CN108211118A - Implanted packaging body and its manufacturing method and implantable medical device - Google Patents
Implanted packaging body and its manufacturing method and implantable medical device Download PDFInfo
- Publication number
- CN108211118A CN108211118A CN201711410701.2A CN201711410701A CN108211118A CN 108211118 A CN108211118 A CN 108211118A CN 201711410701 A CN201711410701 A CN 201711410701A CN 108211118 A CN108211118 A CN 108211118A
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- metal
- package substrate
- metal cap
- melting portion
- implanted
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 67
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims abstract description 227
- 239000002184 metal Substances 0.000 claims abstract description 227
- 239000000758 substrate Substances 0.000 claims abstract description 112
- 238000002844 melting Methods 0.000 claims abstract description 53
- 230000008018 melting Effects 0.000 claims abstract description 53
- 238000003466 welding Methods 0.000 claims abstract description 45
- 239000000155 melt Substances 0.000 claims abstract description 22
- 238000005538 encapsulation Methods 0.000 claims abstract description 4
- 230000004936 stimulating effect Effects 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 239000001307 helium Substances 0.000 claims description 4
- 229910052734 helium Inorganic materials 0.000 claims description 4
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 4
- 230000001568 sexual effect Effects 0.000 claims description 4
- 230000003760 hair shine Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 16
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 16
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 10
- 229910052737 gold Inorganic materials 0.000 description 10
- 239000010931 gold Substances 0.000 description 10
- 210000000056 organ Anatomy 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 8
- 229910052697 platinum Inorganic materials 0.000 description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 6
- 230000006378 damage Effects 0.000 description 6
- 229910052741 iridium Inorganic materials 0.000 description 6
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 6
- 229910052758 niobium Inorganic materials 0.000 description 6
- 239000010955 niobium Substances 0.000 description 6
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 6
- 229910052763 palladium Inorganic materials 0.000 description 6
- 229910052715 tantalum Inorganic materials 0.000 description 6
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 6
- 229910052719 titanium Inorganic materials 0.000 description 6
- 239000010936 titanium Substances 0.000 description 6
- 210000004369 blood Anatomy 0.000 description 5
- 239000008280 blood Substances 0.000 description 5
- 210000001124 body fluid Anatomy 0.000 description 5
- 239000010839 body fluid Substances 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 208000027418 Wounds and injury Diseases 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 208000014674 injury Diseases 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 241001074085 Scophthalmus aquosus Species 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000005312 bioglass Substances 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 210000003477 cochlea Anatomy 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 201000010099 disease Diseases 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 210000000887 face Anatomy 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 210000001525 retina Anatomy 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/18—Applying electric currents by contact electrodes
- A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
- A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
- A61N1/372—Arrangements in connection with the implantation of stimulators
- A61N1/37205—Microstimulators, e.g. implantable through a cannula
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/18—Applying electric currents by contact electrodes
- A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
- A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
- A61N1/372—Arrangements in connection with the implantation of stimulators
- A61N1/375—Constructional arrangements, e.g. casings
- A61N1/3758—Packaging of the components within the casing
Landscapes
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Biomedical Technology (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Radiology & Medical Imaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention provides a kind of implanted packaging body and its manufacturing method and implantable medical device, provides the package substrate with bio-compatibility；The metal cap with bio-compatibility is prepared, the metal cap includes melting portion, and the melting portion includes welding surface；Metal connecting layer is formed in the surface periphery of the package substrate；The metal cap is covered on the surface of the package substrate, and the welding surface is made to be bonded with the metal connecting layer surface；Melting portion described in laser irradiation, so that the melting portion melts and connects the package substrate and the metal cap.Implanted encapsulation manufacturing method can prepare intensity height and the strong implanted packaging body of stability.
Description
Technical field
The present invention relates to implantable medical devices technical field, more particularly to a kind of implanted packaging body and manufacturing method and
Implantable medical device.
Background technology
Nowadays, since disease can occur for the partial organ of human body so that the normal life level of people is by serious shadow
It rings.The rapid development of implantable medical instrument, partial organ's function to restore patient provide possibility.Implantable medical
Instrument includes implantable packaging body and implantable stimulating electrode.Since implantable packaging body is protection implantable medical
Chip, electronic component and integrated circuit of instrument etc. have key effect so that prepare a kind of the implantable of superior performance
Formula packaging body is particularly important.However, current implantable packaging body still remains problem：Fastness difference and stability are poor.
