CN108213407A - A kind of preparation method of the porous heating surface of function division - Google Patents
A kind of preparation method of the porous heating surface of function division Download PDFInfo
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- CN108213407A CN108213407A CN201810015574.4A CN201810015574A CN108213407A CN 108213407 A CN108213407 A CN 108213407A CN 201810015574 A CN201810015574 A CN 201810015574A CN 108213407 A CN108213407 A CN 108213407A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/11—Making porous workpieces or articles
- B22F3/1121—Making porous workpieces or articles by using decomposable, meltable or sublimatable fillers
- B22F3/1134—Inorganic fillers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
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Abstract
The invention discloses a kind of preparation methods of the porous heating surface of function division, are related to enhanced boiling heat transfer technical field.This method includes：The Cu particles of certain grain size are proportionally weighed and are uniformly mixed with SiC particulate, add in perforating agent and adhesive, apply certain pressure in Diamond dies to compress, then the Isothermal sinter in atmosphere of hydrogen, sintered product dissolving removal perforating agent, is dried to obtain SiC/Cu and blends sintered porous surface.The present invention has obtained the porous heating surface of function division by sintering process using surface energy differential is different, preparation process is simple, mild condition, obtained SiC/Cu blending porous surface high mechanical strengths, hole aperture and voidage are controllable, it is obviously improved relative to single metal porous structure heat transfer coefficient, in trial stretch, under the conditions of certain grain size, with the increase of SiC/Cu mixing proportions, heat transfer coefficient increases, heat-transfer effect enhances, when SiC/Cu volume ratios are 0.8, and sintering temperature is 880 DEG C, heat transfer coefficient relative maximum has fine application prospect.
Description
Technical field
The present invention relates to enhanced boiling heat transfer technical field, specially a kind of porous heating surface preparation side of function division
Method.
Background technology
Boiling heat transfer is one of most common heat transfer type in industrial process, is common in various heat exchangers, and porous table
Face is a kind of important channel of enhanced boiling heat transfer.Relative to smooth surface, porous surface can significantly improve boiling heat transfer system
Number reduces boiling pressure difference, improves critical heat flux density and enhances the antifouling capability of equipment.Porous structure surface can substantially carry
High energy source utilization rate has fine application prospect, it is very necessary to study porous heating surface.
In recent years, with the progress of micro-nano manufacturing technology, added on the heat transmission surface using micro-nano manufacturing technology
The micro-nano porous structure of work carrys out enhanced boiling heat transfer significant effect.Relative to the structure of conventional scale, these are micro-nano porous
Structure can greatly improve heat transfer area, improve surface wetting characteristic, improve capillary force, improve steam bubble nucleation density, drop
Low vapour-liquid flow resistance, so as to enhance the dynamic process of boiling phase transformation, final enhanced boiling heat transfer performance.
The preparation method of porous surface metal includes at present：Mechanical processing method, flame spraying, sintering process, galvanoplastic, change
Etch and silk screen cladding process etc. are learned, mechanical processing method is outputed different using the method for mechanical processing in metal base surface
Hole, heat transfer property are greatly improved, but since the hole of very little can not be processed, so performance raising is limited；Flame-spraying
Method is to be ejected into the different metal powder of granularity and auxiliary pore creating material on outer metallic surface matrix at a high speed using special flame
Obtain metal porous coating, this method can in the range of wider hot-fluid enhanced boiling heat transfer, be applicable in different matrix surface shape
Shape, but this method cannot manufacture porous layer outside metal tube, the thickness of porous layer and aperture are also uneven；Sintering process includes powder
Last sintering process and silk screen sintering method, wherein powder sintering are that metal powder bond is sintered into one on the metal surface to be formed
Porous metals coating, silk screen sintering method are that multiple layer metal silk screen is arranged in matrix surface as required, apply imposed load, lead to
It crosses high temperature sintering and forms the good slug type complex metal wire-mesh porous surface of mechanical strength.Wherein sintering process is for metal porous table
Face is more common, but for parent/hydrophobic blending particle sintered porous structure of SiC/Cu, the fusing point of copper is 1083 DEG C, carbonization
The fusing point of silicon is 2830 DEG C, is that silicon-carbide particle is also far from reaching fusing point when copper particle reaches fusing point to melt molding, due to
The difference of its surface nature and the mechanism difference in sinter molding, Direct particle mixing can not be sintered to obtain porous surface,
The tight ness rating of guarantee metallic particles had both been needed in preparation process simultaneously, also to have ensured the stability of sample, current preparation side
Method is also immature.
