CN108220714A - A kind of almag used for electronic packaging and preparation method thereof - Google Patents
A kind of almag used for electronic packaging and preparation method thereof Download PDFInfo
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- CN108220714A CN108220714A CN201711388593.3A CN201711388593A CN108220714A CN 108220714 A CN108220714 A CN 108220714A CN 201711388593 A CN201711388593 A CN 201711388593A CN 108220714 A CN108220714 A CN 108220714A
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- almag
- electronic packaging
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
- C22C21/06—Alloys based on aluminium with magnesium as the next major constituent
- C22C21/08—Alloys based on aluminium with magnesium as the next major constituent with silicon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
- C22C1/026—Alloys based on aluminium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/002—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working by rapid cooling or quenching; cooling agents used therefor
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
- C22F1/047—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys with magnesium as the next major constituent
Abstract
The present invention provides a kind of almags used for electronic packaging and preparation method thereof, are prepared using the following raw material：8 0.2 0.3 0.2 0.6 0.4 0.2 1.2 1.8wt% of 0.5wt%, V of 0.8wt%, Mn of 0.9wt%, Zr of 0.5wt%, Ti of 0.7wt%, Bi of 0.6wt%, Cr of 12wt%, Si of Mg, Sn0.4 1.2wt%, surplus Al.Compared with prior art, using Mg, Si, Cr, Bi, Ti, Zr, Mn, V, Sn, Al as raw material, each ingredient interaction influences each other the present invention, improves the mechanical property and wear-resisting property of the almag of preparation, is suitable as electronic package material use.
Description
Technical field
The present invention relates to almag technical field more particularly to a kind of almag used for electronic packaging and its preparation sides
Method.
Background technology
Automotive electronics is the assembly of electronic control device for vehicle and vehicular automotive electronic device, and automotive electronics is in automotive engineering
In occupy vital position, be exploitation new automobile, improve the most important technical measures of automotive performance.Due to automotive interior
There are extreme operating temperature range, strong mechanical oscillation and the adverse circumstances factors such as spot is more, it is to be ensured that automobile electricity
Sub- properties of product are interference-free, it is necessary to carry out the encapsulation work of product.Selected encapsulating material with realize industry it is lower into
The technology trends such as sheet, stronger function, higher reliability.
In the prior art, almag and preparation method thereof has obtained extensive report, for example, application No. is
201310485036.9 Chinese patent literature reports a kind of almag, the ingredient and weight hundred that the almag includes
Point ratio is：Magnesium 20%-35%, silicon 0.5%-0.8%, copper 0.5%-1%, zinc 0.01%-0.05%, manganese 0.1%-0.8%, iron
0.1%-0.5%, rhenium 0.1%-0.3%, titanium 0.01%-0.07%, nickel 0.01%-0.05%, chromium 0.01%-0.05%,
Remaining is aluminium and inevitable impurity；The density of the almag is 2-3kg/cm3, and thermal conductivity factor is 150- under room temperature
200W/M.k, tensile strength 270-350MPa.Chinese patent literature application No. is 201410243274.3 reports one kind
It is light-weight, the big lightweight almag of intensity.By the material composition of following weight percent：Mg：15-19%, Mn：1-1.2%,
Cu：0.2%th, Zn:0.1%th, Fe：0.1%th, Ti：0.08-0.09%, Si：0.2%；Remaining is Al and inevitable impurity.
The alloy is 2-3g/cm3 in the density of normal atmosphere pressure that room temperature is 4 DEG C.Thermal conductivity factor under the alloy at normal temperature is
140-210W/M.k.The tensile strength of the alloy is 270-350MPa.Application No. is 201611215191.9 Chinese patents
A kind of copper cladded aluminum-magnesium alloy wire of document report, including being located at the aluminum-magnesium alloy wire at center and be closely coated on aluminum-magnesium alloy wire
The layers of copper of outer surface, the volume of layers of copper account for the volume 10%-20% of aluminum-magnesium alloy wire, and the thickness of layers of copper is the half of aluminum-magnesium alloy wire
Diameter 3.8%-8.2%；Aluminum-magnesium alloy wire includes following components：Si0.01-0.05wt%, Fe0.05-0.15wt%, Mn0.04-
0.10wt%, Mg 0.85-1.00wt%, Cr0.02-0.08wt%, remaining is Al；Copper cladded aluminum-magnesium alloy wire passes through following step
It is rapid to obtain：The aluminium ingot that the trade mark is Al 99.7 is put into melting in shaft furnace, after aluminium water is filled it up in stove, is once skimmed, and
It when temperature of aluminum liquid reaches 780 DEG C, is transferred into holding furnace, puts aluminium water on one side, add in aluminum-boron alloy on one side, treat in holding furnace
Molten aluminum sequentially adds aluminum chromium, alumal, magnesium ingot after putting well.
