CN108215028B - Mold system for preparing polishing pad and use method thereof - Google Patents

Mold system for preparing polishing pad and use method thereof Download PDF

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Publication number
CN108215028B
CN108215028B CN201711354504.3A CN201711354504A CN108215028B CN 108215028 B CN108215028 B CN 108215028B CN 201711354504 A CN201711354504 A CN 201711354504A CN 108215028 B CN108215028 B CN 108215028B
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temperature
heat
conducting medium
wall
substrate
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CN108215028A (en
Inventor
朱顺全
李翔
刘敏
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Hubei Dinglong Cmi Holdings Ltd
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Hubei Dinglong Cmi Holdings Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/26—Moulds or cores
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/009—Tools not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/38—Heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/44—Measuring, controlling or regulating

Abstract

The invention provides a die system for preparing a polishing pad and a using method thereof, and the die system comprises a die for accommodating reaction materials, wherein the die comprises a base and an outer wall with a hollow cylinder structure, and a space between the base and the outer wall and above the base forms a die cavity for accommodating the reaction materials; the substrate is provided with a first temperature sensor, and the first temperature sensor is used for monitoring the temperature of the upper end face of the substrate in real time; the outer wall is provided with a second temperature sensor, and the second temperature sensor is used for monitoring the temperature of the inner end face of the outer wall in real time; the first temperature sensor and the second temperature sensor are both connected with a first digital control system, and the first digital control system regulates and controls the heating state of the mold in real time according to the temperature of the upper end surface of the substrate and the temperature of the inner end surface of the outer wall. The die system for preparing the polishing pad has the advantages of simple structure, more accurate temperature control and higher efficiency.

Description

Mold system for preparing polishing pad and use method thereof
Technical Field
The invention relates to the technical field of polishing of chemical mechanical planarization treatment, in particular to a mold system for preparing a polishing pad and a using method thereof.
Background
In integrated circuit and other electronic device manufacturing, multiple layers of conductive, semiconductive, and dielectric materials deposited on the surface of a semiconductor wafer need to be removed. Chemical mechanical planarization or Chemical Mechanical Polishing (CMP) is currently the most commonly used technique for polishing the surface of a workpiece. CMP is a technique that combines chemical attack and mechanical removal, and is also the most commonly used technique for planarization of semiconductor wafers and the like. Currently, in a conventional CMP process, the polishing pad is mounted on a carrier assembly of the apparatus while positioning contact with the polishing pad during polishing. The wafer is pressed against the polishing pad with a controlled pressure applied during polishing, and the polishing pad is rotated relative to the wafer by an external driving force. The polishing solution is continuously dropped during the rotation process, so that the surface of the wafer is flattened through the mechanical action of the surface of the polishing pad and the chemical action of the polishing solution.
U.S. patent No. 5578362R provides a polishing pad of the known art comprising a polymeric matrix of a plurality of dispersed microspheres. The microspheres are typically mixed into a liquid polymer matrix, then mixed with additional curing materials, finally moved into a mold for curing, and the molded article is then cut into polishing pads. Unfortunately, polishing pads formed in this manner can suffer from defective striations, uneven density distribution, and low yields.
Defective streaks are caused by differences in the bulk density of microspheres in a polymer matrix or by non-uniform mixing of materials. These striations are undesirable, and thus areas of non-uniform microsphere packing density or reactivity can result in substandard pad appearance, and more seriously, non-uniform polishing performance during polishing. The uneven density distribution is caused by uneven expansion degree of microspheres due to uneven heat distribution of the whole system (casting body) in the casting and gelling processes, so that uneven density distribution from the upper layer to the lower layer and from the middle to the periphery of the whole system is caused. Such non-controllable thermal expansion may lead to poor repeatability in process flow control, which may reduce the density yield of the entire system, and in addition, different density distributions in the same plane may affect the stability of the results during polishing.
Disclosure of Invention
In order to overcome the problems or at least partially solve the problems, the invention provides a mold system for preparing a polishing pad and a use method thereof, so as to solve the technical problem that the gel temperature is difficult to accurately control to influence the quality of the polishing pad in the process of preparing the polishing pad.
According to one aspect of the invention, a mold system for preparing a polishing pad is provided, which comprises a mold for accommodating a reaction material, wherein the mold comprises a hollow substrate and an outer wall with a hollow structure, the outer wall is positioned on the upper side of the substrate and is in contact with the upper end face of the substrate, a first temperature sensor is arranged on the substrate and is used for monitoring the temperature of the upper end face of the substrate in real time;
the outer wall is provided with a second temperature sensor, and the second temperature sensor is used for monitoring the temperature of the inner end face of the outer wall in real time;
a space between the substrate and the outer wall and above the substrate forms a die cavity for accommodating the reaction materials;
a first pipeline through which a first heat-conducting medium flows is arranged in the substrate, a second pipeline through which a second heat-conducting medium flows is arranged in the outer wall, the temperature of the first heat-conducting medium is regulated by a first temperature regulating device, and the temperature of the second heat-conducting medium is regulated by a second temperature regulating device;
the first temperature adjusting device is connected with a first digital control system, the second temperature adjusting device is connected with a second digital control system, the first digital control system is used for adjusting the temperature of the first heat-conducting medium based on the temperature of the upper end face of the base, and the second digital control system is used for adjusting the temperature of the second heat-conducting medium based on the temperature of the inner end face of the outer wall.
Further, a plurality of the first temperature sensors are disposed on the substrate, and the plurality of the first temperature sensors are evenly distributed around the center of the substrate.
Further, the outer wall is a hollow cylinder, and a plurality of second temperature sensors which are uniformly distributed on the outer wall along the annular direction of the outer wall are arranged on the outer wall.
Further, the device also comprises an air draft cover which is arranged above the die and used for reducing the surface temperature of the reaction materials; the air suction opening of the air suction cover faces the mold cavity, a panel is fixed at the lower end of the cover body of the air suction cover, the panel is parallel to the substrate, and a plurality of through holes are uniformly distributed in the panel.
Further, the diameter of the face plate is 1.1-1.3 times the diameter of the mold cavity.
Furthermore, a plurality of infrared thermometers are uniformly distributed on the panel and used for acquiring the temperature of the upper surface of the reaction material, the infrared thermometers are connected with a third digital control system, and the third digital control system regulates and controls the wind speed of the air suction opening according to the temperature change rate of the upper surface of the reaction material.
