CN108219741A - A kind of light organosilicon casting glue and preparation method thereof - Google Patents
A kind of light organosilicon casting glue and preparation method thereof Download PDFInfo
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- CN108219741A CN108219741A CN201810005082.7A CN201810005082A CN108219741A CN 108219741 A CN108219741 A CN 108219741A CN 201810005082 A CN201810005082 A CN 201810005082A CN 108219741 A CN108219741 A CN 108219741A
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- Prior art keywords
- parts
- casting glue
- light
- organosilicon casting
- light organosilicon
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention relates to polyurethane, polyureas technical fields, more particularly to a kind of light organosilicon casting glue and preparation method thereof, the light organosilicon casting glue of the present invention, using vinyl silicone oil, containing hydrogen silicone oil as basic sizing material, using glass hollow micro mist as volume filler, using aluminium nitride as heat filling, appropriate fire retardant, auxiliary agent etc. are equipped with, is prepared into light organosilicon heat conductive flame-retarding casting glue, product density is low, thermal conductivity is high, good flame resistance, good combination property meets market development demand.
Description
Technical field
The present invention relates to organosilicon technical fields, and in particular to a kind of light organosilicon casting glue and preparation method thereof.
Background technology
With new energy revolution, chemical energy source will slowly be eliminated, before and after many countries have announced the year two thousand thirty in the world
Stop the production and sales of fuel oil automobile.The energy carrier that dynamic lithium battery will rapidly become automobile, and dynamic lithium battery
There is the active demand constantly promoted than energy, how safely and effectively to promote the energy density of lithium battery, be lithium battery production enterprise
The industry task of top priority.
There is a different explorations in present each enterprise of lithium battery group process, but with regard to current technology development path from the point of view of,
Soft-package battery is gradually favored because its is light-weight, energy density is high, improved safety by most enterprise, how into one
The safety that step improves battery is more and more important.
But gap of the current soft-package battery in assembling between the fixation of battery pack and battery pack, mostly using stent
Screw is added to fix, then is filled with expanded material.This structure still remains larger security risk, specially:Stent adds screw
Larger pressure can be caused to battery pack fixed position, and corresponding position cannot be generated in battery pack thermal expansion when fixed
It moves, while battery pack is required to have very high mechanical property in bracket fixture portions position, otherwise will be difficult to reach good fixed effect.
The fixed another method of battery pack is solved at present completes sky simultaneously for traditional organic silicon potting adhesive embedding fixation
Gap is filled.This technique has good fixed effect, but traditional organic silicon potting adhesive is because of big (the generally 1.2-2.0g/ of density
cm3Left and right), it can cause battery weight that energy density decline is significantly increased in this way.Therefore, traditional organosilicon embedding how is solved
Glue causes battery weight to be significantly increased as a urgent problem to be solved.
Invention content
It is an object of the invention to be directed to problems of the prior art, a kind of light organosilicon casting glue is provided, it
With lighting (≤1.0g/cm3), the comprehensive performances such as excellent thermal conductivity or thermal insulation, anti-flammability and lighting.
Another object of the present invention is to provide a kind of preparation method of light organosilicon casting glue.
The purpose of the present invention is achieved through the following technical solutions:
A kind of light organosilicon casting glue, is mixed with by the component of following parts by weight:
As preference, the sizing includes the terminal hydroxy group of add-on type vinyl silicone oil, containing hydrogen silicone oil or condensed type
Any one in silicone oil and crosslinking agent or two or more mixtures.
Wherein, the light filler is less than 1.0g/cm for density3Light material.
As preference, the light filler is micro- including glass hollow micro mist, aluminium oxide hollow powder, silicon dioxide hollow
Powder, any one in cinder micro mist or two or more mixtures.
As preference, the heat filling includes appointing in silica, aluminium oxide, silicon nitride, aluminium nitride, beryllium nitride
The mixture for one or more of anticipating.
As another preferred, the heat filling includes silicon carbide or metal fine powder.
As preference, the thermal insulating filling includes diatom ooze, precipitated calcium carbonate, talcum powder, mica powder, epoxy resin
Powder, plastics micro mist, expanded material micro mist in any one or two or more mixtures.