Invention content
It is described the purpose of the present invention is to provide a kind of implanted packaging body and its manufacturing method and implantable medical device
The manufacturing method of implanted packaging body can prepare a kind of intensity height and the strong implanted packaging body of stability.
A kind of manufacturing method of implanted packaging body, including：
Package substrate with bio-compatibility is provided；
The metal cap with bio-compatibility is prepared, the metal cap includes melting portion, and the melting portion includes welding surface；
Metal connecting layer is formed in the surface periphery of the package substrate；
The metal cap is covered on the surface of the package substrate, and make the welding surface and the metal connecting layer table
Face paste is closed；
Melting portion described in laser irradiation, so that the melting portion melts and connects the package substrate and the metal cap.
Wherein, " metal cap with bio-compatibility is prepared, the metal cap includes melting portion, described in the step
Melting portion includes welding surface " include：
A metal cover body is prepared, the metal cover body includes joint face and the fixation for being convexly equipped in the joint face side
Portion；
A becket is prepared, the becket includes the first anchor ring and the second anchor ring that are oppositely arranged, and the melting portion is set
In on second anchor ring；
By the welding metal rings on the metal cover body, so that the first anchor ring is connect with the joint face.
Wherein, " becket is prepared, the becket includes the first anchor ring and the second ring that are oppositely arranged in the step
Face, the melting portion are set on second anchor ring " include：
Inner surface around the becket forms positioning region, the positioning region and the fixed part phase of the metal cover
Mutually support.
Wherein, include in the step " forming metal connecting layer in the surface periphery of the package substrate "：
Multiple spaced first grooves are formed around the surface of the metal connecting layer, the melting portion melts and fills out
Full of multiple first grooves.
Wherein, the step " metal cap is covered on the surface of the package substrate, and make the welding surface with
The metal connecting layer surface fitting " further includes：
Along the package substrate direction to the metal cap apply constant pressure so that the metal connecting layer with it is described
Welding surface is bonded.
Wherein, in the step " melting portion described in laser irradiation, so that the melting portion melts and connects the encapsulation base
Plate and the metal cap " further includes：
The metal cap and the package substrate are placed on rotatable welding bench；
The welding bench is at the uniform velocity rotated, so that laser beam melts the melting portion along the periphery of the metal cap.
Wherein, the airtight sexual satisfaction helium leak rates of the package substrate and the metal cap are less than 1 × 10-9Pa·m3/
s。
The present invention provides a kind of implanted packaging body, including：Package substrate with bio-compatibility and simultaneous with biology
The metal cap of capacitive, the surface periphery of the package substrate are equipped with one layer of metal connecting layer；The metal cap is connected and fixed on institute
It states in the metal connecting layer of package substrate.
The present invention provides a kind of implanted packaging body, including：Package substrate with bio-compatibility and simultaneous with biology
The metal cap of capacitive；The metal cap includes the metal cover body and becket that are connected with each other；The surface of the metal cover body
Equipped with fixed part, the inner peripheral surface of the becket is equipped with positioning region, and the fixed part is mutually supported with the positioning region；The envelope
The surface periphery for filling substrate is equipped with one layer of metal connecting layer；The becket is connected and fixed on the metal connection of the package substrate
On layer.
The present invention provides a kind of implantable medical device, including implanted stimulating electrode and implanted packaging body；The plant
Enter formula packaging body to be electrically connected with implanted stimulating electrode.
Beneficial effects of the present invention are as follows：By forming metal connecting layer in the surface periphery of package substrate and utilizing laser
The melting portion of the metal cap is irradiated, so that the melting portion melts and connects the package substrate and the metal cap.
Therefore, the manufacturing method of the implanted packaging body can be prepared a kind of strong with stability, the high bio-compatibility of intensity
Implanted packaging body.
Description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention, for those of ordinary skill in the art, without creative efforts, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the flow diagram of the manufacturing method of the implanted packaging body of the application.
Fig. 2 is the overlooking the structure diagram of the package substrate of Fig. 1 steps S10.
Fig. 3 is the package substrate internal plane diagram of Fig. 1 steps S10.
Fig. 4 is the cross section structure schematic diagram of the metal cap of step S20 in Fig. 1.
Fig. 5 is the part flow diagram of step S20 in Fig. 1.
