CN108188865A - A kind of laser crystal burnishing device - Google Patents
A kind of laser crystal burnishing device Download PDFInfo
- Publication number
- CN108188865A CN108188865A CN201810217986.6A CN201810217986A CN108188865A CN 108188865 A CN108188865 A CN 108188865A CN 201810217986 A CN201810217986 A CN 201810217986A CN 108188865 A CN108188865 A CN 108188865A
- Authority
- CN
- China
- Prior art keywords
- retainer
- rack
- holding tray
- laser crystal
- keeping body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
- B24B13/005—Blocking means, chucks or the like; Alignment devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
- B24B13/01—Specific tools, e.g. bowl-like; Production, dressing or fastening of these tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The present invention provides a kind of laser crystal burnishing devices, belong to polissoir field.Laser crystal burnishing device, including rack, polishing disk, first driving means, holding tray, retainer and the second driving device.Polishing disk is rotatably set to rack.First driving means are used to that polishing disk to be driven to rotate around vertical axis relative to rack.Holding tray is equipped with the putting hole for placing crystal, and holding tray is positioned on polishing disk.Retainer is movably set to rack, and holding tray is maintained on polishing disk by retainer.Second driving device is used to drive retainer relative to rack to the direction movement closer or far from vertical axis.Position of the holding tray on polishing disk can be changed in the second driving device in this laser crystal burnishing device, rough polishing can be not only carried out to crystal, but also can carry out finishing polish to crystal.
Description
Technical field
The present invention relates to polissoir field, in particular to a kind of laser crystal burnishing device.
Background technology
Non- Mr.'s optical crystal such as high efficiency laser crystal LBO, YCOB, when it is non-for ultrashort, ultra-intense laser device key
Linear material, the crystalloid have wide transmission range, moderate nonlinear factor, high damage threshold and good chemistry and machine
Tool characteristic is widely used in the light lasers such as laser freuqency doubling and optical parametric oscillator and photoparametric amplifier field.To crystal
When being polished, generally require extremely onerous to the rough polishing of crystal and quiet polishing, polishing process using different equipment completions.
Invention content
The purpose of the present invention is to provide a kind of laser crystal burnishing devices, and thick, finishing polish pole is carried out to crystal to improve
For troublesome problem.
The invention is realized in this way：
Based on above-mentioned purpose, the present invention provides a kind of laser crystal burnishing device, including：
Rack；
Polishing disk, the polishing disk are rotatably set to the rack；
First driving means, the first driving means are used to that the relatively described rack of the polishing disk to be driven around vertical axis to turn
It is dynamic；
Holding tray, the holding tray are equipped with the putting hole for placing crystal, and the holding tray is positioned over the polishing
On disk；
Retainer, the retainer are movably set to the rack, and the holding tray is maintained at by the retainer
On the polishing disk；
Second driving device, second driving device is for driving the relatively described rack of the retainer to close or remote
Direction movement from the vertical axis.
In a preferred embodiment of the invention, the retainer includes frame ontology, the first keeping body, the second keeping body and elasticity
Mechanism；
The frame ontology is movably set to the rack, first keeping body with second keeping body and institute
It states frame ontology to be hinged, first keeping body is connect with second keeping body by the elastic mechanism, the elastic mechanism
With the trend that first keeping body is prevented to be located remotely from each other with second keeping body, the holding tray is held in described the
Between one keeping body and second keeping body.
In a preferred embodiment of the invention, the elastic mechanism includes first connecting rod, second connecting rod, push rod and the first elasticity
Part；
One end of the first connecting rod is hinged with first keeping body, the other end of the first connecting rod and the push rod
Hinged, one end of the second connecting rod is hinged with second keeping body, and the other end of the second connecting rod is cut with scissors with the push rod
It connects, the push rod is movably set to the frame ontology, and first elastic component acts on the push rod and the frame ontology
Between；
When the angle of first keeping body and second keeping body increases, the push rod being capable of relatively described frame sheet
Body moves, to compress first elastic component.
