CN108195564A - The method and apparatus for evaluating LED component luminous flux - Google Patents

The method and apparatus for evaluating LED component luminous flux Download PDF

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Publication number
CN108195564A
CN108195564A CN201711367733.9A CN201711367733A CN108195564A CN 108195564 A CN108195564 A CN 108195564A CN 201711367733 A CN201711367733 A CN 201711367733A CN 108195564 A CN108195564 A CN 108195564A
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China
Prior art keywords
cavity
solders
luminous flux
silver paste
led component
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CN201711367733.9A
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Chinese (zh)
Inventor
胡进
蔡赛
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Suzhou Billion Photoelectric Technology Co Ltd Billiton
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Suzhou Billion Photoelectric Technology Co Ltd Billiton
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Priority to CN201711367733.9A priority Critical patent/CN108195564A/en
Publication of CN108195564A publication Critical patent/CN108195564A/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G01M11/02—Testing optical properties
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2607—Circuits therefor
    • G01R31/2632—Circuits therefor for testing diodes
    • G01R31/2635—Testing light-emitting diodes, laser diodes or photodiodes

Abstract

Present invention is disclosed a kind of method and apparatus for evaluating LED component luminous flux, wherein this method includes：The solder distributed image of die bond layer in LED component is shot using X ray, the solder of die bond layer includes Au/Sn solders and silver paste solder；Identification is located at the cavity in Au/Sn solders and silver paste solder in solder distributed image；Obtain the driving current interval value of LED component；According to type and quantity and driving current interval value empty in Au/Sn solders and silver paste solder, the luminous flux of LED component is evaluated.Temperature when LED component works can influence its luminous flux, this influence can be more apparent with the raising of the driving current of LED component, and die bond layer is the main thermally conductive pathways of LED component chips and lead frame, empty type and quantity determine its heat-conductive characteristic again in die bond layer, utilize the solder distributed image of X ray shooting die bond layer, and identifying the cavity in wherein Au/Sn solders and silver paste solder, the driving current interval value of cooperated with LED device can make an appraisal to LED light flux.

Description

The method and apparatus for evaluating LED component luminous flux
Technical field
The invention belongs to LED field of luminescent technology, and in particular to a kind of method and apparatus for evaluating LED component luminous flux.
Background technology
Conventional incandescent energy consumption is high, short life, in today that global resources are in short supply, forbids giving birth to by national governments gradually Production, substitute products are electronic energy-saving lamps therewith, although electronic energy-saving lamp improves energy-saving effect, but due to the use of many pollutions The heavy metal element of environment, and run counter to the main trend of environmental protection.With LED technology high speed development LED illumination gradually into Only choosing for novel green illumination.LED principle of luminosity, energy-saving and environmental protection level on all be far superior to traditional lighting production Product.
However, lack a kind of can lead to some LED devices in the prior art in the method for effective evaluation LED component luminous flux Part manufacture product cannot reach the light flux values of factory settings, be badly in need of a kind of method and apparatus for evaluating LED component luminous flux, can To carry out quality inspection to LED component before manufacture, to reject unqualified device.
Invention content
One embodiment of the application provides a kind of method for evaluating LED component luminous flux, can effectively estimate out LED devices The luminous flux of part, in order to reject unqualified device, this method includes：
The solder distributed image of die bond layer in LED component is shot using X ray, the solder of the die bond layer includes Au/Sn Solder and silver paste solder；
Identification is located at the cavity in the Au/Sn solders and silver paste solder in the solder distributed image；
Obtain the driving current interval value of LED component；
According to type and quantity empty in the Au/Sn solders and silver paste solder and the driving current interval value, Evaluate the luminous flux of LED component.
