CN108196207B - Magnetic field probe adopting isolated via hole structure - Google Patents
Magnetic field probe adopting isolated via hole structure Download PDFInfo
- Publication number
- CN108196207B CN108196207B CN201711257850.XA CN201711257850A CN108196207B CN 108196207 B CN108196207 B CN 108196207B CN 201711257850 A CN201711257850 A CN 201711257850A CN 108196207 B CN108196207 B CN 108196207B
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- strip line
- via hole
- signal
- shielding
- line
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
Abstract
The invention relates to a magnetic field probe adopting an isolated via hole structure, which comprises a symmetrical non-shielding ring, a grounding via hole, a strip line, an isolated via hole, a signal via hole, an adapter, an extension line of a symmetrical arm of the non-shielding ring, an upper shielding layer of the strip line, a lower shielding layer of the strip line, a strip line medium and a strip line signal line. The symmetrical non-shielding ring is located in an interlayer of a medium material of the strip line to ensure the strength of the symmetrical non-shielding ring, one arm of the symmetrical non-shielding ring is directly connected with a signal line of the strip line, the other arm is connected with an upper shielding layer and a lower shielding layer of the strip line through a grounding via hole via a non-shielding symmetrical ring extension line, an isolation via hole is located on the strip line and is connected with the upper shielding layer and the lower shielding layer of the strip line, and is simultaneously located between the grounding via hole and the strip line signal line, and the other end of the strip line signal line is connected with an adapter through a signal via hole.
Description
[ technical field ] A method for producing a semiconductor device
The invention belongs to the field of electromagnetic field test, and particularly relates to a magnetic field probe structure for testing a broadband high-sensitivity near-field magnetic field, which can obtain near-field magnetic field distribution parameters of a tested object through the near-field test of the probe.
[ background of the invention ]
With the rapid development of electrical engineering, electronic science and technology, computer technology, control theory, control engineering and other technologies, electronic circuits occupy an indispensable position in various industries. The working frequency band of the electronic circuit is continuously expanded, the integration level and the complexity are higher and higher, and any section of wiring in the circuit can possibly become a source of a radiation magnetic field. The coupling between different trace radiations is one of the main causes of the system level electromagnetic compatibility problem.
Documents issued by the state technical supervision authority explicitly state that any product with severe radio interference is prohibited from production and use, which does not comply with the national standards. Accurate measurement of radiation of different electronic circuits is an effective investigation means for index quantization link in electromagnetic compatibility design. However, when the electromagnetic field intensity radiated by the tested circuit is measured in the far field, the accurate position of the radiation source in the tested device cannot be accurately obtained, which is a main problem in the process of electromagnetic compatibility modification of the tested circuit. Compared with the defects of far field test, the near field test can accurately position the radiation source in the electronic circuit. More and more electronic devices have the characteristic of wide working frequency band, and the signal current on the wiring is very small. However, the magnetic field probe used in the current near field test process cannot have the characteristics of broadband and high sensitivity, so that a group of near field test probes are required to jointly measure in the test process to meet the requirements, including using a probe with a larger size at a low frequency and replacing the probe with a smaller size at a high frequency. Frequent replacement of the magnetic field probe during testing can introduce large measurement errors in the results.
[ summary of the invention ]
In order to overcome the defects of the existing near-field magnetic field probe, the invention aims to provide a magnetic field probe applied to near-field testing, which can solve the problem that the test cannot be carried out due to weak signal current in broadband testing and the defect of measurement error caused by probe replacement.
The purpose of the invention is realized by adopting the following technical scheme:
a magnetic field probe adopting an isolated via hole structure comprises a symmetrical non-shielding ring, an isolated via hole, a ground via hole, a strip line, a signal via hole and an adapter.
The symmetrical non-shielding ring is an important metal structure for picking up near-field magnetic field distribution, two arms of the symmetrical non-shielding ring are symmetrical about a central axis, one arm of the symmetrical non-shielding ring is connected with a signal line of a strip line, and the other arm of the symmetrical non-shielding ring is directly connected with an upper layer shielding ground and a lower layer shielding ground of the strip line through a grounding through hole after being prolonged; the unshielded symmetrical ring structure is similar to a U-shaped structure, and the left arm and the right arm are positioned in the strip line medium and are symmetrical about the central axis.
The isolation via hole aims at providing a sufficient backflow path for distributed current, is arranged on the strip line and is positioned between an extension line of one arm of the symmetrical non-shielding ring and a signal line of the microstrip line; the isolation via hole is in the form of a metal through hole and is directly connected with the upper shielding ground and the lower shielding ground of the strip line.