In a preferred embodiment of the invention, the frame ontology, which is equipped with, plugs hole, and first elastic component is located at described insert
In apertured, one end of the push rod is slidably inserted in described plug in hole.
In a preferred embodiment of the invention, the retainer further includes the first pinch roller and the second pinch roller, first pinch roller
Rotatably it is set to first keeping body, second pinch roller is rotatably set to second keeping body, and described
One pinch roller and second pinch roller are tangent with the holding tray.
In a preferred embodiment of the invention, the laser crystal burnishing device further includes supporting rack and third driving device,
The retainer is connect with the rack by support frame as described above；
Support frame as described above is movably set to the rack, and second driving device is used to drive support frame as described above water
Translation is dynamic, so that the retainer is moved to the direction closer or far from the vertical axis；
The retainer is movably set to support frame as described above, and the third driving device is used to drive the retainer
It is vertically movable with respect to support frame as described above.
In a preferred embodiment of the invention, the putting hole is set on the center of the holding tray；
The retainer further includes link and extrusion, and the extrusion is connected with the push rod by the link
It connects；
When the retainer moves vertically downwards, the extrusion can be moved into the putting hole and be squeezed described
Crystal.
In a preferred embodiment of the invention, the extrusion includes fixed body, mobile and the second elastic component；
The fixed body is connect with the link, and the mobile is movably set to the fixed body, the work
Kinetoplast can relatively described fixed body it is vertically movable；
Second elastic component is set between the mobile and fixed body, and second elastic component, which has, pushes the work
The trend that kinetoplast moves vertically downwards relative to the fixed body.
In a preferred embodiment of the invention, the fixed body is equipped with pilot hole, and one end of the mobile is slidable
It is inserted in the pilot hole；
The mobile is equipped with the first protrusion, and the hole wall of the pilot hole is equipped with the second protrusion, and described second
On the track that protruding parts is moved vertically downwards in first protrusion.
In a preferred embodiment of the invention, the mobile include the body of rod and squeeze disk, one end of the body of rod with it is described
Disk connection is squeezed, the other end of the body of rod is slidably inserted in the pilot hole.
The beneficial effects of the invention are as follows：
The present invention provides a kind of laser crystal burnishing device, and holder is maintained on polishing disk by retainer, when crystal is put
After putting in the putting hole in holding tray, under the effect of gravity, crystal will be contacted with polishing disk, first driving means driving polishing
After disk rotation, polishing disk will drive holding tray rotation, and polishing disk can be polished crystal.Since retainer is movably set
In in rack, the second driving device drives retainer to the direction movement closer or far from polishing disk center, so as to push
Holding tray is subjected to displacement on polishing disk, the axis of rotation line-spacing polishing disk of holding tray around vertical axis it is bigger, polishing disk is to crystalline substance
The polishing effect of body is better.Therefore, when needing to carry out rough polishing to crystal, can holding tray be reduced by the second driving device
The distance of rotation axis and vertical axis；When needing to carry out finishing polish to crystal, can by the second driving device holding tray from
The distance of shaft axis and vertical axis.This laser crystal burnishing device not only can carry out rough polishing, but also crystal can be carried out to crystal
Finishing polish.
Description of the drawings
It in order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range, for those of ordinary skill in the art, without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 is the structure diagram at the first visual angle of laser crystal burnishing device that the embodiment of the present invention 1 provides；
Fig. 2 is the structure diagram at the second visual angle of laser crystal burnishing device that the embodiment of the present invention 1 provides；
Fig. 3 is the structure diagram of retainer shown in Fig. 2；
Fig. 4 is the structure diagram at the first visual angle of laser crystal burnishing device that the embodiment of the present invention 2 provides；
Fig. 5 is the structure diagram at the second visual angle of laser crystal burnishing device that the embodiment of the present invention 2 provides；
Fig. 6 is the structure diagram of retainer shown in fig. 5；
Fig. 7 is the partial view of retainer shown in Fig. 4.
