CN108179460A - A kind of high roughness electrolytic copper foil and preparation method thereof - Google Patents
A kind of high roughness electrolytic copper foil and preparation method thereof Download PDFInfo
- Publication number
- CN108179460A CN108179460A CN201711460411.9A CN201711460411A CN108179460A CN 108179460 A CN108179460 A CN 108179460A CN 201711460411 A CN201711460411 A CN 201711460411A CN 108179460 A CN108179460 A CN 108179460A
- Authority
- CN
- China
- Prior art keywords
- carried out
- smooth surface
- hair side
- processing
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/22—Electroplating: Baths therefor from solutions of zinc
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention relates to high roughness electrolytic copper foils more particularly to a kind of high roughness electrolytic copper foil and preparation method thereof, and including hair side and smooth surface, smooth surface and hair side are bonded with non-woven fabrics, and method includes：First stage：Step 1：The hair side of copper foil is carried out throwing brush processing using brush roll is thrown；Step 2：Pickling is carried out to hair side；Step 3：Roughening Copper treatment is carried out to hair side；Step 4：Curing Copper treatment is carried out to hair side；Step 5：Zinc-plated processing is carried out to hair side；Step 6：Processing is passivated to hair side；Step 7：Drying and processing is carried out to hair side；Second stage：Step 1：The smooth surface of copper foil is carried out throwing brush processing using brush roll is thrown；Step 2：Pickling is carried out to smooth surface；Step 3：Roughening Copper treatment is carried out to smooth surface；Step 4：Curing Copper treatment is carried out to smooth surface；Step 5：Zinc-plated processing is carried out to smooth surface；Step 6：Processing is passivated to smooth surface；Step 7：Drying and processing is carried out to smooth surface.
Description
Technical field
The invention belongs to electrolytic copper foil technical fields more particularly to a kind of high roughness electrolytic copper foil and preparation method thereof.
Background technology
Electrolytic copper foil is the important material of copper-clad plate (CCL) and printed circuit board (PCB) manufacture.In current electronic information
In industry high speed development, electrolytic copper foil is referred to as electronic product signal and power transmission, " neural network " linked up.2002
Rise, the production value of China's printed circuit board has intruded third place in the world, the baseplate material as PCB --- copper-clad plate also into
For the third-largest producing country in the world.Thus the electrolytic copper foil industry in China is also made to have the development advanced by leaps and bounds in recent years.
Invention content
In view of this, the present invention provides a kind of high roughness electrolytic copper foil and preparation method thereof, particularly suitable for two-sided
It is prepared with the electrolytic copper foil of non-woven fabrics bonding.
The technical solution adopted by the present invention is as follows：
A kind of high roughness electrolytic copper foil, the electrolytic copper foil include smooth surface and hair side, the smooth surface and hair side with nothing
Woven fabric bonds.
A kind of preparation method of high roughness electrolytic copper foil, which is characterized in that the method includes：
First stage：
Step 1：The hair side of copper foil is carried out throwing brush processing using brush roll is thrown；
Step 2：Pickling is carried out to hair side；
Step 3：Roughening Copper treatment is carried out to hair side；
Step 4：Curing Copper treatment is carried out to hair side；
Step 5：Zinc-plated processing is carried out to hair side；
Step 6：Processing is passivated to hair side；
Step 7：Drying and processing is carried out to hair side；
Second stage：
Step 1：The smooth surface of copper foil is carried out throwing brush processing using brush roll is thrown；
Step 2：Pickling is carried out to smooth surface；
Step 3：Roughening Copper treatment is carried out to smooth surface；
Step 4：Curing Copper treatment is carried out to smooth surface；
Step 5：Zinc-plated processing is carried out to smooth surface；
Step 6：Processing is passivated to smooth surface；
Step 7：Drying and processing is carried out to smooth surface.
Further, the hair side to copper foil throw brush processing and the hair side of copper foil is used to throw brushing using brush roll is thrown
Roller is carried out during throwing brush processing, throwing brush roll model 400#~1000# of use.