Invention content
In order to solve the deficiencies in the prior art, a kind of system of the porous heating surface of function division provided by the invention
Preparation Method, easy to operate, mild condition.
It is provided by the invention it is a kind of utilize the porous heating surface preparation method of the different realization function division of surface energy differential, including with
Lower step：
S1, according to 0.2~0.8：1 volume ratio weighs the silicon-carbide particle of certain grain size and copper particle and mixes respectively
It closes, the grain size of the silicon-carbide particle is 80~180 μm, and the grain size of copper particle is 106~120 μm, then into hybrid particles
Potassium sulfate is added in as perforating agent to control the porosity of porous surface according to 10%~40% volume fraction, is eventually adding few
The ethyl alcohol of amount makes silicon-carbide particle uniform and not stratified with copper particles stick as adhesive；
S2, the mixture for obtaining S1 are added in Diamond dies, and the pressure compaction of 12~16MPa of application obtains thickness and is
The other thin slice of grade spontaneously dries 90~110min；
S3, the thin slice compressed in S2 in atmosphere of hydrogen using stage sintering process is sintered, be warming up to first
80~130 DEG C, 30min is kept the temperature, then be warming up to 260~320 DEG C, keep the temperature 15min, then heat to 680~720 DEG C, heat preservation
10min is finally warming up to 860~880 DEG C, keeps the temperature 40min；
S4, S3 is calcined after product using distillation water dissolution removal perforating agent, be dried to obtain SiC/Cu blending sintering it is more
Hole surface.
Preferably, in S1, the additional proportion of perforating agent potassium sulfate is 20%, the additional proportion of adhesive ethyl alcohol for 5~
8%.
Compared with prior art, preparation method of the invention has the advantages that：
The present invention adds in perforating agent and adhesive, selection by the way that the copper particle and silicon-carbide particle of certain grain size are mixed
Fusing point be 1067 DEG C of potassium sulfate as perforating agent, property is stablized, and drilling while is easily removed, and selects ethyl alcohol as bonding
Agent, nontoxic and readily volatilized, the influence to metal surface is smaller, effectively solves Cu and is easily layered and mixes uneven with SiC
The problem of；It is sintered in atmosphere of hydrogen after compression, removal perforating agent obtains SiC/Cu blending porous surfaces.The preparation method operates
Simply, mild condition, adhesive and perforating agent in preparation process are easy to be removed, and select Cu as matrix, fusing point is high and hydrophobic
The strong SiC of performance is dopant material, and obtained hydrophilic/hydrophobic porous surface is not only fine and close but also stablizes, high mechanical strength, aperture and sky
Gap rate is controllable, and is obviously improved relative to single metal porous structure heat transfer coefficient, does not change SiC grain sizes and only changes and mixes
During miscellaneous ratio, with the increase of SiC/Cu mixing proportions, heat transfer coefficient increases, heat-transfer effect enhancing, when SiC/Cu volume ratios are
0.8, a diameter of 80~106 μm of SiC particulate, Cu particle diameters are 106~120 μm, when sintering temperature is 880 DEG C, heat transfer coefficient
Relative maximum；When changing SiC grain sizes, the porosity of porous surface and aperture change correspondingly, and SiC/Cu blending volume ratios are 0.6,
A diameter of 150~180 μm of SiC particulate, Cu particle diameters are that the heat transfer property of 106~120 μm of porous surface is optimal.
Description of the drawings
Fig. 1 is the preparation technology figure that SiC/Cu blends porous surface；
Fig. 2 is the metallography microscope collection of illustrative plates of pure Cu porous surfaces；
Fig. 3 is the metallography microscope collection of illustrative plates of SiC/Cu blending porous surfaces that volume ratio is 0.4 in embodiment 2；
Fig. 4 is the metallography microscope collection of illustrative plates of SiC/Cu blending porous surfaces that volume ratio is 0.6 in embodiment 3；
Fig. 5 is the metallography microscope collection of illustrative plates of SiC/Cu blending porous surfaces that volume ratio is 0.6 in embodiment 6；
Volume ratio is in smooth Cu surfaces, pure Cu porous surfaces and embodiment 1- embodiments 4 when Fig. 6 is using water as working medium
0.2nd, 0.4,0.6,0.8 SiC/Cu blending porous surfaces and the heat transfer coefficient figure of Rohsenow theoretical calculations；
Volume ratio in smooth Cu surfaces, pure Cu porous surfaces and embodiment 1- embodiments 4 when Fig. 7 is using ethyl alcohol as working medium
SiC/Cu for 0.2,0.4,0.6,0.8 blends the degree of superheat of porous surface with heat flux change curve；
Different-grain diameter, different doping ratio in pure Cu porous surfaces and embodiment 3- embodiments 8 when Fig. 8 is using water as working medium
SiC/Cu blending porous surface the degree of superheat with heat flux change curve；
Different-grain diameter, different doping ratio in pure Cu porous surfaces and embodiment 3- embodiments 8 when Fig. 9 is using water as working medium
SiC/Cu blending porous surface heat transfer coefficient with heat flux change curve；
Figure 10 is using water as the boiling experimental phenomena figure of the pure Cu porous surfaces of working medium；
The SiC/Cu that volume ratio is 0.4 in embodiment 2 when Figure 11 is using water as working medium blends the boiling experiment of porous surface
Phenomenon figure.