Fig. 6 is the cross section structure schematic diagram for the metal cover body that step S21 shown in Fig. 5 is formed.
Fig. 7 is the structure diagram for the becket that step S22 shown in Fig. 5 is formed.
Fig. 8 is the part flow diagram of step S22 in Fig. 5.
Fig. 9 is the structure diagram for the becket that step S22a shown in Fig. 8 is formed.
Figure 10 is the floor map for the becket that step S22a shown in Fig. 8 is formed.
Figure 11 is the structure diagram for the metal cap that step S23 shown in Fig. 5 is formed.
Figure 12 is the metal connecting layer internal plane diagram that step S30 is formed in Fig. 1.
Figure 13 is the part flow diagram of step S30 in Fig. 1.
Figure 14 is the metal connecting layer internal plane diagram that step S31 is formed in Figure 13.
Figure 15 is the part flow diagram of step S40 in Fig. 1.
Figure 16-19 is the internal plane diagram of the implanted packaging body of the formation of step S50 in Fig. 1.
Figure 20 is the part flow diagram of step S50 in Fig. 1.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without creative efforts
Embodiment shall fall within the protection scope of the present invention.
Referring to Fig. 1, a kind of flow of the manufacturing method of implanted packaging body is provided in one better embodiment of the application
Figure.The manufacturing method of the implanted packaging body mainly for the preparation of high stability and high intensity implanted packaging body 100, with
Extend the service life of implanted packaging body 100.
In the present embodiment, the manufacturing method of the implanted packaging body includes but are not limited to include step S10, step
S20, step S30, step S40 and step S50, each step are described in detail as follows：
Step S10 provides the package substrate 10 with bio-compatibility.Please refer to Fig. 2 and Fig. 3.
Wherein, the meaning of the package substrate 10 with bio-compatibility refers to meet ISO (International
Organization for Standardization：International standardization) 10993.5, ISO 10993.10, ISO 10993.6,
The package substrate 10 of the international standard requirement of ISO 10993.6, ISO 10993.3.10 airtight sexual satisfaction helium of package substrate is let out
Leak rate is less than 1 × 10-9Pa·m3/ s avoids body fluid and blood in human body etc. from damaging package substrate 10 through package substrate 10
Interior electronic component.
In the present embodiment, the shape of package substrate 10 is cylinder, can be placed in the person to avoid when package substrate 10 in this way
When internal, because the surface of package substrate 10, there are the organs injured during tip into the human body.Package substrate 10 includes being oppositely arranged
First surface 111 and second surface 112.Please refer to Fig. 2 and Fig. 3.Wherein, the meaning of " opposite " refers in opposition to each other, this
Refer to that the first surface 111 and the second surface 112 are two " faces " in opposition to each other in embodiment.Package substrate 10
Material can be but be not limited only to as aluminium oxide, zirconium oxide, silicon nitride and bioglass material that purity is greater than or equal to
99%.A diameter of 6~15mm of package substrate 10, thickness are 0.3~0.8mm, and port number is between 1~1000.Package substrate
10 surface is embedded multiple spaced conductive columns 11, and conductive column 11 is embedded in by filling technique in the package substrate 10,
The filling technique can be but be not limited only in for embedding technique, magnetron sputtering technique, hot evaporation technology or silk-screen printing
Technology.The material of conductive column 11 can be but be not limited only in for titanium, platinum, iridium, palladium, niobium, tantalum or wherein at least two kinds of conjunction
Gold.In other embodiments, the shape of package substrate 10, diameter, thickness and port number can be set according to actual conditions, this Shen
It please be not construed as limiting.
Step S20 prepares the metal cap 20 with bio-compatibility, and the metal cap 20 includes melting portion 21, melting portion 21
Including welding surface 211.Please refer to Fig. 4.
In the present embodiment, the meaning with the metal cap 20 of bio-compatibility refers to meet ISO 10993.5,
The metal cap 20 that ISO10993.10, ISO 10993.6, ISO 10993.6, ISO 10993.3 is required.Metal cap 20 it is airtight
Sexual satisfaction helium leak rates are less than 1 × 10-9Pa·m3/s.The material of metal cap 20 can be but be not limited only to for titanium, platinum, iridium,
Palladium, niobium, tantalum or the alloy of wherein at least two kinds formation.The purity of metal cap 20 is greater than or equal to 99%.For example, work as metal cap
When 20 material is platinum, the composition of metal cap 20 is greater than or equal to 99% platinum for purity.Metal cap 20 by metallic plate end
It bends and is integrally formed.The end of metal cap 20 is melting portion 21, to provide wlding for welding.The end face in melting portion forms weldering
Junction 211, to be connect with package substrate 10.