Further, it is described that pickling is carried out to hair side and smooth surface is carried out in acid cleaning process, in the electrolytic solution of use：
Cu2+Concentration≤10g/L, H2SO4Concentration range is 100g/L~200g/L, 20~40 DEG C of solution temperature.
Further, it is described that hair side is carried out during being roughened Copper treatment and carrying out roughening Copper treatment to smooth surface, it uses
Electrolytic solution in：Cu2+A concentration of 9g/L~15g/L, H2SO4Concentration range is 120g/L~200g/L, solution temperature 25
~35 DEG C, current density is 1500~3700A/ ㎡.
Further, it is described that hair side is carried out during curing Copper treatment and carrying out curing Copper treatment to smooth surface, it uses
Electrolytic solution in：Cu2+Concentration 40g/L~65g/L, H2SO4Concentration range is 90g/L~130g/L, solution temperature 40~60
DEG C, 1500~3000A/ of current density ㎡.
Further, it is described that hair side is carried out during curing Copper treatment and carrying out curing Copper treatment to smooth surface, it uses
Electrolytic solution in：Zn2+Concentration range is 4g/L~5g/L, K4P2O7Concentration range for 150g/L~170g/L, pH value 9~12,
20~50 DEG C of solution temperature, 50~100A/ of current density ㎡.
Further, it is described processing to be passivated to hair side and during being passivated processing to smooth surface, the electricity of use
Solve C in solutionr 6+A concentration of 1g/L~2.5g/L, pH value are 10~12, solution temperature is 20~40 DEG C, current density 100~
400A/㎡。
Further, the temperature that drying and processing is carried out to hair side and drying and processing is carried out to smooth surface is 200 DEG C~300
℃。
In conclusion the present invention provides a kind of high roughness electrolytic copper foil and preparation method thereof, particularly suitable for two-sided
It is prepared with the electrolytic copper foil of non-woven fabrics bonding.
Specific embodiment
The present invention provides a kind of high roughness electrolytic copper foil and preparation method thereof, for solving in the prior art.
The technical solution in the embodiment of the present invention will be clearly and completely described below, it is clear that described implementation
Example is only part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is common
Technical staff's all other embodiments obtained without making creative work belong to the model that the present invention protects
It encloses.
In order to which the present invention is described in more detail, with reference to embodiment to a kind of high roughness electrolytic copper foil provided by the invention
And preparation method thereof, it is specifically described.
Embodiment 1
A kind of high roughness electrolytic copper foil, the electrolytic copper foil include smooth surface and hair side, the smooth surface and hair side with nothing
Woven fabric bonds.
A kind of preparation method of high roughness electrolytic copper foil, which is characterized in that the method includes：
First stage：
Step 1：The hair side of copper foil is carried out throwing brush processing using brush roll is thrown；
Step 2：Pickling is carried out to hair side；
Step 3：Roughening Copper treatment is carried out to hair side；
Step 4：Curing Copper treatment is carried out to hair side；
Step 5：Zinc-plated processing is carried out to hair side；
Step 6：Processing is passivated to hair side；
Step 7：Drying and processing is carried out to hair side；
Second stage：
Step 1：The smooth surface of copper foil is carried out throwing brush processing using brush roll is thrown；
Step 2：Pickling is carried out to smooth surface；
Step 3：Roughening Copper treatment is carried out to smooth surface；
Step 4：Curing Copper treatment is carried out to smooth surface；
Step 5：Zinc-plated processing is carried out to smooth surface；
Step 6：Processing is passivated to smooth surface；
Step 7：Drying and processing is carried out to smooth surface.
Embodiment 2
A kind of high roughness electrolytic copper foil, the electrolytic copper foil include smooth surface and hair side, the smooth surface and hair side with nothing
Woven fabric bonds.