Further, the distance between the upper end face of the reaction material and the panel is 10-40 cm.
According to another aspect of the present invention, there is also provided a method for using a mold system for manufacturing a polishing pad, the mold being configured to receive a gelation reaction material, the initial temperatures of the first heat transfer medium and the second heat transfer medium being the same, the initial temperatures being both 30 to 70 ℃, and the temperature of the heat transfer medium being adjusted during the gelation reaction so that the temperature difference between the temperature of the heat transfer medium and the temperature measured by the corresponding temperature sensor is 5 to 25 ℃;
preferably, the initial temperature is 35-65 ℃, and the temperature difference between the heat-conducting medium and the temperature measured by the corresponding temperature sensor in the gelation process is controlled to be 8-20 ℃.
Further, if the temperature difference between the temperature measured by the temperature sensor and the heat-conducting medium is more than 25 ℃, the corresponding digital control system regulates and controls heat supply to the heat-conducting medium, and if the temperature difference between the temperature measured by the temperature sensor and the heat-conducting medium is less than 5 ℃, the corresponding digital control system regulates and controls cooling of the heat-conducting medium.
The beneficial effects of the invention are mainly reflected in the following aspects:
the temperature sensors are correspondingly arranged on the substrate and the outer wall, and the corresponding first digital control system and the second digital control system can accurately and comprehensively regulate and control the temperature difference between different detection points and the heat-conducting medium in the die cavity respectively, namely the temperature difference between the accommodated reaction materials at different positions and the die can be regulated and controlled, so that the heat dissipation of the reaction materials is orderly dredged; meanwhile, the air draft cover is arranged above the die, and the surface temperature of the reaction materials contained in the die cavity is further regulated and controlled, so that the temperature change of the reaction materials can be monitored and controlled from all directions, and the high-quality polishing pad can be prepared.
Drawings
FIG. 1 is a schematic view of a mold structure with a temperature sensor according to a preferred embodiment of the present invention;
fig. 2 is a schematic view of the structure of an extraction hood with an infrared thermometer according to a preferred embodiment of the invention.
Detailed Description
The following describes embodiments of the present invention in further detail with reference to the examples and the accompanying drawings. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
A first object of the present invention is to provide a method for preparing a polishing pad, comprising the steps of: mixing the liquid prepolymer, the curing agent and the hollow micro-element at 50-85 ℃ to form a curable mixture, wherein the viscosity of the curable mixture is 3000-20000cps, and curing after gelling to obtain the curable mixture; the liquid prepolymer is a polyurethane prepolymer formed by reacting polyol and isocyanate as raw materials.
Casting, gelling and curing are typically involved in the preparation of the polishing pad. In the process of pouring and mixing, the mixing temperature of the liquid prepolymer, the curing agent and the hollow micro-element is controlled to be 50-85 ℃, and the viscosity is controlled to be 3000-20000cps, so that the mixing and reaction effects are ideal; and the reaction material formed by the liquid prepolymer, the curing agent and the hollow micro-element has controllable heat release.
If the mixing temperature is too low, the reaction rate of the materials is low and the degree of reaction in the gel stage is insufficient, resulting in a material that is less than optimal in properties, such as a decrease in elastic modulus, which decreases the removal efficiency of the polishing pad and shortens the service life.
If the mixing temperature is too high, the heat of reaction of the material is high, the heat release is severe, and uncontrollable thermal expansion is caused in the gel stage, so that the volume of the expandable hollow micro-element is expanded, and the whole material system has low density and extremely uneven density distribution. In addition, the thermal expansion of the reaction materials can also make the microspheres in the material system move directionally, so that the packing density distribution of the microspheres in different areas is inconsistent, and finally, the stripe is generated.
Among them, the viscosity is preferably a value measured at 50 ℃.
Wherein the curable mixture is generally added with a corresponding curing agent known in the art.
In a preferred embodiment, the temperature for mixing the liquid prepolymer, the curing agent and the hollow micro-components is preferably 55-85 ℃; more preferably 60 to 80 ℃.
In a preferred embodiment, after mixing the liquid prepolymer, curing agent and hollow microelements, the viscosity of the resulting curable mixture is preferably 4000-; more preferably 5000-.
In a preferred embodiment, the liquid prepolymer is a polyurethane prepolymer obtained by reacting a polyol with an isocyanate as a raw material.
In a preferred embodiment, the polyol is a polyester polyol or a polyether polyol, or a mixture of a polyester polyol and a polyether polyol.
In a preferred embodiment, the method further comprises transferring the curable mixture to a mold for gelation in order to ensure that the resulting polishing pad has a smaller striation defect rate, a smaller difference in hardness between different regions, and more uniform properties. Wherein the initial temperature of the mould is 30-70 ℃, and the temperature difference between the temperature of the reaction materials and the heat-conducting medium for regulating and controlling the temperature of the mould 1 in the gelling process is controlled to be 5-25 ℃.
The mentioned moulds can be heated by setting heat conduction of a heat-conducting medium, and the temperature of the moulds can be regulated and controlled by changing the temperature of the heat-conducting medium.
In a preferred embodiment, the curable mixture is transferred to a mould for gelation. Wherein the initial temperature of the mould is 35-65 ℃, and the temperature difference between the reaction materials and the heat-conducting medium for regulating and controlling the temperature of the mould 1 in the gelling process is 8-20 ℃.
In a preferred embodiment, the curable mixture is transferred to a mould 1 for gelling. Wherein the initial temperature of the mould 1 is 40-60 ℃, and the temperature difference between the reaction materials and the heat-conducting medium for regulating and controlling the temperature of the mould 1 in the gelling process is controlled to be 10-15 ℃.
In a preferred embodiment, after the liquid prepolymer, curing agent and hollow micro-components are mixed in the head of the casting machine, the resulting curable mixture is poured into the mold 1 to gel.
Wherein, the temperature rising rate of the reaction materials is preferably controlled to be 0-6 ℃/min in the gelation process; preferably 0-5 ℃/min; more preferably 0-4 deg.C/min.
In a preferred embodiment, the mould 1 comprises a hollow base 11 and a hollow structured outer wall 12 in order to better achieve control of the reaction mass gelling process. The outer wall 12 is located on the upper side of the base 11, and the bottom end of the outer wall 12 is in contact with the upper end face of the base 11.