In one embodiment, according to empty type and quantity and the driving in the Au/Sn solders and silver paste solder Electric current interval value is evaluated the luminous flux of LED component, is specifically included：
Judge whether the driving current interval value is more than preset value；If it is not,
Identify the quantity that cavity is penetrated in the Au/Sn solders and silver paste solder；
First luminous flux weighing factor value is determined with the quantity that cavity is penetrated in the Au/Sn solders；
Second luminous flux weighing factor value is determined with the quantity that cavity is penetrated in silver paste solder；
According to the standard light flux values of LED component, the first luminous flux weighing factor value and the second luminous flux weighing factor Value evaluates the luminous flux of LED component.
In one embodiment, identify the quantity that cavity is penetrated in the Au/Sn solders and silver paste solder, specifically include：
The area that cavity is penetrated in the Au/Sn solders and silver paste solder is obtained, and respectively by itself and standard cyst areas It compares, to obtain the quantity that cavity is penetrated in the Au/Sn solders and silver paste solder.
In one embodiment, the first luminous flux weighing factor value is determined with the quantity that cavity is penetrated in the Au/Sn solders, is had Body includes：
The quantity that cavity is penetrated in the Au/Sn solders is multiplied by the first empty weighting coefficient, obtains the first luminous flux shadow Ring weighted value；And
Second luminous flux weighing factor value is determined with the quantity that cavity is penetrated in silver paste solder, is specifically included：
The quantity that cavity is penetrated in silver paste solder is multiplied by the second empty weighting coefficient, obtains the influence of the second luminous flux Weighted value；Wherein,
Described first empty weighting coefficient is less than the second empty weighting coefficient.
In one embodiment, according to empty type and quantity and the driving in the Au/Sn solders and silver paste solder Electric current interval value is evaluated the luminous flux of LED component, is specifically included：
Judge whether the driving current interval value is more than preset value；If so,
Identify the quantity for penetrating cavity in the Au/Sn solders；
Top layer cavity, bottom cavity, central cavity and the quantity for penetrating cavity in identification silver paste solder；
First luminous flux weighing factor value is determined with the quantity that cavity is penetrated in the Au/Sn solders；
Second is determined with the quantity that cavity, top layer cavity, bottom cavity and central cavity are penetrated in silver paste solder Luminous flux weighing factor value；
According to the standard light flux values of LED component, the first luminous flux weighing factor value and the second luminous flux weighing factor Value evaluates the luminous flux of LED component.
In one embodiment, identify the quantity for penetrating cavity in the Au/Sn solders, specifically include：
The area that cavity is penetrated in the Au/Sn solders is obtained, and itself and standard cyst areas are compared, with described in acquisition The quantity in cavity is penetrated in Au/Sn solders；And
The quantity of cavity, top layer cavity, bottom cavity and central cavity is penetrated in identification silver paste solder, it is specific to wrap It includes：
The area that cavity, top layer cavity, bottom cavity and central cavity are penetrated in silver paste solder is obtained, and respectively Itself and standard cyst areas are compared, cavity, top layer cavity, bottom cavity and center are penetrated in silver paste solder to obtain The quantity in cavity.
In one embodiment, the first luminous flux weighing factor value is determined with the quantity that cavity is penetrated in the Au/Sn solders, is had Body includes：
The quantity that cavity is penetrated in the Au/Sn solders is multiplied by the first empty weighting coefficient, obtains the first luminous flux shadow Ring weighted value；And
Second is determined with the quantity that cavity, top layer cavity, bottom cavity and central cavity are penetrated in silver paste solder Luminous flux weighing factor value, specifically includes：
The quantity that cavity, top layer cavity, bottom cavity and central cavity are penetrated in silver paste solder is multiplied by respectively Second empty weighting coefficient, third cavity weighting coefficient, the 4th empty weighting coefficient and the 5th empty weighting coefficient, and ask With obtain the second luminous flux weighing factor value；Wherein,
Described first empty the second empty the 4th cavities of weighting coefficient ＜ thirds cavity weighting coefficient ＜ of weighting coefficient ＜ add The empty weighting coefficients of weight coefficient ＜ the 5th.
