CN108229223B - Method and device for preventing electronic product from being disassembled - Google Patents
Method and device for preventing electronic product from being disassembled Download PDFInfo
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- CN108229223B CN108229223B CN201611160067.7A CN201611160067A CN108229223B CN 108229223 B CN108229223 B CN 108229223B CN 201611160067 A CN201611160067 A CN 201611160067A CN 108229223 B CN108229223 B CN 108229223B
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- G06—COMPUTING; CALCULATING OR COUNTING
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- G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
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Abstract
The invention relates to the field of electronic equipment, in particular to a method and a device for preventing disassembly operation of an electronic product, wherein the method comprises the steps of detecting the temperature of each preset detection point in the electronic product when the electronic product is determined to be in an operation state; judging whether the temperature of each detection point is abnormal or not according to the preset normal temperature of each detection point; wherein the normal temperature is the temperature when the electronic product is in an undetached operation state; when the abnormal temperature conditions of the detection points are determined to meet the preset protection conditions, the electronic product is judged to be in the disassembly operation state, and the electronic product is protected by adopting the preset protection measures, so that whether the electronic product is in the disassembly operation state can be judged by using a software algorithm only according to the temperature changes of the different detection points without adding any additional matching circuit or depending on any external physical connection or internal special hardware circuit based on the existing components of the electronic product, the realization is simple, and the realization cost is reduced.
Description
Technical Field
The invention relates to the field of electronic equipment, in particular to a method and a device for preventing electronic products from being disassembled and operated.
Background
After a new electronic product is marketed, a competitor is often subjected to disassembly analysis in order to obtain the technology in the aspect, so that manufacturers often set certain protection measures in order to protect their interests and do not want the competitor to easily disassemble and test their products. For example, the shell is linked with a switch, products are detected in place, communication signals with a monitoring system are confirmed, and once the set protection conditions are triggered, the products are determined to be in an abnormal operation state according to a control algorithm of the products, and self-locking protection can be adopted.
In the prior art, the anti-disassembly operation methods can be divided into the following two categories: 1) the reference signal must be provided by means of a physical connection outside the product, for example, monitoring, in-situ detection; 2) the reference signal is provided by means of its own hardware circuit, e.g. a cabinet ganged switch, a connection signal detected in place, etc.
Therefore, the anti-disassembly operation technology in the prior art needs to rely on external physical connection or a special hardware circuit, and the method which needs to rely on establishment of external input conditions increases the cost. Meanwhile, the anti-disassembly operation method in the prior art can input false in-place detection signals or false communication normal signals for deception, so that whether the electronic product is in the disassembly operation state or not can not be distinguished.
Disclosure of Invention
The embodiment of the invention provides a method and a device for preventing electronic products from being disassembled so as to further reduce the cost of the electronic products from being disassembled.
The embodiment of the invention provides the following specific technical scheme:
a method for preventing disassembly operation of an electronic product comprises the following steps:
when the electronic product is determined to be in the running state, detecting the temperature of each detection point preset in the electronic product;
judging whether the temperature of each detection point is abnormal or not according to the preset normal temperature of each detection point; the normal temperature is the temperature when the electronic product is in an undetached operation state;
and when the abnormal temperature condition of each detection point is determined to meet the preset protection condition, judging that the electronic product is in a disassembly operation state, and adopting a preset protection measure to protect the electronic product.
Preferably, the normal temperature of each detection point is determined according to a temperature set obtained when the electronic product is in an undetached operating state.
Preferably, the temperature set is obtained by actual detection; or the like, or, alternatively,
the temperature set is obtained by calculation according to preset operation parameters and a preset operation mode, wherein the operation parameters are any one or any combination of the following: ambient temperature, load conditions, input conditions.
Preferably, the determining whether the temperature of each of the detecting points is abnormal specifically includes:
and respectively comparing the detected temperature of each detection point with the normal temperature of each detection point, and when the detected temperature of any one and/or a plurality of detection points is determined to be different from the normal temperature of any one and/or a plurality of detection points, determining that the temperature of any one and/or a plurality of detection points is abnormal.
