CN108215028A - A kind of mold system and its application method for being used to prepare polishing pad - Google Patents
A kind of mold system and its application method for being used to prepare polishing pad Download PDFInfo
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- CN108215028A CN108215028A CN201711354504.3A CN201711354504A CN108215028A CN 108215028 A CN108215028 A CN 108215028A CN 201711354504 A CN201711354504 A CN 201711354504A CN 108215028 A CN108215028 A CN 108215028A
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- temperature
- heat
- reaction mass
- substrate
- mold
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/26—Moulds or cores
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/009—Tools not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/38—Heating or cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/44—Measuring, controlling or regulating
Abstract
The present invention provides a kind of mold system and its application method for being used to prepare polishing pad, mold including being used to house reaction mass, the mold includes the outer wall of substrate and hollow cylinder structure, and the space between the substrate and outer wall and above the substrate forms the die cavity for housing the reaction mass；The substrate is equipped with the first temperature sensor, and first temperature sensor is used to monitor the temperature of the substrate upper surface in real time；Second temperature sensor is provided on the outer wall, the second temperature sensor is used to monitor the temperature of the outer wall inner face in real time；First temperature sensor is connected with the second temperature sensor with the first numerical control system, and first numerical control system is according to the temperature of the substrate upper surface and the temperature real-time monitoring of the outer wall inner face to the heated condition of the mold.The mold system for being used to prepare polishing pad of the present invention, simple in structure, temperature control is more accurate, more efficient.
Description
Technical field
The present invention relates to the polishing technology fields of chemical-mechanical planarization processing, are used to prepare more particularly, to one kind
The mold system and its application method of polishing pad.
Background technology
In integrated circuit and other electronic equipment manufacturings, the multilayer conductive material that will be deposited on semiconductor wafer surface is needed
Material, semi-conducting material and dielectric material removal.Chemical machinery plane polishing or chemically mechanical polishing (CMP) are currently used for workpiece
Surface polishes most common technology.CMP be by chemical erosion and mechanical removal combination technology and to semiconductor wafer etc
Planarize most common technology.At present, it during conventional CMP, on the bracket component of equipment, while sets polished
The position contacted in journey with polishing pad.Chip has been applied in controllable pressure in polishing process, presses to polishing pad, passes through external driving force
Make polishing pad relative to wafer rotational.There is the polishing fluid that duration instills in rotation process, so as to pass through the machine of pad interface
Tool acts on and the chemical action of polishing fluid, and wafer surface is planarized.
United States Patent (USP) US5578362R provides a kind of polishing pad of known technology, and the polishing pad is comprising there are many dispersions
The polymer substrate of microsphere.The microsphere is ordinarily incorporated into a kind of liquid polymers matrix, then former with other curing
Material mixing finally moves into mold and cures, the object of molding then is cut into polishing pad.Unfortunately, shape in this way
Into polishing pad may defective property striped, the problem of Density Distribution unevenness and low yield.
Caused by defective striped is the bulk density difference of microsphere in polymer substrate or material mixing unevenness.This
A little stripeds are undesirable, and the inhomogenous region of difference microballoon bulk densities or reaction in this way can lead to polishing pad appearance not
Standard up to standard may more seriously lead to the inhomogenous of polishing performance in polishing process.Density Distribution unevenness be due to cast and
System (pour mass) entirety heat is unevenly distributed in gel process, causes microsphere expansion degree inconsistent, so as to cause entire body
Layer is fastened to lower floor, the intermediate Density Distribution to periphery is uneven.On the one hand linear thermal expansion non-controllable in this way can lead to technological process
Poor repeatability in control, can make the density qualification rate of whole system reduce, in addition, the distribution of conplane different densities may
Influence the stability of result in polishing process.
Invention content
It solves the above problems in order to overcome the problems referred above or at least partly, the present invention provides one kind to be used to prepare polishing
The mold system and its application method of pad, during preparing polishing pad with solution, gelling temp is difficult to accurately control and influence
The technical issues of polishing pad quality.
According to an aspect of the present invention, a kind of mold system for being used to prepare polishing pad is provided, including including for holding
The mold of reaction mass is put, the mold includes the outer wall of hollow substrate and hollow structure, and the outer wall is located at the substrate
It upside and is contacted with the upper surface of the substrate, the substrate is equipped with the first temperature sensor, first temperature sensor
For monitoring the temperature of the substrate upper surface in real time；
Second temperature sensor is provided on the outer wall, the second temperature sensor is used to monitor the outer wall in real time
The temperature of inner face；
Space between the substrate and outer wall and above the substrate forms to house the reaction mass
Die cavity；
The first pipe of the first heat-conducting medium is connected in the substrate equipped with inside stream, internal circulation is equipped in the outer wall
There is a second pipe of the second heat-conducting medium, first heat-conducting medium adjusts temperature by the first temperature-adjusting device, and described second
Heat-conducting medium adjusts temperature by second temperature regulating device；
First temperature-adjusting device is connected with the first numerical control system, the second temperature regulating device and second
Numerical control system is connected, and first numerical control system is for the temperature adjustment described first based on the substrate upper surface
The temperature of heat-conducting medium, second numerical control system are led for the temperature adjustment described second based on the outer wall inner face
The temperature of thermal medium.
Further, multiple first temperature sensors, multiple first temperature sensors are set in the substrate
It is uniformly distributed around the center of the substrate.
Further, the outer wall is hollow cylinder, and the outer wall, which is equipped with along outer wall circumferential direction, divides equally the more of outer wall
A second temperature sensor.
Further, the top for being set to the mold, the pumping for reducing the reaction mass surface temperature are further included
Fan housing；The suction opening of the draught hood is fixed with panel towards the die cavity, the cover body lower end of the draught hood, and the panel is put down
Row is evenly distributed with multiple through-holes in the substrate on the panel.
Further, 1.1-1.3 times of the diameter of a diameter of die cavity of the panel.
Further, uniformly distributed on the panel to have multiple infrared radiation thermometers, the infrared radiation thermometer is used to obtain institute
The temperature of reaction mass upper surface is stated, the infrared radiation thermometer is connected with third numerical control system, and the third is digital control
System regulates and controls the wind speed size of the suction opening according to the rate temperature change of the reaction mass upper surface.
Further, distance is 10-40cm between the upper surface of the reaction mass and the panel.
According to another aspect of the present invention, a kind of application method for the mold system for being used to prepare polishing pad is also provided,
Mold is for housing gelation reaction material, and the initial temperature of the first heat-conducting medium and the second heat-conducting medium is identical, initial temperature
It is 30-70 DEG C, the temperature of heat-conducting medium is adjusted during gelation reaction, makes itself and corresponding temperature sensor measurement temperature
The temperature difference be 5-25 DEG C；
Preferably, initial temperature is 35-65 DEG C, and heat-conducting medium in gelation process is controlled to be surveyed with corresponding temperature sensor
The temperature difference of constant temperature degree is 8-20 DEG C.
