the lead frame and the resin convex part of each plastic packaging body;
acquiring the ratio of the area of a delamination image between the lead frame and the resin convex part in an ultrasonic instrument scanning image of each plastic package body to the area of the ultrasonic instrument scanning image;
finding out a plastic package body with the ratio of the area of the delamination image to the area of the ultrasonic instrument scanning image equal to a second threshold value as the plastic package body with the delamination;
and taking the value of the adhesive force between the lead frame and the resin convex part of the plastic package body with the separation layer as the first preset threshold value.
The embodiment of the application achieves the main technical effects that: by preparing the plastic package body with the resin convex part and using the resin convex part as a force applying surface for a thrust test, the adhesive force data between the lead frame and the resin convex part of the plastic package body can be obtained through the thrust test, and the adhesive degree between the lead frame and the resin convex part of the plastic package body can be quantitatively judged. The method and the device can scientifically and reasonably determine the bonding force between the resin on the plastic package body and the lead frame, and can quantitatively judge the bonding degree between the lead frame and the resin lug boss of the plastic package body.
Further, whether or not there is delamination between the lead frame of the resin projection portion of the molded body and the resin projection portion can be determined based on the thrust test data, and since the resin projection portion is a component of the resin adhered to the molded body, it can be determined whether or not there is delamination of the resin on the molded body. The method can scientifically and reasonably judge whether the layering exists between the resin and the lead frame in actual use, can be used as a means for layering detection of the semiconductor plastic package body, and improves the accuracy of the layering detection of the semiconductor plastic package body.
Drawings
FIG. 1 is a top view of a mold cavity according to an embodiment of the present disclosure;
FIG. 2 is a side view of a mold cavity shown in an embodiment of the present application;
fig. 3 is a bottom view of a plastic package body according to an embodiment of the present application;
FIG. 4 is a top view of a mold cavity assembly according to an embodiment of the present disclosure;
fig. 5 is a bottom view of a plastic package assembly according to an embodiment of the present application;
FIG. 6 is a schematic diagram illustrating a thrust test according to an embodiment of the present application;
fig. 7 is a flowchart of a method for detecting adhesion according to a third embodiment of the present application;
fig. 8 is a flowchart illustrating a method for detecting adhesion according to the fourth embodiment of the present application;
fig. 9 is a flowchart illustrating a fourth embodiment of the present application for determining the first preset threshold.
DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
It is to be understood that although the terms first, second, third, etc. may be used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present application. The word "if" as used herein may be interpreted as "at … …" or "when … …" or "in response to a determination", depending on the context.
Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.
Example one
Referring to fig. 1 to 6, a cavity 1 according to an embodiment of the present application is used for preparing a plastic package body 2 having a resin protrusion 22 by using a lead frame 24 as a substrate, and the plastic package body 2 is used for implementing a thrust test by using a side of the resin protrusion 22 as a force application surface of a thrust machine and a thrust machine (not shown).
The bottom of the cavity 1 is provided with a groove 11 for accommodating resin and a resin boss 22 formed by the resin and a channel 12 communicated with the groove 11 and used for guiding the resin to the groove 11, the bottom of the cavity 1 is also provided with a support body 13 for supporting a lead frame 24, and the support body 13 is provided with a pouring gate (not shown) communicated with the channel 12.
In this embodiment, the bottom surface of the groove 11 may be in the shape of a first square, the opening of the groove 11 may be in the shape of a second square, and the side length of the second square is greater than the side length of the first square. That is, the side walls of the groove 11 are inclined. In the present embodiment, the slope of the side wall of the groove 11 may be 10 °. Thus, the resin boss 22 is prepared as a trapezoidal body having a trapezoidal section along the central axis, as shown in FIG. 6.
In practical applications, the side length of the second square may range from 1.5 mm to 2.5 mm. Preferably, the second square has a side of 2 mm. Thus, when the thrust test is carried out, the push knife 61 of the thrust machine can apply the thrust conveniently, and stable thrust data can be obtained.