In other embodiment, metal cap 20 can also weld to be formed via multiple metallic plates.Specifically, in step S20
" metal cap 20 with bio-compatibility is prepared, the metal cap 20 includes melting portion 21, and the melting portion 21 includes welding surface
211." include but are not limited to include step S21, step S22, step S23 and step S24, referring to Fig. 5, each step is detailed
Carefully it is described below：
Step S21 prepares a metal cover body 23, and the metal cover body 23 includes joint face 232 and is convexly equipped in the company
The fixed part 231 of 232 side of junction；Please refer to Fig. 6.
In the present embodiment, the material of metal cover body 23 can be but be not limited only to for titanium, platinum, iridium, palladium, niobium, tantalum or
The alloy of wherein at least two kinds formation.The size of metal cover body 23 is 6~15mm.Metal cover body 23 is passed through by one piece of metallic plate
Bending process is integrally formed.The end of metal cover body 23 is stairstepping.The opposite connection of fixed part 231 on metal cover body 23
It protrudes in face 232.The fixed part 231 is fixed can play the role of when metal cover body 23 is placed on becket 24.
When the side of fixed part 231 is bonded with the inner peripheral surface of the becket 24, metal cap ontology 23 can be caused to tightly hold
On becket 24, avoid reducing metal due to metal cover body 23 and becket 24 occur mobile in subsequent welding process
The firmness and air-tightness that cover body 23 is connect with becket 24.The smooth outer surface of metal cover body 23, impulse- free robustness, in this way
Can to avoid when metal cover body 23 is placed in human body since organ is stabbed on coarse surface.In other embodiment
In, the size and shape of metal cover body 23 is not restricted, and is set according to actual conditions.
Step S22 prepares a becket 24, and the becket 24 includes the first anchor ring 241 and the second anchor ring that are oppositely arranged
242, the melting portion 21 is set on 242 on second anchor ring；Please refer to Fig. 7.
In the present embodiment, the material of becket 24 can be but be not limited only to as titanium, platinum, iridium, palladium, niobium, tantalum or wherein
At least two alloys formed.24 machined formation of becket.Process for machining includes vehicle, milling, plane, mill, brill and boring etc..Gold
The outer diameter for belonging to ring 24 is 6~15mm, is highly 0.3~3mm.Becket 24 is equipped with melting portion 21 to provide weldering for welding
Material.First anchor ring 241 of becket 24 is connecting metal cover 23.Second anchor ring 242 is to the surface with metal connecting layer 30
Connection, to realize the connection of metal cap 20 and package substrate 10.The peripheral surface Glabrous thorn of becket 24, can be to avoid stabbing
Organ.In other embodiments, the outer diameter of becket 24 and height do not restrict, and can be set according to actual conditions.
" becket 24 is prepared, the becket 24 includes the first anchor ring 241 and second being oppositely arranged in step S22
Anchor ring 242, the melting portion 21 include set on second anchor ring 242 "：
Step S22a forms positioning region 243, the positioning region 243 and the metal around the inner surface of the becket 24
The fixed part 231 of lid 23 mutually supports.Please refer to Fig. 8-10.
In the present embodiment, the material of the positioning region 243 can be but be not limited only to for titanium, platinum, iridium, palladium, niobium, tantalum or
The alloy of wherein at least two kinds formation.The size of the positioning region 243 is 0.1~2mm.The positioning region 243 is in metal
Cover body 23 plays the role of positioning when being placed on becket 24, and positioning region 243 is mutually supported with fixed part 231, can be made
It obtains metal cover body 23 to be tightly secured on becket 24, avoid in subsequent welding process because of metal cover body 23 and gold
Belong to ring 24 to occur mobile and reduce firmness and air-tightness that metal cover body 23 is connect with becket 24.
The becket 24 is welded on the metal cover body 23 by step S23, so that the first anchor ring 241 and the company
Junction 232 connects.