Further, it is corresponding digital control if temperature sensor measurement temperature and the temperature difference of heat-conducting medium are more than 25 DEG C
System regulation is to heat-conducting medium heat supply, if the two temperature difference is less than 5 DEG C, corresponding numerical control system regulation and control cooling heat conduction is situated between
Matter.
The beneficial effects are mainly as follows following aspects：
By being correspondingly arranged temperature sensor and corresponding first and second digital control system in substrate and outer wall
System can accurately and comprehensively regulate and control the temperature difference of different test points and heat-conducting medium in die cavity, you can regulate and control accommodating difference respectively
The temperature difference of reaction mass and mold at position, so as to the orderly heat dissipation for dredging reaction mass；Meanwhile it is set above mold
Draught hood is put, further regulates and controls the surface temperature of the reaction mass housed in die cavity, so as to from each directional surveillance and tune
The temperature change of reaction mass is controlled, to prepare the polishing pad of high-quality.
Description of the drawings
Fig. 1 is according to the mold structure diagram that temperature sensor is carried in a preferred embodiment of the invention；
Fig. 2 is the structure diagram according to the draught hood that infrared radiation thermometer is carried in a preferred embodiment of the invention.
Specific embodiment
With reference to embodiment and attached drawing, the specific embodiment of the present invention is described in further detail.Implement below
Example is used to illustrate the present invention, but be not limited to the scope of the present invention.
The first object of the present invention is the provision of a kind of preparation method of polishing pad, and this method comprises the following steps：It will
Liquid prepolymer, curing agent are mixed with hollow microcomponent at 50~85 DEG C, to form curable mixtures, the curable mixing
The viscosity of object is 3000-20000cps, after gel curing to get；The liquid prepolymer is to be by polyalcohol and isocyanates
The polyurethane prepolymer that raw material reaction forms.
Cast, gel and curing are generally included in the preparation process of polishing pad.And in mixed process is poured into a mould, pass through by
The mixing temperature of liquid prepolymer, curing agent and hollow microcomponent is controlled at 50~85 DEG C, and viscosity is controlled in 3000-20000cps
When, mixing and reaction effect are more satisfactory；Also, the reaction mass formed by liquid prepolymer, curing agent with hollow microcomponent
Heat release is controllable.
If mixing temperature is too low, material reaction rate is low, in gel phase extent of reaction deficiency, leads to material in performance
Optimum state is not achieved, such as elasticity modulus reduces, the removal efficiency of polishing pad, and reduced service life can be reduced in this way.
If mixing temperature is too high, the reaction heat of material is high, and heat release is violent, uncontrollable heat can be caused swollen in gel phase
It is swollen, make above-mentioned expandable hollow microcomponent volume expansion, the density for leading to material system entirety is relatively low, and Density Distribution pole is not
Uniformly.In addition, the thermal expansion due to reaction mass can also make microballoon displacement in material system, lead to different zones microballoon
Bulk density distribution is inconsistent, eventually leads to the generation of striped.
Wherein, viscosity is preferably to measure obtained value at 50 DEG C.
Wherein, corresponding curing agent known in the field is usually added into foregoing curable mixture.
In a preferred embodiment, it is preferably with the temperature that hollow microcomponent mixes by liquid prepolymer, curing agent
55~85 DEG C；More preferably 60~80 DEG C.
In a preferred embodiment, after liquid prepolymer, curing agent being mixed with hollow microcomponent, gained is consolidated
The viscosity for changing mixture is preferably 4000-18000cps；More preferably 5000-16000cps.
In a preferred embodiment, aforesaid liquid prepolymer is is that raw material reacts by polyalcohol and isocyanates
Polyurethane prepolymer.
In a preferred embodiment, polyalcohol is polyester polyol or polyether polyol or polyester polyol with gathering
The mixture of ethoxylated polyhydric alcohol.
In a preferred embodiment, for the strip flaw rate smaller of polishing pad ensured, different zones
Nonhomogeneous hardness smaller, performance is more uniform, further included in the preparation method by the curable mixtures be transferred in mold into
Row gelation.Wherein, the initial temperature of the mold is 30-70 DEG C, controls the temperature of reaction mass and regulation and control in gel process
The temperature difference of the heat-conducting medium of 1 temperature of mold is 5-25 DEG C.
It is mentioned that mold can be heated by setting heat-conducting medium heat transfer, and pass through the temperature for changing heat-conducting medium
It spends to realize the regulation and control to mold temperature.
In a preferred embodiment, the curable mixtures are transferred in mold and carry out gelation.Wherein, institute
It is 35-65 DEG C to state the initial temperature of mold, controls heat-conducting medium of the reaction mass with regulating and controlling 1 temperature of mold in gel process
The temperature difference be 8-20 DEG C.
In a preferred embodiment, the curable mixtures are transferred in mold 1 and carry out gelation.Wherein,
The initial temperature of the mold 1 is 40-60 DEG C, controls heat conduction of the reaction mass with regulating and controlling 1 temperature of mold in gel process
The temperature difference of medium is 10-15 DEG C.
In a preferred embodiment, liquid prepolymer, curing agent are mixed with hollow microcomponent in the head of casting machine
After the completion of conjunction, obtained curable mixtures are poured into gelation in mold 1.
Wherein, the heating rate that reaction mass is preferably controlled in gelation process is 0-6 DEG C/min；Preferably 0-5 DEG C/
min；More preferably 0-4 DEG C/min.
In a preferred embodiment, in order to which the control to reaction mass gelation process is better achieved, mold 1 wraps
Include the outer wall 12 of hollow substrate 11 and hollow structure.Outer wall 12 is located at the upside of substrate 11, and the bottom end of outer wall 12 and substrate
11 upper surface contact.
Die cavity is formed between the substrate 11 and outer wall 12 and positioned at the space of 11 top of substrate.By reaction mass namely
Foregoing curable mixture, which is transferred in the die cavity, carries out gelation；It is equipped in the substrate 11 and outer wall 12 for real-time
The temperature sensor of reaction mass temperature is recorded, meanwhile, each temperature sensor is connected respectively with corresponding numerical control system, number
Word control system is used for the heating for detecting temperature, that is, reaction mass temperature according to temperature sensor and carrying out adjustment heat-conducting medium in real time
State, to regulate and control the temperature in die cavity, as shown in Figure 1.