Referring to fig. 3, the single plastic package body 2 prepared by using the cavity 1 includes a lead frame 24, a resin protrusion 22, a first resin portion 21, and a second resin portion 23 as a base; wherein the first resin portion 21 is formed by adhering the resin in the channel 12 to the lead frame 24, and the shape of the first resin portion 21 is the same as that of the channel 12. The second resin portion 23 is formed by adhering resin outside the cavity 1 to the lead frame 24.
In practice, the cavity assembly 3 is generally prepared by repeating the cavity 1 as a unit, wherein the direction of the channels 12 is different, for example, the direction of the channels 12 of adjacent cavities 1 is axisymmetric. In this way, a plurality of assemblies 4 of the plastic package body 2 can be prepared by using the cavity assembly 3 and the assembly of the lead frame 24, so that the plastic package body 2 prepared under the same process condition can be repeatedly subjected to the thrust test to ensure the reliability of the thrust test.
In addition, it should be noted that, since the cavity 1 can replace the cavity on the packaging production line, the adhesion between the resin and the lead frame of the packaging product on the current packaging production line can be known at any time, and the delamination condition can also be known according to the adhesion.
By using the technical scheme, the influence of the lead frames in the same batch on the adhesive force of the resin and the lead frames (such as different oxidation degrees in the process) under different packaging process conditions can be known. Specifically, the lead frames in the same batch are used as a base body, a plastic package body is prepared on production lines of different packaging processes by utilizing a cavity, a thrust test is carried out, the adhesive force between resin and the lead frames is detected, and specifically, when the value of the adhesive force is lower than or equal to a first preset threshold value, the separation layer between the lead frames and the resin lug bosses is judged.
By using the technical scheme in the application, the difference of lead frames in different batches under the same process can be known, and effective data can be provided for follow-up lead frame manufacturers. Specifically, different batches of lead frames are used as substrates, the plastic package bodies are prepared on a production line of the same packaging process by utilizing the cavities, a thrust test is carried out, the obtained thrust data are compared, and the difference of the adhesive force between the resin for preparing the plastic package bodies by using the different batches of lead frames in the same process and the lead frames is further obtained.
By utilizing the technical scheme in the application, the difference of the adhesive force between the resins of different manufacturers can be judged uniformly. Specifically, the same batch of lead frames are used as a base body, resins of different manufacturers are used, a plastic package body is prepared on a production line of the same packaging process by utilizing a cavity, a thrust test is carried out, and the obtained thrust data are compared, so that the difference of the adhesive force between the resins of different manufacturers is obtained.
By utilizing the technical scheme in the application, the type selection of the resin can be judged. Specifically, the lead frames in the same batch are used as a base body, different types of resins are used, the plastic package bodies are prepared on a production line of the same packaging process by utilizing the cavities, a thrust test is carried out, the obtained thrust data are compared, and the difference of the adhesive force between the resin of the plastic package bodies packaged by the different types of resins and the lead frames is further obtained.
The embodiment of the application achieves the main technical effects that: by preparing the plastic package body with the resin convex part and using the resin convex part as a force applying surface for a thrust test, the adhesive force data between the lead frame and the resin convex part of the plastic package body can be obtained through the thrust test, and the adhesive degree between the lead frame and the resin convex part of the plastic package body can be quantitatively judged. The method and the device can scientifically and reasonably determine the bonding force between the resin on the plastic package body and the lead frame, and can quantitatively judge the bonding degree between the lead frame and the resin lug boss of the plastic package body.
Further, whether or not there is delamination between the lead frame of the resin projection portion of the molded body and the resin projection portion can be determined based on the thrust test data, and since the resin projection portion is a component of the resin adhered to the molded body, it can be determined whether or not there is delamination of the resin on the molded body. The method can scientifically and reasonably judge whether the layering exists between the resin and the lead frame in actual use, can be used as a means for layering detection of the semiconductor plastic package body, and improves the accuracy of the layering detection of the semiconductor plastic package body.