A kind of preparation method of high roughness electrolytic copper foil, which is characterized in that the method includes：
First stage：
Step 1：The hair side of copper foil is carried out throwing brush processing using brush roll is thrown；
Step 2：Pickling is carried out to hair side；
Step 3：Roughening Copper treatment is carried out to hair side；
Step 4：Curing Copper treatment is carried out to hair side；
Step 5：Zinc-plated processing is carried out to hair side；
Step 6：Processing is passivated to hair side；
Step 7：Drying and processing is carried out to hair side；
Second stage：
Step 1：The smooth surface of copper foil is carried out throwing brush processing using brush roll is thrown；
Step 2：Pickling is carried out to smooth surface；
Step 3：Roughening Copper treatment is carried out to smooth surface；
Step 4：Curing Copper treatment is carried out to smooth surface；
Step 5：Zinc-plated processing is carried out to smooth surface；
Step 6：Processing is passivated to smooth surface；
Step 7：Drying and processing is carried out to smooth surface.
Further, the hair side to copper foil throw brush processing and the hair side of copper foil is used to throw brushing using brush roll is thrown
Roller is carried out during throwing brush processing, throwing brush roll model 400#~1000# of use.
Further, it is described that pickling is carried out to hair side and smooth surface is carried out in acid cleaning process, in the electrolytic solution of use：
Cu2+Concentration≤10g/L, H2SO4Concentration range is 100g/L~200g/L, 20~40 DEG C of solution temperature.
Further, it is described that hair side is carried out during being roughened Copper treatment and carrying out roughening Copper treatment to smooth surface, it uses
Electrolytic solution in：Cu2+A concentration of 9g/L~15g/L, H2SO4Concentration range is 120g/L~200g/L, solution temperature 25
~35 DEG C, current density is 1500~3700A/ ㎡.
Further, it is described that hair side is carried out during curing Copper treatment and carrying out curing Copper treatment to smooth surface, it uses
Electrolytic solution in：Cu2+Concentration 40g/L~65g/L, H2SO4Concentration range is 90g/L~130g/L, solution temperature 40~60
DEG C, 1500~3000A/ of current density ㎡.
Embodiment 3
A kind of high roughness electrolytic copper foil, the electrolytic copper foil include smooth surface and hair side, the smooth surface and hair side with nothing
Woven fabric bonds.
A kind of preparation method of high roughness electrolytic copper foil, which is characterized in that the method includes：
First stage：
Step 1：The hair side of copper foil is carried out throwing brush processing using brush roll is thrown；
Step 2：Pickling is carried out to hair side；
Step 3：Roughening Copper treatment is carried out to hair side；
Step 4：Curing Copper treatment is carried out to hair side；
Step 5：Zinc-plated processing is carried out to hair side；
Step 6：Processing is passivated to hair side；
Step 7：Drying and processing is carried out to hair side；
Second stage：
Step 1：The smooth surface of copper foil is carried out throwing brush processing using brush roll is thrown；
Step 2：Pickling is carried out to smooth surface；
Step 3：Roughening Copper treatment is carried out to smooth surface；
Step 4：Curing Copper treatment is carried out to smooth surface；
Step 5：Zinc-plated processing is carried out to smooth surface；
Step 6：Processing is passivated to smooth surface；
Step 7：Drying and processing is carried out to smooth surface.
Further, the hair side to copper foil throw brush processing and the hair side of copper foil is used to throw brushing using brush roll is thrown
Roller is carried out during throwing brush processing, throwing brush roll model 400#~1000# of use.
Further, it is described that pickling is carried out to hair side and smooth surface is carried out in acid cleaning process, in the electrolytic solution of use：
Cu2+ concentration≤10g/L, H2SO4 concentration range is 100g/L~200g/L, 20~40 DEG C of solution temperature.
Further, it is described that hair side is carried out during being roughened Copper treatment and carrying out roughening Copper treatment to smooth surface, it uses
Electrolytic solution in：A concentration of 9g/L~15g/L of Cu2+, H2SO4 concentration ranges are 120g/L~200g/L, solution temperature 25
~35 DEG C, current density is 1500~3700A/ ㎡.
Further, it is described that hair side is carried out during curing Copper treatment and carrying out curing Copper treatment to smooth surface, it uses
Electrolytic solution in：Cu2+ concentration 40g/L~65g/L, H2SO4 concentration ranges are 90g/L~130g/L, solution temperature 40~60
DEG C, 1500~3000A/ of current density ㎡.