Preferably, when it is determined that the abnormal temperature condition at each detection point satisfies a preset protection condition, it is determined that the electronic product is in a disassembly operation state, and the method specifically includes:
if only one detection point exists, when the temperature of the detection point is determined to be abnormal, the electronic product is judged to be in a disassembly operation state; or the like, or, alternatively,
when the number of the detection points with abnormal temperature reaches a first preset threshold value, judging that the electronic product is in a disassembly operation state; or the like, or, alternatively,
and when the number of the detection points with abnormal temperature is determined to reach a second preset threshold value, and the number of the detection points with abnormal temperature is not less than a third preset threshold value, the electronic product is judged to be in a disassembly operation state.
Preferably, the preset protection measures are any one or a combination of the following measures: self-locking shutdown protection, and limitation of the operational capability or function of the product.
An electronic product disassembly operation prevention device comprises:
the detection unit is used for detecting the temperature of each detection point preset in the electronic product when the electronic product is determined to be in the running state;
the judging unit is used for judging whether the temperature of each detection point is abnormal or not according to the preset normal temperature of each detection point; the normal temperature is the temperature when the electronic product is in an undetached operation state;
and the processing unit is used for judging that the electronic product is in a disassembly operation state when the abnormal temperature condition of each detection point meets the preset protection condition, and adopting a preset protection measure to protect the electronic product.
Preferably, the normal temperature of each detection point is determined according to a temperature set obtained when the electronic product is in an undetached operating state.
Preferably, the temperature set is obtained by actual detection; or the like, or, alternatively,
the temperature set is obtained by calculation according to preset operation parameters and a preset operation mode, wherein the operation parameters are any one or any combination of the following: ambient temperature, load conditions, input conditions.
Preferably, when determining whether the temperature of each of the detecting points is abnormal, the determining unit is specifically configured to:
and respectively comparing the detected temperature of each detection point with the normal temperature of each detection point, and when the detected temperature of any one and/or a plurality of detection points is determined to be different from the normal temperature of any one and/or a plurality of detection points, determining that the temperature of any one and/or a plurality of detection points is abnormal.
Preferably, when it is determined that the abnormal temperature condition at each detection point satisfies a preset protection condition and it is determined that the electronic product is in a disassembly operation state, the processing unit is specifically configured to:
if only one detection point exists, when the temperature of the detection point is determined to be abnormal, the electronic product is judged to be in a disassembly operation state; or the like, or, alternatively,
when the number of the detection points with abnormal temperature reaches a first preset threshold value, judging that the electronic product is in a disassembly operation state; or the like, or, alternatively,
and when the number of the detection points with abnormal temperature is determined to reach a second preset threshold value, and the number of the detection points with abnormal temperature is not less than a third preset threshold value, the electronic product is judged to be in a disassembly operation state.
Preferably, the preset protection measures are any one or a combination of the following measures: the self-locking shutdown protection can limit the operation capacity or function of the electronic product.
In the embodiment of the invention, when the electronic product is determined to be in the running state, the temperature of each preset detection point in the electronic product is detected; judging whether the temperature of each detection point is abnormal or not according to the preset normal temperature of each detection point; the normal temperature is the temperature when the electronic product is in an undetached operation state; when the abnormal temperature conditions of the detection points are determined to meet the preset protection conditions, the electronic product is judged to be in a disassembly operation state, and the electronic product is protected by adopting the preset protection measures, so that whether the electronic product is in the disassembly operation state can be judged by using a software algorithm only according to the temperature change of different detection points without adding any additional supporting circuit or depending on any external physical connection or internal special hardware circuit on the basis of the existing components of the electronic product, the disassembly operation prevention protection of the electronic product is further realized, in addition, the temperature data is not a specially added parameter but is an inherent working parameter of the electronic product, the realization difficulty is further reduced, and the realization cost is reduced.