Example two
Referring to fig. 3, in accordance with the first embodiment, a second embodiment of the present application further provides a plastic package body 2 prepared from the cavity 1; the plastic package body 2 includes a lead frame 24 as a base body and a resin bump 22 adhered to the lead frame; the plastic package body 2 is used for matching the thrust machine with the thrust machine by taking one side of the resin convex part 22 as a force application surface of the thrust machine so as to realize a thrust test.
The embodiment of the application achieves the main technical effects that: since the plastic package body is provided with the resin convex part, one side of the resin convex part can be used as a force applying surface for a thrust test, the adhesive force data between the lead frame and the resin convex part of the plastic package body can be obtained through the thrust test, and the adhesive degree between the lead frame and the resin convex part of the plastic package body can be quantitatively judged. The method and the device can scientifically and reasonably determine the bonding force between the resin on the plastic package body and the lead frame, and can quantitatively judge the bonding degree between the lead frame and the resin lug boss of the plastic package body.
Further, whether or not there is delamination between the lead frame of the resin projection portion of the molded body and the resin projection portion can be determined based on the thrust test data, and since the resin projection portion is a component of the resin adhered to the molded body, it can be determined whether or not there is delamination of the resin on the molded body. The method can scientifically and reasonably judge whether the layering exists between the resin and the lead frame in actual use, can be used as a means for layering detection of the semiconductor plastic package body, and improves the accuracy of the layering detection of the semiconductor plastic package body.
EXAMPLE III
Referring to fig. 6 to 7, corresponding to the first embodiment and the second embodiment, a third embodiment of the present application further provides a method for detecting adhesion, including the following steps 701 to 703:
in step 701, placing the plastic package body on a test board of a thrust machine; wherein, one side of the resin convex part on the plastic package body faces upwards.
In step 702, a push blade of a pushing machine applies a pushing force to one side of a resin convex part as a force application surface and to the other side opposite to the one side of the resin convex part; during the application of the pushing force, the value of the pushing force continues to increase from 0 until the pusher pushes the resin boss away from the lead frame.
In step 703, a pushing force when the pusher pushes the resin bump away from the lead frame is obtained as an adhesive force.
With continued reference to fig. 6, one side of the resin protrusion 24 on the plastic package body faces upward, the push blade 61 of the push machine applies a pushing force to the other side of the resin protrusion opposite to the one side with the one side of the resin protrusion 22 as a force applying surface, and during the pushing force application, the value of the pushing force continuously increases from 0 until the push blade pushes the resin protrusion away from the lead frame, and the pushing force at this time is obtained as an adhesive force.
By using the technical scheme, the influence of the lead frames in the same batch on the adhesive force of the resin and the lead frames (such as different oxidation degrees in the process) under different packaging process conditions can be known. Specifically, the same batch of lead frames are used as a substrate, the plastic package body is prepared on production lines of different packaging processes by utilizing the cavity, a thrust test is carried out, and the adhesive force between the resin and the lead frames is detected.
By using the technical scheme in the application, the difference of lead frames in different batches under the same process can be known, and effective data can be provided for follow-up lead frame manufacturers. Specifically, different batches of lead frames are used as substrates, the plastic package bodies are prepared on a production line of the same packaging process by utilizing the cavities, a thrust test is carried out, the obtained thrust data are compared, and the difference of the adhesive force between the resin for preparing the plastic package bodies by using the different batches of lead frames in the same process and the lead frames is further obtained.
By utilizing the technical scheme in the application, the difference of the adhesive force between the resins of different manufacturers can be judged uniformly. Specifically, the same batch of lead frames are used as a base body, resins of different manufacturers are used, a plastic package body is prepared on a production line of the same packaging process by utilizing a cavity, a thrust test is carried out, and the obtained thrust data are compared, so that the difference of the adhesive force between the resins of different manufacturers is obtained.