As preference, the fire retardant include aluminium hydroxide, magnesium hydroxide, melamine, ammonium polyphosphate, phosphate,
Any one in decabromodiphenylethane, antimony oxide or two or more mixtures.
As preference, the auxiliary agent includes coupling agent, catalyst, inhibitor, anti-denaturant, reinforcing agent, structuring control
Any one in preparation or two or more mixtures.
A kind of preparation method of light organosilicon casting glue, step are as follows:
1) 20-80 parts of vinyl silicone oils, 10-60 parts of decabromodiphenylethane, 3-20 parts of antimony oxides are milled to fineness
It is spare as flame retardant intermediate less than 5um;
2) 20-70 parts of vinyl silicone oils, 1-20 parts of silane coupling agents, 5-60 parts of aluminium nitride are placed in kneader, 120
After the lower kneading of degree is agglomerating, vacuum kneading 2 hours is down to room temperature naturally in sealing, spare as heat conduction intermediate;
3) by 10-50 parts of vinyl silicone oils, 10-40 parts of fire-retardant intermediates, 0-50 parts of heat conduction intermediates, stir evenly,
Mix slowly it is lower 0-30 parts of glass hollow micro mists are slowly added to and stirred evenly in batches, add 0.1-3 parts of platinum catalysts, stir
It mixes uniformly, component A is made after vacuum defoamation;
4) 5-30 parts of vinyl silicone oils, 5-40 parts of fire-retardant intermediates, 0-50 parts of heat conduction intermediates are stirred evenly, at a slow speed
0-30 parts of glass hollow micro mists are slowly added to and stirred evenly in batches under stirring, add 2-10 parts of containing hydrogen silicone oils, 0.1-2 parts
Inhibitor stirs evenly, and B component is made after vacuum defoamation;
5) by the component A prepared and B component by weight 0.2-2:0.2-2 is uniformly mixed, and can be filled after vacuum defoamation
Note.
Relative to the prior art, beneficial effects of the present invention are:
The light organosilicon casting glue of the present invention, it is micro- with glass hollow using vinyl silicone oil, containing hydrogen silicone oil as basic sizing material
Powder is volume filler, using aluminium nitride as heat filling, is equipped with appropriate fire retardant, auxiliary agent etc., is prepared into light organosilicon heat conduction
Fire-proof potting compound, product density is low, thermal conductivity is high, good flame resistance, good combination property, meets market development demand.
Specific embodiment
Below in conjunction with specific embodiment, the present invention will be described in detail.
Embodiment 1.
The present embodiment provides a kind of light organosilicon casting glues, are mixed with by the component of following parts by weight:
Embodiment 2.
The present embodiment provides a kind of light organosilicon casting glues, are mixed with by the component of following parts by weight:
Embodiment 3.
The present embodiment provides a kind of light organosilicon casting glues, are mixed with by the component of following parts by weight:
Embodiment 4.
The present embodiment provides a kind of light organosilicon casting glues, are mixed with by the component of following parts by weight:
Embodiment 5.
The present embodiment provides a kind of light organosilicon casting glues, are mixed with by the component of following parts by weight:
Embodiment 6.
The present embodiment provides a kind of preparation method of light organosilicon casting glue, step is as follows:
1) 20-80 parts of vinyl silicone oils, 10-60 parts of decabromodiphenylethane, 3-20 parts of antimony oxides are milled to fineness
It is spare as flame retardant intermediate less than 5um;
2) 20-70 parts of vinyl silicone oils, 1-20 parts of silane coupling agents, 5-60 parts of aluminium nitride are placed in kneader, 120
After the lower kneading of degree is agglomerating, vacuum kneading 2 hours is down to room temperature naturally in sealing, spare as heat conduction intermediate;
3) by 10-50 parts of vinyl silicone oils, 10-40 parts of fire-retardant intermediates, 0-50 parts of heat conduction intermediates, stir evenly,
Mix slowly it is lower 0-30 parts of glass hollow micro mists are slowly added to and stirred evenly in batches, add 0.1-3 parts of platinum catalysts, stir
It mixes uniformly, component A is made after vacuum defoamation;
4) 5-30 parts of vinyl silicone oils, 5-40 parts of fire-retardant intermediates, 0-50 parts of heat conduction intermediates are stirred evenly, at a slow speed
0-30 parts of glass hollow micro mists are slowly added to and stirred evenly in batches under stirring, add 2-10 parts of containing hydrogen silicone oils, 0.1-2 parts
Inhibitor stirs evenly, and B component is made after vacuum defoamation;
5) by the component A prepared and B component by weight 0.2-2:0.2-2 is uniformly mixed, and can be filled after vacuum defoamation
Note.