Icon：100- laser crystal burnishing devices；10- racks；11- top plates；12- bottom plates；13- supporting rods；14- sliding slots；
20- polishing disks；21- shafts；211- vertical axis；30- first driving means；The first motors of 31-；32- first gears；33- second
Gear；40- holding trays；41- putting holes；50- retainers；51- frame ontologies；511- plugs hole；The first keeping bodies of 52-；53- second
Protective；54- elastic mechanisms；541- first connecting rods；542- second connecting rods；543- push rods；The first elastic components of 544-；55- first
Pinch roller；The second pinch rollers of 56-；57- links；571- horizontal parts；572- vertical portions；58- extrusions；581- fixed bodies；5811- is led
Xiang Kong；The second protrusions of 5812-；582- mobiles；The 5821- bodies of rod；5822- squeezes disk；The first protrusions of 5822-；583-
Two elastic components；60- supporting racks；61- pedestals；62- connecting rods；The second driving devices of 70-；The second motors of 71-；The first screws of 72-；
80- third driving devices；81- third motors；The second screws of 82-.
Specific embodiment
Purpose, technical scheme and advantage to make the embodiment of the present invention are clearer, below in conjunction with the embodiment of the present invention
In attached drawing, the technical solution in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
Part of the embodiment of the present invention, instead of all the embodiments.The present invention being usually described and illustrated herein in the accompanying drawings is implemented
The component of example can be configured to arrange and design with a variety of different.
Therefore, below the detailed description of the embodiment of the present invention to providing in the accompanying drawings be not intended to limit it is claimed
The scope of the present invention, but be merely representative of the present invention selected embodiment.Based on the embodiments of the present invention, this field is common
Technical staff's all other embodiments obtained without creative efforts belong to the model that the present invention protects
It encloses.
It should be noted that in the absence of conflict, the feature in embodiment and embodiment in the present invention can phase
Mutually combination.
It should be noted that：Similar label and letter represents similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need to that it is further defined and explained in subsequent attached drawing.
In the description of the embodiment of the present invention, it should be noted that indicating position or position relationship is based on shown in attached drawings
Orientation or the position relationship invention product using when the orientation usually put or position relationship or this field
Orientation or position relationship that technical staff usually understands or the invention product using when the orientation usually put or position close
System is for only for ease of the description present invention and simplifies description rather than instruction or imply that signified device or element must have
Specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, term " the
One ", " second ", " third " etc. are only used for distinguishing description, and it is not intended that instruction or hint relative importance.
In the description of the embodiment of the present invention, it is also necessary to which explanation is unless specifically defined or limited otherwise, term
" setting ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected or integrally connect
It connects；Can be directly connected to, can also be indirectly connected with by intermediary.For the ordinary skill in the art, may be used
The concrete meaning of above-mentioned term in the present invention is understood with concrete condition.
Embodiment 1
As shown in Figure 1 and Figure 2, the present embodiment provides a kind of laser crystal burnishing device 100, including rack 10, polishing disk
20th, first driving means 30, holding tray 40, retainer 50,60 and second driving device 70 of supporting rack.Polishing disk 20 is rotatable
It is set in rack 10, first driving means 30 are used to that polishing disk 20 to be driven to rotate around vertical axis 211 relative to rack 10.Holding tray
40 are set on polishing disk 20, and holding tray 40 is maintained on polishing disk 20 by retainer 50, and retainer 50 passes through branch with rack 10
Support 60 connects, and the second driving device 70 is used to that retainer 50 to be driven to move horizontally with respect to rack 10.