The space between the base 11 and the outer wall 12 and above the base 11 constitutes a mould cavity. Transferring the reaction mass, namely the curable mixture into the die cavity for gelation; the substrate 11 and the outer wall 12 are both provided with temperature sensors for recording the temperature of the reaction materials in real time, and meanwhile, each temperature sensor is respectively connected with a corresponding digital control system, and the digital control system is used for adjusting the heating state of the heat-conducting medium in real time according to the temperature detected by the temperature sensors, namely the temperature of the reaction materials, so as to adjust the temperature in the die cavity, as shown in fig. 1.
Specifically, the first temperature sensor 13 is connected to a first digital control system; correspondingly, a first pipeline is arranged in the substrate 11, a first heat-conducting medium flows in the first pipeline, and the heated or cooled first heat-conducting medium is used for heating or cooling the substrate 11; the first digital control system regulates heating or cooling of the first heat transfer medium according to the temperature data of the first temperature sensor 13. The first pipe may be embedded inside the substrate 11, or may be disposed close to the bottom of the substrate 11.
The second temperature sensor is connected with the second digital control system; correspondingly, a second pipeline is arranged inside the outer wall 12, a second heat-conducting medium flows in the second pipeline, and the heated or cooled second heat-conducting medium is used for heating or cooling the outer wall 12. The second digital control system regulates heating or cooling of the second heat transfer medium according to the temperature data of the first temperature sensor 13. The second duct may be embedded inside the outer wall 12 around the periphery of the outer wall 12, or may be arranged around a side wall that is attached to the outer wall 12.
In the following, if not specifically stated, the adjustment and control of the heat transfer medium by the digital control system all means the adjustment and control between the corresponding digital control system and the heat transfer medium.
That is, the substrate 11 is provided with a first temperature sensor 13, and the outer wall 12 is provided with a second temperature sensor 14, which can measure the temperature of the reaction materials and feed back to the corresponding digital control system. When the reaction is vigorously carried out and the temperature of the reaction materials is detected to start rising, if the temperature difference is more than 25 ℃, the first digital control system controls the temperature rise of the heat-conducting medium, maintains the temperature difference between the substrate 11 and the reaction materials in the mould 1, and gently dredges the heat dissipation in the reaction materials, so that the reaction unevenness caused by the rapid temperature drop of the reaction materials is avoided. If the temperature difference between the two is less than 5 ℃, the first digital control system controls the heat-conducting medium to start cooling, the temperature of the substrate 11 and the outer wall 12 starts to decrease, and the temperature difference between the heat-conducting medium and the reaction materials is kept in a proper range, so that the heat dissipation of the reaction materials is not influenced. The second digital control system regulates the temperature difference in the same manner as the first digital control system.
Wherein the substrate is generally oriented along an x-y plane and the mold cavity has a central axis perpendicular to the x-y plane.
In a preferred embodiment, the mold cavity may be provided in the shape of a circular ring for more precise control. The outer wall 12 is a cylinder having a hollow structure. The substrate 11 is provided with a plurality of first temperature sensors 13 for detecting temperature in real time along the radial direction of the uniform circular ring. And a plurality of second temperature sensors 14 for detecting the temperature in real time are arranged on the outer wall 12 and divide the outer wall 12 along the annular direction of the outer wall 12.
Further, a pipeline is arranged inside the cavity of the substrate 11 and the outer wall, a heat-conducting medium flows in the pipeline, and two ends of the pipeline are respectively connected with a temperature adjusting device which is also connected with a digital control system.
For example, 8 first temperature sensors 13 may be disposed on the substrate in the radial direction of the sharing ring radius, and 8 second temperature sensors 14 may be disposed on the outer wall 12 in the circumferential direction of the outer wall to share the outer wall 12.
Specifically, the pipe may be a straight pipe or a bent pipe in the form of a spiral pipe or the like, as long as the purpose of effectively exchanging heat with the mold 1 can be achieved. The heat-conducting medium circulating in the pipeline can be water, heat-conducting oil and other heat-conducting media. The both ends of pipeline link to each other with temperature regulation apparatus respectively, and the mode of being connected with temperature regulation apparatus is nimble, as long as can reach in the heating or cooling pipeline heat-conducting medium's purpose can to the heat-conducting medium in making the pipeline plays the effect of heat transfer with the mould, thereby plays the effect of heating or cooling the mould, and then adjusts the temperature difference of the heat-conducting medium of reaction material and heat conduction material. The temperature difference between the reaction materials and the heat-conducting medium is kept in a proper range, so that the heat dissipation rate of the reaction materials cannot fluctuate greatly, and the quality of the prepared polishing pad is improved.
Specifically, the first temperature sensor 13 and the second temperature sensor 14 are connected to a first digital control system and a second digital control system, respectively. The first temperature sensor 13 and the second temperature sensor 14 respectively convey the monitored surface temperatures of the reaction materials to the first digital control system and the second digital control system.
The digital control system regulates and controls the heating state of the mold 1 according to the surface temperature information and the temperature information of the heat-conducting medium in the pipeline, namely, according to the temperature difference between the temperature of the heat-conducting medium in the pipeline and the surface temperature of the reaction material sensed by the first temperature sensor 13 or the second temperature sensor 14, so as to regulate and control the temperature of the mold 1, namely, the temperature of the upper end surface of the substrate 11 or the inner end surface of the outer wall 12, and thus, the purpose of regulating and controlling the temperature of the reaction material in the mold cavity is achieved. When the difference between the surface temperature of the reaction materials and the temperature of the heat-conducting medium is in a proper range, the temperature of the heat-conducting medium is kept unchanged; when the difference between the surface temperature of the reaction materials and the temperature of the heat-conducting medium is lower than a preset minimum value, cooling the heat-conducting medium to increase the difference between the temperature of the heat-conducting medium and the surface temperature of the reaction materials; and when the difference value between the surface temperature of the reaction materials and the temperature of the heat-conducting medium is higher than the preset maximum value, heating the heat-conducting medium to reduce the difference value between the temperature of the heat-conducting medium and the surface temperature of the reaction materials.
That is, the first temperature sensor 13 and the second temperature sensor 14 are correspondingly disposed on the substrate 11 and the outer wall 12, and can measure the surface temperature of the reaction materials and feed back to the corresponding digital control system.