One embodiment of the application also provides a kind of device for evaluating LED component luminous flux, including：
X ray shooting unit, for shooting the solder distributed image of die bond layer in LED component, the solder of the die bond layer Including Au/Sn solders and silver paste solder；
Recognition unit is located at for being identified in the solder distributed image in the Au/Sn solders and silver paste solder Cavity；
Acquiring unit, for obtaining the driving current interval value of LED component；
Luminous flux computing unit, for according to type and quantity empty in the Au/Sn solders and silver paste solder and The drive current range value evaluates the luminous flux of LED component.
Compared with prior art, the technical solution of the application has the advantages that：
Temperature when LED component works can influence its luminous flux, and this influence can be increased with the driving current of LED component And it is more apparent, and die bond layer is the main thermally conductive pathways of LED component chips and lead frame, heat-conductive characteristic can be direct The operating temperature of LED component is influenced, and type and quantity empty in die bond layer determine the heat-conductive characteristic of die bond layer, profit The solder distributed image of die bond layer in LED component is shot with X ray, and identifies the sky in wherein Au/Sn solders and silver paste solder Hole, the driving current interval value of cooperated with LED device can make an appraisal to LED light flux.
Description of the drawings
Fig. 1 is the flow chart of LED light flux evaluation method in one embodiment of the application；
Fig. 2 is the module map of LED light flux evaluation device in one embodiment of the application.
Specific embodiment
The application is described in detail below with reference to specific embodiment shown in the drawings.But these embodiments are simultaneously The application is not limited, structure that those of ordinary skill in the art are made according to these embodiments, method or functionally Transformation is all contained in the protection domain of the application.
Join Fig. 1, introduce the method that LED component luminous flux is evaluated in one embodiment of invention, this method includes：
S1, the solder distributed image that die bond layer in LED component is shot using X ray, the solder of the die bond layer include Au/ Sn solders and silver paste solder.
In one typical LED component encapsulating structure, including LED chip epitaxial layer, chip bonding layer, substrate, die bond layer, Lead frame copper clad layers and lead frame ceramic layer up and down, die bond layer are by LED chip and lead frame by one layer of solder It is fixed, since coarse lead frame upper surface can promote the luminous efficiency of LED component, surface is widely used at present Lead frame after roughening, but the surface being roughened brings the problem of serious to the welding of die bond layer, the solder of die bond layer is very Difficulty is formed on its surface perfect welding layer, easily forms cavity, and die bond layer thermal resistance is caused to increase.Production technology general at present In, two kinds of materials completion LED chips of LED chip generally use Au/Sn solders and silver paste solder are fixedly connected with lead frame. Also, normally, the thickness of Au/Sn solders can be more thinner than silver paste solder far away.
S2, identification is located at the cavity in the Au/Sn solders and silver paste solder in the solder distributed image.
S3, the driving current interval value for obtaining LED component.
S4, according to type and quantity empty in the Au/Sn solders and silver paste solder and the driving current section Value evaluates the luminous flux of LED component.
Non-destructive testing to die bond layer filling quality can be realized using X ray shooting, due in Au/Sn solders and silver paste The region of fill solder, metal material aggregation, X ray is more difficult to penetrate die bond layer, thus color is compared with case, and in the sky not being filled Hole region, then metal material is relatively fewer, and X ray can readily penetrate through die bond layer.By by the image shot and standard The image in various types of cavities is compared, and can accurately learn the type and quantity in cavity.And die bond layer is LED component The main thermally conductive pathways of chips and lead frame, heat-conductive characteristic can directly affect the luminous flux of LED component, and die bond layer The type and quantity in middle cavity determine the heat-conductive characteristic of die bond layer again, and the weldering of die bond layer in LED component is shot using X ray Expect distributed image, can identify the cavity in wherein Au/Sn solders and silver paste solder accordingly.Meanwhile the driving current of LED component The size that LED component operating temperature influences luminous flux is influenced whether again, it is generally the case that the driving current of LED component is smaller, Then its operating temperature influences luminous flux smaller, conversely, driving current is bigger, then influence of its operating temperature to luminous flux is got over Greatly.This is because when driving current is higher, the operating temperature of LED component is higher, the accumulation of heat of the active layer of LED chip Internal quantum can be more significantly decreased, so as to be had an impact to the luminous flux of LED.