Those of ordinary skills in the art should understand that:The discussion of any of the above embodiment is exemplary only, not
It is intended to imply that the scope of the present disclosure is limited to these examples (including claim);Under the thinking of the present invention, above example
Or it can also be combined between the technical characteristic in different embodiments, and there is different aspect present invention as described above
Many other variations, in order to it is concise they do not provided in details.Therefore, all within the spirits and principles of the present invention,
Any omission for being made, modification, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of light organosilicon casting glue, which is characterized in that be mixed with by the component of following parts by weight:
2. light organosilicon casting glue according to claim 1, which is characterized in that the sizing includes add-on type second
Any one in the end hydroxyl silicone oil and crosslinking agent of alkenyl silicone oil, containing hydrogen silicone oil or condensed type or two or more mixtures.
3. light organosilicon casting glue according to claim 1, which is characterized in that the light filler is less than for density
1.0g/cm3Light material.
4. light organosilicon casting glue according to claim 3, which is characterized in that the light filler includes glass hollow
Micro mist, aluminium oxide hollow powder, silicon dioxide hollow micro mist, any one in cinder micro mist or two or more mixing
Object.
5. light organosilicon casting glue according to claim 1, which is characterized in that the heat filling includes titanium dioxide
Any one in silicon, aluminium oxide, silicon nitride, aluminium nitride, beryllium nitride or two or more mixtures.
6. the preparation method of light organosilicon casting glue according to claim 1, which is characterized in that the heat filling packet
Include silicon carbide or metal fine powder.
7. light organosilicon casting glue according to claim 1, which is characterized in that the thermal insulating filling include diatom ooze,
Precipitated calcium carbonate, talcum powder, mica powder, epoxy resin powder, plastics micro mist, expanded material micro mist in any one or two kinds
Above mixture.
8. light organosilicon casting glue according to claim 1, which is characterized in that the fire retardant include aluminium hydroxide,
Any one or two kinds in magnesium hydroxide, melamine, ammonium polyphosphate, phosphate, decabromodiphenylethane, antimony oxide with
On mixture.
9. light organosilicon casting glue according to claim 1, which is characterized in that the auxiliary agent includes coupling agent, catalysis
Any one in agent, inhibitor, anti-denaturant, reinforcing agent, antistructurizing agent or two or more mixtures.
10. a kind of preparation method of light organosilicon casting glue, which is characterized in that step is as follows:
1) 20-80 parts of vinyl silicone oils, 10-60 parts of decabromodiphenylethane, 3-20 parts of antimony oxides are milled to fineness and are less than
5um is spare as flame retardant intermediate;
2) 20-70 parts of vinyl silicone oils, 1-20 parts of silane coupling agents, 5-60 parts of aluminium nitride are placed in kneader, under 120 degree
Mediate it is agglomerating after, vacuum kneading 2 hours is down to room temperature naturally in sealing, spare as heat conduction intermediate;
3) by 10-50 parts of vinyl silicone oils, 10-40 parts of fire-retardant intermediates, 0-50 parts of heat conduction intermediates, stir evenly, at a slow speed
0-30 parts of glass hollow micro mists are slowly added to and stirred evenly in batches under stirring, add 0.1-3 parts of platinum catalysts, stirring is equal
It is even, component A is made after vacuum defoamation;
4) 5-30 parts of vinyl silicone oils, 5-40 parts of fire-retardant intermediates, 0-50 parts of heat conduction intermediates are stirred evenly, mixed slowly
It is lower that 0-30 parts of glass hollow micro mists are slowly added to and stirred evenly in batches, add 2-10 parts of containing hydrogen silicone oils, 0.1-2 parts of inhibition
Agent stirs evenly, and B component is made after vacuum defoamation;
5) by the component A prepared and B component by weight 0.2-2:0.2-2 is uniformly mixed, and can be perfused after vacuum defoamation.