For example, when the reaction of the reaction materials in the mold cavity is vigorously carried out and the temperature of the reaction materials begins to rise, if the temperature difference between the temperature of the heat-conducting medium and the temperature of the reaction materials is larger than 25 ℃, the digital control system controls the temperature regulating device to heat the heat-conducting medium, so that the temperature of the heat-conducting medium rises, and the difference between the temperature of the heat-conducting medium and the temperature of the reaction materials is reduced.
If the temperature difference between the two is less than 5 ℃, the digital control system controls the temperature adjusting device to cool the heat-conducting medium, so that the difference between the temperature of the heat-conducting medium and the temperature of the reaction materials is increased, and the difference between the temperature of the heat-conducting medium and the temperature of the reaction materials is increased. The temperature difference between the heat-conducting medium and the reaction material is controlled by adopting the mode, so that the temperature of the reaction material and the temperature of the heat-conducting medium are not too large or too small in the gelation process of the reaction material, the heat accumulation in the reaction material is dredged, the temperature of the reaction material is not reduced too large/too fast in the gelation process of the reaction material, or the temperature difference between the reaction material and the environment is not too large, the reaction is not uniform, and the quality of the polishing pad is influenced.
In a preferred embodiment, in order to better realize the regulation and the yield of the product, the preparation method further comprises the step of adjusting the wind speed for reducing the surface temperature of the reaction materials during the gelation process:
when the temperature rise rate of the surface of the reaction material is 0-2 ℃/min, the wind speed is kept at 1000-2000m3H, when the temperature rise rate is 2-4 ℃/min, the wind speed is set to 2000-3000m3H, when the temperature rise rate is more than 4 ℃/min, the wind speed is increased to 3000-4000m3H is used as the reference value. In addition, the highest temperature of the reaction materials needs to be controlled in the gelling process, and when the temperature is higher than 90 ℃, the temperature rise rate of the reaction materials needs to be increased to 3000-4000m at any time3Because excessive temperatures can cause uncontrolled expansion of the internal hollow micro-components, resulting in non-uniform density.
In a preferred embodiment, in order to achieve the above regulation, the air draft cover 2 is disposed above the mold 1 during the gelation process, the air draft cover 1 includes a cover 23 and a panel 21, and the panel 21 is fixed to the lower end of the cover 23. The panel 21 of the air draft cover 2 is provided with an infrared thermometer 22 for acquiring the surface temperature of the reaction materials and a third digital control system for adjusting the wind speed of the air inlet according to the change rate of the surface temperature.
In order to realize the regulation, an air draft hood 2 is arranged above the mold 1 in the gelation process, and an air draft opening of the air draft hood 2 faces the mold 1. An infrared thermometer 22 arranged on the panel 21 obtains the surface temperature of the reaction material in the mold 1, and transmits the surface temperature information to a third digital control system, and the third digital control system controls the operation of the draft hood 2 according to the surface temperature change rate information.
When the surface heating rate of the reaction materials in the mold 1 is too high and needs to be reduced, starting the air draft cover 2 to be in an air draft state so as to reduce the surface heating rate of the reaction materials in the mold 1; when the infrared thermometer 22 senses that the surface heating rate of the reaction materials in the mold 1 is reduced to a proper value, the infrared thermometer 22 transmits the real-time temperature information to the third digital control system, and the third digital control system can adjust the wind speed so as to slow down the cooling effect on the reaction materials in the mold 1.
In a preferred embodiment, the panels 21 are preferably divided into a plurality of small areas, and each small area is provided with an infrared thermometer 22 for acquiring the surface temperature of the corresponding reaction material. For example, the panels 21 are equally divided into 12 small areas as shown in fig. 2. The optimal range of the adjustable wind speed of each small area is 1000-3/h。
Specifically, the draft hood 2 is divided into a plurality of small areas, and a corresponding infrared thermometer is correspondingly arranged in each small area, so that the infrared thermometers 22 can comprehensively and accurately reflect the surface temperature of the reaction materials in the mold 1, and the third digital control system can more accurately regulate and control the working state of the draft hood 2.
In a preferred embodiment, the hood 2 is preferably a circular hood with a diameter of 1.1 to 1.3 times the diameter of the mold cavity and a height of 10 to 40cm from the upper end face of the reaction mass. The diameter range of the air draft cover is 1.1-1.3 times, the cooling effect is mainly considered, the air draft cover is too small to completely cover a casting surface, the air draft cover is too large to enable the whole casting surface to have uneven wind speed, and circulation is easy to form, so that the reaction materials are cooled unevenly. For the setting of the height used in correspondence with the wind speed, too low affects the heat dissipation, too high the wind speed decreases.
In a preferred embodiment, the hood 2 is preferably a circular hood with a diameter of 1.2 times the diameter of the mould cavity; the height of the exhaust hood from the upper end surface of the reaction materials is 15-35 cm; preferably 20-30 cm.
In a preferred embodiment, the polishing pad is obtained by curing the reaction mass during gelation when the temperature of the reaction mass is detected to be constant and not lower than 60 ℃ to form a cured material. Specifically, in the gelation process, when the temperature of the surface of the reaction material is detected to be constant and is higher than 60 ℃, the reaction material is solidified to form a solidified material, and the polishing pad is obtained.
For different systems, the different types of polymers can cause different reaction heat, that is, the highest temperature and rate of reaction can be different, the temperature in the stable phase of the gel reaction is not lower than 60 ℃, so that the final performance of the material is not greatly influenced, and if the temperature is too low, the mobility of molecular chains is weakened, the reaction degree in the post-curing phase can be reduced, and the mechanical performance of the material can be reduced.
Curing is generally carried out by placing the gelled reaction mass in an oven, the temperature and time of curing being determined by the person skilled in the art according to the degree of curing.
Another object of the present invention is to provide a polishing pad prepared by the above-mentioned method.
Referring to fig. 1, another object of the present invention is to provide a mold system for manufacturing a polishing pad including gelation of a reaction material, the mold system for manufacturing a polishing pad including a mold 1, the mold 1 including a base 11 and an outer wall 12 of a hollow cylindrical structure, the outer wall 12 being located on an upper side of the base 11 and contacting an upper end surface of the base 11. A first temperature sensor 13 is arranged on the substrate 11, and the first temperature sensor 13 is used for monitoring the temperature of the upper end surface of the substrate in real time; a second temperature sensor 14 is arranged on the outer wall, and the second temperature sensor 14 is used for monitoring the temperature of the inner end face of the outer wall 12 in real time;
the space between the substrate 11 and the outer wall 12 and above the substrate 11 forms a mold cavity to adjust the temperature of the reaction mass based on the temperature of the upper end surface of the substrate and the temperature of the inner end surface of the outer wall.