Further, it is described that hair side is carried out during curing Copper treatment and carrying out curing Copper treatment to smooth surface, it uses
Electrolytic solution in：Zn2+ concentration ranges are 4g/L~5g/L, K4P2O7 concentration ranges are 150g/L~170g/L, pH value 9~
12nd, 20~50 DEG C of solution temperature, 50~100A/ of current density ㎡.
Further, it is described processing to be passivated to hair side and during being passivated processing to smooth surface, the electricity of use
A concentration of 1g/L~2.5g/L of Cr6+, pH value are 10~12 in solution solution, solution temperature is 20~40 DEG C, current density 100~
400A/㎡。
Further, the temperature that drying and processing is carried out to hair side and drying and processing is carried out to smooth surface is 200 DEG C~300
℃。
In the preparation method of aforementioned high roughening degree electrolytic copper foil, the roughening copper stage, copper foil light, hair side current density
Divide four sections of positioning, given current density is respectively 2800~3700,1500,2800~3700 and 1500A/ ㎡, i.e., using two
A electrolytic cell, four pieces of anode plates realize that given time is identical.
In the preparation method of the aforementioned heat-resisting electrolytic copper foil of height, the curing copper stage, copper pool smooth surface, hair side current density
Two sections are divided to give, the current density that smooth surface, hair side give is respectively 1500~3500A/ ㎡ and 1500~3500A/ ㎡, that is, is used
Two electrolytic cells, two pieces of anode plates realize that given time is identical, and current density is not quite identical.
In the preparation method of the aforementioned heat-resisting electrolytic copper foil of height, the zinc-plated stage, smooth surface, two sections of hair side current density point
Given, the current density that smooth surface, hair side give is respectively 50~100A/ ㎡ and 50~100A/ ㎡, zinc-plated stage light splitting surface, hair
Face gives different current densities, time all same.
In the preparation method of aforementioned high roughness electrolytic copper foil, the passivation stage light splitting surface, hair side current density point
Two sections given, and current density is respectively 100~400A/ ㎡ and 100~400A/ ㎡.Passivation stage light splitting surface, hair side give difference
Current density, time all same.
In the preparation method of aforementioned high roughness electrolytic copper foil, the tool of electrolytic copper foil is made in the DC electrodeposition technique
Body method is that electrolyte composition is carried out reasonable combination, technique stream with electro-deposition process parameter using DC electrodeposition technique
Journey is as follows：Using electrolyte Cu2+70~90g/L, 100~140g/L of H2SO4 concentration, 20 ± 5PPm of Cl- concentration parameter, temperature
Spend 50~60 DEG C, 40~60m of flow3/ h, 5000~8000A/ of current density ㎡ carry out electro-deposition.
The organic additive is collagen, and the additive amount of collagen is 2mg/L, molecular weight 1000~5000.
The above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications also should
It is considered as protection scope of the present invention.
Claims (9)
1. a kind of high roughness electrolytic copper foil, which is characterized in that the electrolytic copper foil includes smooth surface and hair side, the smooth surface and hair
Face is bonded with non-woven fabrics.
2. the preparation method of high roughness electrolytic copper foil as described in claim 1, which is characterized in that the method includes：
First stage：
Step 1：The hair side of copper foil is carried out throwing brush processing using brush roll is thrown；
Step 2：Pickling is carried out to hair side；
Step 3：Roughening Copper treatment is carried out to hair side；
Step 4：Curing Copper treatment is carried out to hair side；
Step 5：Zinc-plated processing is carried out to hair side；
Step 6：Processing is passivated to hair side；
Step 7：Drying and processing is carried out to hair side；
Second stage：
Step 1：The smooth surface of copper foil is carried out throwing brush processing using brush roll is thrown；
Step 2：Pickling is carried out to smooth surface；
Step 3：Roughening Copper treatment is carried out to smooth surface；
Step 4：Curing Copper treatment is carried out to smooth surface；
Step 5：Zinc-plated processing is carried out to smooth surface；
Step 6：Processing is passivated to smooth surface；
Step 7：Drying and processing is carried out to smooth surface.