Wherein, the effect of rack 10 is support all parts.In the present embodiment, rack 10 includes top plate 11,12 and of bottom plate
Supporting rod 13, top plate 11 are connect with bottom plate 12 by supporting rod 13, and top plate 11 is parallel to bottom plate 12.It is set on the upper surface of top plate 11
There is sliding slot 14, sliding slot 14 is T-slot.
Polishing disk 20 is disc.Polishing disk 20 is connect by shaft 21 with rack 10.One end of shaft 21 and polishing disk
20 connections are fixed, and shaft 21 is coaxially disposed with polishing disk 20.Shaft 21 is arranged in top plate 11 and bottom plate 12 simultaneously, and shaft 21 is perpendicular
To arrangement, shaft 21 can be rotated relative to rack 10, and the axis of shaft 21 is vertical axis 211, and shaft 21 can be with respect to rack 10
It is rotated around vertical axis 211.After polishing disk 20 is connect with rack 10 by shaft 21, polishing disk 20 is located at the top of rack 10, throws
CD 20 is horizontally disposed.
In the present embodiment, first driving means 30 include the first motor 31, first gear 32 and second gear 33, the first electricity
Machine 31 is fixed on the bottom plate 12 of rack 10, and first gear 32 is fixed in shaft 21, and second gear 33 is fixed on the first motor
On 31 output shaft, first gear 32 is engaged with second gear 33.When motor works, shaft 21 will drive polishing disk 20 opposite
Rack 10 is rotated around vertical axis 211.
Holding tray 40 is disc, and holding tray 40 is equipped with putting hole 41, and the both ends of putting hole 41 penetrate through holding tray respectively
40 upper and lower surface, putting hole 41 are used to place crystal block.The shape of putting hole 41 depends on the shape of crystal block, the present embodiment
In, putting hole 41 is rectangle.Putting hole 41 can be one, two or more, and in the present embodiment, putting hole 41 is one, is put
Put the center that hole 41 is located at holding tray 40.
As shown in figure 3, in the present embodiment, retainer 50 includes frame ontology 51, the first keeping body 52, the second keeping body, bullet
Property mechanism 54, the first pinch roller 55 and the second pinch roller 56.Frame ontology 51, the first keeping body 52 and the second keeping body are strip knot
Structure, one end of the first keeping body 52 is hinged with frame ontology 51, and second keeping body one end is hinged with frame ontology 51, and the first pinch roller 55 can
Rotation is set to first one end of keeping body 52 far from frame ontology 51, and the second pinch roller 56 is rotatably set to the second keeping body
One end far from frame ontology 51, the first keeping body 52 are connect with the second keeping body by elastic mechanism 54, and elastic mechanism 54 has
The trend that the first keeping body 52 and the second keeping body is prevented to be located remotely from each other.
Wherein, elastic mechanism 54 includes first connecting rod 541, second connecting rod 542,543 and first elastic component 544 of push rod.The
One end of one connecting rod 541 is hinged with the first keeping body 52, and the other end and push rod 543 of first connecting rod 541 are hinged, second connecting rod
542 one end is hinged with the second keeping body, and the other end and push rod 543 of second connecting rod 542 are hinged, and first connecting rod 541 is opposite to be pushed away
The axis that bar 543 rotates is overlapped with second connecting rod 542 relative to the axis that push rod 543 rotates.Length of the push rod 543 along frame ontology 51
Direction arranges that one end of frame ontology 51, which is equipped with, plugs hole 511, and one end of push rod 543, which is slidably inserted in, to be plugged in hole 511,
Push rod 543 can be moved axially with respect to frame ontology 51.First elastic component 544, which is located at, to be plugged in hole 511, and the first elastic component 544 is made
For between push rod 543 and frame ontology 51.When push rod 543 is moved relative to frame ontology 51 and compresses the first elastic component 544, first
The angle of 52 and second keeping body of keeping body will increase；Conversely, when the angle of the first keeping body 52 and the second keeping body increases,
Push rod 543 will move relative to frame ontology 51 and compress the first elastic component 544.In the present embodiment, the first elastic component 544 is spring.
