CN108179381B

CN108179381B - Manufacturing method of precise mask plate

Info

Publication number: CN108179381B
Application number: CN201810199983.4A
Authority: CN
Inventors: 陈海涛
Original assignee: Kunshan Govisionox Optoelectronics Co Ltd
Current assignee: Kunshan Govisionox Optoelectronics Co Ltd
Priority date: 2018-03-12
Filing date: 2018-03-12
Publication date: 2020-03-17
Anticipated expiration: 2038-03-12
Also published as: CN108179381A

Abstract

The invention relates to a method for manufacturing a precise mask plate, which comprises the following steps: providing a mask substrate; performing full etching on the mask substrate to form a first region with a first opening pattern and a second region with a second opening pattern; the second region is connected to at least one side of the first region; and plugging the open holes in the second area to form a non-display area, and taking the first area as a display area. According to the manufacturing method of the precise mask plate, the display area is subjected to full-etching hole opening, and meanwhile, the second area serving as the non-display area is subjected to full-etching hole opening, so that the stress at each position of the display area is uniform, the edge wrinkles of the display area are reduced, and the probability of mura generated by a display using the precise mask plate is effectively reduced.

Description

Manufacturing method of precise mask plate

Technical Field

The invention relates to the technical field of organic electroluminescent device manufacturing, in particular to a manufacturing method of a precise mask plate.

Background

In the manufacturing process of the organic electroluminescent display device, a Fine mask (Fine mask) is required. When the precise mask plate is manufactured, the display area is generally subjected to full etching to evaporate organic materials, and other areas are not subjected to full etching to limit the shape of the display area. Half-etching is usually performed near the display area to reduce wrinkles at the edges of the display area. Some of the areas near the display area are not etched during part of the process. The display area is completely etched, and the display area edge is half etched or not etched, so that the two areas are different in structure, wrinkles are brought, and the display generates a mura (phenomenon that brightness of the display is uneven, and various marks are caused) phenomenon.

Disclosure of Invention

Therefore, a method for manufacturing a precision mask capable of effectively reducing the edge wrinkles of the display area is needed.

A manufacturing method of a precise mask plate comprises the following steps:

providing a mask substrate;

performing full etching on the mask substrate to form a first region with a first opening pattern and a second region with a second opening pattern; the second region is connected to at least one side of the first region; and

and blocking the open holes in the second area to form a non-display area, and taking the first area as a display area.

According to the manufacturing method of the precise mask plate, the display area is subjected to full-etching hole opening, and meanwhile, the second area serving as the non-display area is subjected to full-etching hole opening, so that the stress at each position of the display area is uniform, the edge wrinkles of the display area are reduced, and the probability of mura generated by a display using the precise mask plate is effectively reduced.

In one embodiment, when the mask substrate is subjected to full etching, the mask substrate is subjected to double-sided etching.

In one embodiment, the pattern unit forming the first opening pattern is the same as the pattern unit forming the second opening pattern.

In one embodiment, when plugging the open holes in the second area, the open holes in the second area are plugged by using metal glue.

In one embodiment, the ductility of the metal paste is greater than or equal to the ductility of the material of the mask substrate.

In one embodiment, the melting point of the metal paste is higher than the evaporation temperature of the precise mask plate.

In one embodiment, in the step of plugging the opening in the second region with the metal paste, the formed metal paste is located between two planes of the mask substrate.

In one embodiment, the method further comprises the following steps:

detecting a hole plugging condition in the second area; and

and when the plane where any point on the metal glue is detected to exceed the surface of the mask substrate, removing the metal glue, and plugging the open holes in the second region again.

In one embodiment, the metal paste is removed by a laser when the metal paste is removed.

In one embodiment, the material of the mask substrate is an alloy.

Drawings

Fig. 1 is a flowchart of a method for manufacturing a precision mask in an embodiment;

FIG. 2 is a schematic structural diagram of a mask substrate obtained by double-sided etching;

FIG. 3 is a schematic diagram of the second area after step S130 is completed;

FIG. 4 is a partial flowchart of a method for fabricating a precision mask in another embodiment;

fig. 5 is a schematic view of the filled metal paste exceeding the surface of the mask substrate.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Fig. 1 is a flowchart of a method for manufacturing a precision mask in an embodiment, and the precision mask manufactured by the method may be applied to an organic electroluminescent display device (OLED). Referring to fig. 1, the method comprises the steps of:

in step S110, a mask substrate is provided.

The mask substrate is provided with certain magnetism and ductility resistance. In one embodiment, the mask substrate is made of a nickel-iron alloy, such as Invar (Invar). In other embodiments, the mask substrate may be made of stainless steel. The mask substrate is provided with a thickness of typically 10 to 50 microns. In one embodiment, the mask substrate may have a thickness of 15 to 25 microns.

Step S120, performing full etching on the mask substrate to form a first region having a first opening pattern and a second region having a second opening pattern.