Specifically, the first temperature sensor 13 is connected with the first numerical control system；Accordingly, it is set inside substrate 11
Have first pipe, there is the first heat transfer medium flows in first pipe, the first heat-conducting medium after being heated or cooled for heat or
Cool down substrate 11；First numerical control system regulates and controls according to the temperature data of the first temperature sensor 13 to the first heat-conducting medium
It is heated or cooled.First pipe can be embedded to 11 inside of substrate or be adjacent to the bottom setting of substrate 11.
Second temperature sensor is connected with the second numerical control system；Accordingly, it is internally provided with the second pipe in outer wall 12
There are the second heat transfer medium flows in road in second pipe, and the second heat-conducting medium after being heated or cooled is for being heated or cooled outer wall
12.Second numerical control system regulates and controls according to the temperature data of the first temperature sensor 13 to the heating of the second heat-conducting medium or cold
But.Second pipe can surround the periphery of outer wall 12 to be embedded in the inside of outer wall 12 or around being closely attached on outer wall 12
Side wall is set.
Below unless otherwise specified, numerical control system regulation and control heat-conducting medium states corresponding numerical control system with leading
Regulation and control between thermal medium.
That is, being provided with the first temperature sensor 13 in substrate 11, outer wall 12 is provided with second temperature sensor 14, can measure
The temperature of reaction mass simultaneously feeds back to corresponding numerical control system.When reaction acutely progress, detect that reaction mass temperature is opened
When beginning to increase, if the temperature difference is more than 25 DEG C, the control heat-conducting medium heating of the first numerical control system is maintained in substrate 11 and mold 1
The temperature difference of reaction mass leniently dredges the diverging of heat in reaction mass, is unlikely to lead reaction mass sharp temperature drop
Cause reaction uneven.If both initial temperature difference is less than 5 DEG C, the first numerical control system control heat-conducting medium is begun to cool down, substrate
11 and 12 temperature of outer wall begin to decline, the temperature difference of heat-conducting medium and reaction mass is maintained at suitable range, is unlikely to influence anti-
Answer the heat dissipation of material.Second numerical control system regulates and controls the temperature difference in a manner of identical with the first numerical control system.
Wherein, substrate is oriented generally along x-y plane, and die cavity has the central shaft perpendicular to x-y plane.
In a preferred embodiment, it is more accurately controlled to realize, die cavity can be set as circular ring shape.It is described
Outer wall 12 is the cylinder with hollow structure.The substrate 11 is multiple for real-time along the distribution of respectively annular radii radial direction
Detect the first temperature sensor 13 of temperature.The outer wall 12, which is equipped with along outer wall 12 is circumferential, divides equally the multiple for real of outer wall 12
When detect temperature second temperature sensor 14.
Further, pipeline is additionally provided in the cavity inside of substrate 11 and outer wall, there are heat transfer medium flows in the pipeline,
Also, the both ends of pipeline are connected respectively with temperature-adjusting device, which is also connected with numerical control system.
For example, 8 the first temperature sensors 13 can be set along annular radii radial direction is divided equally in substrate, on outer wall 12
Equipped with 8 second temperature sensors 14 for dividing equally outer wall 12 along outer wall circumferential direction.
Specifically, pipeline can be the bend pipe of the forms such as straight tube or spiral, as long as can reach has mold 1
Imitate the purpose of heat exchange.The heat-conducting medium to circulate in pipeline can be the heat-conducting mediums such as water, conduction oil.The both ends difference of pipeline
It is connected with temperature-adjusting device, the mode being connect with temperature-adjusting device is flexible, is heated or cooled in pipeline as long as can reach
The purpose of heat-conducting medium, so that heat-conducting medium in pipeline plays the role of heat exchange with mold, so as to play heating or cold
But the effect of mold, and then adjust the temperature difference of the heat-conducting medium of reaction mass and Heat Conduction Material.Reaction mass and heat-conducting medium
The temperature difference is maintained at suitable range, can make the rate of heat dispation of reaction mass will not fluctuate too greatly, so as to promote prepared throwing
The quality of light pad.
Specifically, the first temperature sensor 13 and second temperature sensor 14 respectively with the first numerical control system and second
Numerical control system is connected.First temperature sensor 13 and second temperature sensor 14 will monitor the obtained surface of reaction mass
Temperature is delivered to the first numerical control system and the second numerical control system respectively.
Numerical control system is the temperature information according to heat-conducting medium in the surface temperature information and pipeline, i.e., according to pipe
The surface temperature of reaction mass that the temperature of heat-conducting medium senses with the first temperature sensor 13 or second temperature sensor 14 in road
Degree is poor, regulates and controls the heated condition to mold 1, so as to regulate and control in the temperature of mold 1 namely adjustment 11 upper surface of substrate or outer wall 12
The temperature of end face, so as to achieve the purpose that regulate and control the temperature of reaction mass in die cavity.Surface temperature and heat conduction when reaction mass
The temperature gap of medium is in OK range, then the temperature of heat-conducting medium remains unchanged；When the surface temperature of reaction mass is with leading
The temperature gap of thermal medium is less than preset minimum, then cools down to heat-conducting medium, makes the temperature and reaction mass of heat-conducting medium
Surface temperature difference increase；When the surface temperature of reaction mass and the temperature gap of heat-conducting medium are higher than preset peak,
It then heats up to heat-conducting medium, reduces the temperature of heat-conducting medium and the surface temperature difference of reaction mass.
That is, being correspondingly arranged the first temperature sensor 13 and second temperature sensor 14 on substrate 11 and outer wall 12, can measure
The surface temperature of reaction mass simultaneously feeds back to corresponding numerical control system.
For example, the reaction when the reaction mass in die cavity acutely carries out, when the temperature of reaction mass starts raising, if heat conduction
The temperature difference of the temperature of medium and the temperature of reaction mass is more than 25 DEG C, and numerical control system controls temperature-adjusting device heating to lead
Thermal medium increases the temperature of heat-conducting medium, so as to reduce the difference of the temperature of the temperature of heat-conducting medium and reaction mass.
If the two temperature difference is less than 5 DEG C, numerical control system control temperature-adjusting device cooling heat-conducting medium makes heat conduction be situated between
The difference of the temperature of matter and the temperature of reaction mass increases, so as to increase the difference of the temperature of the temperature of heat-conducting medium and reaction mass
Value.The temperature difference between heat-conducting medium and reaction mass is controlled in this way, makes reaction mass in gelation process, is reacted
The temperature of material and the temperature of heat-conducting medium will not be excessive or too small, so as to dredge the thermal accumlation inside reaction mass, make anti-
Material is answered in gelation process, temperature of charge will not decline excessive/too fast or reaction mass and the temperature difference of environment will not mistake
Greatly, cause reaction uneven, influence polishing pad quality.