As shown in Figure 1, supporting rack 60 includes pedestal 61 and connecting rod 62, the section of pedestal 61 is T-shaped block, the bottom of connection-rod
End connect fixation with pedestal 61.The frame ontology 51 of retainer 50 is connect with connecting rod 62, and pedestal 61 is slidably arranged on rack
In sliding slot 14 on 10, the second driving device 70 is for driving supporting rack 60 to move horizontally, so as to make rack 10 to close or remote
Direction movement from vertical axis 211.After retainer 50 is connect with rack 10 by supporting rack 60, supporting rack 60 is located on vertical,
Retainer 50 is located in horizontal direction.
In the present embodiment, the second driving device 70 includes the second motor 71 and the first screw 72, and the second motor 71 is fixed on
On the top plate 11 of rack 10, the output axis connection of the first screw 72 and the second motor 71, the first screw 72 is along the half of polishing disk 20
Diameter direction arranges that the pedestal 61 of supporting rack 60 is bolted in the outside of the first screw 72.When the second motor 71 works, the second screw
82 rotations, so as to which retainer 50 be made to follow the moving radially along polishing disk 20 of supporting rack 60.
As shown in Fig. 2, holding tray 40 is placed on polishing disk 20, holding tray 40 is maintained at polishing disk 20 by retainer 50
On, the first holding tray 40 is located between the first keeping body 52 of retainer 50 and the second keeping body, the first pinch roller 55 and the second pressure
Wheel 56 is tangent with holding tray 40.When the first motor 31, which works, drives polishing wheel rotation, holding tray 40 is in the effect of frictional force
Under, it will be rotated around the axis of itself.Holding tray 40, which rotates, will drive the first pinch roller 55 and the second pinch roller 56 to rotate, the first pinch roller 55
And second the setting of pinch roller 56 can effectively reduce frictional force between holding tray 40 and retainer 50.
When handling polishing crystal, crystal is placed in the putting hole 41 of holding tray 40, and crystal is made in the gravity of itself
It is contacted with lower with polishing disk 20, after the work of the first motor 31, polishing disk 20 will be rotated around vertical axis 211, and holding tray 40 will be around certainly
Body axis rotate so that polishing disk 20 is processed by shot blasting crystal.Since retainer 50 and rack 10 are rotatablely connected, the second electricity
After the work of machine 71 moves horizontally retainer 50, retainer 50 can make holding tray 40 in the radial direction of 20 upper edge polishing disk 20 of polishing disk
It is mobile, so as to which 21 line of the axis of rotation for making holding tray 40 is moved to the direction far from or close to vertical axis 211, the rotation of holding tray 40
21 line of axis and the distance of vertical axis 211 are bigger, and polishing disk 20 is better to the polishing effect of crystal.When need to crystal carry out rough polishing
Light time reduces the distance of 21 line of the axis of rotation and vertical axis 211 of holding tray 40 by the second motor 71；When need to crystal carry out
During finishing polish, increase the distance of 21 line of the axis of rotation and vertical axis 211 of holding tray 40 by the second motor 71.This laser crystal
Burnishing device 100 can not only carry out crystal rough polishing, but also can carry out finishing polish to crystal.
In practical operation, when holding tray 40 has just been put on polishing disk 20, holding tray 40 is with retainer 50 not in contact with throwing
CD 20 rotate by drive holding tray 40 is rotated around vertical axis 211, after holding tray 40 turns an angle, holding tray 40 finally with
Retainer 50 contacts, and retainer 50 will prevent holding tray 40 from being rotated around vertical axis 211, and holding tray 40 will be slided with polishing disk 20
Dynamic friction, holding tray 40 will be around own axis.When holding tray 40 is just contacted with retainer 50, the first keeping body 52 with
Angle will increase after second keeping body stress, so as to which push rod 543 be made to be moved relative to frame ontology 51, elastic component be compressed, elastic component
Cushioning effect can be played, so as to avoid holding tray 40 that rigid collision occurs with retainer 50.Certainly, for the placement of unlike material
For disk 40, the frictional force between polishing disk 20 is different, when the frictional force from polishing disk 20 suffered by holding tray 40 is larger
When, the first keeping body 52 and the second keeping body will open automatically, so as to increase between the first keeping body 52 and the second keeping body
Angle, to increase holding capacity of the retainer 50 to the first holding tray 40.
