CN108192525B - Bonding assembly and release film thereof - Google Patents
Bonding assembly and release film thereof Download PDFInfo
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- CN108192525B CN108192525B CN201810134601.XA CN201810134601A CN108192525B CN 108192525 B CN108192525 B CN 108192525B CN 201810134601 A CN201810134601 A CN 201810134601A CN 108192525 B CN108192525 B CN 108192525B
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- layer
- release
- bonding
- adhesive
- adhesive layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/204—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous
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- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
Abstract
The invention relates to a bonding assembly and a release film thereof. A release film for covering an adhesive layer comprises a first release layer and a second release layer, wherein the first release layer comprises a first surface and a second surface; the second release layer comprises a main body part and an overlapping part arranged on the first surface, the end of the first release layer, which is far away from the second release layer, is a first release film end, and the end of the main body part, which is far away from the overlapping part, is a second release film end; when covering the adhesive layer from the type film, the second surface is attached to the adhesive layer, the lap joint part is positioned between two ends of the adhesive layer, and the main body part is spaced from the adhesive layer. Because overlap joint portion is located between the both ends of tie coat, and main part and tie coat interval to make the above-mentioned separation point that bonds the subassembly be located between the both ends of tie coat, separation point and tie coat and the separation point dislocation set who bears the weight of the membrane, thereby can effectively avoid appearing "anti-type" phenomenon of leaving.
Description
Technical Field
The invention relates to the technical field of bonding, in particular to a bonding assembly and a release film thereof.
Background
In consumer electronics, particularly in the area of the industrial chain where modules are attached, it is common to attach a large number of tapes to product modules. In the process of attaching the adhesive tape, the adhesive tape often has a phenomenon of 'reverse release', namely the adhesive tape is stuck on a release film and cannot be normally torn off, so that the adhesive tape is scrapped, and the utilization rate of the adhesive tape and the efficiency of module attachment are seriously influenced.
As shown in fig. 1, the conventional adhesive assembly 10 generally includes a carrier film 12, an adhesive layer 14 and a release film 16 stacked in sequence, wherein a surface of the release film 16 close to the adhesive layer 14 is coated with a release agent so as to be torn from the adhesive layer 14, when the adhesive assembly 10 is used, an operator firstly tears the release film 16, then holds the left and right ends of the carrier film 12 with hands, attaches the adhesive layer 14 to a product, and finally tears the carrier film 12, so that another product can be adhered to the product with the adhesive layer 14 through the adhesive layer 14. However, when the release film 16 is torn off by an operator, it sometimes happens that the adhesive layer 14 is carried away by the release film 16, rather than staying on the carrier film 12, which is an abnormal "reverse release" phenomenon.
To solve such problems, engineers make many verifications at the product development stage to finally select materials. However, the types of the glue materials are various, such as silica gel, acrylic glue, conductive cloth, etc., and the properties are different, so that the materials are easily modified due to temperature and humidity changes in the storage and transportation processes. Therefore, even careful selection of materials cannot completely avoid abnormalities such as "reverse release" when the experience of the engineer is insufficient.
Disclosure of Invention
In view of the above, there is a need for an adhesive assembly and a release film thereof that can effectively avoid the "reverse release" phenomenon.
A release film for covering a tie layer, the release film including opposing first and second ends, comprising:
the first release layer comprises a first surface and a second surface which are opposite; and
the second release layer comprises a main body part and an overlapping part which are connected, the overlapping part is arranged on the first surface, the first end is the end of the first release layer far away from the second release layer, and the second end is the end of the main body part far away from the overlapping part;
when the release film covers the bonding layer, the second surface is attached to the bonding layer, the lap joint part is located between two ends of the bonding layer, and the main body part is spaced from the bonding layer.
In the above-mentioned from the type membrane, when tearing from the type membrane on the tie coat, pull the one end that the main part kept away from the overlap joint portion earlier, also draw the second end promptly for first from the type layer from the separation point and the tie coat separation, then continue to pull the main part, so that first from type layer and tie coat complete separation, thereby accomplish to tear from the step of type membrane. Because the overlap joint portion is located between the both ends of tie coat, just the main part with the tie coat interval to make the above-mentioned separation point that bonds the subassembly be located between the both ends of tie coat, separation point and tie coat and the dislocation set of the separation point that bears the membrane, thereby can effectively avoid appearing "anti-type" phenomenon of leaving.