Drawings
FIG. 1 is a flow chart of a method for preventing electronic products from being disassembled in the embodiment of the invention;
FIG. 2 is a schematic diagram illustrating a mapping relationship between different ambient temperatures and temperatures of detection points according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of an electronic product according to an embodiment of the invention;
FIG. 4 is a schematic diagram of an internal structure of an electronic product according to an embodiment of the invention;
FIG. 5 is a diagram illustrating an internal temperature simulation distribution of an electronic product in an undetached operating state according to an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of an electronic product according to an embodiment of the present invention, in which an upper cover of the electronic product is opened in half;
FIG. 7 is a diagram illustrating an internal temperature simulation distribution of an electronic product in an operating state where the upper cover is half opened according to an embodiment of the present invention;
FIG. 8 is a schematic structural diagram illustrating an electronic product with a fully opened top cover according to an embodiment of the present invention;
FIG. 9 is a diagram illustrating an internal temperature simulation distribution of an electronic product in an operating state where an upper cover is fully opened according to an embodiment of the present invention;
FIG. 10 is a side view of an electronic product in an undetached operating state according to an embodiment of the present invention;
fig. 11 is a simulation diagram of the wind speed at the air outlet at the tail of an electronic product in an undetached operating state according to the embodiment of the invention;
FIG. 12 is a side view of an electronic product in an operating state where the upper cover is half opened according to an embodiment of the present invention;
fig. 13 is a simulation diagram of the wind speed at the air outlet at the tail of an electronic product in an operating state where the upper cover is half opened according to the embodiment of the present invention;
FIG. 14 is a side view of an electronic product in an operating state with the top cover fully opened according to an embodiment of the present invention;
fig. 15 is a simulation diagram of the wind speed at the air outlet at the tail of an electronic product in the operating state where the upper cover is fully opened according to the embodiment of the present invention;
fig. 16 is a schematic structural diagram of an apparatus for preventing electronic products from being disassembled in the embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to further reduce the cost of the electronic product disassembly prevention operation technology, in the embodiment of the invention, the temperature of each preset detection point in the electronic product is obtained, whether the temperature of each detection point is abnormal or not is judged according to the temperature of each preset detection point in the undetached operation state of the electronic product, whether the electronic product is in the disassembly operation state or not is determined, and then the electronic product is protected by adopting a preset protection measure without depending on any external physical connection or adding a special hardware design, so that the cost is reduced.
The present invention will be described in detail with reference to specific examples, but it is to be understood that the present invention is not limited to the examples.
It should be noted that, in practice, the anti-disassembly operation method of the electronic product generally needs to rely on external physical connection or a dedicated hardware circuit thereof, which increases the cost, and in the embodiment of the present invention, the cost does not need to be additionally increased, and whether the electronic product is in an undetached operation state or a disassembled operation state is determined based on a software algorithm, so as to implement protection of the electronic product, therefore, the electronic product in the embodiment of the present invention needs to have the following basic conditions:
1) software control is contained, and pure hardware is not suitable.
2) The electronic product has an obvious shell, and the air cooling natural cooling is not limited.
3) When the electronic product operates, the operation management needs to be carried out by referring to the ambient temperature and the temperature of the internal elements or the internal space parts.
Referring to fig. 1, in the embodiment of the present invention, a specific flow of a method for preventing an electronic product from being disassembled is as follows:
step 100: and when the electronic product is determined to be in the running state, detecting the temperature of each preset detection point in the electronic product.
In practice, in the case of an undetached operation of an electronic product, the mapping relationship between the ambient temperature (for example, point a) and the temperatures of the respective elements or the respective spatial portions in the electronic product (for example, any one of them is point B) is known, and for example, when point a is 25 degrees, the temperature range of point B is 30 degrees to 90 degrees, that is, when point a is 25 degrees, the temperature of point B is determined to be 30 degrees to 90 degrees, and when the temperature of point B is detected to be 50 degrees, the temperature of point B does not change when the operating conditions, the operating load, and the like of the electronic product are not changed. When the electronic product is disassembled, that is, the casing of the electronic product is opened and then operated, the heat dissipation condition of the electronic product will change significantly, for example, when the temperature of the point a is 25 degrees, the temperature range of the point B will probably change to 30 to 70 degrees, that is, the temperature of the point B will change, exactly, for each determined operation state, the temperature of the point B will change when the casing is complete and the casing is removed, for example, when the casing is present, the temperature of the point B is known to be 50 degrees, the casing is removed, and the temperature of the point B becomes 60 degrees. I.e. under certain operating conditions, the temperature at point B is no longer known 50 degrees.