But the almag of above-mentioned report is not appropriate for using as electronic package material.
Invention content
Present invention solves the technical problem that be to provide a kind of almag used for electronic packaging and preparation method thereof, intensity compared with
Height, and with good wear-resisting property.
In view of this, it the present invention provides a kind of almag used for electronic packaging, is prepared using the following raw material：Mg 8-
12wt%, Si 0.2-0.6wt%, Cr 0.3-0.7wt%, Bi 0.2-0.5wt%, Ti 0.6-0.9wt%, Zr 0.4-
0.8wt%, Mn 0.2-0.5wt%, V 1.2-1.8wt%, Sn 0.4-1.2wt%, surplus Al.
Preferably, Mg 8-10wt%.
Preferably, Si 0.4-0.6wt%.
Preferably, Cr 0.3-0.6wt%.
Preferably, Bi 0.3-0.5wt%.
Preferably, Ti 0.6-0.8wt%.
Preferably, Zr 0.5-0.8wt%.
Preferably, Mn 0.3-0.5wt%.
Preferably, V 1.2-1.5wt%.
Correspondingly, a kind of preparation side of the almag used for electronic packaging described in the present invention also provides above-mentioned technical proposal
Method includes the following steps：According to alloy ingredient add in raw material, using high frequency melting furnace, alloying element is melted, with 25 DEG C/
The cooling velocity of second casts the alloy, obtains ingot bar；3 hours are kept the temperature at 470 DEG C to the almag ingot bar of above-mentioned preparation, then
4 hours are kept the temperature at 590 DEG C, water quenching obtains almag used for electronic packaging.
The present invention provides a kind of almag used for electronic packaging and preparation method thereof, is prepared using the following raw material：Mg 8-
12wt%, Si 0.2-0.6wt%, Cr 0.3-0.7wt%, Bi 0.2-0.5wt%, Ti 0.6-0.9wt%, Zr 0.4-
0.8wt%, Mn 0.2-0.5wt%, V 1.2-1.8wt%, Sn 0.4-1.2wt%, surplus Al.Compared with prior art,
Using Mg, Si, Cr, Bi, Ti, Zr, Mn, V, Sn, Al as raw material, each ingredient interaction influences each other the present invention, improves system
The mechanical property and wear-resisting property of standby almag are suitable as electronic package material use.
Specific embodiment
For a further understanding of the present invention, the preferred embodiment of the invention is described with reference to embodiment, still
It should be appreciated that these descriptions are only for the feature and advantage that further illustrate the present invention rather than to the claims in the present invention
Limitation.
The embodiment of the invention discloses a kind of almags used for electronic packaging, are prepared using the following raw material：Mg 8-
12wt%, Si 0.2-0.6wt%, Cr 0.3-0.7wt%, Bi 0.2-0.5wt%, Ti 0.6-0.9wt%, Zr 0.4-
0.8wt%, Mn 0.2-0.5wt%, V 1.2-1.8wt%, Sn 0.4-1.2wt%, surplus Al.
Preferably, Mg 8-10wt%, Si 0.4-0.6wt%, Cr 0.3-0.6wt%, Bi 0.3-
0.5wt%, Ti 0.6-0.8wt%, Zr 0.5-0.8wt%, Mn 0.3-0.5wt%, V 1.2-1.5wt%.
Correspondingly, a kind of preparation side of the almag used for electronic packaging described in the present invention also provides above-mentioned technical proposal
Method includes the following steps：According to alloy ingredient add in raw material, using high frequency melting furnace, alloying element is melted, with 25 DEG C/
The cooling velocity of second casts the alloy, obtains ingot bar；3 hours are kept the temperature at 470 DEG C to the almag ingot bar of above-mentioned preparation, then
4 hours are kept the temperature at 590 DEG C, water quenching obtains almag used for electronic packaging.