A bonded assembly comprising:
a carrier film;
the bonding layer is arranged on the bearing film; and
the release film covers the adhesive layer.
In one embodiment, in a direction from the first end to the second end, a length of an area of the adhesive layer covered by the first release layer is greater than a length of an area of the adhesive layer spaced from the main body portion.
In one embodiment, in the direction from the first end to the second end, the length of the area covered by the first release layer is not less than 2/3 times the length of the adhesive layer.
In one embodiment, two ends of the carrier film respectively extend out of two ends of the adhesive layer, and respectively form a first holding portion and a second holding portion, so that an operator can hold the carrier film conveniently.
In one embodiment, the first holding part and the second holding part are respectively provided with a first alignment mark and a second alignment mark.
In one of them embodiment, the bonding subassembly still includes first heightening layer and second heightening layer, first heightening layer is located first taking the portion of holding between the fingers and being close to on the surface of tie coat, and with the tie coat interval sets up, the second heightening layer is located the second is taken the portion of holding between the fingers and being close to on the surface of tie coat, and with the tie coat interval sets up, first heightening layer with first from type layer interval sets up, the second heightening layer with the main part interval sets up.
In one embodiment, the thickness of the second elevation layer is greater than the thickness of the first elevation layer.
In one embodiment, the bonding assembly further comprises a height increasing layer, the height increasing layer is arranged on the carrier film and is spaced from the bonding layer, the height increasing layer is located between the release film and the carrier film, and the thickness of the height increasing layer is smaller than that of the bonding layer.
In one embodiment, the orthographic projection of the carrier film on the plane of the adhesive layer completely covers the adhesive layer, and the orthographic projection of the release film on the plane of the adhesive layer completely covers the orthographic projection of the carrier film on the plane of the adhesive layer.
Drawings
FIG. 1 is a cross-sectional view of a conventional bonding assembly;
FIG. 2 is a cross-sectional view of a bonding assembly provided in accordance with an embodiment of the present invention;
fig. 3 is an elevational view of the bonding assembly shown in fig. 2.
Detailed Description
The adhesive assembly and the release film thereof are further described with reference to the accompanying drawings and the specific embodiments.
As shown in fig. 1, in the conventional adhesive kit 10, the "reverse-release" phenomenon occurs because the release film 16 is not normally separated at the separation start point when the release film 16 is peeled off, and the adhesive layer 14 is separated from the carrier film 12 at the wrong separation point 10a, rather than the release film 16 at the correct separation point 10b, due to the adhesive force and vacuum force between the adhesive layer 14 and the release film 16.
As shown in fig. 2 and 3, in order to avoid the "reverse release" phenomenon, the present embodiment provides an adhesive assembly 20, and the adhesive assembly 20 will be described in detail below.
The bonding assembly 20 comprises a release film 100, a bonding layer 200 and a carrier film 300, wherein the bonding layer 200 is arranged on the carrier film 300, and the release film 100 covers the surface of the bonding layer 200 far away from the carrier film 300, so that the bonding layer 200 can be effectively protected.
The release film 100 includes a first release layer 110 and a second release layer 120. The first release layer 110 includes a first surface 112 and a second surface 114 opposite to each other. The second release layer 120 includes a main body portion 122 and a bridging portion 124 connected to each other, and the bridging portion 124 is disposed on the first surface 112. The first end 102 of the release film 100 is located at an end of the first release layer 110 away from the second release layer 120, and the second end 104 of the release film 100 is located at an end of the main body 122 away from the overlapping portion 124. When the release film 100 covers the adhesive layer 200, the second surface 114 is attached to the adhesive layer 200, the overlapping portion 124 is located between two ends of the adhesive layer 200, and the main portion 122 is spaced apart from the adhesive layer 200.
When the release film 100 is torn, one end of the main body portion 122 away from the overlapping portion 124, that is, the second end 104, is pulled first, so that the first release layer 110 is separated from the separation point 20a and the adhesive layer 200, and then the main body portion 122 is pulled continuously, so that the first release layer 110 is completely separated from the adhesive layer 200, thereby completing the step of tearing the release film 100.