Specific embodiment
Embodiment 1
A kind of preparation method of the porous heating surface of function division, specific preparation process is as shown in Figure 1, including following step
Suddenly：
S1, the ratio for being 0.2 according to SiC/Cu volume ratios weigh the SiC particulate 0.09g that grain size is 80~106 μm, weigh
Grain size is 106~120 μm of Cu particle 1.565g, adds in 0.213gK2SO4Powder is uniformly mixed as perforating agent, adds in 20uL
Absolute ethyl alcohol make its bonding, stir evenly；
S2, the mixture stirred evenly is placed in Diamond dies, applies 16MPa pressure pressures in red copper smooth surface
Tightly, porous layer thickness is made to spontaneously dry 90min for 1mm；
S3, the material after being compressed in S2 is heat-treated under an atmosphere of hydrogen, first, in accordance with the heating rate of 3 DEG C/min
It is warming up to 120 DEG C and keeps the temperature 30min, ensure solvent volatilization, be then warming up to 300 DEG C according to identical heating rate and keep the temperature
15min, then be warming up to 700 DEG C and keep the temperature 10min and preheated, it is finally reached 870 DEG C of sintering temperatures and keeps the temperature 40min and burnt
Knot, natural cooling 12h after the completion of sintering；
S4, the SiC/Cu blending that volume ratio is 0.2 will be dried to obtain in S3 after sintered substance migration distillation water dissolution
Sintered porous surface.
Embodiment 2
The ratio for being 0.4 according to SiC/Cu volume ratios weighs the SiC particulate 0.151g that grain size is 80~106 μm, weighs grain
Diameter is 106~120 μm of Cu particle 1.342g, adds in 0.213gK2SO4The absolute ethyl alcohol that powder adds in 20uL after mixing makes
It is bonded, and is subsequently placed in application 16MPa pressure compactions in Diamond dies, is obtained the porous layer that thickness is 1mm, is spontaneously dried
90min is first warming up to 120 DEG C according to the heating rate of 3 DEG C/min in atmosphere of hydrogen and keeps the temperature 30min, then heats to 300
DEG C and keep the temperature 15min, then be warming up to 700 DEG C and keep the temperature 10min and preheated, be finally reached 875 DEG C of sintering temperatures and keep the temperature
40min is sintered, natural cooling 12h after the completion of sintering, will obtain the SiC/ that volume ratio is 0.4 after sintered product dissolving drying
Cu blends sintered porous surface.
Embodiment 3
The ratio for being 0.6 according to SiC/Cu volume ratios weighs the SiC particulate 0.198g that grain size is 80~106 μm, weighs grain
Diameter is 106~120 μm of Cu particle 1.174g, adds in 0.213gK2SO4The absolute ethyl alcohol that powder adds in 20uL after mixing makes
It is bonded, and is subsequently placed in application 16MPa pressure compactions in Diamond dies, is obtained the porous layer that thickness is 1mm, is spontaneously dried
90min is first warming up to 120 DEG C according to the heating rate of 3 DEG C/min in atmosphere of hydrogen and keeps the temperature 30min, then heats to 300
DEG C and keep the temperature 15min, then be warming up to 700 DEG C and keep the temperature 10min and preheated, be finally reached 880 DEG C of sintering temperatures and keep the temperature
40min is sintered, natural cooling 12h after the completion of sintering, will obtain the SiC/ that volume ratio is 0.6 after sintered product dissolving drying
Cu blends sintered porous surface.