The present invention provides a kind of almag used for electronic packaging and preparation method thereof, is prepared using the following raw material：Mg 8-
12wt%, Si 0.2-0.6wt%, Cr 0.3-0.7wt%, Bi 0.2-0.5wt%, Ti 0.6-0.9wt%, Zr 0.4-
0.8wt%, Mn 0.2-0.5wt%, V 1.2-1.8wt%, Sn 0.4-1.2wt%, surplus Al.Compared with prior art,
Using Mg, Si, Cr, Bi, Ti, Zr, Mn, V, Sn, Al as raw material, each ingredient interaction influences each other the present invention, improves system
The mechanical property and wear-resisting property of standby almag are suitable as electronic package material use.
For a further understanding of the present invention, technical solution provided by the invention is carried out specifically with reference to embodiment
Bright, protection scope of the present invention is not limited by the following examples.
Raw material used in the embodiment of the present invention is purchased in market.
Embodiment 1
A kind of almag used for electronic packaging is prepared using the raw material of following parts by weight：
Mg 8wt%, Si 0.6wt%, Cr 0.3wt%, Bi 0.5wt%, Ti 0.6wt%, Zr 0.8wt%, Mn
0.2wt%, V 0.8wt%, Sn 0.4wt%, surplus Al.
Raw material is added according to the ingredient of above-mentioned alloy, using high frequency melting furnace, alloying element is melted, with 25 DEG C/sec
Cooling velocity casts the alloy, obtains ingot bar；
3 hours are kept the temperature at 470 DEG C to the almag ingot bar of above-mentioned preparation, then keeps the temperature 4 hours at 590 DEG C, water quenching,
Obtain almag used for electronic packaging.
The performance of almag used for electronic packaging manufactured in the present embodiment is detected, bending strength 95MPa, 1000
Hour is without abrasion.
Embodiment 2
A kind of almag used for electronic packaging is prepared using the raw material of following parts by weight：
Mg 12wt%, Si 0.2wt%, Cr 0.7wt%, Bi 0.2wt%, Ti 0.9wt%, Zr 0.4wt%, Mn
0.5wt%, V 1.2wt%, Sn 1.2wt%, surplus Al.
Raw material is added according to the ingredient of above-mentioned alloy, using high frequency melting furnace, alloying element is melted, with 25 DEG C/sec
Cooling velocity casts the alloy, obtains ingot bar；
3 hours are kept the temperature at 470 DEG C to the almag ingot bar of above-mentioned preparation, then keeps the temperature 4 hours at 590 DEG C, water quenching,
Obtain almag used for electronic packaging.
The performance of almag used for electronic packaging manufactured in the present embodiment is detected, bending strength 94MPa, 1000
Hour is without abrasion.
Embodiment 3
A kind of almag used for electronic packaging is prepared using the raw material of following parts by weight：
Mg 10wt%, Si 0.4wt%, Cr 0.5wt%, Bi 0.3wt%, Ti 0.7wt%, Zr 0.6wt%, Mn
0.3wt%, V 1.5wt%, Sn 0.8wt%, surplus Al.
Raw material is added according to the ingredient of above-mentioned alloy, using high frequency melting furnace, alloying element is melted, with 25 DEG C/sec
Cooling velocity casts the alloy, obtains ingot bar；
3 hours are kept the temperature at 470 DEG C to the almag ingot bar of above-mentioned preparation, then keeps the temperature 4 hours at 590 DEG C, water quenching,
Obtain almag used for electronic packaging.
The performance of almag used for electronic packaging manufactured in the present embodiment is detected, bending strength 98MPa, 1000
Hour is without abrasion.
Embodiment 4
A kind of almag used for electronic packaging is prepared using the raw material of following parts by weight：
Mg 12wt%, Si 0.5wt%, Cr 0.4wt%, Bi 0.2wt%, Ti 0.8wt%, Zr 0.7wt%, Mn
0.4wt%, V 1.6wt%, Sn 0.5wt%, surplus Al.
Raw material is added according to the ingredient of above-mentioned alloy, using high frequency melting furnace, alloying element is melted, with 25 DEG C/sec
Cooling velocity casts the alloy, obtains ingot bar；
3 hours are kept the temperature at 470 DEG C to the almag ingot bar of above-mentioned preparation, then keeps the temperature 4 hours at 590 DEG C, water quenching,
Obtain almag used for electronic packaging.
The performance of almag used for electronic packaging manufactured in the present embodiment is detected, bending strength 98MPa, 1000
Hour is without abrasion.