Wherein the substrate 11 is generally oriented along an x-y plane and the mold cavity has a central axis perpendicular to the x-y plane.
In order to better achieve the control of the gelation process of the reaction mass, the mold 1 preferably includes a hollow base 11 and an outer wall 12 having a hollow cylindrical structure, and both upper and lower ends of the outer wall 12 are open. The lower end of the outer wall 12 is in contact with the upper end face of the base 11, so that a space between the base 11 and the outer wall 12 and above the base 11 constitutes a cavity.
The liquid prepolymer, the curing agent and the hollow micro-element are fully and uniformly mixed and then transferred into the die cavity for gelling. After the reaction mass is transferred into the mold cavity, the reaction mass contacts both the inner end surface of the base 11 and the inner end surface of the outer wall 12, and the shape of the reaction mass in the mold cavity is the same as the shape of the mold cavity.
The reaction mass is in contact with the inner end surface of the substrate 11, and the first temperature sensor 13 provided on the substrate 11 is capable of monitoring the temperature of the reaction mass in contact with the upper end surface of the substrate 11. That is, the temperature of the upper end surface of the substrate 11 monitored by the first temperature sensor 13 is actually the temperature of the bottom surface of the reaction material accommodated in the cavity.
Similarly, the reaction mass is in contact with the inner end surface of the outer wall 12, and the second temperature sensor 14 provided on the outer wall 12 is able to monitor the temperature of the reaction mass in contact with the inner end surface of the outer wall 12. That is, the temperature of the inner end surface of the outer wall 12 monitored by the second temperature sensor 14 is actually the temperature of the lateral surface of the reaction material contained in the mold cavity.
Therefore, the first temperature sensor 13 and the second temperature sensor 14 are correspondingly arranged on the substrate 11 and the outer wall 12, so that the surface temperature of the reaction materials contained in the mold cavity can be monitored more comprehensively and accurately.
In a specific embodiment, the temperature of the mould 1 is initially between 30 and 70 ℃ when the reaction mass is transferred to the mould 1 for gelation, and the temperature difference between the reaction mass and the mould 1 during gelation is controlled between 5 and 25 ℃.
In a preferred embodiment, the curable mixture is transferred to the mould 1 for gelation, said mould 1 initially having a temperature of 35-65 ℃ and the temperature difference between the reaction mass and said mould 1 during gelation being controlled to be 8-20 ℃.
In a preferred embodiment, the curable mixture is transferred to a mould 1 for gelling. Wherein the initial temperature of the mould 1 is 40-60 ℃, and the temperature difference between the reaction material and the mould 1 in the gelling process is controlled to be 10-15 ℃.
Specifically, after the reaction mass is transferred into the mold 1, it undergoes a gelation reaction in the mold 1. At this time, the curable material becomes the reaction material in the mold 1, and the initial temperature of the mold 1 and the temperature difference between the reaction material and the mold 1 are regulated, so that the obtained polishing pad has smaller stripe defect rate, smaller hardness difference of different areas and more uniform performance.
In a preferred embodiment, the device further comprises a pipeline with a heat-conducting medium flowing inside, the pipeline transversely penetrates through the substrate, and two ends of the pipeline are respectively connected with a temperature adjusting device; the temperature adjusting device is connected with a digital control system, and the digital control system is used for adjusting the temperature of the reaction materials based on the temperature of the upper end face of the substrate or the temperature of the inner end face of the outer wall. Specifically, the temperature adjusting means may be a water bath, an oil bath or the like. Depending on the type of temperature adjustment device, the temperature adjustment device may or may not be in contact with the lower end surface of the substrate 11.
Specifically, the pipe may be a straight pipe or a bent pipe in the form of a spiral pipe or the like, as long as the purpose of effectively exchanging heat with the mold 1 can be achieved. The medium flowing in the pipeline can be water, heat-conducting oil and other media. The both ends of pipeline link to each other with temperature regulation apparatus respectively, and the mode of being connected with temperature regulation apparatus is nimble, as long as can reach in the heating or cooling pipeline heat-conducting medium's purpose can to the heat-conducting medium in making the pipeline plays the effect of heat transfer with the mould, thereby plays the effect of heating or cooling mould, and then the adjustment reaction material is with the difference in temperature of heat conduction material. The temperature difference between the reaction materials and the heat conduction material is kept in a proper range, so that the heat dissipation rate of the reaction materials cannot fluctuate greatly, and the quality of the prepared polishing pad is improved.
In particular, the first temperature sensor 13 and the second temperature sensor 14 are both connected to a first digital control system. The first temperature sensor 13 and the second temperature sensor 14 deliver the monitored surface temperature of the reaction mass to the first digital control system.
The first digital control system regulates and controls the heating state of the mold 1 according to the surface temperature information and the temperature information of the heat-conducting medium in the pipeline, namely, according to the temperature of the heat-conducting medium in the pipeline and the surface temperature difference of the reaction materials sensed by the first temperature sensor 13 and the second temperature sensor 14, so that the temperature of the mold 1 is regulated and controlled, namely, the temperatures of the upper end surface of the substrate 11 and the inner end surface of the outer wall 12 are regulated and controlled, and the purpose of regulating and controlling the temperature of the reaction materials in the mold cavity is achieved. When the difference between the surface temperature of the reaction materials and the temperature of the heat-conducting medium is in a proper range, the temperature of the heat-conducting medium is kept unchanged; when the difference between the surface temperature of the reaction materials and the temperature of the heat-conducting medium is lower than a preset minimum value, cooling the heat-conducting medium to increase the difference between the temperature of the heat-conducting medium and the surface temperature of the reaction materials; and when the difference value between the surface temperature of the reaction materials and the temperature of the heat-conducting medium is higher than the preset maximum value, heating the heat-conducting medium to reduce the difference value between the temperature of the heat-conducting medium and the surface temperature of the reaction materials.