Embodiment 4
The ratio for being 0.8 according to SiC/Cu volume ratios weighs the SiC particulate 0.235g that grain size is 80~106 μm, weighs grain
Diameter is 106~120 μm of Cu particle 1.044g, adds in 0.213gK2SO4The absolute ethyl alcohol that powder adds in 20uL after mixing makes
It is bonded, and is subsequently placed in application 16MPa pressure compactions in Diamond dies, is obtained the porous layer that thickness is 1mm, is spontaneously dried
90min is first warming up to 120 DEG C according to the heating rate of 3 DEG C/min in atmosphere of hydrogen and keeps the temperature 30min, then heats to 300
DEG C and keep the temperature 15min, then be warming up to 700 DEG C and keep the temperature 10min and preheated, be finally reached 880 DEG C of sintering temperatures and keep the temperature
40min is sintered, natural cooling 12h after the completion of sintering, will obtain the SiC/ that volume ratio is 0.8 after sintered product dissolving drying
Cu blends sintered porous surface.
Embodiment 5
The ratio for being 0.6 according to SiC/Cu volume ratios weighs the SiC particulate 0.838g that grain size is 106~120 μm, weighs grain
Diameter is 106~120 μm of Cu particle 1.174g, adds in 0.213gK2SO4The absolute ethyl alcohol that powder adds in 20uL after mixing makes
It is bonded, and is subsequently placed in application 16MPa pressure compactions in Diamond dies, is obtained the porous layer that thickness is 1mm, is spontaneously dried
90min is first warming up to 120 DEG C according to the heating rate of 3 DEG C/min in atmosphere of hydrogen and keeps the temperature 30min, then heats to 300
DEG C and keep the temperature 15min, then be warming up to 700 DEG C and keep the temperature 10min and preheated, be finally reached 880 DEG C of sintering temperatures and keep the temperature
40min is sintered, natural cooling 12h after the completion of sintering, will obtain the SiC/ that volume ratio is 0.6 after sintered product dissolving drying
Cu blends sintered porous surface.
Embodiment 6
The ratio for being 0.6 according to SiC/Cu volume ratios weighs the SiC particulate 0.801g that grain size is 150~180 μm, weighs grain
Diameter is 106~120 μm of Cu particle 1.174g, adds in 0.213gK2SO4The absolute ethyl alcohol that powder adds in 20uL after mixing makes
It is bonded, and is subsequently placed in application 16MPa pressure compactions in Diamond dies, is obtained the porous layer that thickness is 1mm, is spontaneously dried
90min is first warming up to 120 DEG C according to the heating rate of 3 DEG C/min in atmosphere of hydrogen and keeps the temperature 30min, then heats to 300
DEG C and keep the temperature 15min, then be warming up to 700 DEG C and keep the temperature 10min and preheated, be finally reached 880 DEG C of sintering temperatures and keep the temperature
40min is sintered, natural cooling 12h after the completion of sintering, will obtain the SiC/ that volume ratio is 0.6 after sintered product dissolving drying
Cu blends sintered porous surface.
Embodiment 7
The ratio for being 0.8 according to SiC/Cu volume ratios weighs the SiC particulate 0.231g that grain size is 106~120 μm, weighs grain
Diameter is 106~120 μm of Cu particle 1.044g, adds in 0.213gK2SO4The absolute ethyl alcohol that powder adds in 20uL after mixing makes
It is bonded, and is subsequently placed in application 16MPa pressure compactions in Diamond dies, is obtained the porous layer that thickness is 1mm, is spontaneously dried
90min is first warming up to 120 DEG C according to the heating rate of 3 DEG C/min in atmosphere of hydrogen and keeps the temperature 30min, then heats to 300
DEG C and keep the temperature 15min, then be warming up to 700 DEG C and keep the temperature 10min and preheated, be finally reached 880 DEG C of sintering temperatures and keep the temperature
40min is sintered, natural cooling 12h after the completion of sintering, will obtain the SiC/ that volume ratio is 0.8 after sintered product dissolving drying
Cu blends sintered porous surface.
Embodiment 8
The ratio for being 0.8 according to SiC/Cu volume ratios weighs the SiC particulate 0.220g that grain size is 150~180 μm, weighs grain
Diameter is 106~120 μm of Cu particle 1.044g, adds in 0.213gK2SO4The absolute ethyl alcohol that powder adds in 20uL after mixing makes
It is bonded, and is subsequently placed in application 16MPa pressure compactions in Diamond dies, is obtained the porous layer that thickness is 1mm, is spontaneously dried
90min is first warming up to 120 DEG C according to the heating rate of 3 DEG C/min in atmosphere of hydrogen and keeps the temperature 30min, then heats to 300
DEG C and keep the temperature 15min, then be warming up to 700 DEG C and keep the temperature 10min and preheated, be finally reached 880 DEG C of sintering temperatures and keep the temperature
40min is sintered, natural cooling 12h after the completion of sintering, will obtain the SiC/ that volume ratio is 0.8 after sintered product dissolving drying
Cu blends sintered porous surface.