In a preferred embodiment, in order to be better achieved the yield of regulation and control and product, in above-mentioned preparation method
It is additionally included in the wind speed adjusted in gelation process for reducing reaction mass surface temperature：
When the temperature rise rate on reaction mass surface is in 0-2 DEG C/min, wind speed 1000-2000m is kept3/ h, when warm raising speed
For rate in 2-4 DEG C/min, wind speed is set as 2000-3000m3/ h, when temperature rise rate is more than 4 DEG C/min, wind speed increases to
3000-4000m3/h.In addition, the maximum temperature of control reaction mass is also needed in gel process, when temperature is higher than 90 degree, instead
Answering material, no matter heating rate is how much to be required to wind speed to increase to 3000-4000m at that time3/ h can cause because temperature is excessively high
The uncontrollable expansion of inner hollow microcomponent, leads to density unevenness one.
It in a preferred embodiment, can be by gelation process, in mold 1 in order to realize above-mentioned regulation and control
Top be equipped with draught hood 2, draught hood 1 includes cover body 23 and panel 21, and panel 21 is fixed on the lower end of cover body 23.Draught hood 2
Panel 21 be equipped with for obtain reaction mass surface temperature infrared radiation thermometer 22 and for according to the surface temperature
The third numerical control system of change rate regulating tuyere wind speed size.
It, can be by the way that in gelation process, draught hood 2, exhausting be equipped in the top of mold 1 in order to realize above-mentioned regulation and control
The suction opening of cover 2 is towards mold 1.The infrared radiation thermometer 22 set at panel 21 obtains the surface temperature of reaction mass in mold 1,
And the surface temperature information is delivered to third numerical control system, third numerical control system is according to the surface temperature rate
Information controls the running of draught hood 2.
When needing to reduce when the surface heating rate of reaction mass in mold 1 is excessively high, start draught hood 2 and be in exhausting shape
State, to reduce the surface heating rate of reaction mass in mold 1；When infrared radiation thermometer 22 perceives the table of reaction mass in mold 1
Face heating rate is down to desired value, infrared radiation thermometer 22 by real time temperature information conveyance at this time to third numerical control system,
Wind speed is adjusted in third numerical control system, to slow down the cooling effect to reaction mass in mold 1.
In a preferred embodiment, panel 21 is preferably divided into multiple zonules, is all provided in each zonule useful
In the infrared radiation thermometer 22 for obtaining corresponding reaction mass surface temperature.For example, panel 21 is divided into 12 zonules, such as Fig. 2
It is shown.The adjustable wind speed preferred scope of each zonule is 1000-5000m3/h。
Specifically, draught hood 2 is divided into several zonules, and corresponding infrared measurement of temperature is correspondingly arranged in each zonule
Instrument enables infrared radiation thermometer 22 comprehensively and accurately to reflect the surface temperature of reaction mass in mold 1, so that third number control
System processed can more accurately regulate and control the working condition of draught hood 2.
In a preferred embodiment, 2 preferably circular draught hood of draught hood, the 1.1- of a diameter of die cavity diameter
1.3 times, the height of the upper surface from reaction mass is 10-40cm.The diameter range of draught hood is 1.1-1.3 times, is mainly examined
Consider cooling effect, it is too small to cover casting area comprehensively, make very much entire casting area wind speed uneven greatly, and easily form circulation, make anti-
Material inhomogeneous cooling is answered to weigh.It is used for the setting of height is corresponding with wind speed, too low to influence heat dissipation, too high wind speed subtracts
It is small.
In a preferred embodiment, 2 preferably circular draught hood of draught hood, 1.2 times of a diameter of die cavity diameter；
Height of the draught hood from the upper surface of reaction mass is 15-35cm；Preferably more excellent 20-30cm.
In a preferred embodiment, when the constant temperature of detection reaction mass and not less than 60 in gelation process
DEG C, reaction mass is cured, to form cured material to get the polishing pad.Specifically, in gelation process, work as detection
The constant temperature on reaction mass surface and in higher than 60 DEG C, reaction mass is cured, to form cured material to get described
Polishing pad.
For different systems, the difference of type of polymer can make reaction heat different, that is, react attainable highest
Temperature and rate are different, if the temperature of gel reaction stabilization sub stage be not less than 60 degree, for material final performance without too
Big to influence, if temperature is too low, molecular chain mobility weakens, the extent of reaction of cure stage after reducing, and reduces the mechanics of materials
Energy.
Curing is typically that reaction mass after gelation is put into baking oven to cure, cured temperature and time this field
Technical staff can be depending on curing degree.
It is another object of the present invention to provide the polishing pads that above-mentioned preparation method is prepared.
It is shown in Figure 1, it is another object of the present invention to provide a kind of mold system for being used to prepare polishing pad,
Gelation including being used for reaction mass, the mold system for being used to prepare polishing pad include mold 1, and the mold 1 includes base
Bottom 11 and the outer wall 12 of hollow cylinder structure, the outer wall 12 be located at 11 upside of the substrate and with the upper end of the substrate 11
Face contacts.The substrate 11 is equipped with the first temperature sensor 13, and first temperature sensor 13 is for described in monitoring in real time
The temperature of substrate upper surface；Second temperature sensor 14 is provided on the outer wall, the second temperature sensor 14 is for real
When monitor the temperature of 12 inner face of outer wall；
Die cavity is formed between the substrate 11 and outer wall 12 and positioned at the space of 11 top of substrate, it is described to be based on
The temperature of substrate upper surface and the temperature of the outer wall inner face adjust the temperature of the reaction mass.
Wherein, substrate 11 is oriented generally along x-y plane, and die cavity has the central shaft perpendicular to x-y plane.
In order to which the control to reaction mass gelation process is better achieved, mold 1 preferably includes hollow substrate 11 and tool
There is the outer wall 12 of hollow cylinder structure, and the upper and lower ends of outer wall 12 are open.The lower end of outer wall 12 and the upper surface of substrate 11
Contact makes to form die cavity between substrate 11 and outer wall 12 and positioned at the space of 11 top of substrate.
After liquid prepolymer, curing agent are sufficiently mixed uniformly with hollow microcomponent, it is transferred to gelation in the die cavity.Reaction
After material is transferred in die cavity, reaction mass is contacted with the inner face of substrate 11 and the inner face of outer wall 12, and reaction mass exists
Shape in die cavity is identical with the shape of die cavity.
Reaction mass is contacted with the inner face of substrate 11, then the first temperature sensor 13 set in substrate 11 can monitor
Obtain the temperature of reaction mass contacted with 11 upper surface of substrate.That is, the substrate that the first temperature sensor 13 monitors
The temperature of 11 upper surfaces is actually the temperature of the reaction mass bottom surface housed in die cavity.