The grounding via hole is used for enabling the symmetrical non-shielding ring and the microstrip line to form a passage, is positioned at the tail end of the extension line of the symmetrical non-shielding ring, is in a metal through hole, and is directly connected with the upper layer shielding ground of the strip line and the lower layer shielding ground of the strip line.
The strip line is composed of a signal line, a strip line medium, an upper shielding ground and a lower shielding ground, wherein the upper shielding ground of the strip line is positioned on the upper surface of the strip line medium, the lower shielding ground of the strip line is positioned on the lower surface of the strip line medium, and the signal line is positioned in the strip line medium; the other end of the signal wire is connected with the adapter through a signal via hole, and the signal picked up by the magnetic field probe is transmitted to the test equipment through the adapter.
The signal via hole and the adapter are positioned at the other end of the strip line, the signal via hole penetrates through a strip line medium to be connected with a signal line of the strip line, and the signal via hole is isolated from an upper layer shielding ground of the strip line and a lower layer shielding ground of the strip line to prevent short circuit. The adapter is fixed on the strip line through the signal through hole, and aims to provide a convenient connection method for transmitting a signal tested by the probe to the test equipment.
Compared with the prior art, the invention has the beneficial effects that:
the invention can realize the characteristics of broadband and high sensitivity by using the symmetrical non-shielding ring near-field magnetic field probe for isolating the through hole, effectively overcomes the defects that weak signals cannot be measured and measurement errors are introduced due to probe replacement in the traditional test, and ensures the accuracy of the test result.
[ description of the drawings ]
FIG. 1 is a schematic top view of the probe structure of the present invention.
FIG. 2 is a schematic side view of the probe structure of the present invention.
FIG. 3 is a schematic diagram of near field testing of the probe structure of the present invention
Reference numerals: 1. a non-shielding symmetric ring; 2. a ground via; 3. a strip line; 4. isolating the via; 5. a signal via; 6. an adapter; 7. the extension line of the symmetrical arm of the non-shielding ring; 8. a shielding layer on the strip line; 9. a strip line lower shield layer; 10. a stripline medium; 11. a strip line signal line; 12. a magnetic field probe; 13. a platform to be tested; 14. a coaxial cable; 15. testing equipment;
[ detailed description ] embodiments
The present invention will be described in further detail with reference to the accompanying drawings.
As shown in fig. 1 and fig. 2, the present embodiment provides a magnetic field probe applied to a near field test, which includes a symmetric unshielded loop 1, a ground via 2, a strip line 3, an isolated via 4, a signal via 5, an adapter 6, an unshielded loop symmetric arm extension line 7, a strip line upper shielding layer 8, a strip line lower shielding layer 9, a strip line medium 10, and a strip line signal line 11. The symmetrical non-shielding ring 1 is located in an interlayer of a dielectric material 10 of the strip line 3 to ensure the strength of the symmetrical non-shielding ring, one arm of the ring is directly connected with a signal line 11 of the strip line 3, the other arm is connected with an upper shielding layer 8 and a lower shielding layer 9 of the strip line 3 through a non-shielding symmetrical ring extension line 7 through a grounding via hole 2, an isolation via hole 4 is located on the strip line 3 and is connected with the upper shielding layer 8 and the lower shielding layer 9 of the strip line, and is located between the grounding via hole 2 and the strip line signal line 11, and the other end of the strip line signal line 11 is connected with an adapter 6 through a signal via hole 5. The electronic devices tested by the near field magnetic field in the present embodiment may include integrated circuits, circuit boards, cables, chassis, etc., which are merely exemplary and do not list all the tested electronic devices.
As shown in fig. 3, the magnetic field probe 12 of the present invention is placed on a near field plane of the tested platform 13, the magnetic field probe 12 is connected to one end of the coaxial cable 14, and the other end of the coaxial cable 14 is connected to the testing equipment 15. By moving the position of the magnetic field probe 12 and reading the result on the testing device 15, the magnetic field test result on the near field plane of the tested platform 13 can be obtained.
It will be apparent to those skilled in the art that various other changes and modifications can be made in the above-described embodiments and concepts and all such changes and modifications are intended to be within the scope of the appended claims.