In the conventional adhesive assembly 10, the wrong separation point 10a and the correct separation point 10b are located at the same end of the adhesive layer 200 and are opposite to each other, which easily causes the "reverse-release" phenomenon. The separation point 20a of the adhesive assembly 20 provided by this embodiment is located between the two ends of the adhesive layer 200, and the separation point 20a and the separation point 20b of the adhesive layer 200 and the carrier film 300 are arranged in a staggered manner, so that the phenomenon of "reverse release" can be effectively avoided.
Further, in the present embodiment, the first release layer 110 and the second release layer 120 are both rectangular. The direction from the first end 102 to the second end 104 is a first direction, the direction perpendicular to the first direction on the horizontal plane is a second direction, and the widths of the first release layer 110 and the second release layer 120 in the second direction are the same. Thus, after the first release layer 110 and the second release layer 120 are overlapped, the orthographic projection of the obtained release film 100 on the horizontal plane is rectangular.
Further, in this embodiment, the material and thickness of the first release layer 110 are the same as those of the second release layer 120, so that the first release layer 110 and the second release layer 120 can be manufactured by the same process, which is very convenient for manufacturing. Further, in this embodiment, the first release layer 110 and the second release layer 120 are integrally formed, so that the first release layer 110 and the second release layer 120 can be conveniently manufactured.
Further, in the present embodiment, the length of the overlapping portion 124 is 0.5 cm to 5 cm in the direction from the first end 102 to the second end 104. Thus, the first release layer 110 and the second release layer 120 can be firmly connected, and the area of the overlapping portion 124 can be smaller, so that the material cost of the release film 100 is reduced.
Further, in the present embodiment, a release agent layer (not shown) is disposed on the second surface 114. The release agent layer can reduce the adhesive force between the first release layer 110 and the adhesive layer 200, and is more beneficial to the complete separation of the first release layer 110 and the adhesive layer 200. It is understood that in other embodiments, the second surface 114 may be plasma treated to reduce the adhesion between the first release layer 110 and the adhesive layer 200, and in this case, the release agent layer may be omitted.
The main body 122 is spaced apart from the adhesive layer 200, that is, a part of the adhesive layer 200 is not attached to the release film 100 and is exposed outside. When the adhesive assembly 20 is used in a clean room, the exposed adhesive layer 200 is not contaminated, and the adhesive needs can be satisfied.
Further, in the present embodiment, in the direction from the first end 102 to the second end 104, the length of the region of the adhesive layer 200 covered by the first release layer 110 is greater than the length of the region of the adhesive layer 200 spaced from the main body portion. Thus, the exposed area of the adhesive layer 200 can be reduced, and the application range of the adhesive assembly 20 can be expanded, and the adhesive assembly is not limited to use in a clean room.
Further, in the present embodiment, in the direction from the first end 102 to the second end 104, the length of the region of the adhesive layer 200 covered by the first release layer 110 is not less than 2/3 times the length of the adhesive layer 200. Preferably, the length of the area of the adhesive layer 200 covered by the first release layer 110 in the direction from the first end 102 to the second end 104 is not less than 4/5 times the length of the adhesive layer 200.
Further, in the present embodiment, two ends of the carrier film 300 respectively extend out of two ends of the adhesive layer 200, and respectively form the first holding portion 310 and the second holding portion 320, so that an operator can conveniently hold and hold the carrier film 300. After the release film 100 is peeled off, the operator holds the first holding portion 310 and the second holding portion 320 with two hands to bond the adhesive layer 200 to the product. Specifically, in the present embodiment, the product is a back plate of a display panel.
Further, in the present embodiment, the first pinching portion 310 and the second pinching portion 320 are respectively provided with a first alignment mark 312 and a second alignment mark 322. In this manner, alignment is facilitated so that the adhesive layer 200 is adhered to a certain position of the product. Specifically, in the present embodiment, the first alignment mark 312 is a circular through hole opened on the first holding and pinching portion 310, the second alignment mark 322 is a bar-shaped through hole opened on the second holding and pinching portion 320, and an extending direction of the bar-shaped through hole is parallel to a direction from the first end 102 to the second end 104. It is understood that in other embodiments, the mark is not limited to a through hole, but may be a bump.
