CN108060442A - A kind of method that Copper-Aluminum compound row surface prepares zinc-copper composite deposite - Google Patents

A kind of method that Copper-Aluminum compound row surface prepares zinc-copper composite deposite Download PDF

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Publication number
CN108060442A
CN108060442A CN201711292576.XA CN201711292576A CN108060442A CN 108060442 A CN108060442 A CN 108060442A CN 201711292576 A CN201711292576 A CN 201711292576A CN 108060442 A CN108060442 A CN 108060442A
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copper
aluminum compound
zinc
plating
added
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CN108060442B (en
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董晓文
王连忠
兰占军
徐飞
兰武克
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YANTAI FISEND BIMETAL CO Ltd
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YANTAI FISEND BIMETAL CO Ltd
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10Electroplating with more than one layer of the same or of different metals
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/22Electroplating: Baths therefor from solutions of zinc
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/30Electroplating: Baths therefor from solutions of tin
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34Pretreatment of metallic surfaces to be electroplated

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The present invention provides the methods that a kind of Copper-Aluminum compound row surface prepares zinc-copper composite deposite, comprise the following steps:(1), hot dipping oil removing;(2), prepare NaOH lye and alkali cleaning;(3), configuration mix acid liquor and pickling;(4), surface sink zinc;(5), carry out surface copper pre-plating;(6), it is tin plating;(7), drying and processing.The composite deposite chemical stability of the present invention is high, and resistance to oxidation, not easy to change in air;Copper in electro-coppering has good electric conductivity and mechanical performance, easily activates, is bonded between forming good metal-Metal with other coats of metal, so as to can just obtain the plating good combination power of interlayer;Coating conducts electricity very well, and coating prime coat is compound for zinc-copper, and surface conductivity reaches more than 90%, and electroplating surfaces with tin layer conductivity reaches more than 85%.