By utilizing the technical scheme in the application, the type selection of the resin can be judged. Specifically, the lead frames in the same batch are used as a base body, different types of resins are used, the plastic package bodies are prepared on a production line of the same packaging process by utilizing the cavities, a thrust test is carried out, the obtained thrust data are compared, and the difference of the adhesive force between the resin of the plastic package bodies packaged by the different types of resins and the lead frames is further obtained.
The embodiment of the application achieves the main technical effects that: the plastic package body with the resin lug boss prepared by the cavity is used as a force applying surface for a thrust test, so that the adhesive force between the lead frame and the resin lug boss of the plastic package body can be obtained through the thrust test, and the adhesive degree between the lead frame and the resin lug boss of the plastic package body can be quantitatively judged. The method and the device can scientifically and reasonably determine the bonding force between the resin on the plastic package body and the lead frame, and can quantitatively judge the bonding degree between the lead frame and the resin lug boss of the plastic package body.
Example four
Referring to fig. 8 to 9, corresponding to the first embodiment and the second embodiment, a fourth embodiment of the present application further provides a method for detecting adhesion, including the following steps 801 to 804:
in step 801, placing the plastic package body on a test board of a thrust machine; wherein, one side of the resin convex part on the plastic package body faces upwards.
In step 802, a push blade of a push machine applies a pushing force toward the other side of the resin boss portion opposite to the one side of the resin boss portion, with the one side of the resin boss portion as a force application surface; during the application of the pushing force, the value of the pushing force continues to increase from 0 until the pusher pushes the resin boss away from the lead frame.
In step 803, a pushing force when the pusher pushes the resin bump away from the lead frame is obtained as an adhesive force.
In step 804, it is determined that there is a delamination between the lead frame and the resin bump when the value of the adhesive force is lower than or equal to a first preset threshold value. The first preset threshold may be determined according to the batch, manufacturer, and type of resin of the lead frame. Referring to fig. 9, the method for acquiring the first preset threshold may specifically include the following steps 901 to 904:
in step 901, an ultrasonic scanner scan image of a set number of molded bodies and an adhesive force between the lead frame and the resin convex portion of each molded body are acquired.
In step 902, a ratio of an area of a delamination image between the lead frame and the resin bump in the ultrasonic scan image of each of the molded bodies to an area of the ultrasonic scan image is acquired.
In step 903, a plastic package body with a ratio of the area of the delamination image to the area of the ultrasound scanning image equal to a second threshold is found out as the plastic package body with the delamination.
In step 904, the lowest value of the adhesive force between the lead frame and the resin bump of the plastic package body with the delamination is set as a first preset threshold value.
In one embodiment, ultrasonic scanning images of a plurality of molding bodies may be acquired and the adhesion between the lead frame and the resin bumps of each molding body measured, wherein the number of molding bodies is sufficient to cover the presence and absence of delamination between the lead frame and the resin bumps.
In one embodiment, the delamination image is different from the resin image and the delamination image is different from the leadframe image, such that the delamination image, the resin image and the leadframe image in the sonotrode scan image of the plastic package can be identified by image recognition techniques. After the delamination image, the resin image, and the lead frame image are identified, a ratio of an area of the delamination image between the lead frame and the resin bump in the ultrasonic scanner scan image and an area of the ultrasonic scanner scan image for obtaining each plastic package can be calculated.
In one embodiment, the greater the ratio of the area of the delamination image to the area of the ultrasound scan image, indicating that the space between the lead frame and the resin bumps may be greater, delamination may be present when the ratio of the area of the delamination image to the area of the ultrasound scan image is greater than a second threshold. Wherein the second threshold may be an empirical value. And the adhesive force between the lead frame and the resin convex part of the plastic package body, the ratio of the area of the delamination image to the area of the ultrasonic scanning image is equal to the second threshold value, is used as a first preset threshold value, so that whether delamination exists between the resin on the plastic package body and the lead frame can be judged according to the comparison result of the adhesive force between the lead frame and the resin convex part of the plastic package body and the first preset threshold value.