Therefore, in the embodiment of the invention, whether the electronic product is in a disassembly operation state can be judged according to whether the temperature of the currently detected point B is consistent with the recorded normal temperature of the point B, and further corresponding protective measures can be taken.
The preset detection points can be temperature measurement points when the electronic product runs or temperature measurement points newly added by a user according to requirements.
In addition, the number of each preset detection point is not limited in the embodiment of the present invention, and may be set according to actual situations, and may be one or multiple, preferably, in order to further improve the accuracy of the subsequent determination of whether the electronic product is in the disassembly state, a plurality of existing detection points of the electronic product itself are utilized, for example, 4 detection points are utilized, which are respectively the point a, the point B, the point C, and the point D.
This is because, if the electronic product cannot normally operate under a fault condition, the temperature of the point B is likely not to change no matter whether the electronic product is opened or not, that is, whether the electronic product is disassembled or not, but the temperature of the point C is detected to be different as long as the electronic product still has the point C which works locally, and the judgment can be performed according to the temperature change of the point C, so that the judgment accuracy can be improved by setting a plurality of detection points.
Of course, if all circuits in the electronic product do not work, the electronic product does not need to be protected, and in this case, the embodiment of the present invention may not be considered.
Step 110: judging whether the temperature of each detection point is abnormal or not according to the preset normal temperature of each detection point; the normal temperature is the temperature when the electronic product is in an undetached operation state.
When step 110 is executed, the method specifically includes:
first, the normal temperatures of the respective detection points are determined.
The preset normal temperature of each detection point is determined according to a temperature set obtained when the electronic product is in an undetached operation state.
The temperature set may be obtained in the following two ways:
the first mode is as follows: obtained by actual detection.
That is to say, in the embodiment of the present invention, when the housing of the electronic product is not disassembled, the normal temperature of each detection point in a certain operation state is directly obtained through actual detection.
For example, referring to fig. 2, a1, a2, … and An are different environmental temperatures, for example, 25 degrees, -40 degrees, … 45 degrees, B1, B2, … and B3 are ranges of normal temperatures of the point B at different environmental temperatures.
In the embodiment of the invention, the normal temperature of each detection point is obtained in advance through actual detection, and the obtained normal temperature of the point B under different environmental temperatures is stored, for example, in a certain determined operation state, when the temperature of a1 is 25 degrees, the temperature of B1 is 40 degrees, when the temperature of a2 is-40 degrees, the temperature of B2 is 10 degrees, and the like, so that when the current environmental temperature is 25 degrees, the normal temperature of the point B can be directly determined to be 40 degrees.
The second mode is as follows: and calculating according to preset operation parameters and a preset operation mode.
Wherein the operation parameter is any one or any combination of the following: ambient temperature, load conditions, input conditions.
Of course, in the embodiment of the present invention, the operation parameters are not limited to the above-mentioned several operation parameters, and may be selected and set according to actual situations.
For example, if the operation parameter is an ambient temperature and the operation mode is a mapping relationship between the ambient temperature and a normal temperature of the detection point, the operation parameter specifically includes: and obtaining the current ambient temperature according to the detected current ambient temperature and the mapping relation between the preset ambient temperature and the normal temperature of each detection point.
According to the first mode, the more data in the temperature set obtained by actual detection is stored, the more accurate the normal temperature of each detection point can be determined, but the more data to be stored is, and in practice, the normal temperature of the corresponding point B when the point a is 5 to 30 degrees is stored because general disassembly is usually performed indoors. However, in this case, the stored data certainly cannot include all the value-taking conditions of a, and therefore, the change rule may be obtained by statistics according to the stored data, the mapping relationship between the ambient temperature and the normal temperature of the detection point is obtained, and the normal temperature of the point B at different ambient temperatures is further calculated according to the mapping relationship.