That is, the first temperature sensor 13 and the second temperature sensor 14 are correspondingly disposed on the substrate 11 and the outer wall 12, and can measure the surface temperature of the reaction materials and feed back to the corresponding digital control system.
For example, when the reaction of the reaction materials in the mold cavity is vigorously carried out and the temperature of the reaction materials begins to rise, if the temperature difference between the temperature of the heat-conducting medium and the temperature of the reaction materials is larger than 25 ℃, the digital control system controls the temperature regulating device to heat the heat-conducting medium, so that the temperature of the heat-conducting medium rises, and the difference between the temperature of the heat-conducting medium and the temperature of the reaction materials is reduced.
If the temperature difference between the two is less than 5 ℃, the first digital control system and the second digital control system respectively control the temperature adjusting devices to cool the corresponding heat-conducting media, so that the difference between the temperature of the heat-conducting media and the temperature of the reaction materials is increased, and the difference between the temperature of the heat-conducting media and the temperature of the reaction materials is increased. The temperature difference between the heat-conducting medium and the reaction material is controlled by adopting the mode, so that the temperature of the reaction material and the temperature of the heat-conducting medium are not too large or too small in the gelation process of the reaction material, the heat accumulation in the reaction material is dredged, the temperature of the reaction material is not reduced too large/too fast in the gelation process of the reaction material, or the temperature difference between the reaction material and the environment is not too large, the reaction is not uniform, and the quality of the polishing pad is influenced.
In a preferred embodiment, in order to achieve a more precise control, the substrate 11 is provided with a plurality of the first temperature sensors 13, which are evenly distributed around the center of the substrate. In a preferred embodiment, the outer wall 12 is a hollow cylinder structure, and a plurality of the second temperature sensors 14 are disposed on the outer wall 12 and equally divide the outer wall 12 along the circumferential direction of the outer wall 12.
Specifically, the first temperature sensor 13 may be embedded in an inner wall of the substrate 11, and the second temperature sensor 14 may be embedded in an inner surface of the outer wall 12. The first temperature sensor 13 and the second temperature sensor 14 are uniformly arranged on the substrate 11 or the outer wall 12. A plurality of first temperature sensors 13 are arranged around the center of the substrate 11; a plurality of second temperature sensors 14 are evenly arranged on the outer wall 12 around the central axis of the mould 1.
For example, 8 first temperature sensors 13 may be provided on the substrate 11 in the radial direction of the averaging circle radius; the outer wall 12 is provided with a plurality of the second temperature sensors 14 circumferentially equally dividing the outer wall 12 along the outer wall 12.
Referring to fig. 2, in a preferred embodiment, an air draft hood 2 is provided above the mold 1. The suction opening of the suction hood 2 faces the mold 1. When the hood 2 is in operation, it can be used to reduce the surface temperature of the reaction mass contained in the mould 1, thus enhancing the efficiency of the heat dissipation inside the reaction mass.
Further, the extractor hood 2 comprises a cover 23 and a panel 21. At the air exhaust opening, a panel 21 is provided, which is fixed to the lower end of the cover 23 of the air exhaust hood 2, and the surface of the panel 21 is parallel to the base 11. A plurality of through holes are uniformly distributed on the panel 21. The plurality of through holes penetrate the panel 21 in a direction perpendicular to the panel 21.
Specifically, set up a plurality of through-holes on the panel 21, help promoting the operating efficiency of draft cover 2, make the wind direction that draft cover 2 provided concentrate on acting on reaction material, promote the cooling efficiency to reaction material. And the temperature change of the surface of the same material is even, and the uniformity of the polishing pad is improved. Meanwhile, the plurality of through holes are formed in the plate surface 21, so that the wind speed of the draught hood 2 can be accurately regulated and controlled conveniently.
In a preferred embodiment, a plurality of infrared thermometers 22 for acquiring the surface temperature of the reaction materials are uniformly distributed on the panel 21, and the infrared thermometers are used for acquiring the temperature of the upper surface of the reaction materials.
In a preferred embodiment, the hood 2 further comprises a third digital control system. The infrared thermometer 22 is connected to a third digital control system. And the third digital control system is used for regulating and controlling the wind speed of the air suction opening according to the temperature change rate of the upper surface of the reaction material.
Specifically, the infrared thermometer 22 disposed on the panel 21 obtains the upper surface temperature of the reaction material in the mold 1, and transmits the surface temperature information to the third digital control system, and the third digital control system controls the operation of the exhaust hood 2 according to the change rate of the upper surface temperature.
When the temperature rise rate of the upper surface of the reaction material in the mold 1 is too high and needs to be reduced, the air draft speed of the air draft cover 2 is increased so as to reduce the temperature rise rate of the upper surface of the reaction material in the mold 1; when the infrared thermometer 22 senses that the temperature rising rate of the upper surface of the reaction material in the mold 1 falls to a proper value, the infrared thermometer 22 transmits the real-time temperature information at that time to the third digital control system, and the third digital control system can adjust the air draft rate so as to relieve the cooling effect on the reaction material in the mold 1.
In a preferred embodiment, the panels 21 are preferably divided into a plurality of small areas, and each small area is provided with an infrared thermometer 22 for acquiring the surface temperature of the corresponding reaction material. For example, the panels 21 are equally divided into 12 small areas as shown in fig. 2. The optimal range of the adjustable wind speed of each small area is 1000-3/h。
Specifically, the draft hood 2 is divided into a plurality of small areas, and the infrared thermometer 22 is correspondingly arranged in each small area, so that the infrared thermometers 22 can comprehensively and accurately reflect the surface temperature of the reaction materials in the mold 1, and the third digital control system can more accurately regulate and control the working state of the draft hood 2.
Specifically, a plurality of infrared thermometers 22 are uniformly distributed on a panel 21 of the air draft cover 2, a third digital control system connected with the infrared thermometers 22 is arranged, and the structure is combined with the first temperature sensor 13 and the second temperature sensor 14 arranged on the base 11 and the outer wall 12 of the mold 1, so that the temperature of the reaction materials in the mold 1 can be regulated and controlled more accurately.