Claims (4)
1. The utility model provides an adopt magnetic field probe of keeping apart via hole structure which characterized in that: the device comprises a symmetrical non-shielding ring, an isolation via hole, a ground via hole, a strip line, a signal via hole and an adapter;
the symmetrical non-shielding ring is an important metal structure for picking up near-field magnetic field distribution, two arms of the symmetrical non-shielding ring are symmetrical about a central axis, one arm of the symmetrical non-shielding ring is connected with a signal line of a strip line, and the other arm of the symmetrical non-shielding ring is extended and then directly connected with an upper shielding ground and a lower shielding ground of the strip line through a grounding through hole;
the isolated via hole is a sufficient backflow path for current distribution, is arranged on the strip line and is positioned between an extension line of one arm of the symmetrical non-shielding ring and a signal line of the strip line; the isolated via hole is directly connected with the upper shielding ground and the lower shielding ground of the strip line;
the grounding via hole is a path formed by the symmetrical non-shielding ring and the strip line and is positioned at the tail end of the extension line of the symmetrical non-shielding ring, and the grounding via hole is directly connected with the upper layer shielding ground of the strip line and the lower layer shielding ground of the strip line;
the strip line consists of a signal line, a strip line medium, an upper shielding ground and a lower shielding ground; the upper layer shield of the strip line is positioned on the upper surface of the strip line medium, the lower layer shield of the strip line is positioned on the lower surface of the strip line medium, and the signal line is positioned in the strip line medium; the other end of the signal wire is connected with the adapter through a signal via hole, and the signal picked up by the magnetic field probe is transmitted to the test equipment through the adapter;
the signal via hole and the adapter are positioned at the other end of the strip line, the signal via hole penetrates through a strip line medium to be connected with a signal line of the strip line, and the signal via hole is isolated from an upper layer shielding ground of the strip line and a lower layer shielding ground of the strip line to prevent short circuit; the adapter is fixed on the strip line through the signal via hole, and transmits a signal tested by the probe to the test equipment.
2. The magnetic field probe adopting the isolated via structure of claim 1, wherein: the unshielded symmetrical ring structure is similar to a U-shaped structure, and the left arm and the right arm are positioned in the strip line medium and are symmetrical about the central axis.
3. The magnetic field probe adopting the isolated via structure of claim 1, wherein: the isolated vias are in the form of metal vias.
4. The magnetic field probe adopting the isolated via structure of claim 1, wherein: the ground vias are in the form of metal vias.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711257850.XA CN108196207B (en) | 2017-12-04 | 2017-12-04 | Magnetic field probe adopting isolated via hole structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711257850.XA CN108196207B (en) | 2017-12-04 | 2017-12-04 | Magnetic field probe adopting isolated via hole structure |
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| Publication Number | Publication Date |
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| CN108196207A CN108196207A (en) | 2018-06-22 |
| CN108196207B true CN108196207B (en) | 2020-06-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201711257850.XA Active CN108196207B (en) | 2017-12-04 | 2017-12-04 | Magnetic field probe adopting isolated via hole structure |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109215859B (en) * | 2018-08-10 | 2023-12-19 | 深圳市信维通信股份有限公司 | Strip line/microstrip line for transmitting radio frequency signals |
| CN116679244B (en) * | 2023-07-27 | 2023-10-17 | 中国科学院上海高等研究院 | Automatic measuring device and method for fast pulse magnetic field |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5052947A (en) * | 1990-11-26 | 1991-10-01 | United States Of America As Represented By The Secretary Of The Air Force | Cable shield termination backshell |
| CN204389661U (en) * | 2015-01-08 | 2015-06-10 | 南京信息工程大学 | Printed circuit template magnet field probe |
| CN105717466A (en) * | 2016-04-08 | 2016-06-29 | 北京航空航天大学 | Broadband minitype near field magnetic field measurement probe |
| CN105891611A (en) * | 2016-04-08 | 2016-08-24 | 北京航空航天大学 | Broadband miniature near-field electric field test probe |
-
2017
- 2017-12-04 CN CN201711257850.XA patent/CN108196207B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5052947A (en) * | 1990-11-26 | 1991-10-01 | United States Of America As Represented By The Secretary Of The Air Force | Cable shield termination backshell |
| CN204389661U (en) * | 2015-01-08 | 2015-06-10 | 南京信息工程大学 | Printed circuit template magnet field probe |
| CN105717466A (en) * | 2016-04-08 | 2016-06-29 | 北京航空航天大学 | Broadband minitype near field magnetic field measurement probe |
| CN105891611A (en) * | 2016-04-08 | 2016-08-24 | 北京航空航天大学 | Broadband miniature near-field electric field test probe |
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| CN108196207A (en) | 2018-06-22 |
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