In one embodiment, a plastic package body with a ratio of an area of a plurality of delamination images to an area of an image scanned by an ultrasonic instrument equal to a second threshold may be found out as the plastic package body with the delamination, and in practical application, a lowest value of an adhesive force between a lead frame and a resin protrusion of the plurality of delamination plastic package bodies may be used as a first preset threshold, so that only the plastic package body with the adhesive force between the lead frame and the resin protrusion lower than the lowest value may be determined as the delamination, and a delamination determination result is more accurate.
On the basis of the technical effects of the third embodiment, the third embodiment can also determine whether delamination exists between the lead frame and the resin bump of the plastic package body according to the thrust test data, and further determine whether delamination exists in the resin on the plastic package body because the resin bump is a component of the resin adhered to the plastic package body. The method can scientifically and reasonably judge whether the layering exists between the resin and the lead frame in actual use, can be used as a means for layering detection of the semiconductor plastic package body, and improves the accuracy of the layering detection of the semiconductor plastic package body.
The above-described embodiments of the apparatus are merely illustrative, and the units described as separate parts may or may not be physically separate, and the parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the scheme of the application. One of ordinary skill in the art can understand and implement it without inventive effort.
The present invention is not intended to be limited to the particular embodiments shown and described, but is to be accorded the widest scope consistent with the principles and novel features herein disclosed.
Claims (1)
1. An adhesion detection method for detecting adhesion between a lead frame and a resin boss portion of a mold body including the lead frame as a base and the resin boss portion adhered to the lead frame, the adhesion detection method comprising:
placing the plastic package body on a test board of a thrust machine; wherein one side of the resin bulge part on the plastic package body faces upwards;
the push knife of the push machine takes one side of the resin bulge part as a force application surface and applies push force towards the other opposite side of one side of the resin bulge part; during the application of the pushing force, the value of the pushing force continuously increases from 0 until the pushing blade pushes the resin convex part away from the lead frame;
acquiring a pushing force when the pushing blade pushes the resin convex part away from the lead frame as the bonding force;
the adhesion detection method further comprises the following steps:
when the value of the adhesive force is lower than or equal to a first preset threshold value, judging that a separation layer exists between the lead frame and the resin convex part;
the adhesion detection method further comprises the following steps:
acquiring ultrasonic instrument scanning images of a set number of plastic packaging bodies and the adhesive force between the lead frame and the resin convex part of each plastic packaging body;
acquiring the ratio of the area of a delamination image between the lead frame and the resin convex part in an ultrasonic instrument scanning image of each plastic package body to the area of the ultrasonic instrument scanning image;
finding out a plastic package body with the ratio of the area of the delamination image to the area of the ultrasonic instrument scanning image equal to a second threshold value as the plastic package body with the delamination;
and taking the lowest value of the adhesive force between the lead frame and the resin convex part of the plastic package body with the separation layer as the first preset threshold value.
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| CN104111184A (en) * | 2013-04-17 | 2014-10-22 | 苏州住友电木有限公司 | Evaluation method of sealing performance, test piece used for evaluation, manufacturing mould and manufacturing method of the test piece |
| CN204575515U (en) * | 2015-05-22 | 2015-08-19 | 京隆科技(苏州)有限公司 | A kind of IC adhesion mechanism for testing |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104111184A (en) * | 2013-04-17 | 2014-10-22 | 苏州住友电木有限公司 | Evaluation method of sealing performance, test piece used for evaluation, manufacturing mould and manufacturing method of the test piece |
| CN204575515U (en) * | 2015-05-22 | 2015-08-19 | 京隆科技(苏州)有限公司 | A kind of IC adhesion mechanism for testing |
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