For another example, if the operation parameter is a load condition and the operation manner is a mapping relationship between the load condition and a normal temperature of the detection point, the operation parameter specifically includes: and obtaining the load condition according to the detected current load condition and the mapping relation between the preset load condition and each detection point.
That is, the normal temperature of each detection point when the electronic product is under different load conditions, for example, the normal temperature of each detection point when the electronic product is under half load condition; and when the vehicle is fully loaded, the normal temperature of each detection point is calculated according to the determined mapping relation between the load condition and the detection point.
Then, judging whether the temperature of each detection point is abnormal, specifically:
and respectively comparing the detected temperature of each detection point with the normal temperature of each detection point, and determining that the temperature of any one and/or a plurality of detection points is abnormal when the detected temperature of any one and/or a plurality of detection points is determined to be different from the normal temperature of any one and/or a plurality of detection points.
It is to be noted that the normal temperature at which the comparison is made and the temperature of the currently detected detection point should be obtained under the same conditions except for the condition whether the electronic equipment is disassembled or not, in order to prevent erroneous judgment.
Furthermore, the temperature change of each detection point can be detected and judged by the software of the electronic product, and the temperature data of each detection point can be reported to the monitor for monitoring and judgment.
Step 120: and when the abnormal temperature condition of each detection point is determined to meet the preset protection condition, judging that the electronic product is in a disassembly operation state, and adopting a preset protection measure to protect the electronic product.
When the step 120 is executed, the method specifically includes:
firstly, when the abnormal temperature conditions of the detection points are determined to meet the preset protection conditions, the electronic product is judged to be in a disassembly operation state, and the method specifically comprises the following conditions:
in the first case: if only one detection point exists, when the temperature of the detection point is determined to be abnormal, the electronic product is judged to be in a disassembly operation state.
In the second case: and when the number of the detection points with abnormal temperature reaches a first preset threshold value, judging that the electronic product is in a disassembly operation state.
In the third case: and when the number of the detection points with abnormal temperature is determined to reach a second preset threshold value, and the number of the detection points with abnormal temperature is not less than a third preset threshold value, the electronic product is judged to be in a disassembly operation state.
For example, if there are 4 detection points, namely, a point a, a point B, a point C, and a point D, which are continuously detected 8 times, the second preset threshold is 2, and the third preset threshold is 5, and when the 8 detections are finished, if there are at least 5 detections, and the number of the detection points with abnormal temperature reaches 2, it is determined that the electronic product is in the disassembly operation state.
The values of the first preset threshold, the second preset threshold and the third preset threshold are not limited in the embodiment of the invention, and can be set according to actual requirements, so that the intelligence and flexibility of the anti-disassembly operation method of the electronic product are improved.
And then, adopting a preset protection measure to protect the electronic product.
Wherein, the preset protection measures are any one or combination of the following measures: the self-locking shutdown protection (i.e., locking up the electronic product) limits the operation capability or function of the electronic product.
For example, if the electronic product is in a stable operation state, 4 detection points, namely point a, point B, point C, and point D, are provided, the temperature of the detection points is detected at any time every day for 10 days, the second preset threshold is 3, and the third preset threshold is 5, then during each detection, if the temperature of the abnormal detection points reaches 3, the detection is recorded as 1 time, and if at least 5 times are recorded, it is determined that the electronic product is in a disassembly operation state, that is, the electronic product is in an open-shell operation state, then a self-locking protection is adopted, and the electronic product is locked.
For another example, if the electronic product is in a frequent power on/off state, 4 detection points, namely point a, point B, point C, and point D, are detected once the temperature of each detection point is detected when each power on exceeds a certain time, for example, half an hour, the second preset threshold value is 2, and the third preset threshold value is 3, then in each detection, if the number of detection points with abnormal temperature reaches 2, and in the 5 detections, the number of detection points with abnormal temperature reaches 3, it is determined that the electronic product is in a disassembly operation state, that is, the electronic product is in an open shell operation state, a self-locking protection is adopted, and the electronic product is locked.
The above embodiments are further described in detail below using a specific application scenario. The electronic product is taken as a power supply electronic product, and the electronic product is exemplified by a closed shell and air cooling and heat dissipation.