Equally, reaction mass is contacted with the inner face of outer wall 12, then 14 energy of second temperature sensor set on outer wall 12
Enough monitorings obtain the temperature of reaction mass contacted with 12 inner face of outer wall.That is, second temperature sensor 14 monitors to obtain
12 inner face of outer wall temperature, be actually in die cavity house reaction mass side surface temperature.
Therefore, the first temperature sensor 13 and second temperature sensor 14, energy are correspondingly arranged in substrate 11 and outer wall 12
Enough surface temperatures for more comprehensively, accurately monitoring reaction mass accommodating in die cavity.
In a specific embodiment, gelation is carried out when reaction mass is transferred in mold 1, the mold 1 is initial
Temperature for 30-70 DEG C, it is 5-25 DEG C to control the temperature difference of reaction mass and the mold 1 in gelation process.
In a preferred embodiment, curable mixtures are transferred in the mold 1 and carry out gelation, the mold
1 initial temperature is 35-65 DEG C, and it is 8-20 DEG C to control the temperature difference of reaction mass and the mold 1 in gelation process.
In a preferred embodiment, the curable mixtures are transferred in mold 1 and carry out gelation.Wherein,
The initial temperature of the mold 1 is 40-60 DEG C, and it is 10-15 to control the temperature difference of reaction mass and the mold 1 in gel process
℃。
Specifically, after reaction mass is transferred in mold 1, gelation reaction is carried out in mold 1.It is at this point, curable
Material becomes the reaction mass in mold 1, regulates and controls the temperature between the initial temperature of mold 1 and reaction mass and mold 1
Difference, the strip flaw rate smaller of the polishing pad enabled to, the nonhomogeneous hardness smaller of different zones, performance are more uniform.
In a preferred embodiment, the pipeline that inside stream is connected with heat-conducting medium is further included, the pipeline extends transversely through
The substrate, the both ends of the pipeline are connected respectively with temperature-adjusting device；The temperature-adjusting device and numerical control system
It is connected, the numerical control system is for the temperature based on the substrate upper surface or the temperature of outer wall inner face adjustment institute
State the temperature of reaction mass.Specifically, temperature-adjusting device can be down to devices such as water-bath, oil baths.According to thermostatic
Type, temperature-adjusting device can be with the lower face contact or discontiguous of substrate 11.
Specifically, pipeline can be the bend pipe of the forms such as straight tube or spiral, as long as can reach has mold 1
Imitate the purpose of heat exchange.The medium to circulate in pipeline can be the media such as water, conduction oil.The both ends of pipeline respectively with temperature tune
Regulating device is connected, and the mode being connect with temperature-adjusting device is flexible, and heat-conducting medium in pipeline is heated or cooled as long as can reach
Purpose so that heat-conducting medium in pipeline plays the role of heat exchange with mold, mold is heated or cooled so as to play
Effect, and then adjust the temperature difference of reaction mass and Heat Conduction Material.The temperature difference of reaction mass and Heat Conduction Material is maintained at suitable model
It encloses, the rate of heat dispation of reaction mass can be made will not fluctuate too greatly, so as to promote the quality of prepared polishing pad.
Specifically, the first temperature sensor 13 and second temperature sensor 14 are connected with the first numerical control system.The
The surface temperature of reaction mass that monitoring obtains is delivered to the first number by one temperature sensor 13 and second temperature sensor 14
Control system.
First numerical control system is the temperature information according to heat-conducting medium in the surface temperature information and pipeline, i.e. root
The table of reaction mass sensed according to the temperature of heat-conducting medium in pipeline with the first temperature sensor 13 and second temperature sensor 14
Face temperature difference regulates and controls the heated condition to mold 1, so as to regulate and control the temperature of mold 1 namely adjustment 11 upper surface of substrate and outer wall
The temperature of 12 inner faces, so as to achieve the purpose that regulate and control the temperature of reaction mass in die cavity.When reaction mass surface temperature with
The temperature gap of heat-conducting medium is in OK range, then the temperature of heat-conducting medium remains unchanged；When the surface temperature of reaction mass
Temperature gap with heat-conducting medium then cools down to heat-conducting medium, makes the temperature of heat-conducting medium with reacting less than preset minimum
The surface temperature difference increase of material；When the surface temperature of reaction mass and the temperature gap of heat-conducting medium are higher than preset highest
Value then heats up to heat-conducting medium, reduces the temperature of heat-conducting medium and the surface temperature difference of reaction mass.
That is, being correspondingly arranged the first temperature sensor 13 and second temperature sensor 14 on substrate 11 and outer wall 12, can measure
The surface temperature of reaction mass simultaneously feeds back to corresponding numerical control system.
For example, the reaction when the reaction mass in die cavity acutely carries out, when the temperature of reaction mass starts raising, if heat conduction
The temperature difference of the temperature of medium and the temperature of reaction mass is more than 25 DEG C, and numerical control system controls temperature-adjusting device heating to lead
Thermal medium increases the temperature of heat-conducting medium, so as to reduce the difference of the temperature of the temperature of heat-conducting medium and reaction mass.
If the two temperature difference is less than 5 DEG C, control temperature is adjusted respectively for the first numerical control system and the second digital control system
Device cools down corresponding heat-conducting medium, increases the difference of the temperature of heat-conducting medium and the temperature of reaction mass, is led so as to increase
The difference of the temperature of thermal medium and the temperature of reaction mass.The temperature between heat-conducting medium and reaction mass is controlled in this way
Difference makes reaction mass in gelation process, and the temperature of reaction mass and the temperature of heat-conducting medium will not be excessive or too small, so as to
The thermal accumlation inside reaction mass is dredged, makes reaction mass in gelation process, temperature of charge will not decline excessive/mistake
Soon or the temperature difference of reaction mass and environment will not be excessive, and causes reaction uneven, influences polishing pad quality.
In a preferred embodiment, it is more accurately controlled to realize, the substrate 11 is provided with multiple described
First temperature sensor 13, multiple first temperature sensors are uniformly distributed around the center of the substrate.At one preferably
In embodiment, outer wall 12 is hollow cylindrical structure, and the outer wall 12 is equipped with along the circumferential respectively outer wall 12 of outer wall 12
Multiple second temperature sensors 14.
Specifically, the first temperature sensor 13 can be embedded at the inner wall of substrate 11, and second temperature sensor 14 can be embedded at
The inner surface of outer wall 12.First temperature sensor 13, second temperature sensor 14 are uniform cloth in substrate 11 or outer wall 12
It puts.Multiple first temperature sensors 13 are around the center arrangement of substrate 11；Multiple second temperature sensors 14 are in mold 1
Mandrel line is evenly arranged on outer wall 12.