In the present embodiment, becket 24 is fixed on welding bench using clamping piece.Random angle can occur for the welding bench
The rotation of degree, and the welding bench angular velocity of rotation and rotation angle accurately control.Metal cover body 23 is placed on metal again
On ring 24, so that the first anchor ring 241 of becket 24 and the joint face 232 of metal cover body 23 are bonded.Due to becket 24
The outer diameter of outer diameter and metal cover body 23 is equal so that metal cover body 23 is mutually aligned with becket 24.In addition, in order into one
Step reduces the gap between metal cover body 23 and becket 24, along becket 24 direction metal cover body 23 appearance
Face applies constant pressure.In this way, it is also possible that metal cover body 23 and becket 24 are more secured after welding, so as to increase
The stability and air-tightness of metal cover body 23 and becket 24.
In the present embodiment, as shown in figure 11, the metal cover body close to the becket 24 is irradiated by laser beam
23 end, so that the end of metal cover body 23 melts and connect joint face 232 with first anchor ring 241.It is described to swash
The wavelength of light beam can be but be not limited to 1060nm or 532nm.The laser beam is emitted by laser.The laser can
Think but be not limited to light laser, carbon dioxide laser or semiconductor laser.Specifically, laser beam is radiated at gold
On first position for belonging to the end of cover body 23, the metal cover body 23 of the position takes place melting and by the position
Metal cover body 23 connect with becket 24.The depth that the laser beam melts is not limited to illustrative metal as shown in figure 11
The width welded in cover, but for the degree of being connected firmly for ensureing metal cover body 23 and becket 24, what the laser beam melted
Depth should be greater than 2/3rds of 24 width of metal cover body.It can specifically be set according to actual conditions.In addition, it accurately revolves again
Turn welding bench, so that end of the laser beam along the periphery molten metal cover body 23 of the metal cover body 23.It is in this way, described
Metal cover body 23 is just attached with becket 24.Therefore, metal cover body 23 and becket 24 are carried out by laser beam
Welding, not only increases the firmness that metal cover body 23 is connect with becket 24, and improves metal cover body 23 and gold
Belong to the air-tightness of ring 24, avoid after implanted packaging body is implanted into human body, body fluid and blood etc. are through metal cap 20 and enter
Damage electronic component part in metal cap 20, so as to extend the service life of implanted packaging body.In addition, by laser beam by metal cap sheet
Body 23 is welded with becket 24, is avoided other impurities and is introduced in implanted packaging body 100.In other embodiments, institute
Metal cover body 23 is stated to connect by realizations such as soldering or diffusion welding (DW)s with becket 24.It is set with specific reference to actual conditions
It puts.
Step S30 forms metal connecting layer 30 in the surface periphery of the package substrate 10；Please refer to Fig.1 2.
In the present embodiment, the metal connecting layer 30 is the cyclic structure formed around 10 periphery of package substrate.The gold
The material for belonging to articulamentum 30 can be but be not limited only to as titanium, platinum, iridium, palladium, niobium, tantalum or the conjunction of wherein at least two kinds formation
Gold.Preferably, the material identical of the material of the metal connecting layer 30 and metal cap 20, can help improve metal cap in this way
20 firmness being connect with metal connecting layer 30.The metal connecting layer 30 is splashed by embedding technique, screen printing technique, magnetic control
It penetrates or hot evaporation etc. is formed on the surface of package substrate 10.The thickness of metal connecting layer 30 is 100nm~10 μm.Metal connects
It is 0.1~3mm to connect the outer diameter of layer 30 and difference in internal diameters.Metal connecting layer is formed by the periphery in package substrate 10, can be caused
Metal cap 20 connect more secured with package substrate 10, so as to significantly increase the stability of metal cap 20 and package substrate 10
And air-tightness.In other embodiments, the thickness of metal connecting layer 30 and size do not define.
It is further included in step S30 " forming metal connecting layer 30 in the surface periphery of the package substrate 10 "：
Step S31 is formed around the surface of the metal connecting layer 30 and multiple is alternatively arranged the first groove 31, the melting
Portion melts and fills completely multiple first grooves 31.Please refer to Fig.1 3 and Figure 14.