Fig. 3 is a schematic view of an external appearance of the electronic product, and fig. 4 is a schematic view of an internal structure of the electronic product.
In practice, when an electronic product is in operation, the operation state of the electronic product, such as output current limit, output power limit, etc., is adjusted according to the temperatures at A, B, C, D four detection points, so as to ensure that the electronic product is in a safe operation state, and the electronic product is not damaged due to high temperature.
1) Referring to fig. 5, a simulated distribution diagram of the internal temperature of the electronic product in the non-disassembled operating state (i.e. the operating state in which the housing is complete) is shown.
2) Fig. 6 is a schematic structural diagram illustrating that the upper cover of the electronic product is half opened under the same operating conditions, such as constant ambient temperature, constant workload, constant input/output signals, and the like;
fig. 7 is a diagram showing an internal temperature simulation distribution diagram obtained when the upper cover of the electronic product is half opened during power-on operation.
3) Fig. 8 is a schematic diagram illustrating that the upper cover of the electronic product is completely opened under the same operating conditions, for example, the ambient temperature is unchanged, the work load is unchanged, the input and output signals are unchanged, and the like;
referring to fig. 9, for the power-on operation, when the top cover of the electronic product is fully opened, the obtained internal temperature simulation distribution diagram is obtained.
As can be seen from the above simulation diagram, referring to table 1, in the above three cases, the temperature changes at A, B, C, D four detection points obtained by simulation, where point a is the ambient temperature and point B, C, D is the internal element or space of the electronic product.
TABLE 1 temperature Change at various inspection points under different operating conditions
| (degree centigrade) | A | B | C | D |
| Complete shell | 25 | 115 | 124 | 124 |
| Upper cover half opened | 25 | 110 | 124 | 134 |
| The upper cover is completely opened | 25 | 140 | 191 | 199 |
| Temperature difference | / | 5/25 | 0/67 | 10/75 |
As can be seen from fig. 5, fig. 7, fig. 9 and table 1, if the complete housing and the incomplete housing, i.e. the electronic product, are disassembled, the temperature of 3 detection points inside the electronic product is obviously changed, so that the change can be easily detected to determine whether the electronic product is in an open operating state.
Further, it can be seen from simulations that the main cause of the above temperature difference is the wind speed around the device changes due to the wind channel change, see fig. 10-15.
In which, 1) referring to fig. 10, a side wind velocity diagram of the electronic product in an undetached operating state (i.e., an operating state in which the housing is complete) is shown;
fig. 11 is a diagram showing a simulation diagram of the wind speed at the tail outlet of the electronic product in an undetached operating state (i.e., an operating state in which the housing is complete).
2) Referring to fig. 12, a side view of the electronic product when the top cover of the electronic product is half opened;
fig. 13 is a diagram showing a simulation of the wind speed at the air outlet at the tail of the electronic product when the upper cover of the electronic product is opened by half.
3) Referring to fig. 14, a side view of the electronic product when the top cover of the electronic product is fully opened;
referring to fig. 15, when the upper cover of the electronic product is completely opened, a wind speed simulation diagram of the tail air outlet of the electronic product is shown.
As can be seen from fig. 10 to fig. 15, the wind speeds at 3 detection points in the electronic product are also significantly changed when the complete housing and the incomplete housing, that is, the electronic product is disassembled, and therefore, in the embodiment of the present invention, the judgment on whether the electronic product is disassembled is not limited only according to the temperature change at each detection point in the electronic product, but also can be performed according to the wind speed change at each detection point in the electronic product, and the method in the embodiment of the present invention can also be adopted, and also belongs to the protection scope of the embodiment of the present invention.
Based on the above embodiments, referring to fig. 16, in an embodiment of the present invention, an apparatus for preventing an electronic product from being disassembled specifically includes:
the detection unit 20 is configured to detect the temperature of each detection point preset in the electronic product when it is determined that the electronic product is in an operating state;
a determining unit 21, configured to determine whether the temperature of each detection point is abnormal according to a preset normal temperature of each detection point; the normal temperature is the temperature when the electronic product is in an undetached operation state;
and the processing unit 22 is configured to determine that the electronic product is in a disassembly operation state when it is determined that the temperature abnormality at each detection point meets a preset protection condition, and protect the electronic product by using a preset protection measure.