When the reaction of the reaction materials in the mold 1 is vigorously carried out and the temperature of the reaction materials begins to rise, the first temperature sensor 13 and the second temperature sensor 14 sense that the temperature difference between the surface temperature of the reaction materials in the mold 1 and the heat-conducting medium is too large, the first temperature sensor 13 and the second temperature sensor 14 transmit sensed temperature information to corresponding digital control systems, and the digital control systems regulate and control the temperature rise process of the heat-conducting medium, and mainly relate to the temperature rise amplitude and the temperature rise rate. At this time, the infrared thermometer 22 at the panel 21 of the hood 2 senses that the temperature of the upper surface of the reaction material in the mold 1 is high, and the air draft rate of the hood 2 is increased.
When the temperature difference between the reaction material and the heat-conducting medium is in a proper range, the temperature of the heat-conducting medium is kept unchanged. Meanwhile, an infrared thermometer 22 arranged on a panel 21 of the air draft cover 2 senses the surface temperature of the reaction materials, and a third digital control system regulates and controls the operation of the air draft cover 2 to keep the corresponding air speed so as to keep the temperature difference between the reaction materials and the heat-conducting medium in a proper range. When the temperature difference between the temperature of the reaction materials and the heat-conducting medium is too small, the first digital control system and the second digital control system respectively control the temperature adjusting device to cool the heat-conducting medium, and the third digital control system controls the air draft cover 2 to reduce the air speed so as to increase the temperature difference between the temperature of the reaction materials and the heat-conducting medium, so that the heat dissipation of the reaction materials can be dredged, and the heat accumulation in the reaction materials is avoided.
Therefore, the first temperature sensor 13, the second temperature sensor 14, the first digital control system, the second digital control system and the corresponding infrared thermometer 22 and the third digital control system on the air draft cover 2 on the die 1 are arranged, and all the parts are matched with each other to operate, so that the accuracy and the instantaneity of temperature regulation and control of reaction materials can be effectively improved in the gelation process of preparing the polishing pad, the comprehensive performance of the prepared polishing pad is effectively improved, and the product yield is improved.
In a preferred embodiment, the hood 2 is preferably a circular hood with a diameter of 1.1-1.3 times the diameter of the mould cavity; preferably with a diameter of 1.2 times the diameter of the die cavity. The diameter range of the air draft cover 2 is 1.1-1.3 times, the cooling effect is mainly considered, the air draft cover is too small to completely cover the casting surface, the air speed of the whole casting surface is uneven due to the too large air draft cover, and circulation is easy to form, so that the reaction materials are cooled unevenly. For the setting of the height used in correspondence with the wind speed, too low affects the heat dissipation, too high the wind speed decreases.
In a preferred embodiment, the air draft cover 2 is preferably a circular air draft cover, and the distance between the air draft cover 2 and the upper end surface of the mold 1 is 10-40 cm; preferably, the distance between the air draft cover 2 and the upper end surface of the die 1 is 15-35 cm; more preferably 20-30 cm.
A method for using a die system for preparing a polishing pad is characterized in that a die is used for accommodating a gelation reaction material, the initial temperature of a first heat-conducting medium is the same as that of a second heat-conducting medium, the initial temperatures of the first heat-conducting medium and the second heat-conducting medium are both 30-70 ℃, and the temperature of the heat-conducting medium is adjusted in the gelation reaction process so that the temperature difference between the temperature of the heat-conducting medium and the temperature measured by a corresponding temperature sensor is 5-25 ℃;
preferably, the initial temperature is 35-65 ℃, and the temperature difference between the heat-conducting medium and the temperature measured by the corresponding temperature sensor in the gelation process is controlled to be 8-20 ℃.
In a preferred embodiment, the corresponding digital control system regulates the supply of heat to the heat-conducting medium if the temperature sensor determines a temperature difference between the temperature and the heat-conducting medium of more than 25 ℃, and the corresponding digital control system regulates the cooling of the heat-conducting medium if the temperature difference between the temperature and the heat-conducting medium is less than 5 ℃.
The polishing pad prepared by the preparation method and the die system for preparing the polishing pad has high uniformity from top to bottom, few stripes, uniform density and performance, and the yield of products is close to 100 percent. Wherein the casting thickness of the polishing pad is preferably in the range of 1-5 cm. The greater the casting thickness of the polishing pad, the greater the temperature difference between the inside and outside of the polishing pad, and the impact on the performance of the polishing pad.
The preparation method provided by the invention provides the optimal process conditions in the pouring and gelling processes, and the polishing pad with less stripes, uniform density and high yield is obtained by controlling the change of the system temperature in the whole process. In the chemical mechanical polishing process, the polished material can obtain better surface appearance.
The following examples are used to illustrate the performance of polishing pads prepared by the above-described method and mold system for preparing polishing pads. Unless otherwise specified, the technical means used in the examples are conventional technical means well known to those skilled in the art. The reagents used in the examples are commercially available unless otherwise specified.
Example 1
A predetermined amount of liquid prepolymer, curing agent and microspheres were mixed, set to 60 degrees after degassing was completed and circulated in a casting machine, and liquid MOCA (4,4 '-diamino-3, 3' -dichlorodiphenylmethane) was set to 116 ℃ for circulation. The base and outer wall temperatures were pre-adjusted to stabilize to 50 ℃. Mixing the materials in a high-speed stirring head according to a certain proportion, and pouring the mixture to the center of a die cavity to ensure that the mixture is uniformly leveled. The temperature of the mixture during casting was measured to be 65.3 ℃ and the viscosity 10000cps (50 ℃). When the whole thickness of the casting is about 5cm, the casting is stopped, and the temperature rise rate of the reaction materials is controlled to be 3.9 ℃/min in the gelation process. Along with the proceeding of the gelling process, when the temperature difference between the reaction material and the heat-conducting medium is increased to more than 25 ℃, the first digital control system controls the temperature adjusting device to heat the heat-conducting medium so as to reduce the temperature difference and keep the temperature difference in a proper range. At the same time, the wind speed of the draft hood above the mold cavity increases with increasing temperature. When the surface temperature of the system is detected to be maintained at 80 ℃ and has a downward trend, the casting body is transferred into an oven to be cured, the temperature of the oven is increased to 100 ℃ within 30min, and the curing is carried out for 16 h. After curing, the sheets were cut to a thickness of about 2mm, for a total of 25 sheets. The yield and the polished NU value of the obtained polishing pad are shown in Table 1
TABLE 1 polishing pad yield and polished NU (%) value
Example 2
A polishing pad was prepared in the same manner as in example 1, except that: the temperature of the mixed materials is 63.8 ℃; controlling the temperature rise rate of the reaction materials to be 3.5 ℃/min in the gelation process; the temperature difference between the reaction mass and the mold was maintained at 12.8 ℃. The yield and polished NU of the resulting polishing pad are shown in Table 1.