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109021578A (en) * | 2018-06-30 | 2018-12-18 | 广东冠能电力科技发展有限公司 | New insulation material and preparation method thereof for being coated on aerial Naked conducting wire |
WO2020039761A1 (en) * | 2018-08-23 | 2020-02-27 | 信越化学工業株式会社 | Thermally-conductive silicone composition and thermally-conductive silicone cured product |
CN111269690A (en) * | 2020-03-30 | 2020-06-12 | 上海纽帕新材料科技有限公司 | Light heat-conducting filling and sealing foamed silica gel |
CN112680174A (en) * | 2020-12-25 | 2021-04-20 | 郑州圣莱特空心微珠新材料有限公司 | Modified silicone adhesive, preparation method and application thereof, and vacuum glass |
CN114263048A (en) * | 2021-12-25 | 2022-04-01 | 杭州崇耀科技发展有限公司 | Organosilicon synthetic leather surface course, preparation method and organosilicon synthetic leather |
WO2024108681A1 (en) * | 2022-11-23 | 2024-05-30 | 江西天永诚高分子材料有限公司 | Ultra-low-density super-flame-retardant organosilicon thermal-insulating potting compound and preparation method therefor |
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US20140206816A1 (en) * | 2011-08-04 | 2014-07-24 | Yuangang Zhao | Addition-type organosilicon sealant for halogen-free conductive and flame-resistant electric products |
CN104861661A (en) * | 2015-05-13 | 2015-08-26 | 浙江中天氟硅材料有限公司 | Low density heat conduction pouring sealant and preparation method thereof |
CN105131844A (en) * | 2015-09-18 | 2015-12-09 | 广西路佳道桥勘察设计有限公司 | Heat-insulating water-proof material as well as preparation method and application method thereof |
CN105838322A (en) * | 2016-05-26 | 2016-08-10 | 张学健 | Novel organosilicone pouring sealant |
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CN101638518A (en) * | 2009-09-09 | 2010-02-03 | 成都硅宝科技股份有限公司 | Room-temperature vulcanized silicone rubber resisting acid-gas corrosion and high temperature and preparation method thereof |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109021578A (en) * | 2018-06-30 | 2018-12-18 | 广东冠能电力科技发展有限公司 | New insulation material and preparation method thereof for being coated on aerial Naked conducting wire |
WO2020039761A1 (en) * | 2018-08-23 | 2020-02-27 | 信越化学工業株式会社 | Thermally-conductive silicone composition and thermally-conductive silicone cured product |
CN111269690A (en) * | 2020-03-30 | 2020-06-12 | 上海纽帕新材料科技有限公司 | Light heat-conducting filling and sealing foamed silica gel |
CN112680174A (en) * | 2020-12-25 | 2021-04-20 | 郑州圣莱特空心微珠新材料有限公司 | Modified silicone adhesive, preparation method and application thereof, and vacuum glass |
CN114263048A (en) * | 2021-12-25 | 2022-04-01 | 杭州崇耀科技发展有限公司 | Organosilicon synthetic leather surface course, preparation method and organosilicon synthetic leather |
CN114263048B (en) * | 2021-12-25 | 2024-02-06 | 杭州崇耀科技发展有限公司 | Organic silicon synthetic leather surface layer, preparation method and organic silicon synthetic leather |
WO2024108681A1 (en) * | 2022-11-23 | 2024-05-30 | 江西天永诚高分子材料有限公司 | Ultra-low-density super-flame-retardant organosilicon thermal-insulating potting compound and preparation method therefor |
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Effective date of registration: 20190513 Address after: Group 11, Xinhe Village, Taoyuan Town, Wujiang District, Suzhou City, Jiangsu Province Applicant after: Suzhou Julian Electronic Materials Co., Ltd. Address before: Room 102, No. 3, Canghai No. 2 Road, Yonghe, Guangzhou Economic and Technological Development Zone, Guangdong 510000 Applicant before: Guangzhou Ming Fei synthetic material Co., Ltd. |
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