Embodiment 2
As shown in Figure 4, Figure 5, the present embodiment provides a kind of laser crystal burnishing device 100, the difference with above-described embodiment
It is, laser crystal burnishing device 100 further includes third driving device 80.In the present embodiment, retainer 50 is movably set
In supporting rack 60, third driving device 80 is used to drive retainer 50 vertically movable with respect to supporting rack 60.
In the present embodiment, the connecting rod 62 of support base is hollow-core construction.Third driving device 80 includes 81 He of third motor
Second screw 82, third motor 81 are fixed on the top of connecting rod, the output axis connection of the second screw 82 and third motor 81, and second
Screw 82 is extended in connecting rod 62, and one end of the frame ontology 51 of retainer 50 is extended horizontally in connecting rod 62, frame ontology 51
It is bolted in the second screw 82.When third motor 81 drives the rotation of the first screw 72, retainer 50 will vertically be moved with respect to supporting rack 60
It is dynamic.
In the present embodiment, as shown in fig. 6, retainer 50 further includes link 57 and extrusion 58, extrusion 58 and push rod
543 links 57 connect, so that extrusion 58 is located at the surface of putting hole 41.
Specifically, as shown in fig. 7, link 57 includes horizontal part 571 and vertical portion 572, one end of horizontal part 571 is with erecting
One end connection in straight portion 572, the one end of vertical portion 572 far from horizontal part 571 are connect with push rod 543, and vertical portion 572 is with respect to push rod
543 extend vertically upward.In the present embodiment, extrusion 58 includes fixed body 581,582 and second elastic component 583 of mobile, living
Kinetoplast 582 is movably set to fixed body 581, and the second elastic component 583 is acted between mobile 582 and fixed body 581, Gu
Determine body 581 and be fixed on the one end of horizontal part 571 far from vertical portion 572, the second elastic component 583, which has, pushes mobile 582 opposite
The trend that fixed body 581 moves vertically downwards.
Wherein, pilot hole 5811 is equipped in fixed body 581, pilot hole 5811 is blind hole.It is set on the hole wall of pilot hole 5811
There is the second protrusion 5812, the second protrusion 5812 is loop configuration.Mobile 582 includes the body of rod 5821 and for squeezing crystal
Extruding disk 5822, extruding disk 5822 is circular slab, and one end of the body of rod 5821 connect fixation with squeezing disk 5822, the body of rod 5821 and
Pressing body is coaxially disposed.The body of rod 5821 is equipped with the first protrusion 5822, and the first protrusion 5822 is loop configuration.The body of rod 5821
Slidably be inserted in pilot hole 5811 far from one end of pressing body, the first protrusion 5822 be located at pilot hole 5811 it is interior and with
The hole wall formation of pilot hole 5811 is slidably matched, and the body of rod 5821 and the hole wall formation of the second protrusion 5812 are slidably matched.This reality
It applies in example, the second elastic component 583 is spring, and the second elastic component 583 is set in pilot hole 5811, and the second elastic component 583 acts on
Between mobile 582 and fixed body 581, elastic component has mobile 582 is pushed to be relatively fixed that body 581 moves vertically downwards to become
Gesture, the second protrusion 5812 are located on the track that the first protrusion 5822 moves vertically downwards, i.e. the second protrusion 5812 is perpendicular
To most being contacted at last with the first protrusion 5822 during moving down, to limit mobile 582, avoid mobile 582 with
Fixed body 581 is detached from.