Description

A kind of method that Copper-Aluminum compound row surface prepares zinc-copper composite deposite
Technical field
The invention belongs to technical field of copper aluminum composite material, relate in particular to a kind of Copper-Aluminum compound row surface and prepare zinc-copper The method of composite deposite.
Background technology
In recent years copper-aluminum composite conductor material have been realized in replace pure copper be widely applied, Copper-Aluminum compound comes rule Modelling production, product price occupy absolute advantage, are obtained in transmission of electricity field of power distribution, complete set of equipments neck, electrical equipment control field Extensive popularization and national Long-and Medium-term Development Planning emphasis support one of new material technology research and development direction of development.But It is since copper aluminum composite material surface and end have part aluminium exposed among air, the contact surface of both metals is in air Electrolyte is easily formed under the action of moisture, carbon dioxide and other impurities, so as to which what is formed is anode by cathode, copper of aluminium Primary battery makes aluminium generate electrochemical corrosion, causes the contact resistance increase of copper, aluminium junction.The increase of contact resistance, in operation Temperature will be caused to raise, corrosion oxidation will aggravate under high temperature, generate vicious circle, quality of connection is made further to deteriorate, most After cause contact point temperature excessively high or even the accidents such as can smolder, burn.So it is to Copper-Aluminum compound row's surface protection processing Very crucial, the appropriate electroplating technology of generally use handles pure copper in the prior art, and since Copper-Aluminum compound is arranged Plating and pure copper have the electroplate liquid environment and electroplating work procedure of fundamental difference, so the electroplating technology of fine copper is not appropriate for copper aluminium Composite bar.
The content of the invention
The present invention provides the side that a kind of Copper-Aluminum compound row surface prepares zinc-copper composite deposite to solve the above-mentioned problems Method.
The technical proposal of the invention is realized in this way:A kind of Copper-Aluminum compound row surface prepares the side of zinc-copper composite deposite Method comprises the following steps:
(1), hot dipping oil removing:Hot dipping oil removing is carried out to Copper-Aluminum compound row surface, degreasing powder is added in 30~40 DEG C of water, according to 3 ~5% ratio is added in pure water, and the oil removing time is 10min, is cleaned afterwards with 30 DEG C of hot water;
(2), prepare NaOH lye and alkali cleaning:Concentration of lye is 7~10g/L, Copper-Aluminum compound is drained into 1~2min of lye, so It is cleaned afterwards with clear water;
(3), configuration mix acid liquor and pickling:Mix acid liquor is the NaNO of concentration 8g/L3With the H of concentration 12g/L2SO4Mixing Copper-Aluminum compound is drained into 1~2min of cleaning in acid solution, is then cleaned with clear water by liquid;
(4), surface sink zinc:Copper-Aluminum compound is drained into, electro-galvanized layer is carried out in zinc bath, 10g/L AL-16 aluminium alloys are sunk Zinc agent is slowly added in the pure water that temperature is 30 DEG C, tank liquor proportioning is continuously stirred into solution, when Copper-Aluminum compound row surface is molten in zinc To be taken out during ocean-grey, the time is 6~8min, is then cleaned in pure water for surface reaction in liquid;
(5), carry out surface copper pre-plating:The cuprous oxide of 30g/L is added in tank liquor, the 10g/L oxidations that dissociate is added in and receives, adjust electric current 6~12A/dm2 of density, is constantly stirred, then tank liquor temperature control is washed in 40 DEG C, electroplating time 10 minutes in room temperature 30s;
(6), it is tin plating:Tin bath tank liquor proportioning is stannous 30-50g/L, sulfuric acid adjuvant 35-60g/L, SSA860 15g/L, is adopted Electroplated with the current density of 1.5A/dm2, the time be 10~15min, tin plating 5 μm of layer thickness, room temperature pure water cleaning;
(7), drying and processing:It is dried up with air-heater, temperature≤40 DEG C;
Preferably, degreasing powder includes 12 % of lauric acid amide of ethanol, 6 % of tertiary sodium phosphate, 13 ~ 22 % of sodium carbonate, sodium hydroxide 8 ~ 14 %, 60 % of surfactant.
The beneficial effects of the invention are as follows:The composite deposite chemical stability of the present invention is high, and resistance to oxidation, not variable in air Color;Copper in electro-coppering has good electric conductivity and mechanical performance, easily activates, is formed with other coats of metal good It is bonded between metal-Metal, so as to can just obtain the plating good combination power of interlayer;Coating conducts electricity very well, and coating prime coat is zinc Copper is compound, and surface conductivity reaches more than 90%, and electroplating surfaces with tin layer conductivity reaches more than 85%;Coating adhesion is good, after heavy zinc Aluminium material surface can be with copper electroplating layer, and by high adhesive force, exposed aluminium end is after copper electroplating layer, in electroplating surfaces with tin, electricity Plating prime coat is complete and is easy to tin plating.
Specific embodiment
For a better understanding and implementation, prepare zinc-copper composite deposite the following detailed description of a kind of Copper-Aluminum compound row surface Method:
The first step:Copper-Aluminum compound row's surface treatment of plating is clean, hot dipping oil removing is carried out, degreasing powder is added according to 4% ratio It is added in pure water, during which oil removing 10min in 40 DEG C of water needs to stir back and forth, take out cleaned in 30 DEG C of hot water afterwards;
Second step:Copper-Aluminum compound is drained into the lye that concentration is 8g/L, 2min is soaked in lye by alkali cleaning, then clear with clear water It washes;
3rd step:Copper-Aluminum compound is drained into mix acid liquor by pickling, and mix acid liquor is the NaNO of concentration 8g/L3 It is with concentration The H of 12g/L2SO4, then scavenging period 2min cleans with clear water;
4th step:Surface sinks zinc, and the AL-16 aluminium alloys that concentration is 10g/L are sunk zinc agent is slowly added to the pure water that temperature is 30 DEG C In, tank liquor proportioning is continuously stirred into solution, then time 8min is cleaned in pure water;
5th step:Surface copper pre-plating is carried out, the cuprous oxide of 30g/L is added in tank liquor, the 10g/L oxidations that dissociate is added in and receives, adjust Then current density 8A/dm2, uniform stirring, tank liquor temperature control wash 30s to 40 DEG C, electroplating time 10 minutes in room temperature;
6th step:Tin plating, tank liquor proportioning is stannous:40g/L, sulfuric acid adjuvant:55g/L、SSA860:15g/L, using 1.5A/ The current density of dm2 is electroplated, time 10-15min, tin plating 5 μm of layer thickness, electroplates about 5 minutes under normal temperature state, room temperature Pure water cleans;
7th step drying and processing, is dried up with air-heater.