For example, 8 the first temperature sensors 13 can be set along respectively annular radii radial direction in substrate 11；In outer wall 12
Equipped with multiple second temperature sensors 14 along the circumferential respectively outer wall 12 of outer wall 12.
It is shown in Figure 2, in a preferred embodiment, the top of mold 1 is provided with draught hood 2.Draught hood 2
Suction opening is towards mold 1.When draught hood 2 operates, it can be used to reduce the surface temperature of the reaction mass housed in mold 1
Degree, the efficiency distributed so as to intensified response material internal heat.
Further, draught hood 2 includes cover body 23 and panel 21.Panel 21 is provided at suction opening, which fixes
In the lower end of 2 cover body 23 of draught hood, and the plate face of panel 21 is parallel to substrate 11.It is evenly distributed on panel 21 multiple logical
Hole.Multiple through-hole runs through panel 21 along perpendicular to the direction of panel 21.
Specifically, multiple through-holes are set on panel 21, help to promote the running efficiency of draught hood 2, draught hood 2 is provided
Wind direction concentration act on reaction mass, promote the cooling efficiency to reaction mass.And make the temperature change of same surface of material
It is average, increase polishing pad uniformity.Meanwhile multiple through-holes are set in plate face 21, also allow for the accurate tune to 2 wind speed of draught hood
Control.
In a preferred embodiment, it is evenly distributed on the panel 21 multiple for obtaining the reaction mass
The infrared radiation thermometer 22 of surface temperature, the infrared radiation thermometer are used to obtain the temperature of the reaction mass upper surface.
In a preferred embodiment, draught hood 2 further includes third numerical control system.Infrared radiation thermometer 22 and third
Numerical control system is connected.Third numerical control system is used to be regulated and controled according to the rate temperature change of the reaction mass upper surface
The wind speed size of the suction opening.
Specifically, the infrared radiation thermometer 22 set at panel 21 obtains the upper surface temperature of reaction mass in mold 1, and will
The surface temperature information is delivered to third numerical control system, and third numerical control system is according to the upper surface rate temperature change
Control the running of draught hood 2.
When needing cooling when the heating rate of reaction mass upper surface in mold 1 is excessively high, increase the exhausting wind of draught hood 2
Speed, to reduce the upper surface heating rate of reaction mass in mold 1；When infrared radiation thermometer 22 is perceived in mold 1 on reaction mass
The heating rate on surface is down to desired value, and infrared radiation thermometer 22 is by real time temperature information conveyance at this time to the digital control system of third
Exhausting rate is adjusted in system, third numerical control system, to alleviate the cooling effect to reaction mass in mold 1.
In a preferred embodiment, panel 21 is preferably divided into multiple zonules, is all provided in each zonule useful
In the infrared radiation thermometer 22 for obtaining corresponding reaction mass surface temperature.For example, panel 21 is divided into 12 zonules, such as Fig. 2
It is shown.The adjustable wind speed preferred scope of each zonule is 1000-5000m3/h。
Specifically, draught hood 2 is divided into several zonules, and corresponding infrared radiation thermometer is correspondingly arranged in each zonule
22, infrared radiation thermometer 22 is enable comprehensively and accurately to reflect the surface temperature of reaction mass in mold 1, so that third number control
System processed can more accurately regulate and control the working condition of draught hood 2.
Specifically, uniformly distributed multiple infrared radiation thermometers 22 on the panel 21 of draught hood 2, and set and infrared radiation thermometer 22
Connected third numerical control system, the first temperature sensing set in the substrate 11 of above structure combination mold 1 and outer wall 12
Device 13 and second temperature sensor 14 can more accurately regulate and control the temperature of reaction mass in mold 1.
When the reaction of reaction mass in mold 1 acutely carries out, and reaction mass temperature starts raising, the first temperature sensor
13 and second temperature sensor 14 perceive mold 1 in reaction mass surface temperature and heat-conducting medium excessive temperature differentials when, first
The temperature information of perception is delivered to corresponding numerical control system by temperature sensor 13 and second temperature sensor 14, by number
Control system regulates and controls the temperature-rise period to heat-conducting medium, relates generally to increasing extent of temperature and heating rate.At this point, the face of draught hood 2
The upper surface temperature that infrared radiation thermometer 22 at plate 21 perceives reaction mass in mold 1 is higher, the increase of 2 exhausting rate of draught hood.
When the temperature of reaction mass and the temperature difference of heat-conducting medium are in OK range, the temperature of heat-conducting medium remains unchanged.
Meanwhile the surface temperature of 22 sensitive and reactive material of infrared radiation thermometer set on the panel 21 of draught hood 2, it is digital control by third
System regulation draught hood 2 operates, and keeps corresponding wind speed, to keep the temperature difference of reaction mass and heat-conducting medium in OK range.
When the temperature of reaction mass and the temperature difference of heat-conducting medium are too small, the first numerical control system and the second numerical control system are controlled respectively
Temperature-adjusting device processed cools down heat-conducting medium, and third numerical control system control draught hood 2 reduces wind speed, to increase reaction mass
Temperature and heat-conducting medium the temperature difference, the diverging of reaction mass heat can be dredged, be unlikely to accumulate reaction mass internal heat.
Therefore, the first temperature sensor 13, second temperature sensor 14, the first numerical control system, the second number on mold 1
Word control system and the setting of infrared radiation thermometer 22, third numerical control system on corresponding draught hood 2, each component mutual cooperation
Running so that in the gelation process for preparing polishing pad, can effectively improve the accuracy that regulate and control to reaction mass temperature with
Instantaneity so as to effectively promote the comprehensive performance of preparation-obtained polishing pad, improves product yield.
In a preferred embodiment, 2 preferably circular draught hood of draught hood, the 1.1- of a diameter of die cavity diameter
1.3 again；It is preferred that 1.2 times of a diameter of die cavity diameter.The diameter range of draught hood 2 is 1.1-1.3 times, mainly considers cooling
Effect, it is too small to cover casting area comprehensively, make very much entire casting area wind speed uneven greatly, and easily form circulation, make reaction mass
Inhomogeneous cooling weighs.It is used for the setting of height is corresponding with wind speed, too low to influence heat dissipation, too high wind speed reduces.
In a preferred embodiment, 2 preferably circular draught hood of draught hood, draught hood 2 and 1 upper surface of mold away from
From for 10-40cm；The distance of preferably draught hood 2 and 1 upper surface of mold is 15-35cm；More preferably 20-30cm.