Reference examples
The Cu particle 1.88g that grain size is 106~120 μm are weighed, is placed in Diamond dies and applies 16MPa pressure compactions extremely
Thickness is 1mm, is first warming up to 120 DEG C according to the heating rate of 3 DEG C/min in atmosphere of hydrogen and keeps the temperature 30min, then heats up
To 300 DEG C and 15min is kept the temperature, then is warming up to 700 DEG C and keeps the temperature 10min and preheated, be finally reached 860 DEG C of sintering temperatures and is protected
Warm 40min is sintered, natural cooling 12h after the completion of sintering, will obtain pure Cu porous surfaces after sintered product dissolving drying.
Due to having larger performance difference between copper and silicon carbide, as shown in table 1, in order to which SiC/Cu blending is sintered porous
The mechanical strength and heat transfer property on surface can ensure that we have carried out copper particle and silicon-carbide particle the pine dress of different-grain diameter
Density measurement selects the copper particle in suitable particle size range to be mixed and added into pore creating material and adhesive with silicon-carbide particle, both
Two kinds of particles bonding can be made uniform and not stratified and not easily to fall off.The sintering of different-grain diameter is filtered out using standard scores sample first
Particle measures natural packing state lower volume with precision for ± 2% graduated cylinder, and the electronic balance for being 0.0001g with precision weighs fixed
The quality of volume is measured, the apparent density for calculating particle is as shown in table 2.
The some properties of table 1.Cu and SiC
The apparent density of 2. variable grain diameter of table
The volume ratio that we prepare embodiment 2, embodiment 3, embodiment 6 and reference examples is respectively 0.4 and 0.6
SiC/Cu blends sintered porous surface and pure Cu porous surfaces carry out metallographic microscope test, and Fig. 2 is pure Cu porous surfaces
Metallography microscope collection of illustrative plates, Fig. 3 are that volume ratio prepared by embodiment 2 is respectively that 0.4 SiC/Cu blends the metallographic on sintered porous surface
Micro- collection of illustrative plates, Fig. 4 are that volume ratio prepared by embodiment 3 is respectively that 0.6 SiC/Cu blends the metallography microscope on sintered porous surface
Collection of illustrative plates, Fig. 5 are that volume ratio prepared by embodiment 6 is respectively that 0.6 SiC/Cu blends the metallography microscope collection of illustrative plates on sintered porous surface,
As seen from Figure 2, it is connected completely between pure Cu particles, and forms stable bridge-type structure to a certain extent；From Fig. 3-Fig. 5
As can be seen that SiC is evenly distributed, Cu particles uniformly inlay SiC particulate wherein.
We have carried out the sample of embodiment 1- embodiments 8, the sample of reference examples and smooth Cu surfaces boiling test
Experiment, respectively using water and ethyl alcohol as working medium, and calculates the heat transfer coefficient of each sample, while is managed according to Rohsenow theoretical calculations
By heat transfer coefficient, table 3 is the performance test table of the porous surface of sample in embodiment 1- embodiments 4, and Fig. 6 is implemented for embodiment 1-
Porous surface boiling heat transfer curve of the sample of example 4 when using water as working medium, Fig. 7 be embodiment 1- embodiments 4 sample with
Porous surface boiling heat transfer curve when ethyl alcohol is working medium, Fig. 8 is the sample of embodiment 3- embodiments 8 when using water as working medium
Porous surface boiling heat transfer curve, Fig. 9 are that heat transfer coefficient of the sample of embodiment 3- embodiments 8 when using water as working medium is logical with heat
Amount variation, smooth Cu surfaces, pure Cu porous surfaces and same aperture difference Blend proportion are can be seen that with reference to table 3 and Fig. 6, Fig. 7
The sintered porous surfaces of SiC/Cu of example are respectively provided with excellent heat transfer property, and the heat transfer property of pure Cu porous surfaces is better than smooth Cu tables
Face, the heat transfer property on the sintered porous surfaces of SiC/Cu are better than pure Cu porous surfaces, and the increase of the SiC ratios with doping, pass
Hot coefficient increases, and porosity increases, and the time of penetration of water and ethyl alcohol is reduced, heat transfer property enhancing；It can be seen that from Fig. 8 and Fig. 9
With the increase of SiC particulate diameter and volume proportion, the heat transfer property between porous surface is very close, and it is apparent poor not occur
Different, wherein the blending surface heat transfer performance of bulky grain is better than short grained blending surface, and SiC/Cu blending volume ratios are 0.6, real
The sample of example 6, a diameter of 150-180 μm of SiC particulate are applied, Cu particle diameters are the heat transfer property of 106-120 μm of porous surface
It is optimal.