As shown in figure 4, after extrusion 58 is connect by link 57 with push rod 543,58 displacement putting hole 41 of extrusion
Surface.When the work of third motor 81 makes entire fender bracket move vertically downwards, extrusion 58 will be moved into putting hole 41.
During reality is to polishing crystal, if the thickness of crystal is smaller, during lighter in weight, 81 work of third motor can be made
Make, fender bracket is made to move vertically downwards, after the extruding disk 5822 and crystal contact of extrusion 58, the second elastic component 583 will be pressed
Contracting, the extruding disk 5822 of extrusion 58 will apply pressure to crystal under the action of the second elastic component 583, so as to ensure weight compared with
The quality of finish of light crystal.Certainly, after extrusion 58 is displaced downwardly in putting hole 41, extrusion 58 can also play holding tray 40
Restriction effect.In addition, when holding tray 40 applies pressure to the first protective of fender bracket and the second protective 53 and makes the first guarantor
When the angle of watch box and the second protective 53 increases, holding tray 40 will move, while push rod to the direction far from vertical axis 211
543 will drive link 57 and extrusion 58 to be moved to the direction far from vertical axis 211, so as to ensure that extrusion 58 moves down
It can be re-introduced into putting hole 41, to squeeze crystal.
Remaining structure of the present embodiment is same as Example 1, and details are not described herein.
It these are only the preferred embodiment of the present invention, be not intended to restrict the invention, for those skilled in the art
For member, the invention may be variously modified and varied.Any modification for all within the spirits and principles of the present invention, being made,
Equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of laser crystal burnishing device, which is characterized in that including：
Rack；
Polishing disk, the polishing disk are rotatably set to the rack；
First driving means, the first driving means are used to that the polishing disk to be driven to rotate around vertical axis relative to the rack；
Holding tray, the holding tray are equipped with the putting hole for placing crystal, and the holding tray is positioned on the polishing disk；
Retainer, the retainer are movably set to the rack, and the holding tray is maintained at described by the retainer
On polishing disk；
Second driving device, second driving device are used to drive the relatively described rack of the retainer to closer or far from institute
State the direction movement of vertical axis.
2. laser crystal burnishing device according to claim 1, which is characterized in that the retainer includes frame ontology, the
One keeping body, the second keeping body and elastic mechanism；
The frame ontology is movably set to the rack, first keeping body and second keeping body with the frame
Ontology is hinged, and first keeping body is connect with second keeping body by the elastic mechanism, and the elastic mechanism has
The trend that first keeping body is prevented to be located remotely from each other with second keeping body, the holding tray are held in described first and protect
It holds between body and second keeping body.
3. laser crystal burnishing device according to claim 2, which is characterized in that the elastic mechanism includes first and connects
Bar, second connecting rod, push rod and the first elastic component；
One end of the first connecting rod is hinged with first keeping body, and the other end of the first connecting rod is cut with scissors with the push rod
It connecing, one end of the second connecting rod is hinged with second keeping body, and the other end of the second connecting rod is hinged with the push rod,
The push rod is movably set to the frame ontology, first elastic component act on the push rod and the frame ontology it
Between；
When the angle of first keeping body and second keeping body increases, the push rod being capable of relatively described frame ontology shifting
It is dynamic, to compress first elastic component.
4. laser crystal burnishing device according to claim 3, which is characterized in that the frame ontology is equipped with and plugs hole,
First elastic component is plugged described in being located in hole, and one end of the push rod is slidably inserted in described plug in hole.
5. laser crystal burnishing device according to claim 3, which is characterized in that the retainer further includes the first pinch roller
With the second pinch roller, first pinch roller is rotatably set to first keeping body, and second pinch roller is rotatably set
In second keeping body, first pinch roller and second pinch roller are tangent with the holding tray.