The second region is formed to be connected to at least one side of the first region. In an embodiment, the second region surrounds the first region. The first region is subsequently required to be a display region, and therefore the first opening pattern in the first region needs to be set according to the pixel structure of the display device, for example, the actual opening pattern is determined according to the pattern (pattern) and arrangement of R, G, B three sub-pixels. The second region is subsequently required to be a non-display region, and thus the second opening pattern formed may not be limited. In an embodiment, the pattern units of the first opening pattern are the same as the pattern units of the second opening pattern, that is, the opening conditions in the first region and the second region are consistent, so that the stress at each position of the first region can be further made uniform, and the edge wrinkle of the first region can be reduced.

In this embodiment, during the process of performing the full etching on the mask substrate, a double-sided etching process is adopted, as shown in fig. 2. The full etching of the mask substrate is realized through a double-sided etching process, the area of an opening can be reduced, and the resolution of the display device is further improved.

Step S130, plugging the opening in the second region to form a non-display region, and using the first region as a display region.

Since the second region is required as a non-display region, the hole-blocking operation is performed on the opening therein so that the entire second region cannot be a light-emitting region. Specifically, the gluing device is used for gluing the open holes in the second area so as to complete hole plugging of the open holes in the area. Fig. 3 is a schematic view of the second region after completion of plugging.

According to the manufacturing method of the precise mask plate, the display area is subjected to full-etching hole opening, and meanwhile, the second area serving as the non-display area is subjected to full-etching hole opening, so that the stress at each position of the display area is uniform, the edge wrinkles of the display area are reduced, and the probability of mura generated by a display using the precise mask plate is effectively reduced. By adopting the method, the wrinkles caused by the difference of the structures of the two areas caused by the full etching of the display area and the half etching or non-etching of the edge of the display area can be effectively avoided.

In an embodiment, in step S130, the holes in the second area are plugged by using metal glue, that is, a glue coating process is used. In the gluing process, the gluing position precision and the gluing amount need to be controlled, so that the metal glue accurately falls on the opening area without influencing the flatness of the evaporation surface. The ductility of the selected metal glue should be more than or equal to the ductility of the mask substrate selected material, so that the problem that the metal glue falls off in the whole stretching process of the precise mask plate can be prevented from occurring or the problem that the precise mask plate deforms can be prevented from occurring. Meanwhile, the melting point of the selected metal glue is higher than the evaporation temperature of the precise mask plate, so that the metal glue is prevented from falling off in the evaporation process of the precise mask plate. In addition, the selected metal glue needs to meet the condition that the metal glue is firmly dropped at the opening and is not easy to drop, so that the metal glue can be prevented from dropping, and the non-display area can also carry out light transmission display.

As shown in fig. 3, the metal paste after plugging the hole is located between two planes of the mask substrate, so that the flatness of the whole precision mask plate is not affected. In an embodiment, the method further includes the following steps, as shown in fig. 4:

step S210, detecting a hole plugging condition in the second area.

In the process of plugging the hole, the fact that the plugging hole at each time meets the actual requirement cannot be ensured, and therefore the plugging condition of the hole needs to be detected after the plugging is finished. In this embodiment, in the process of detecting the hole plugging condition, it is mainly detected whether the metal paste filled in the hole plugging process exceeds the mask substrate, as shown in fig. 5, that is, a plane where any point exists on the metal paste exceeds the surface of the mask substrate.

Step S220, when the fact that the plane where any point on the metal glue is located exceeds the surface of the mask substrate is detected, the metal glue is removed, and hole plugging is conducted on the opening in the second area again.

When the situation shown in fig. 5 is detected that the plane where any point of the metal paste is located exceeds the surface of the mask substrate, the metal paste is removed by means of laser and the like, and then the hole in the second area is plugged again. In the process of removing the metal glue, the metal glue can be partially removed or completely removed.

In an embodiment, after the step S220 is completed, the step S210 is continuously executed, that is, the filled condition is detected again, so as to ensure that the filled metal paste does not affect the flatness of the entire mask substrate.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A manufacturing method of a precise mask plate is characterized by comprising the following steps:

providing a mask substrate;

blocking the open holes in the second area to form a non-display area, and taking the first area as a display area;

wherein, it is right when the trompil in second region carries out the stifled hole, it is right to utilize metal to glue trompil in the second region carries out the stifled hole, and the metal that forms glues and is located between two planes of mask base plate, the ductility that the metal glued is more than or equal to the ductility of the material of mask base plate, the melting point that the metal glued is higher than the coating by vaporization temperature of accurate mask plate.

2. The method according to claim 1, wherein the mask substrate is subjected to double-sided etching while the mask substrate is subjected to full etching.

3. The method according to claim 1, wherein the pattern unit forming the first opening pattern is the same as the pattern unit forming the second opening pattern.

4. The method of claim 1, further comprising:

detecting a hole plugging condition in the second area; and

5. The method according to claim 4, wherein the metal paste is removed by laser when the metal paste is removed.

6. The method of claim 1, wherein the material of the mask substrate is an alloy.