In the present embodiment, step S4 is specifically included：
S41, judge whether the driving current interval value is more than preset value；If it is not, then include：
The quantity in cavity is penetrated in S4111, the identification Au/Sn solders and silver paste solder.
Specifically, the area that cavity is penetrated in the Au/Sn solders and silver paste solder is obtained, and respectively by itself and standard null Hole area compares, to obtain the quantity that cavity is penetrated in the Au/Sn solders and silver paste solder.
S4112, the first luminous flux weighing factor value is determined to penetrate the quantity in cavity in the Au/Sn solders.
Specifically, the quantity that cavity is penetrated in the Au/Sn solders is multiplied by the first empty weighting coefficient, obtains the first light Flux weighing factor value.
S4113, the second luminous flux weighing factor value is determined to penetrate the quantity in cavity in silver paste solder.
Specifically, the quantity that cavity is penetrated in silver paste solder is multiplied by the second empty weighting coefficient, obtains the second light Flux weighing factor value.
S4114, standard light flux values, the first luminous flux weighing factor value and the second luminous flux shadow according to LED component Weighted value is rung, evaluates the luminous flux of LED component.
It penetrates cavity and refers to that this kind of cavity is to lead to solder according to one kind cavity completely through solder thickness direction The main reason for thermal resistance increases, therefore, the quantity in cavity is penetrated by calculating can effectively evaluate the heat transfer effect of die bond layer Fruit.
In the present embodiment, the first empty weighting coefficient is less than the second empty weighting coefficient, this is because, silver paste solder There is the thermal conductivity that may be significantly smaller relative to Au/Sn solders, and the thickness of silver paste solder is also relative to the thickness of Au/Sn solders Bigger, therefore influence of the cavity to die bond layer heat transfer that penetrate occurred in silver paste solder is significantly more than in Au/Sn solders Existing penetrates influence of the cavity to die bond layer heat transfer.And since the driving current interval value of LED component at this time is less than preset value, Therefore, the operating temperature of LED component is relatively small to its luminous flux influence value, so it is only necessary to consider in solder to penetrate sky Hole.
And if driving current interval value is more than preset value in step S41；Then further include：
The quantity for penetrating cavity in S4121, the identification Au/Sn solders.
Specifically, the area that cavity is penetrated in the Au/Sn solders and silver paste solder is obtained, and respectively by itself and standard null Hole area compares, to obtain the quantity that cavity is penetrated in the Au/Sn solders and silver paste solder.
Top layer cavity, bottom cavity, central cavity and the number for penetrating cavity in S4122, identification silver paste solder Amount.
Specifically, the face that cavity, top layer cavity, bottom cavity and central cavity are penetrated in silver paste solder is obtained Product, and respectively compare itself and standard cyst areas, cavity, top layer cavity, bottom sky are penetrated in silver paste solder to obtain Hole and the quantity of central cavity.
S4123, the first luminous flux weighing factor value is determined to penetrate the quantity in cavity in the Au/Sn solders.
Specifically, the quantity that cavity is penetrated in the Au/Sn solders is multiplied by the first empty weighting coefficient, obtains the first light Flux weighing factor value
S4124, to be penetrated in silver paste solder, cavity, top layer is empty, bottom is empty and the quantity of central cavity is true Fixed second luminous flux weighing factor value.
Specifically, the quantity point for cavity, top layer cavity, bottom cavity and central cavity being penetrated in silver paste solder It is not multiplied by the second empty weighting coefficient, third cavity weighting coefficient, the 4th empty weighting coefficient and the 5th empty weighting coefficient, And sum, obtain the second luminous flux weighing factor value.
