CN108219357A - A kind of humic acid modified enhancing phenolic foam material - Google Patents

A kind of humic acid modified enhancing phenolic foam material Download PDF

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Publication number
CN108219357A
CN108219357A CN201810032144.3A CN201810032144A CN108219357A CN 108219357 A CN108219357 A CN 108219357A CN 201810032144 A CN201810032144 A CN 201810032144A CN 108219357 A CN108219357 A CN 108219357A
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CN
China
Prior art keywords
humic acid
acid modified
foam material
phenolic foam
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201810032144.3A
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Chinese (zh)
Inventor
罗嘉辉
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Individual
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Individual
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Publication date
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Priority to CN201810032144.3A priority Critical patent/CN108219357A/en
Publication of CN108219357A publication Critical patent/CN108219357A/en
Withdrawn legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/0066—Use of inorganic compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/0066—Use of inorganic compounding ingredients
    • C08J9/0071—Nanosized fillers, i.e. having at least one dimension below 100 nanometers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2351/00—Characterised by the use of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers
    • C08J2351/08—Characterised by the use of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2361/00—Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
    • C08J2361/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08J2361/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2361/00—Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
    • C08J2361/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08J2361/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C08J2361/14—Modified phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/346—Clay
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Nanotechnology (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Emulsifying, Dispersing, Foam-Producing Or Wetting Agents (AREA)

Abstract

A kind of humic acid modified enhancing phenolic foam material of the present invention, raw material and raw material weight percentage composition are as follows：Expandable phenolic resin 40 50%, ethyl methacrylate 0.1 1%, propylene oxide 0.1 3%, kaolin 0.1 3%, dispersant 0.1 3%, halloysite nanotubes 40 60%.The present invention have the characteristics that toughness it is high, it is heat-resisting, be not easy it is scaling-off.

Description

A kind of humic acid modified enhancing phenolic foam material
Technical field
The invention belongs to materials science field more particularly to a kind of humic acid modified enhancing phenolic foam materials.
Background technology
Phenol formaldehyde foam is by the thermosetting phase obtained by formaldehyde and phenol through polycondensation occurs under the conditions of base catalysis to liquid Foaming agent, curing agent and other modifying agents are added in phenolic resin, by controlling reaction temperature, foams what is be prepared. In architecture exterior wall insulating materials application field, phenolic foam has excellent fire resistance, high temperature resistance and heat insulating ability Can etc., the preferred material for becoming the hot spot of research and using.
But the brittleness of phenol formaldehyde foam is big, and it is easily scaling-off, cause its mechanical strength poor, in order to further improve phenolic aldehyde bubble The heat resistance of foam needs to be modified phenolic resin processing, to prepare the phenol formaldehyde foam of mechanical property and excellent heat resistance Material.There is not the relevant report that humic acid is applied to phenolic foam material modification also at present.
Invention content
To solve above-mentioned existing technical problem, the present invention uses following scheme：
A kind of humic acid modified enhancing phenolic foam material, raw material and raw material weight percentage composition are as follows：
Expandable phenolic resin 40-50%；
Ethyl methacrylate 0.1-1%；
Propylene oxide 0.1-3%；
Kaolin 0.1-3%；
Dispersant 0.1-3%；
Halloysite nanotubes 40-60%.
The present invention have the characteristics that toughness it is high, it is heat-resisting, be not easy it is scaling-off.
Specific embodiment
Below in conjunction with specific embodiment, the present invention will be described in detail, herein illustrative examples and explanation of the invention For explaining the present invention, but it is not as a limitation of the invention.
Embodiment
A kind of humic acid modified enhancing phenolic foam material of the present invention, raw material and raw material weight percentage composition are such as Under：Expandable phenolic resin 45%, ethyl methacrylate 0.5%, propylene oxide 0.5%, kaolin 1%, dispersant 2%, Halloysite nanotubes 51%.
The above-described embodiments merely illustrate the principles and effects of the present invention, and is not intended to limit the present invention.It is any ripe The personage for knowing this technology all can carry out modifications and changes under the spirit and scope without prejudice to the present invention to above-described embodiment.Cause This, those of ordinary skill in the art is complete without departing from disclosed spirit and institute under technological thought such as Into all equivalent modifications or change, should by the present invention claim be covered.

Claims (1)

1. a kind of humic acid modified enhancing phenolic foam material, which is characterized in that its raw material and raw material weight percentage composition are as follows：
Expandable phenolic resin 40-50%；
Ethyl methacrylate 0.1-1%；
Propylene oxide 0.1-3%；
Kaolin 0.1-3%；
Dispersant 0.1-3%；
Halloysite nanotubes 40-60%.
CN201810032144.3A 2018-01-12 2018-01-12 A kind of humic acid modified enhancing phenolic foam material Withdrawn CN108219357A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810032144.3A CN108219357A (en) 2018-01-12 2018-01-12 A kind of humic acid modified enhancing phenolic foam material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810032144.3A CN108219357A (en) 2018-01-12 2018-01-12 A kind of humic acid modified enhancing phenolic foam material

Publications (1)

Publication Number Publication Date
CN108219357A true CN108219357A (en) 2018-06-29

Family

ID=62641074

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810032144.3A Withdrawn CN108219357A (en) 2018-01-12 2018-01-12 A kind of humic acid modified enhancing phenolic foam material

Country Status (1)

Country Link
CN (1) CN108219357A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109679042A (en) * 2018-12-10 2019-04-26 沈阳化工大学 A kind of modified method for preparing phenolic foam resin of coconut oil

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109679042A (en) * 2018-12-10 2019-04-26 沈阳化工大学 A kind of modified method for preparing phenolic foam resin of coconut oil

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Application publication date: 20180629