Embodiment 5
A kind of almag used for electronic packaging is prepared using the raw material of following parts by weight：
Mg 11wt%, Si 0.3wt%, Cr 0.6wt%, Bi 0.4wt%, Ti 0.8wt%, Zr 0.5wt%, Mn
0.4wt%, V 1.6wt%, Sn 0.6wt%, surplus Al.
Raw material is added according to the ingredient of above-mentioned alloy, using high frequency melting furnace, alloying element is melted, with 25 DEG C/sec
Cooling velocity casts the alloy, obtains ingot bar；
3 hours are kept the temperature at 470 DEG C to the almag ingot bar of above-mentioned preparation, then keeps the temperature 4 hours at 590 DEG C, water quenching,
Obtain almag used for electronic packaging.
The performance of almag used for electronic packaging manufactured in the present embodiment is detected, bending strength 97MPa, 1000
Hour is without abrasion.
The explanation of above example is only intended to facilitate the understanding of the method and its core concept of the invention.It should be pointed out that pair
For those skilled in the art, without departing from the principle of the present invention, the present invention can also be carried out
Some improvements and modifications, these improvement and modification are also fallen within the protection scope of the claims of the present invention.
The foregoing description of the disclosed embodiments enables professional and technical personnel in the field to realize or use the present invention.
A variety of modifications of these embodiments will be apparent for those skilled in the art, it is as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and the principles and novel features disclosed herein phase one
The most wide range caused.
Claims (10)
1. a kind of almag used for electronic packaging, which is characterized in that prepared using the following raw material：
Mg 8-12wt%, Si 0.2-0.6wt%, Cr 0.3-0.7wt%, Bi 0.2-0.5wt%, Ti 0.6-0.9wt%,
Zr 0.4-0.8wt%, Mn 0.2-0.5wt%, V 1.2-1.8wt%, Sn 0.4-1.2wt%, surplus Al.
2. almag used for electronic packaging according to claim 1, which is characterized in that Mg 8-10wt%.
3. almag used for electronic packaging according to claim 1, which is characterized in that Si 0.4-0.6wt%.
4. almag used for electronic packaging according to claim 1, which is characterized in that Cr 0.3-0.6wt%.
5. almag used for electronic packaging according to claim 1, which is characterized in that Bi 0.3-0.5wt%.
6. almag used for electronic packaging according to claim 1, which is characterized in that Ti 0.6-0.8wt%.
7. almag used for electronic packaging according to claim 1, which is characterized in that Zr 0.5-0.8wt%.
8. almag used for electronic packaging according to claim 1, which is characterized in that Mn 0.3-0.5wt%.
9. almag used for electronic packaging according to claim 1, which is characterized in that V 1.2-1.5wt%.
10. a kind of preparation method of almag used for electronic packaging described in any one of claim 1-9, which is characterized in that
Include the following steps：
Raw material is added according to the ingredient of alloy, using high frequency melting furnace, alloying element is melted, with 25 DEG C/sec of cooling velocity
The alloy is cast, obtains ingot bar；
3 hours are kept the temperature at 470 DEG C to the almag ingot bar of above-mentioned preparation, then keeps the temperature 4 hours at 590 DEG C, water quenching obtains
Almag used for electronic packaging.
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| Application Number | Priority Date | Filing Date | Title |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711388593.3A CN108220714A (en) | 2017-12-20 | 2017-12-20 | A kind of almag used for electronic packaging and preparation method thereof |
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| CN106191581A (en) * | 2016-08-27 | 2016-12-07 | 来安县科来兴实业有限责任公司 | A kind of EMU gear case body dedicated aluminium alloy material |
| CN106854708A (en) * | 2017-01-11 | 2017-06-16 | 广东华昌铝厂有限公司 | The production method of conductor rail aluminium alloy extrusions |
-
2017
- 2017-12-20 CN CN201711388593.3A patent/CN108220714A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104313405A (en) * | 2014-10-14 | 2015-01-28 | 周欢 | Preparation method of corrosion-resistant aluminum alloy |
| CN104313406A (en) * | 2014-10-14 | 2015-01-28 | 周欢 | Corrosion-resistant aluminum alloy and preparation method thereof |
| CN105838940A (en) * | 2016-04-25 | 2016-08-10 | 深圳市喜德盛自行车有限公司 | Aluminum alloy material used for manufacturing bicycle frame and production process for aluminum alloy material |
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Application publication date: 20180629 |