S4125, standard light flux values, the first luminous flux weighing factor value and the second luminous flux shadow according to LED component Weighted value is rung, evaluates the luminous flux of LED component.
Driving current interval value in LED component is more than preset value, not only calculates the quantity pair for penetrating cavity The thermal conduction effect of die bond layer.Also further top layer cavity, bottom cavity and the central cavity in silver paste solder are also received Enter Consideration.Here the cavity of solder topsheet surface part, the bottom cavity that top layer cavity refers to only penetrate refer to only wear The cavity of saturating solder bottom surface part, central cavity refer to be located at the cavity inside solder.Since silver paste solder is with respect to Au/ The thickness bigger of Sn solders, and the thermal resistance with bigger, therefore, by top layer therein cavity, bottom cavity and central cavity The luminous flux of LED component can be more accurately predicted by being included in the factor of evaluation LED component luminous flux.
Wherein, first empty the second empty the 4th cavities of weighting coefficient ＜ thirds cavity weighting coefficient ＜ of weighting coefficient ＜ add The empty weighting coefficients of weight coefficient ＜ the 5th.
Joining Fig. 2, the application also provides a kind of device for evaluating LED component luminous flux, including：
X ray shooting unit, for shooting the solder distributed image of die bond layer in LED component, the solder of the die bond layer Including Au/Sn solders and silver paste solder；
Recognition unit is located at for being identified in the solder distributed image in the Au/Sn solders and silver paste solder Cavity；
Acquiring unit, for obtaining the driving current interval value of LED component；
Luminous flux computing unit, for according to type and quantity empty in the Au/Sn solders and silver paste solder and The drive current range value evaluates the luminous flux of LED component.
The present invention is had the advantages that by the above embodiment：
Temperature when LED component works can influence its luminous flux, and this influence can be increased with the driving current of LED component And it is more apparent, and die bond layer is the main thermally conductive pathways of LED component chips and lead frame, heat-conductive characteristic can be direct The operating temperature of LED component is influenced, and type and quantity empty in die bond layer determine the heat-conductive characteristic of die bond layer, profit The solder distributed image of die bond layer in LED component is shot with X ray, and identifies the sky in wherein Au/Sn solders and silver paste solder Hole, the driving current interval value of cooperated with LED device can make an appraisal to LED light flux.
It should be understood by those skilled in the art that, the embodiment of the present invention can be provided as method, system or computer program Product.Therefore, the reality in terms of complete hardware embodiment, complete software embodiment or combination software and hardware can be used in the present invention Apply the form of example.Moreover, the computer for wherein including computer usable program code in one or more can be used in the present invention The computer program production that usable storage medium is implemented on (including but not limited to magnetic disk storage, CD-ROM, optical memory etc.) The form of product.
The present invention be with reference to according to the method for the embodiment of the present invention, the flow of equipment (system) and computer program product Figure and/or block diagram describe.It should be understood that it can be realized by computer program instructions every first-class in flowchart and/or the block diagram The combination of flow and/or box in journey and/or box and flowchart and/or the block diagram.These computer programs can be provided The processor of all-purpose computer, special purpose computer, Embedded Processor or other programmable data processing devices is instructed to produce A raw machine so that the instruction performed by computer or the processor of other programmable data processing devices is generated for real The device of function specified in present one flow of flow chart or one box of multiple flows and/or block diagram or multiple boxes.
These computer program instructions, which may also be stored in, can guide computer or other programmable data processing devices with spy Determine in the computer-readable memory that mode works so that the instruction generation being stored in the computer-readable memory includes referring to Enable the manufacture of device, the command device realize in one flow of flow chart or multiple flows and/or one box of block diagram or The function of being specified in multiple boxes.
These computer program instructions can be also loaded into computer or other programmable data processing devices so that counted Series of operation steps are performed on calculation machine or other programmable devices to generate computer implemented processing, so as in computer or The instruction offer performed on other programmable devices is used to implement in one flow of flow chart or multiple flows and/or block diagram one The step of function of being specified in a box or multiple boxes.