In the present embodiment, the first groove 31 is formed or is passed through mask plate by metal connecting layer described in plasma etching 30
Multiple splash-proofing sputtering metal or hot evaporation are formed.On the surface of package substrate 10.The shape of first groove 31 can be but not
It is only limitted to as annular shape.When in follow-up welding process, melting portion 21 is melted and filled completely described first groove 31.In this way,
Metal cap 20 is just securely connected with package substrate 10.Can further it be increased by multiple spaced first grooves 31
The join domain of big metal cap 20 and package substrate 10, so as to increase the firmness and gas that package substrate 10 is connect with metal cap 20
Close property.In addition, 21 overflow of melting portion after fusing is also avoided to go out outside metal cap 20, the surface increased outside metal cap 20 is thick
Rugosity causes coarse superficial injury human organ.
The metal cap 20 is placed on the surface of the package substrate 10 by step S40, and makes the welding surface 211 and institute
State the fitting of 30 surface of metal connecting layer.
In the present embodiment, package substrate 10 is fixed on welding bench using clamping piece.Metal cap 20 is placed on encapsulation again
On the first surface 111 of substrate 10, so that the surface of the welding surface 211 of metal cap 20 and metal connecting layer 30 is bonded.Due to gold
The outer diameter of category cover 20 and the outer diameter of package substrate 10 are equal so that metal cap 20 is mutually aligned with package substrate 10.Cause in this way
Metal cap 20 is more beautiful after being welded with package substrate 10.
Further, in step S40 " metal cap 20 is placed on the surface of the package substrate 10, and is made described
Welding surface 211 is bonded with 30 surface of metal connecting layer " include：
Step S41 applies constant pressure along 10 direction of package substrate to the metal cap 20, so that the metal
Articulamentum 30 is bonded with the welding surface 211.Please refer to Fig.1 5.
In the present embodiment, apply constant pressure in the outer surface of metal cap 20 along the direction of package substrate 10, it can be with
Further reduce the gap between metal cap 20 and package substrate 10, so as to which after follow-up welding, metal cap can be dramatically increased
20 and the firmness that connects of package substrate 10 and improve the air-tightness after metal cap 20 and package substrate 10 weld.
Melting portion 21 described in step S50 laser irradiations, so that the melting portion 21 melts and connects the package substrate 10
With the metal cap 20.Please refer to Fig.1 6-19.
In the present embodiment, the wavelength of the laser beam can be but be not limited to 1060nm or 532nm.The laser beam
Emitted by laser.The laser can be but be not limited to light laser, carbon dioxide laser or semiconductor and swash
Light device.By being melted melting portion 21 and connecting metal cap 20 with metal connecting layer 30 on package substrate 10, so as to fulfill gold
Belong to the connection of cover 20 and package substrate 10.In this way, the firmness that metal cap 20 is connect with package substrate 10 is not only increased, and
The air-tightness of metal cap 20 and package substrate 10 is improved, is avoided after implanted packaging body 100 is implanted into human body, body fluid and blood
Liquid etc. penetrates into damage electronic component part in implanted packaging body, so as to fulfill the service life of implanted packaging body 100 is extended.In addition,
It, can be to avoid the introducing of other impurities by laser welding.And metal cap 20 and package substrate 10 by laser are realized and connected
It connects, it is easy to operate, it easily promotes and volume production is efficient.
In step S50 " melting portions 21 described in laser irradiation, so that the melting portion 21 melts and connects the package substrate
10 include but are not limited to include step S51 and step S52 with the metal cap 20 ", please refer to Figure 20, each step is situated between in detail
It continues as follows：
The metal cap 20 and the package substrate 10 are placed on rotatable welding bench by step S51.
Step S52 at the uniform velocity rotates the welding bench, so that laser beam melts described melt along the periphery of the metal cap 20
Solution portion 21.
In the present embodiment, laser beam is radiated on first position in melting portion 21, and the melting portion 21 of the position occurs
It melts and connect the metal cap 20 of the position with package substrate 10.Accurately rotary welding bench again so that laser beam along
The periphery of the metal cap 20 melts the melting portion 21.In this way, the metal cap 20 is just attached with package substrate 10.Its
In, the depth that the laser beam melts is not limited to the depth of the welding of exemplary implanted packaging body 100 as illustrated in figs. 16-19
Degree, but for the degree of being connected firmly for ensureing metal cap 20 and package substrate 10, the depth that the laser beam melts should be greater than metal
2/3rds of 24 width of cover body.In other embodiments, the dissolving depth of laser beam is not specifically limited.Pass through laser beam
Metal cap 20 and package substrate 10 are welded, not only increase the firmness that metal cap 20 is connect with package substrate 10, and
And improve the air-tightness of metal cap 20 and package substrate 10, avoid when implanted packaging body 100 be implanted into human body after, body fluid and
Blood etc. penetrates into damage electronic component part in implanted packaging body 100, so as to fulfill the service life of implanted packaging body 100 is extended.