3. the preparation method of high roughness electrolytic copper foil as claimed in claim 2, which is characterized in that the hair side to copper foil
During the processing of throwing brush being carried out using throwing brush roll and carrying out throwing brush processing using throwing brush roll to the hair side of copper foil, the throwing brush of use
Roller model 400#~1000#.
4. the preparation method of high roughness electrolytic copper foil as claimed in claim 3, which is characterized in that described that acid is carried out to hair side
It washes and smooth surface is carried out in acid cleaning process, in the electrolytic solution of use：Cu2+Concentration≤10g/L, H2SO4Concentration range is 100g/
20~40 DEG C of L~200g/L, solution temperature.
5. the preparation method of high roughness electrolytic copper foil as claimed in claim 4, which is characterized in that described to be carried out slightly to hair side
During changing Copper treatment and carrying out roughening Copper treatment to smooth surface, in the electrolytic solution of use：Cu2+A concentration of 9g/L~15g/L,
H2SO4Concentration range is 120g/L~200g/L, solution temperature is 25~35 DEG C, and current density is 1500~3700A/ ㎡.
6. the preparation method of high roughness electrolytic copper foil as claimed in claim 5, which is characterized in that described to consolidate to hair side
During changing Copper treatment and carrying out curing Copper treatment to smooth surface, in the electrolytic solution of use：Cu2+Concentration 40g/L~65g/L,
H2SO4Concentration range is 90g/L~130g/L, 40~60 DEG C of solution temperature, 1500~3000A/ of current density ㎡.
7. the preparation method of high roughness electrolytic copper foil as claimed in claim 6, which is characterized in that described to consolidate to hair side
During changing Copper treatment and carrying out curing Copper treatment to smooth surface, in the electrolytic solution of use：Zn2+Concentration range for 4g/L~
5g/L、K4P2O7Concentration range is 150g/L~170g/L, pH value 9~12,20~50 DEG C of solution temperature, current density 50~
100A/㎡。
8. the preparation method of high roughness electrolytic copper foil as claimed in claim 7, which is characterized in that described blunt to hair side progress
During changing processing and being passivated processing to smooth surface, C in the electrolytic solution of user 6+A concentration of 1g/L~2.5g/L, pH value
It is 20~40 DEG C for 10~12, solution temperature, 100~400A/ of current density ㎡.
9. the preparation method of high roughness electrolytic copper foil as claimed in claim 8, which is characterized in that described to be dried to hair side
Dry-cure and the temperature that drying and processing is carried out to smooth surface are 200 DEG C~300 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711460411.9A CN108179460A (en) | 2017-12-28 | 2017-12-28 | A kind of high roughness electrolytic copper foil and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711460411.9A CN108179460A (en) | 2017-12-28 | 2017-12-28 | A kind of high roughness electrolytic copper foil and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108179460A true CN108179460A (en) | 2018-06-19 |
Family
ID=62548357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711460411.9A Pending CN108179460A (en) | 2017-12-28 | 2017-12-28 | A kind of high roughness electrolytic copper foil and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108179460A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108893763A (en) * | 2018-07-02 | 2018-11-27 | 青岛昊月鑫电子材料有限公司 | A kind of clutch gold production method for preventing lithium ion from generating lithium dendrite arm |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012184498A (en) * | 2011-02-18 | 2012-09-27 | Jx Nippon Mining & Metals Corp | Electrolytic copper foil for electromagnetic-wave shielding, and manufacturing method therefor |
| CN103160867A (en) * | 2013-03-11 | 2013-06-19 | 福建清景铜箔有限公司 | Copper foil production conjoint machine and high-bonding strength copper foil technology for lithium ion battery |
| CN103397342A (en) * | 2013-08-19 | 2013-11-20 | 湖北中科铜箔科技有限公司 | High heat-resisting electrolytic copper foil and preparation method thereof |