A kind of application method for the mold system for being used to prepare polishing pad, mold are used to house gelation reaction material, the
The initial temperature of one heat-conducting medium and the second heat-conducting medium is identical, and initial temperature is 30-70 DEG C, is adjusted during gelation reaction
The temperature of whole heat-conducting medium, it is 5-25 DEG C to make its temperature difference with corresponding temperature sensor measurement temperature；
Preferably, initial temperature is 35-65 DEG C, and heat-conducting medium in gelation process is controlled to be surveyed with corresponding temperature sensor
The temperature difference of constant temperature degree is 8-20 DEG C.
In a preferred embodiment, it is right if temperature sensor measurement temperature and the temperature difference of heat-conducting medium are more than 25 DEG C
The numerical control system regulation and control answered are to heat-conducting medium heat supply, if the two temperature difference is less than 5 DEG C, corresponding numerical control system regulation and control
Cool down heat-conducting medium.
By above-mentioned preparation method and it is used to prepare polishing pad that the mold system of polishing pad is prepared from top to bottom
High uniformity, striped is few, and density and performance are uniform, and the yield of product is close to 100%.Wherein, the cast thickness range of polishing pad
Preferably 1-5cm.The cast thickness of polishing pad is excessive, and the temperature difference inside and outside polishing pad is bigger, can influence the performance of polishing pad.
Process conditions optimal in cast and gel process are provided in preparation method provided by the invention, it is whole by controlling
The variation of system temperature during a obtains the polishing pad that less striped, density are uniform and yield is high.It is in chemical machinery
In polishing process, better surface topography can be obtained by being polished material.
Below using embodiment to the property by the above method and the polishing pad for the mold system preparation for being used to prepare polishing pad
It can illustrate.Unless otherwise specified, the conventional skill that technological means used in embodiment is well known to those skilled in the art
Art means.Unless otherwise specified, reagent used in embodiment is commercially available.
Embodiment 1
The liquid prepolymer of predetermined amount, curing agent with microsphere are mixed, set after the completion of degassing to 60 degree in casting machine
Middle cycle, and liquid MOCA (4,4 '-diamino -3,3 '-dichloro diphenyl methane) it is set as 116 DEG C of cycles.Pre-adjust substrate and
Outside wall temperature stabilization is to 50 DEG C.Die cavity center is poured into after being mixed in high-speed stirred head with certain proportion, is allowed to uniform levelling.
It is 65.3 DEG C that mixed material temperature at this time can be measured in casting process, viscosity 10000cps (50 DEG C).Pour into a mould integral thickness about
During 5cm, stop cast, the heating rate that reaction mass is controlled in gelation process is 3.9 DEG C/min.With gel process
It carries out, when the increase of the temperature difference of reaction mass and heat-conducting medium, rises to 25 DEG C or more, the first numerical control system control temperature tune
Regulating device heats heat-conducting medium, to reduce its temperature difference, is allowed to be maintained at suitable range.At the same time, exhausting above die cavity
The wind speed of cover is strengthened with the rising of temperature.When the system surface temperature of detecting maintains 80 DEG C and has downward trend, pouring
Injection body, which is moved into baking oven, to be cured, and oven temperature is risen to 100 DEG C in 30min, cures 16h.Thickness is cut into after the completion of curing
The thin slice of about 2mm amounts to 25.The yield and polishing NU values of gained polishing pad are referring to table 1
The yield of 1 polishing pad of table and polishing NU (%) value
Embodiment 2
Polishing pad is prepared using method same as Example 1, the difference is that：Mixed material temperature is 63.8
℃；The heating rate that reaction mass is controlled in gelation process is 3.5 DEG C/min；The temperature difference of reaction mass and mold is maintained at
12.8℃.The yield and polishing NU values of preparation-obtained polishing pad are shown in Table 1.
Embodiment 3
Polishing pad is prepared using method same as Example 1, the difference is that：Mixed material temperature is 58.2
DEG C, viscosity 13000cps；The heating rate that reaction mass is controlled in gelation process is 5.5 DEG C/min；Reaction mass with
The temperature difference of mold is maintained at 18.3 DEG C.The yield and polishing NU values of preparation-obtained polishing pad are shown in Table 1.
Comparative example 1
Polishing pad is prepared using method same as Example 1, the difference is that only：Reaction mass is natural in a mold
Gelation does not regulate and control its temperature.
Comparative example 2
Polishing pad is prepared using method same as Example 1, the difference is that：Mixed material temperature is 88.5
DEG C, viscosity 7000cps；The heating rate that reaction mass is controlled in gelation process is 4.3 DEG C/min；Reaction mass and mould
The temperature difference of tool is maintained at 14.8 DEG C.The yield and polishing NU values of preparation-obtained polishing pad are shown in Table 1.
Comparative example 3
Polishing pad is prepared using method same as Example 1, the difference is that：Mixed material temperature is 64.4
℃；The heating rate that reaction mass is controlled in gelation process is 8.6 DEG C/min；The temperature difference of reaction mass and mold is maintained at
15.5℃.The yield and polishing NU values of preparation-obtained polishing pad are shown in Table 1.
Comparative example 4
Polishing pad is prepared using method same as Example 1, the difference is that：Mixed material temperature is 65.1
℃；The heating rate that reaction mass is controlled in gelation process is 3.8 DEG C/min；The temperature difference of reaction mass and mold is maintained at
27.3℃.The yield and polishing NU values of preparation-obtained polishing pad are shown in Table 1.
Comparative example 5
Polishing pad is prepared using method same as Example 1, the difference is that：Mixed material temperature is 65.8
DEG C, viscosity 23000cps；The heating rate that reaction mass is controlled in gelation process is 4.2 DEG C/min；Reaction mass with
The temperature difference of mold is maintained at 15.2 DEG C.The yield and polishing NU values of preparation-obtained polishing pad are shown in Table 1.
The temperature of mixed material and viscosity and reaction it can be seen from the yield parameter of prepared polishing pad in table 1
The heating rate and reaction mass of material and the temperature difference of mold are maintained at suitable range, can significantly improve prepared
The yield of obtained polishing pad.Finally, method of the invention is only preferable embodiment, is not intended to limit the guarantor of the present invention
Protect range.All within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in this
Within the protection domain of invention.