Preferably, the normal temperature of each detection point is determined according to a temperature set obtained when the electronic product is in an undetached operating state.
Preferably, the temperature set is obtained by actual detection; or the like, or, alternatively,
the temperature set is obtained by calculation according to preset operation parameters and a preset operation mode, wherein the operation parameters are any one or any combination of the following: ambient temperature, load conditions, input conditions.
Preferably, when determining whether the temperature at each of the detecting points is abnormal, the determining unit 21 is specifically configured to:
and respectively comparing the detected temperature of each detection point with the normal temperature of each detection point, and when the detected temperature of any one and/or a plurality of detection points is determined to be different from the normal temperature of any one and/or a plurality of detection points, determining that the temperature of any one and/or a plurality of detection points is abnormal.
Preferably, when it is determined that the temperature abnormality at each of the detecting points satisfies a preset protection condition and it is determined that the electronic product is in a disassembly operation state, the processing unit 22 is specifically configured to:
if only one detection point exists, when the temperature of the detection point is determined to be abnormal, the electronic product is judged to be in a disassembly operation state; or the like, or, alternatively,
when the number of the detection points with abnormal temperature reaches a first preset threshold value, judging that the electronic product is in a disassembly operation state; or the like, or, alternatively,
and when the number of the detection points with abnormal temperature is determined to reach a second preset threshold value, and the number of the detection points with abnormal temperature is not less than a third preset threshold value, the electronic product is judged to be in a disassembly operation state.
Preferably, the preset protection measures are any one or a combination of the following measures: the self-locking shutdown protection can limit the operation capacity or function of the electronic product.
In summary, in the embodiments of the present invention, when it is determined that an electronic product is in an operating state, the temperature of each preset detection point in the electronic product is detected; judging whether the temperature of each detection point is abnormal or not according to the preset normal temperature of each detection point; the normal temperature is the temperature when the electronic product is in an undetached operation state; when the abnormal temperature conditions of the detection points are determined to meet the preset protection conditions, the electronic product is judged to be in a disassembly operation state, and the electronic product is protected by adopting the preset protection measures, so that whether the electronic product is in the disassembly operation state can be judged by using a software algorithm only according to the temperature change of different detection points without adding any additional supporting circuit or depending on any external physical connection or internal special hardware circuit on the basis of the existing components of the electronic product, the disassembly operation prevention protection of the electronic product is further realized, in addition, the temperature data is not a specially added parameter but is an inherent working parameter of the electronic product, the realization difficulty is further reduced, and the realization cost is reduced.
As will be appreciated by one skilled in the art, embodiments of the present invention may be provided as a method, system, or computer program product. Accordingly, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The present invention is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various modifications and variations can be made in the embodiments of the present invention without departing from the spirit or scope of the embodiments of the invention. Thus, if such modifications and variations of the embodiments of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to encompass such modifications and variations.
Claims (12)
1. A method for preventing disassembly operation of an electronic product is characterized by comprising the following steps:
when the electronic product is determined to be in a running state, detecting the temperature of each preset detection point in the electronic product, wherein the detection points are temperature measurement points when the electronic product runs, and the electronic product needs to be run and managed by referring to the ambient temperature and the temperature of an original or an internal space part in the electronic product when the electronic product runs;
judging whether the temperature of each detection point is abnormal or not according to the preset normal temperature of each detection point; the normal temperature is the temperature when the electronic product is in an undetached operation state;
and when the abnormal temperature condition of each detection point is determined to meet the preset protection condition, judging that the electronic product is in a disassembly operation state, and adopting a preset protection measure to protect the electronic product.
2. The method as claimed in claim 1, wherein the normal temperature of each detection point is determined according to a temperature set obtained when the electronic product is in an un-disassembled operation state.
3. The method of claim 2, wherein the set of temperatures is obtained by actual detection; or the like, or, alternatively,
the temperature set is obtained by calculation according to preset operation parameters and a preset operation mode, wherein the operation parameters are any one or any combination of the following: ambient temperature, load conditions, input conditions.