| CN203390671U (en) * | 2013-08-19 | 2014-01-15 | 湖北中科铜箔科技有限公司 | Plane polishing and grinding device for electrolytic copper foil cathode roller |
| CN104562119A (en) * | 2015-01-08 | 2015-04-29 | 河南红日铜箔科技有限公司 | Multi-section non-arsenic roughening treatment method for electrolytic copper foil |
-
2017
- 2017-12-28 CN CN201711460411.9A patent/CN108179460A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012184498A (en) * | 2011-02-18 | 2012-09-27 | Jx Nippon Mining & Metals Corp | Electrolytic copper foil for electromagnetic-wave shielding, and manufacturing method therefor |
| CN103160867A (en) * | 2013-03-11 | 2013-06-19 | 福建清景铜箔有限公司 | Copper foil production conjoint machine and high-bonding strength copper foil technology for lithium ion battery |
| CN103397342A (en) * | 2013-08-19 | 2013-11-20 | 湖北中科铜箔科技有限公司 | High heat-resisting electrolytic copper foil and preparation method thereof |
| CN203390671U (en) * | 2013-08-19 | 2014-01-15 | 湖北中科铜箔科技有限公司 | Plane polishing and grinding device for electrolytic copper foil cathode roller |
| CN104562119A (en) * | 2015-01-08 | 2015-04-29 | 河南红日铜箔科技有限公司 | Multi-section non-arsenic roughening treatment method for electrolytic copper foil |
Non-Patent Citations (1)
| Title |
|---|
| 金荣涛: "电解铜箔双面处理生产工艺的选择", 《有色冶炼》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108893763A (en) * | 2018-07-02 | 2018-11-27 | 青岛昊月鑫电子材料有限公司 | A kind of clutch gold production method for preventing lithium ion from generating lithium dendrite arm |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106011965B (en) | A kind of fine roughening treatment technique of electrolytic copper foil surface | |
| CN103741181B (en) | A kind of many coordination agents cyanide-free gold electroplating plating solution and electrogilding technique | |
| CN106757245B (en) | A kind of process of surface treatment of melanism copper foil | |
| CN104962965B (en) | The environment-friendly type ashing handling process of rolled copper foil | |
| CN103397342B (en) | A kind of high heat-resisting electrolytic copper foil and preparation method thereof | |
| CN104233384A (en) | Cyanide-free gold electroplating solution and electroplating process using same | |
| CN101622380A (en) | The manufacturing method and apparatus of surface coarsening copper coin and surface coarsening copper coin | |
| CN106698406A (en) | Process for preparing graphite according to electrochemical method | |
| CN104674316A (en) | Treatment technique for enhancing peel strength of electronic copper foil | |
| CN103945648A (en) | Production technology for high-frequency circuit board | |
| CN105543948B (en) | It is a kind of for PCB electroplate accompany plating plate/drag cylinder plate move back process for copper | |
| CN104780710B (en) | Printed wiring board and preparation method thereof | |
| CN103501580B (en) | A kind of surface treatment copper foil and preparation method thereof | |
| KR102655111B1 (en) | Electrodeposited copper foil with its surfaceprepared, process for producing the same and usethereof | |
| CN112981481B (en) | Ultrathin copper foil and preparation method thereof | |
| CN109518131A (en) | A kind of ultrathin copper foil with carrier, ultrathin copper foil production method and device | |
| CN108060442A (en) | A kind of method that Copper-Aluminum compound row surface prepares zinc-copper composite deposite | |
| TW201004517A (en) | Method of treating surface of copper and method of treating surface of printed wiring board | |
| CN103014799B (en) | A kind of circuit board plating process of burn-out-proof plate | |
| CN103481583B (en) | A kind of surface has the preparation method processing Copper Foil of loose structure | |
| CN104404590A (en) | Additive used for electrolytic copper foil and surface roughening treatment technology for electrolytic copper foil | |
| CN108179460A (en) | A kind of high roughness electrolytic copper foil and preparation method thereof | |
| TW201217589A (en) | Method for manufacturing copper foil for printed circuit board and copper foil for printed circuit board | |
| CN104928667B (en) | A kind of printed circuit board processing brown liquid based on functionalized ion liquid | |
| ES2625614T3 (en) | Process for the preparation of a non-conductive substrate for electrodeposition |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180619 |