In a typical configuration, computing device includes one or more processors (CPU), input/output interface, net Network interface and memory.
Memory may include computer-readable medium in volatile memory, random access memory (RAM) and/or The forms such as Nonvolatile memory, such as read-only memory (ROM) or flash memory (flash RAM).Memory is computer-readable medium Example.
Computer-readable medium includes permanent and non-permanent, removable and non-removable media can be by any method Or technology come realize information store.Information can be computer-readable instruction, data structure, the module of program or other data. The example of the storage medium of computer includes, but are not limited to phase transition internal memory (PRAM), static RAM (SRAM), moves State random access memory (DRAM), other kinds of random access memory (RAM), read-only memory (ROM), electric erasable Programmable read only memory (EEPROM), fast flash memory bank or other memory techniques, CD-ROM read-only memory (CD-ROM), Digital versatile disc (DVD) or other optical storages, magnetic tape cassette, the storage of tape magnetic rigid disk or other magnetic storage apparatus Or any other non-transmission medium, available for storing the information that can be accessed by a computing device.It defines, calculates according to herein Machine readable medium does not include temporary computer readable media (transitory media), such as data-signal and carrier wave of modulation.
It should also be noted that, term " comprising ", "comprising" or its any other variant are intended to nonexcludability Comprising so that process, method, commodity or equipment including a series of elements are not only including those elements, but also wrap Include other elements that are not explicitly listed or further include for this process, method, commodity or equipment it is intrinsic will Element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that wanted including described Also there are other identical elements in the process of element, method, commodity or equipment.
It will be understood by those skilled in the art that embodiments herein can be provided as method, system or computer program product. Therefore, complete hardware embodiment, complete software embodiment or the embodiment in terms of combining software and hardware can be used in the application Form.It is deposited moreover, the application can be used to can be used in one or more computers for wherein including computer usable program code The shape of computer program product that storage media is implemented on (including but not limited to magnetic disk storage, CD-ROM, optical memory etc.) Formula.
The foregoing is merely embodiments herein, are not limited to the application.For those skilled in the art For, the application can have various modifications and variations.All any modifications made within spirit herein and principle are equal Replace, improve etc., it should be included within the scope of claims hereof.

Claims (8)

  1. A kind of 1. method for evaluating LED component luminous flux, which is characterized in that this method includes：
    The solder distributed image of die bond layer in LED component is shot using X ray, the solder of the die bond layer includes Au/Sn solders With silver paste solder；
    Identification is located at the cavity in the Au/Sn solders and silver paste solder in the solder distributed image；
    Obtain the driving current interval value of LED component；
    According to type and quantity empty in the Au/Sn solders and silver paste solder and the driving current interval value, evaluation The luminous flux of LED component.
  2. 2. according to the method described in claim 1, it is characterized in that, according to empty in the Au/Sn solders and silver paste solder Type and quantity and the driving current interval value, evaluate the luminous flux of LED component, specifically include：
    Judge whether the driving current interval value is more than preset value；If it is not,
    Identify the quantity that cavity is penetrated in the Au/Sn solders and silver paste solder；
    First luminous flux weighing factor value is determined with the quantity that cavity is penetrated in the Au/Sn solders；
    Second luminous flux weighing factor value is determined with the quantity that cavity is penetrated in silver paste solder；
    According to the standard light flux values of LED component, the first luminous flux weighing factor value and the second luminous flux weighing factor value, comment The luminous flux of valency LED component.
  3. 3. according to the method described in claim 2, penetrate sky it is characterized in that, identifying in the Au/Sn solders and silver paste solder The quantity in hole, specifically includes：
    The area that cavity is penetrated in the Au/Sn solders and silver paste solder is obtained, and respectively compares itself and standard cyst areas, To obtain the quantity that cavity is penetrated in the Au/Sn solders and silver paste solder.