6. laser crystal burnishing device according to claim 3, which is characterized in that the laser crystal burnishing device also wraps
Supporting rack and third driving device are included, the retainer is connect with the rack by support frame as described above；
Support frame as described above is movably set to the rack, and second driving device is used to that support frame as described above level to be driven to move
It is dynamic, so that the retainer is moved to the direction closer or far from the vertical axis；
The retainer is movably set to support frame as described above, and the third driving device is used to drive the retainer opposite
Support frame as described above is vertically movable.
7. laser crystal burnishing device according to claim 6, which is characterized in that the putting hole is set on the holding tray
Center；
The retainer further includes link and extrusion, and the extrusion is connect with the push rod by the link；
When the retainer moves vertically downwards, the extrusion can move into the putting hole and squeeze the crystalline substance
Body.
8. laser crystal burnishing device according to claim 7, which is characterized in that the extrusion includes fixed body, work
Kinetoplast and the second elastic component；
The fixed body is connect with the link, and the mobile is movably set to the fixed body, the mobile
Can relatively described fixed body it is vertically movable；
Second elastic component is set between the mobile and fixed body, and second elastic component, which has, pushes the mobile
The trend moved vertically downwards relative to the fixed body.
9. laser crystal burnishing device according to claim 8, which is characterized in that the fixed body is equipped with pilot hole,
One end of the mobile is slidably inserted in the pilot hole；
The mobile is equipped with the first protrusion, and the hole wall of the pilot hole is equipped with the second protrusion, second protrusion
Portion is located on the track that first protrusion moves vertically downwards.
10. laser crystal burnishing device according to claim 9, which is characterized in that the mobile includes the body of rod and squeezes
Platen, one end of the body of rod are connect with the extruding disk, and the other end of the body of rod is slidably inserted in the pilot hole
It is interior.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810217986.6A CN108188865B (en) | 2018-03-16 | 2018-03-16 | Laser crystal polishing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810217986.6A CN108188865B (en) | 2018-03-16 | 2018-03-16 | Laser crystal polishing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108188865A true CN108188865A (en) | 2018-06-22 |
| CN108188865B CN108188865B (en) | 2020-01-10 |
Family
ID=62595388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810217986.6A Active CN108188865B (en) | 2018-03-16 | 2018-03-16 | Laser crystal polishing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108188865B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1310333A (en) * | 1971-02-24 | 1973-03-21 | Propper Mfg Co Inc | Machine for grinding edges of glass articles |
| CN1174869A (en) * | 1997-08-26 | 1998-03-04 | 汪宁 | Polishing disc for chemcal-mechanical polishing and making method |
| CN102248477A (en) * | 2011-07-21 | 2011-11-23 | 清华大学 | Chemical and mechanical polishing method |
| CN102922414A (en) * | 2012-10-18 | 2013-02-13 | 上海宏力半导体制造有限公司 | Chemical mechanical polishing device |
| CN104942704A (en) * | 2014-03-27 | 2015-09-30 | 株式会社荏原制作所 | Elastic membrane, substrate holding apparatus, and polishing apparatus |
-
2018
- 2018-03-16 CN CN201810217986.6A patent/CN108188865B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1310333A (en) * | 1971-02-24 | 1973-03-21 | Propper Mfg Co Inc | Machine for grinding edges of glass articles |
| CN1174869A (en) * | 1997-08-26 | 1998-03-04 | 汪宁 | Polishing disc for chemcal-mechanical polishing and making method |
| CN102248477A (en) * | 2011-07-21 | 2011-11-23 | 清华大学 | Chemical and mechanical polishing method |
| CN102922414A (en) * | 2012-10-18 | 2013-02-13 | 上海宏力半导体制造有限公司 | Chemical mechanical polishing device |
| CN104942704A (en) * | 2014-03-27 | 2015-09-30 | 株式会社荏原制作所 | Elastic membrane, substrate holding apparatus, and polishing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108188865B (en) | 2020-01-10 |
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