In addition, being welded metal cap 20 and package substrate 10 by laser beam, avoid other impurities and introduce implanted packaging body
In 100.
Due to carrying out laser welding between metal cap 20 and package substrate 10 so that metal cap 20 and package substrate 10
External also solidification has part molten metal, and melts that connect metallic surface coarse.Implanted packaging body 100 will be seriously affected in this way
Appearance.In this way when implanted packaging body 100 be implanted into people organ in, can to organ generate injury.Therefore, after need to be to welding
Metal ball is polished and is polished.So that metal cap 20 and the surface of package substrate 10 are smooth, coarse surface is avoided to pierce
It hurts sb.'s feelings organ.In addition, implanted packaging body can also be improved by carrying out sanding and polishing to the surface of metal cap 20 and package substrate 10
100 beauty.
The present embodiment in the surface periphery of package substrate 10 by forming metal connecting layer 30 and using described in laser irradiation
The melting portion 21 of metal cap 20, so that the melting portion 21 melts and connects the package substrate 10 and the metal cap
20, so as to fulfill the connection of package substrate 10 and metal cap 20.Therefore, the manufacturing method of the implanted packaging body can be prepared
One kind is strong with stability, the implanted packaging body 100 of the high bio-compatibility of intensity.
6 are please referred to Fig.1, a kind of implanted packaging body 100 is provided in one better embodiment of the application, including：Have
The package substrate 10 of bio-compatibility and the metal cap 20 with bio-compatibility, the surface periphery of the package substrate 10 are equipped with
One layer of metal connecting layer 30；The metal cap 20 is connected and fixed in the metal connecting layer 30 of the package substrate 10.
The present embodiment, by setting metal connecting layer 30 on 10 surface of package substrate and passing through metal connecting layer 30 by metal cap
20 and package substrate 10 be attached to form implanted packaging body 100.The implanted packaging body 100 has high stability,
High intensity and high-air-tightness, so as to significantly increase the service life of implanted packaging body 100.
8 are please referred to Fig.1, a kind of implanted packaging body 100 is provided in one better embodiment of the application, including：Have
The package substrate 10 of bio-compatibility and the metal cap 20 with bio-compatibility；The metal cap 20 includes the gold being connected with each other
Belong to cover body 23 and becket 24；The surface of the metal cover body 23 is equipped with fixed part 231, the inner peripheral surface of the becket 24
Equipped with positioning region 243, the fixed part 231 is mutually supported with the positioning region 233；The surface periphery of the package substrate 10 is set
There is one layer of metal connecting layer 30；The becket 24 is connected and fixed in the metal connecting layer 30 of the package substrate 10, so that
The metal cap 20 is connect with the package substrate 10.
In the present embodiment, by setting metal connecting layer 30 on 10 surface of package substrate and passing through metal connecting layer 30 by metal
Cover 20 and package substrate 10 are attached to form implanted packaging body 100.In addition, the upper formation in metal cover body 23 is fixed
Portion 231 and the formation positioning region 233 on becket 24, both can cause metal cap ontology 23 to be accurately welded on becket 24
On, and the fastness of metal cover body 23 and becket can be increased.The implanted packaging body 100 has high stability, high
Intensity and high-air-tightness, so as to significantly increase the service life of implanted packaging body 100.
A kind of implantable medical device is provided in one better embodiment of the application.The implantable medical device is used to plant
Enter formula medical instrument, including pacemaker, brain pacemaker, artificial cochlea and artificial retina etc..The implantable medical device
Part includes：Implanted packaging body 100 and implanted stimulating electrode 200 with bio-compatibility.The implanted formula packaging body
100 are electrically connected with implanted stimulating electrode 200.Implantable medical device can reach long-term stability in human body, avoid
Implanted stimulating electrode 200 comes off with implanted packaging body 100, also can significantly enhance the airtight of implantable medical device
Property, it avoids after implanted packaging body is implanted into human body, body fluid and blood etc. penetrate into damage electronic component in implanted packaging body
Part, so as to fulfill the service life of implanted packaging body is extended.