  4. 4. it according to the method described in claim 2, it is characterized in that, is determined with penetrating the quantity in cavity in the Au/Sn solders First luminous flux weighing factor value, specifically includes：
    The quantity that cavity is penetrated in the Au/Sn solders is multiplied by the first empty weighting coefficient, obtaining the first luminous flux influences power Weight values；And
    Second luminous flux weighing factor value is determined with the quantity that cavity is penetrated in silver paste solder, is specifically included：
    The quantity that cavity is penetrated in silver paste solder is multiplied by the second empty weighting coefficient, obtains the second luminous flux weighing factor Value；Wherein,
    Described first empty weighting coefficient is less than the second empty weighting coefficient.
  5. 5. according to the method described in claim 1, it is characterized in that, according to empty in the Au/Sn solders and silver paste solder Type and quantity and the driving current interval value, evaluate the luminous flux of LED component, specifically include：
    Judge whether the driving current interval value is more than preset value；If so,
    Identify the quantity for penetrating cavity in the Au/Sn solders；
    Top layer cavity, bottom cavity, central cavity and the quantity for penetrating cavity in identification silver paste solder；
    First luminous flux weighing factor value is determined with the quantity that cavity is penetrated in the Au/Sn solders；
    Determine that the second light leads to the quantity that cavity, top layer cavity, bottom cavity and central cavity are penetrated in silver paste solder Measure weighing factor value；
    According to the standard light flux values of LED component, the first luminous flux weighing factor value and the second luminous flux weighing factor value, comment The luminous flux of valency LED component.
  6. 6. according to the method described in claim 5, it is characterized in that, identify in the Au/Sn solders penetrate cavity quantity, It specifically includes：
    The area that cavity is penetrated in the Au/Sn solders is obtained, and itself and standard cyst areas are compared, to obtain the Au/ The quantity in cavity is penetrated in Sn solders；And
    The quantity of cavity, top layer cavity, bottom cavity and central cavity is penetrated in identification silver paste solder, is specifically included：
    The area that cavity, top layer cavity, bottom cavity and central cavity are penetrated in silver paste solder is obtained, and respectively by it It is compared with standard cyst areas, cavity, top layer cavity, bottom cavity and central cavity is penetrated in silver paste solder to obtain Quantity.
  7. 7. it according to the method described in claim 5, it is characterized in that, is determined with penetrating the quantity in cavity in the Au/Sn solders First luminous flux weighing factor value, specifically includes：
    The quantity that cavity is penetrated in the Au/Sn solders is multiplied by the first empty weighting coefficient, obtaining the first luminous flux influences power Weight values；And
    Determine that the second light leads to the quantity that cavity, top layer cavity, bottom cavity and central cavity are penetrated in silver paste solder Weighing factor value is measured, is specifically included：
    The quantity that cavity, top layer cavity, bottom cavity and central cavity are penetrated in silver paste solder is multiplied by second respectively Empty weighting coefficient, third cavity weighting coefficient, the 4th empty weighting coefficient and the 5th empty weighting coefficient, and sum, it obtains To the second luminous flux weighing factor value；Wherein,
    Described first empty the second empty the 4th cavity weighting systems of weighting coefficient ＜ thirds cavity weighting coefficient ＜ of weighting coefficient ＜ The 5th empty weighting coefficients of number ＜.
  8. 8. a kind of device for evaluating LED component luminous flux, which is characterized in that including：
    X ray shooting unit, for shooting the solder distributed image of die bond layer in LED component, the solder of the die bond layer includes Au/Sn solders and silver paste solder；
    Recognition unit, for cavity of the identification in the Au/Sn solders and silver paste solder in the solder distributed image；
    Acquiring unit, for obtaining the driving current interval value of LED component；
    Luminous flux computing unit, for according to type and quantity empty in the Au/Sn solders and silver paste solder and described Drive current range value evaluates the luminous flux of LED component.
CN201711367733.9A 2017-12-18 2017-12-18 The method and apparatus for evaluating LED component luminous flux Withdrawn CN108195564A (en)

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