Further, in this embodiment, the bonding assembly 20 further includes a height increasing layer 400, the height increasing layer 400 is disposed on the carrier film 300 and spaced from the bonding layer 200, the height increasing layer 400 is disposed between the release film 100 and the carrier film 300, and the thickness of the height increasing layer 400 is smaller than the thickness of the bonding layer 200. The booster layer 400 may reduce the potential for contamination of the adhesive layer 200 in a cleanroom.
Further, in the present embodiment, the heightening layer 400 includes a first heightening layer 410 and a second heightening layer 420, the first heightening layer 410 is disposed on the surface of the first grip portion 310 close to the adhesive layer 200 and spaced from the adhesive layer 200, and the second heightening layer 420 is disposed on the surface of the second grip portion 320 close to the adhesive layer 200 and spaced from the adhesive layer 200. The first raising layer 410 is spaced apart from the first release layer 110, and the second raising layer 420 is spaced apart from the main body 122. The first elevated layer 410 and the second elevated layer 420 not only reduce the potential for contamination of the adhesive layer 200 in a clean room, but also facilitate handling by an operator. It is understood that in other embodiments, the booster layer 400 may be a closed loop structure, with the booster layer 400 disposed around the adhesive layer 200.
Further, in the present embodiment, the first raising layer 410 and the second raising layer 420 can also increase the friction force between the carrier film 300 and the operator, so as to prevent the carrier film 300 from falling.
Further, in the present embodiment, the thickness of the second raising layer 420 is greater than the thickness of the first raising layer 410, so that the distance between the second raising layer 420 and the second release layer 120 can be reduced, so that the distance between the second raising layer 420 and the second release layer 120 can be the same as the distance between the first raising layer 410 and the first release layer 110. Further, the potential for contamination of the adhesive layer 200 in a cleanroom may be reduced.
Further, in the present embodiment, the orthogonal projection of the carrier film 300 on the plane of the adhesive layer 200 completely covers the adhesive layer 200, and the orthogonal projection of the release film 100 on the plane of the adhesive layer 200 completely covers the orthogonal projection of the carrier film 300 on the plane of the adhesive layer 200. In this way, the adhesive layer 200 may be less likely to be contaminated in a dust room, and the carrier film 300 may be easily held by an operator. Specifically, in the present embodiment, the carrier film 300 and the adhesive layer 200 are square.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The utility model provides a from type membrane for cover tie coat, include relative first end and second end from type membrane, its characterized in that includes:
the first release layer comprises a first surface and a second surface which are opposite; and
the second release layer comprises a main body part and an overlapping part which are connected, the overlapping part is arranged on the first surface, the first end is the end of the first release layer far away from the second release layer, and the second end is the end of the main body part far away from the overlapping part;
when the release film covers the bonding layer, the second surface is attached to the bonding layer, the lap joint part is located between two ends of the bonding layer, and the main body part and the bonding layer are completely separated.
2. A bonded assembly, comprising:
a carrier film;
the bonding layer is arranged on the bearing film; and
the release film according to claim 1, which covers the adhesive layer.
3. The adhesive assembly of claim 2, wherein a length of an area of the adhesive layer covered by the first release layer is greater than a length of an area of the adhesive layer spaced from the main body portion in a direction from the first end to the second end.
4. The adhesive assembly of claim 2, wherein the length of the area of the adhesive layer covered by the first release layer in the direction from the first end to the second end is no less than 2/3 times the length of the adhesive layer.
5. The bonding assembly of claim 2, wherein the two ends of the carrier film extend beyond the two ends of the bonding layer, and respectively form a first grip portion and a second grip portion, so that an operator can grip the carrier film with his/her hands.
6. The bonding assembly of claim 5, wherein the first and second grasping portions have first and second alignment marks disposed thereon, respectively.