4. The method as claimed in claim 2, wherein determining whether the temperature at each of the detecting points is abnormal includes:
and respectively comparing the detected temperature of each detection point with the normal temperature of each detection point, and when the detected temperature of any one and/or a plurality of detection points is determined to be different from the normal temperature of any one and/or a plurality of detection points, determining that the temperature of any one and/or a plurality of detection points is abnormal.
5. The method according to claim 1, 2, 3 or 4, wherein when it is determined that the abnormal temperature condition at each detection point satisfies a preset protection condition, determining that the electronic product is in a disassembly operation state specifically comprises:
if only one detection point exists, when the temperature of the detection point is determined to be abnormal, the electronic product is judged to be in a disassembly operation state; or the like, or, alternatively,
when the number of the detection points with abnormal temperature reaches a first preset threshold value, judging that the electronic product is in a disassembly operation state; or the like, or, alternatively,
and when the number of the detection points with abnormal temperature is determined to reach a second preset threshold value, and the number of the detection points with abnormal temperature is not less than a third preset threshold value, the electronic product is judged to be in a disassembly operation state.
6. The method of claim 5, wherein the predetermined safeguard is any one or a combination of: the self-locking shutdown protection can limit the operation capacity or function of the electronic product.
7. The utility model provides an operation's device is prevented disassembling by electronic product which characterized in that includes:
the detection unit is used for detecting the temperature of each detection point preset in the electronic product when the electronic product is determined to be in the running state, wherein the detection points are temperature measurement points when the electronic product runs, and the electronic product needs to be run and managed by referring to the ambient temperature and the temperature of an internal original or an internal space part when the electronic product runs;
the judging unit is used for judging whether the temperature of each detection point is abnormal or not according to the preset normal temperature of each detection point; the normal temperature is the temperature when the electronic product is in an undetached operation state;
and the processing unit is used for judging that the electronic product is in a disassembly operation state when the abnormal temperature condition of each detection point meets the preset protection condition, and adopting a preset protection measure to protect the electronic product.
8. The apparatus of claim 7, wherein the normal temperature of each detection point is determined according to a set of temperatures obtained when the electronic product is in an un-disassembled operating state.
9. The apparatus of claim 8, wherein the set of temperatures is obtained by actual detection; or the like, or, alternatively,
the temperature set is obtained by calculation according to preset operation parameters and a preset operation mode, wherein the operation parameters are any one or any combination of the following: ambient temperature, load conditions, input conditions.
10. The apparatus according to claim 8, wherein when determining whether the temperature at each of the detecting points is abnormal, the determining unit is specifically configured to:
and respectively comparing the detected temperature of the detection points with the normal temperature of the detection points, and determining that the temperature of any one or more detection points is abnormal when the detected temperature of any one or more detection points is different from the normal temperature of any one or more detection points.
11. The apparatus according to claim 7, 8, 9 or 10, wherein when it is determined that the abnormal temperature at each of the detecting points satisfies a preset protection condition and it is determined that the electronic product is in a disassembly operation state, the processing unit is specifically configured to:
if only one detection point exists, when the temperature of the detection point is determined to be abnormal, the electronic product is judged to be in a disassembly operation state; or the like, or, alternatively,
when the number of the detection points with abnormal temperature reaches a first preset threshold value, judging that the electronic product is in a disassembly operation state; or the like, or, alternatively,
and when the number of the detection points with abnormal temperature is determined to reach a second preset threshold value, and the number of the detection points with abnormal temperature is not less than a third preset threshold value, the electronic product is judged to be in a disassembly operation state.
12. The apparatus of claim 11, wherein the predetermined safeguard is any one or a combination of the following: the self-locking shutdown protection can limit the operation capacity or function of the electronic product.
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| CN102597967A (en) * | 2009-08-06 | 2012-07-18 | 苹果公司 | System and method for accessing diagnostic information |
| CN103778392A (en) * | 2012-12-13 | 2014-05-07 | 深圳市证通电子股份有限公司 | Data safety device and temperature sensing circuit thereof |
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