Example 3
A polishing pad was prepared in the same manner as in example 1, except that: the temperature of the mixed materials is 58.2 ℃, and the viscosity is 13000 cps; controlling the temperature rise rate of the reaction materials to be 5.5 ℃/min in the gelation process; the temperature difference between the reaction mass and the mold was maintained at 18.3 ℃. The yield and polished NU of the resulting polishing pad are shown in Table 1.
Comparative example 1
A polishing pad was prepared in the same manner as in example 1, except that: the reaction mass naturally gelates in the mould without regulating the temperature.
Comparative example 2
A polishing pad was prepared in the same manner as in example 1, except that: the temperature of the mixed material is 88.5 ℃, and the viscosity is 7000 cps; controlling the temperature rise rate of the reaction materials to be 4.3 ℃/min in the gelation process; the temperature difference between the reaction mass and the mold was maintained at 14.8 ℃. The yield and polished NU of the resulting polishing pad are shown in Table 1.
Comparative example 3
A polishing pad was prepared in the same manner as in example 1, except that: the temperature of the mixed materials is 64.4 ℃; controlling the temperature rise rate of the reaction materials to be 8.6 ℃/min in the gelation process; the temperature difference between the reaction mass and the mold was maintained at 15.5 ℃. The yield and polished NU of the resulting polishing pad are shown in Table 1.
Comparative example 4
A polishing pad was prepared in the same manner as in example 1, except that: the temperature of the mixed materials is 65.1 ℃; controlling the temperature rise rate of the reaction materials to be 3.8 ℃/min in the gelation process; the temperature difference between the reaction mass and the mold was maintained at 27.3 ℃. The yield and polished NU of the resulting polishing pad are shown in Table 1.
Comparative example 5
A polishing pad was prepared in the same manner as in example 1, except that: the temperature of the mixed materials is 65.8 ℃, and the viscosity is 23000 cps; controlling the temperature rise rate of the reaction materials to be 4.2 ℃/min in the gelation process; the temperature difference between the reaction mass and the mold was maintained at 15.2 ℃. The yield and polished NU of the resulting polishing pad are shown in Table 1.
As can be seen from the yield parameters of the polishing pad prepared in table 1, the temperature and viscosity of the mixture, the heating rate of the reaction material, and the temperature difference between the reaction material and the mold are maintained in a suitable range, which can significantly improve the yield of the prepared polishing pad. Finally, the method of the present invention is only a preferred embodiment and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (9)

1. A die system for preparing a polishing pad is characterized by comprising a die for containing reaction materials, wherein the die comprises a hollow substrate and an outer wall with a hollow structure, the outer wall is positioned on the upper side of the substrate and is in contact with the upper end face of the substrate, a first temperature sensor is arranged on the substrate and is used for monitoring the temperature of the upper end face of the substrate in real time;
the outer wall is provided with a second temperature sensor, and the second temperature sensor is used for monitoring the temperature of the inner end face of the outer wall in real time;
a space between the substrate and the outer wall and above the substrate forms a die cavity for accommodating the reaction materials;
a first pipeline through which a first heat-conducting medium flows is arranged in the substrate, a second pipeline through which a second heat-conducting medium flows is arranged in the outer wall, the temperature of the first heat-conducting medium is regulated by a first temperature regulating device, and the temperature of the second heat-conducting medium is regulated by a second temperature regulating device;
the first temperature adjusting device is connected with a first digital control system, the second temperature adjusting device is connected with a second digital control system, the first digital control system is used for adjusting the temperature of the first heat-conducting medium based on the temperature of the upper end face of the base, and the second digital control system is used for adjusting the temperature of the second heat-conducting medium based on the temperature of the inner end face of the outer wall;
the exhaust hood is arranged above the die and used for reducing the surface temperature of the reaction materials; the air suction opening of the air suction cover faces the mold cavity, a panel is fixed at the lower end of the cover body of the air suction cover, the panel is parallel to the substrate, and a plurality of through holes are uniformly distributed in the panel.
2. The mold system for preparing a polishing pad as recited in claim 1, wherein a plurality of said first temperature sensors are disposed on said substrate, said plurality of said first temperature sensors being evenly distributed around a center of said substrate.
3. The mold system according to claim 2, wherein the outer wall is a hollow cylinder, and a plurality of the second temperature sensors are provided on the outer wall to equally divide the outer wall in a circumferential direction of the outer wall.
4. The mold system for preparing a polishing pad as recited in claim 1, wherein the face plate has a diameter 1.1-1.3 times a diameter of the mold cavity.
5. The mold system according to claim 1, wherein a plurality of infrared thermometers are uniformly disposed on the panel, the infrared thermometers are used for acquiring the temperature of the upper surface of the reaction material, the infrared thermometers are connected to a third digital control system, and the third digital control system regulates the air speed of the air suction opening according to the temperature change rate of the upper surface of the reaction material.
6. The mold system for preparing a polishing pad as set forth in claim 5, wherein the distance between the upper end surface of the reaction mass and the face plate is 10-40 cm.
7. The method of using a mold system for manufacturing a polishing pad according to claim 1, wherein the mold is used to contain a gelation reaction material, the initial temperature of the first heat transfer medium and the initial temperature of the second heat transfer medium are the same, and the initial temperature is 30 to 70 ℃, and the temperature of the heat transfer medium is adjusted during the gelation reaction so that the difference between the temperature measured by the temperature sensor and the temperature of the heat transfer medium is between 5 ℃ and 25 ℃.
8. Use according to claim 7,
the initial temperature of the first heat-conducting medium and the second heat-conducting medium is 35-65 ℃, and the difference between the temperature measured by the temperature sensor and the temperature of the heat-conducting medium is controlled between 8 ℃ and 20 ℃ in the gelation process.
9. Use according to claim 7, wherein the corresponding digital control system regulates the supply of heat to the heat-conducting medium if the temperature sensor determines a temperature difference between the temperature and the heat-conducting medium of more than 25 ℃, and the corresponding digital control system regulates the cooling of the heat-conducting medium if the temperature difference between the temperature and the heat-conducting medium is less than 5 ℃.
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