The above disclosure is only the preferred embodiments of the present invention, cannot limit the right model of the present invention with this certainly
It encloses, one of ordinary skill in the art will appreciate that realizing all or part of flow of above-described embodiment, and will according to right of the present invention
Made equivalent variations are sought, still falls within and invents covered range.
Claims (10)
1. a kind of manufacturing method of implanted packaging body, which is characterized in that including：
Package substrate with bio-compatibility is provided；
The metal cap with bio-compatibility is prepared, the metal cap includes melting portion, and the melting portion includes welding surface；
Metal connecting layer is formed in the surface periphery of the package substrate；
The metal cap is covered on the surface of the package substrate, and the welding surface is made to be pasted with the metal connecting layer surface
It closes；
Melting portion described in laser irradiation, so that the melting portion melts and connects the package substrate and the metal cap.
2. the manufacturing method of implanted packaging body according to claim 1, which is characterized in that " prepare tool in the step
Have the metal cap of bio-compatibility, the metal cap includes melting portion, and the melting portion includes welding surface " include：
A metal cover body is prepared, the metal cover body includes joint face and the fixed part for being convexly equipped in the joint face side；
A becket is prepared, the becket includes the first anchor ring and the second anchor ring that are oppositely arranged, and the melting portion is set on institute
It states on the second anchor ring；
By the welding metal rings on the metal cover body, so that the first anchor ring is connect with the joint face.
3. the manufacturing method of implanted packaging body according to claim 2, which is characterized in that " prepare one in the step
Becket, the becket include the first anchor ring and the second anchor ring that are oppositely arranged, and the melting portion is set on second anchor ring
On " include：
Inner surface around the becket forms positioning region, and the positioning region and the fixed part of the metal cover mutually support
It holds.
4. the manufacturing method of implanted packaging body according to claim 3, which is characterized in that in the step " described
The surface periphery of package substrate forms metal connecting layer " include：
Multiple spaced first grooves are formed around the surface of the metal connecting layer, the melting portion melts and fills full
Multiple first grooves.
5. according to the manufacturing method of claim 1-4 any one of them implanted packaging bodies, which is characterized in that in the step
" metal cap is covered on the surface of the package substrate, and the welding surface is made to be bonded with the metal connecting layer surface "
It further includes：
Constant pressure is applied to the metal cap along the package substrate direction, so that the metal connecting layer and the welding
Face paste is closed.
6. the manufacturing method of implanted packaging body according to claim 5, which is characterized in that " laser shines in the step
The melting portion is penetrated, so that the melting portion melts and connects the package substrate and the metal cap " it further includes：
The metal cap and the package substrate are placed on rotatable welding bench；
The welding bench is at the uniform velocity rotated, so that laser beam melts the melting portion along the periphery of the metal cap.
7. the manufacturing method of implanted packaging body according to claim 6, which is characterized in that the package substrate and described
The airtight sexual satisfaction helium leak rates of metal cap are less than 1 × 10-9Pa·m3/s。
8. a kind of implanted packaging body, which is characterized in that including：Package substrate with bio-compatibility and with bio-compatible
Property metal cap, the surface periphery of the package substrate is equipped with one layer of metal connecting layer；The metal cap is connected and fixed on described
In the metal connecting layer of package substrate.
9. a kind of implanted packaging body, which is characterized in that including：Package substrate with bio-compatibility and with bio-compatible
The metal cap of property；The metal cap includes the metal cover body and becket that are connected with each other；The surface of the metal cover body is set
There is fixed part, the inner peripheral surface of the becket is equipped with positioning region, and the fixed part is mutually supported with the positioning region；The encapsulation
The surface periphery of substrate is equipped with one layer of metal connecting layer；The becket is connected and fixed on the metal connecting layer of the package substrate
On.
10. a kind of implantable medical device, which is characterized in that will including implanted stimulating electrode and claim 8 or right
Seek 9 implanted packaging body；The implanted packaging body is electrically connected with the implanted stimulating electrode.
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| CN201711410701.2A CN108211118B (en) | 2017-12-23 | 2017-12-23 | Implantable package, method of manufacturing the same, and implantable medical device |
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| CN201711410701.2A CN108211118B (en) | 2017-12-23 | 2017-12-23 | Implantable package, method of manufacturing the same, and implantable medical device |
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