Claims (9)
1. a kind of mold system for being used to prepare polishing pad, which is characterized in that the mold including being used to house reaction mass, it is described
Mold includes the outer wall of hollow substrate and hollow structure, and the outer wall is located on the upside of the substrate and upper with the substrate
End face contacts, and the substrate is equipped with the first temperature sensor, and first temperature sensor is used to monitor the substrate in real time
The temperature of upper surface；
Second temperature sensor is provided on the outer wall, the second temperature sensor is used to monitor the outer wall inner end in real time
The temperature in face；
Space between the substrate and outer wall and above the substrate forms the mould for housing the reaction mass
Chamber；
It is connected with the first pipe of the first heat-conducting medium in the substrate equipped with inside stream, the is connected with equipped with inside stream in the outer wall
The second pipe of two heat-conducting mediums, first heat-conducting medium adjust temperature, second heat conduction by the first temperature-adjusting device
Medium adjusts temperature by second temperature regulating device；
First temperature-adjusting device is connected with the first numerical control system, the second temperature regulating device and the second number
Control system is connected, and first numerical control system adjusts first heat conduction for the temperature based on the substrate upper surface
The temperature of medium, second numerical control system adjust second heat conduction for the temperature based on the outer wall inner face and are situated between
The temperature of matter.
2. the mold system according to claim 1 for being used to prepare polishing pad, which is characterized in that set in the substrate more
A first temperature sensor, multiple first temperature sensors are uniformly distributed around the center of the substrate.
3. the mold system according to claim 2 for being used to prepare polishing pad, which is characterized in that the outer wall is hollow
Cylinder, the outer wall are equipped with the multiple second temperature sensors for dividing equally outer wall along outer wall circumferential direction.
4. the mold system for being used to prepare polishing pad according to claim 1 or 3, which is characterized in that further include and be set to
The top of the mold, the draught hood for reducing the reaction mass surface temperature；The suction opening of the draught hood is towards institute
Die cavity is stated, the cover body lower end of the draught hood is fixed with panel, and the panel parallel is uniform in the substrate, and on the panel
Multiple through-holes are distributed with.
5. the mold system according to claim 4 for being used to prepare polishing pad, which is characterized in that the panel it is a diameter of
1.1-1.3 times of the diameter of the die cavity.
6. the mold system according to claim 4 for being used to prepare polishing pad, which is characterized in that uniform cloth on the panel
Equipped with multiple infrared radiation thermometers, the infrared radiation thermometer is used to obtain the temperature of the reaction mass upper surface, the infrared survey
Wen Yiyu third numerical control systems are connected, and the third numerical control system becomes according to the temperature of the reaction mass upper surface
Change the wind speed size that rate regulates and controls the suction opening.
7. the mold system according to claim 6 for being used to prepare polishing pad, which is characterized in that the reaction mass it is upper
Distance is 10-40cm between end face and the panel.
A kind of 8. application method of the mold system according to claim 1 for being used to prepare polishing pad, which is characterized in that mould
Tool is for housing gelation reaction material, and the initial temperature of the first heat-conducting medium and the second heat-conducting medium is identical, and initial temperature is equal
It is 30-70 DEG C, the temperature of heat-conducting medium is adjusted during gelation reaction, makes itself and corresponding temperature sensor measurement temperature
The temperature difference is 5-25 DEG C；
Preferably, initial temperature is 35-65 DEG C, controls heat-conducting medium and corresponding temperature sensor measurement temperature in gelation process
The temperature difference of degree is 8-20 DEG C.
9. a kind of application method of the mold system according to claim 8 for being used to prepare polishing pad, which is characterized in that if
Temperature sensor measurement temperature and the temperature difference of heat-conducting medium are more than 25 DEG C, and corresponding numerical control system regulation and control supply heat-conducting medium
Heat, if the two temperature difference is less than 5 DEG C, corresponding numerical control system regulation and control cooling heat-conducting medium.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110153885A (en) * | 2019-06-03 | 2019-08-23 | 西安奕斯伟硅片技术有限公司 | A kind of processing method of grinding pad and the processing unit of grinding pad |
| CN110270940A (en) * | 2019-07-25 | 2019-09-24 | 湖北鼎汇微电子材料有限公司 | The continuous casting manufacturing method of polishing pad |
| CN114833736A (en) * | 2022-05-12 | 2022-08-02 | 上海芯谦集成电路有限公司 | Closed casting mold system and method for manufacturing polishing pads |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB798573A (en) * | 1955-09-23 | 1958-07-23 | Wayne Kerr Lab Ltd | Improvements in or relating to resin casting |
| CN201342770Y (en) * | 2009-01-09 | 2009-11-11 | 麦克奥迪（厦门）电气有限公司 | Self-heating die for vacuum casting of epoxy resin insulating casting part |
| KR20110080576A (en) * | 2010-01-06 | 2011-07-13 | 이호필 | Disk type grinding pad and method for manufacturing of as the same |
| CN102950550A (en) * | 2011-08-16 | 2013-03-06 | 罗门哈斯电子材料Cmp控股股份有限公司 | Method of manufacturing chemical mechanical polishing layers |
| CN107116485A (en) * | 2017-06-07 | 2017-09-01 | 广州立启森科技有限公司 | A kind of manufacture method of expansion type porous grinding wheel |
-
2017
- 2017-12-15 CN CN201711354504.3A patent/CN108215028B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB798573A (en) * | 1955-09-23 | 1958-07-23 | Wayne Kerr Lab Ltd | Improvements in or relating to resin casting |
| CN201342770Y (en) * | 2009-01-09 | 2009-11-11 | 麦克奥迪（厦门）电气有限公司 | Self-heating die for vacuum casting of epoxy resin insulating casting part |
| KR20110080576A (en) * | 2010-01-06 | 2011-07-13 | 이호필 | Disk type grinding pad and method for manufacturing of as the same |
| CN102950550A (en) * | 2011-08-16 | 2013-03-06 | 罗门哈斯电子材料Cmp控股股份有限公司 | Method of manufacturing chemical mechanical polishing layers |
| CN107116485A (en) * | 2017-06-07 | 2017-09-01 | 广州立启森科技有限公司 | A kind of manufacture method of expansion type porous grinding wheel |
Non-Patent Citations (1)
| Title |
|---|
| 瞿金平: "《塑料工业手册 注塑、模压工艺与设备》", 31 October 2001, 化学工业出版社 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110153885A (en) * | 2019-06-03 | 2019-08-23 | 西安奕斯伟硅片技术有限公司 | A kind of processing method of grinding pad and the processing unit of grinding pad |
| CN110270940A (en) * | 2019-07-25 | 2019-09-24 | 湖北鼎汇微电子材料有限公司 | The continuous casting manufacturing method of polishing pad |
| CN114833736A (en) * | 2022-05-12 | 2022-08-02 | 上海芯谦集成电路有限公司 | Closed casting mold system and method for manufacturing polishing pads |
| CN114833736B (en) * | 2022-05-12 | 2023-08-18 | 上海芯谦集成电路有限公司 | Closed casting mold system and method for manufacturing polishing pad |
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