Claims (2)

1. a kind of method that Copper-Aluminum compound row surface prepares zinc-copper composite deposite, it is characterised in that comprise the following steps:
(1), hot dipping oil removing:Hot dipping oil removing is carried out to Copper-Aluminum compound row surface, degreasing powder is added in 30~40 DEG C of water, according to 3 ~5% ratio is added in pure water, and the oil removing time is 10min, is cleaned afterwards with 30 DEG C of hot water;
(2), prepare NaOH lye and alkali cleaning:Concentration of lye is 7~10g/L, Copper-Aluminum compound is drained into 1~2min of lye, so It is cleaned afterwards with clear water;
(3), configuration mix acid liquor and pickling:Mix acid liquor is the NaNO of concentration 8g/L3With the H of concentration 12g/L2SO4Mixing Copper-Aluminum compound is drained into 1~2min of cleaning in acid solution, is then cleaned with clear water by liquid;
(4), surface sink zinc:Copper-Aluminum compound is drained into, electro-galvanized layer is carried out in zinc bath, 10g/L AL-16 aluminium alloys are sunk Zinc agent is slowly added in the pure water that temperature is 30 DEG C, tank liquor proportioning is continuously stirred into solution, when Copper-Aluminum compound row surface is molten in zinc To be taken out during ocean-grey, the time is 6~8min, is then cleaned in pure water for surface reaction in liquid;
(5), carry out surface copper pre-plating:The cuprous oxide of 30g/L is added in tank liquor, the 10g/L oxidations that dissociate is added in and receives, adjust electric current 6~12A/dm2 of density, is constantly stirred, then tank liquor temperature control is washed in 40 DEG C, electroplating time 10 minutes in room temperature 30s;
(6), it is tin plating:Tin bath tank liquor proportioning is stannous 30-50g/L, sulfuric acid adjuvant 35-60g/L, SSA860 15g/L, is adopted Electroplated with the current density of 1.5A/dm2, the time be 10~15min, tin plating 5 μm of layer thickness, room temperature pure water cleaning;
(7), drying and processing:It is dried up with air-heater, temperature≤40 DEG C.
2. the method that a kind of Copper-Aluminum compound row surface as described in claim 1 prepares zinc-copper composite deposite, it is characterised in that institute State degreasing powder include 12 % of lauric acid amide of ethanol, 6 % of tertiary sodium phosphate, 13 ~ 22 % of sodium carbonate, 8 ~ 14 % of sodium hydroxide, 60 % of surfactant.
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110552030A (en) * 2019-07-24 2019-12-10 河南平高电气股份有限公司 Copper-aluminum electric contact and preparation method thereof
CN110743913A (en) * 2019-10-21 2020-02-04 江苏中色复合材料有限公司 Production process of copper-aluminum composite decorative material
CN111893524A (en) * 2020-08-14 2020-11-06 常宁市隆源铜业有限公司 Copper stranded wire surface galvanizing method
CN112376095A (en) * 2020-11-13 2021-02-19 中山品高电子材料有限公司 Electroplating process for preventing high-temperature tin melting
CN114990651A (en) * 2022-04-29 2022-09-02 沈阳飞机工业(集团)有限公司 Multiple electroplating process method for copper plating, cadmium plating and tin plating
CN115074793A (en) * 2022-06-16 2022-09-20 山东省机械设计研究院 Novel electroplating process of copper-aluminum composite material

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110552030A (en) * 2019-07-24 2019-12-10 河南平高电气股份有限公司 Copper-aluminum electric contact and preparation method thereof
CN110743913A (en) * 2019-10-21 2020-02-04 江苏中色复合材料有限公司 Production process of copper-aluminum composite decorative material
CN111893524A (en) * 2020-08-14 2020-11-06 常宁市隆源铜业有限公司 Copper stranded wire surface galvanizing method
CN112376095A (en) * 2020-11-13 2021-02-19 中山品高电子材料有限公司 Electroplating process for preventing high-temperature tin melting
CN114990651A (en) * 2022-04-29 2022-09-02 沈阳飞机工业(集团)有限公司 Multiple electroplating process method for copper plating, cadmium plating and tin plating
CN115074793A (en) * 2022-06-16 2022-09-20 山东省机械设计研究院 Novel electroplating process of copper-aluminum composite material
CN115074793B (en) * 2022-06-16 2024-03-08 山东省机械设计研究院 Novel electroplating process of copper-aluminum composite material

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Denomination of invention: A method for preparing zinc copper composite coating on the surface of copper aluminum composite row

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