7. The bonding assembly of claim 5, further comprising a first heightening layer and a second heightening layer, wherein the first heightening layer is disposed on a surface of the first holding portion close to the bonding layer and spaced from the bonding layer, the second heightening layer is disposed on a surface of the second holding portion close to the bonding layer and spaced from the bonding layer, the first heightening layer is spaced from the first release layer, and the second heightening layer is spaced from the main body.
8. A bonded assembly according to claim 7 wherein the thickness of the second height-enhancing layer is greater than the thickness of the first height-enhancing layer.
9. The bonding assembly of claim 2, further comprising a height-increasing layer disposed on the carrier film and spaced apart from the bonding layer, wherein the height-increasing layer is disposed between the release film and the carrier film, and the thickness of the height-increasing layer is less than the thickness of the bonding layer.
10. The bonding assembly of claim 2, wherein an orthographic projection of the carrier film on a plane of the bonding layer completely covers the bonding layer, and an orthographic projection of the release film on a plane of the bonding layer completely covers an orthographic projection of the carrier film on a plane of the bonding layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810134601.XA CN108192525B (en) | 2018-02-09 | 2018-02-09 | Bonding assembly and release film thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810134601.XA CN108192525B (en) | 2018-02-09 | 2018-02-09 | Bonding assembly and release film thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108192525A CN108192525A (en) | 2018-06-22 |
| CN108192525B true CN108192525B (en) | 2020-10-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810134601.XA Active CN108192525B (en) | 2018-02-09 | 2018-02-09 | Bonding assembly and release film thereof |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114410238A (en) * | 2022-01-27 | 2022-04-29 | 郑州领胜科技有限公司 | Reverse release type material belt for narrow-edge foam product and production process |
| CN115418173B (en) * | 2022-09-30 | 2023-10-27 | 业成科技（成都）有限公司 | Adhesive tape structure |
Citations (7)
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| US3592722A (en) * | 1970-06-04 | 1971-07-13 | Morgan Adhesives Co | Slidable adhesive laminate |
| KR20120119753A (en) * | 2011-04-22 | 2012-10-31 | 김명오 | Film roll for forming cover layer using carrier film and method of forming cover layer on printed circuit board using the film roll |
| CN202677264U (en) * | 2012-06-15 | 2013-01-16 | 周柏岳 | Electronic device protective film |
| CN103797567A (en) * | 2011-09-30 | 2014-05-14 | 琳得科株式会社 | Dicing sheet with protective film forming layer and chip fabrication method |
| CN206308307U (en) * | 2016-11-21 | 2017-07-07 | 莫耀天 | A kind of small netted mould release membrance of off-type force |
| CN107042193A (en) * | 2017-03-29 | 2017-08-15 | 深圳市长盈精密技术股份有限公司 | The method for paint spraying of sticker and wearable device lid |
| CN206486464U (en) * | 2017-01-13 | 2017-09-12 | 深圳市佰瑞兴实业有限公司 | A kind of High temperature-resistanadhesive adhesive tape product turns note membrane structure |
-
2018
- 2018-02-09 CN CN201810134601.XA patent/CN108192525B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3592722A (en) * | 1970-06-04 | 1971-07-13 | Morgan Adhesives Co | Slidable adhesive laminate |
| KR20120119753A (en) * | 2011-04-22 | 2012-10-31 | 김명오 | Film roll for forming cover layer using carrier film and method of forming cover layer on printed circuit board using the film roll |
| CN103797567A (en) * | 2011-09-30 | 2014-05-14 | 琳得科株式会社 | Dicing sheet with protective film forming layer and chip fabrication method |
| CN202677264U (en) * | 2012-06-15 | 2013-01-16 | 周柏岳 | Electronic device protective film |
| CN206308307U (en) * | 2016-11-21 | 2017-07-07 | 莫耀天 | A kind of small netted mould release membrance of off-type force |
| CN206486464U (en) * | 2017-01-13 | 2017-09-12 | 深圳市佰瑞兴实业有限公司 | A kind of High temperature-resistanadhesive adhesive tape product turns note membrane structure |
| CN107042193A (en) * | 2017-03-29 | 2017-08-15 | 深圳市长盈精密技术股份有限公司 | The method for paint spraying of sticker and wearable device lid |
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| Publication number | Publication date |
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| CN108192525A (en) | 2018-06-22 |
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