3. pure Cu porous surfaces of table and SiC/Cu porous surface performance test tables
Figure 10 be pure Cu porous surfaces using water as working medium when boiling test experimental phenomena, in Figure 10 (a) (b) (c) (d)
Power is respectively 20.1kWm-2、62.3kW·m-2、83.6kW·m-2And 121.5kWm-2, Figure 11 is that volume ratio is 0.4
SiC/Cu porous surfaces using water as working medium when boiling test experimental phenomena, the power of (a) (b) (c) (d) is respectively in Figure 11
19.7kW·m-2、62.9kW·m-2、85.5kW·m-2And 126.2kWm-2, from Figure 10 and Figure 11 and combine each figure pair
The process of osmosis that the power contrast answered can be seen that the water for the SiC/Cu porous surfaces that volume ratio is 0.4 is significantly faster than that fine copper is more
Hole surface, the SiC/Cu porous surfaces that volume ratio is 0.4 have excellent boiling heat transfer performance.
The above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, without departing from the principle of the present invention, several improvements and modifications can also be made, these improvements and modifications also should
It is considered as protection scope of the present invention.
Claims (2)
1. a kind of preparation method of the porous heating surface of function division, which is characterized in that include the following steps：
S1, according to 0.2~0.8：1 volume ratio weighs the silicon-carbide particle of certain grain size and copper particle and mixes, institute respectively
It is 80~180 μm to state the grain size of silicon-carbide particle, and the grain size of copper particle is 106~120 μm, then into hybrid particles according to
10%~40% volume fraction adds in potassium sulfate as perforating agent to control the porosity of porous surface, is eventually adding a small amount of
Ethyl alcohol makes silicon-carbide particle uniform and not stratified with copper particles stick as adhesive；
S2, the mixture for obtaining S1 are added in Diamond dies, and the pressure compaction for applying 12~16MPa obtains thickness as millimeter
The thin slice of rank spontaneously dries 90~110min；
S3, the thin slice compressed in S2 is sintered in atmosphere of hydrogen using stage sintering process, it is warming up to 80 first~
130 DEG C, 30min is kept the temperature, then be warming up to 260~320 DEG C, keeps the temperature 15min, then heat to 680~720 DEG C, keep the temperature 10min,
860~880 DEG C are finally warming up to, keeps the temperature 40min；
S4, S3 is calcined after product using distillation water dissolution place to go perforating agent, be dried to obtain SiC/Cu and blend sintered porous table
Face.
2. a kind of preparation method of the porous heating surface of function division as described in claim 1, which is characterized in that in S1, system
The additional proportion of hole agent potassium sulfate is 20%, and the additional proportion of adhesive ethyl alcohol is 5~8%.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110842202A (en) * | 2019-11-28 | 2020-02-28 | 内蒙古科技大学 | Free particle/porous medium composite reinforced boiling structure and preparation method thereof |
| CN111690925A (en) * | 2019-03-12 | 2020-09-22 | 中南大学 | Surface hardening and surface functionalization treatment process for titanium and titanium alloy |
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- 2018-01-08 CN CN201810015574.4A patent/CN108213407A/en active Pending
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| CN111690925A (en) * | 2019-03-12 | 2020-09-22 | 中南大学 | Surface hardening and surface functionalization treatment process for titanium and titanium alloy |
| CN111690925B (en) * | 2019-03-12 | 2021-09-24 | 中南大学 | Surface hardening and surface functionalization treatment process for titanium and titanium alloy |
| CN110842202A (en) * | 2019-11-28 | 2020-02-28 | 内蒙古科技大学 | Free particle/porous medium composite reinforced boiling structure and preparation method thereof |
| CN110842202B (en) * | 2019-11-28 | 2021-11-02 | 内蒙古科技大学 | Free particle/porous medium composite reinforced boiling structure and preparation method thereof |
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