CN108174467B

CN108174467B - LED heating method, device, assembly, bathroom heater and warmer

Info

Publication number: CN108174467B
Application number: CN201810055351.0A
Authority: CN
Inventors: 李长华; 余世伟
Original assignee: Opple Lighting Co Ltd
Current assignee: Opple Lighting Co Ltd
Priority date: 2017-06-01
Filing date: 2017-06-01
Publication date: 2024-05-14
Anticipated expiration: 2037-06-01
Also published as: CN107197540B; CN108174467A; CN107197540A

Abstract

The invention provides an LED heating method, an LED heating device, an LED heating assembly, a bathroom heater and a warmer. The LED heating method comprises the following steps: setting an LED chip, wherein the LED chip emits excitation light with the wavelength of 200-680nm when in power-on operation; a spectrum converter which is arranged around the LED chip and can emit infrared rays with the wavelength of 1400-2000nm when being excited by the exciting light rays; when the LED chip emits the excitation light, the spectrum converter is excited by the excitation light and emits infrared rays with the wavelength of 1400-2000 nm. The invention can improve the conversion rate of the exciting light rays and the heating function.

Description

LED heating method, device, assembly, bathroom heater and warmer

The application relates to a method, a device, a heating assembly and equipment for heating by using LEDs, which are classified application of the application patent application with the application date of 2017, 06, 01 and the application number of 201710404366.9.

Technical Field

The invention relates to the field of illumination, in particular to an LED heating method, an LED heating device, an LED heating assembly, a bathroom heater and a bathroom heater.

Background

It is well known that infrared rays have a thermal effect, and when the infrared rays are irradiated onto an object, energy contained in the infrared rays has a high probability of being converted into heat by the object, thereby achieving the effect of heating the object. The infrared rays are divided into three infrared rays of IR-A, IR-B and IR-C according to the wavelength range, wherein the wavelength range of IR-A is 780nm-1400nm, the wavelength range of IR-B is 1400nm-3000nm, and the wavelength range of IR-C is 3000nm-1mm.

Generally, the IR-A has higher penetration rate to skin, can act on subcutaneous tissue, and the IR-A with higher intensity is easy to cause cataract to eyes; the IR-B has higher absorptivity on the skin of a human body, and can convert larger energy into heat; IR-C has strong health care effect on human body and is praised as life light.

The current method for obtaining the IR-B wave band mainly comprises the steps of heating a filament by electricity, raising the temperature of the filament and increasing infrared radiation; part of the product may also be coated with infrared powder on top of a bulb where the filament temperature is designed to be relatively low (e.g. 1800K-2500K), converting part of the visible light or IR-a part of the energy to the IR-B band to increase the heating effect; still another part of the products are coated with a metal coating on the glass shell of the carbon tube sealed by the bubble, and a part of visible light and near infrared to IR-B wave bands are converted by means of the metal surface layer; or by filtering out the infrared portion of the radiation from the high temperature radiation of some gas discharge lamps.

As a result, if the desired band is in a longer band, the temperature of the emitter needs to be reduced to increase the energy duty cycle of the long-wave infrared portion, but after reducing the temperature, the reduction in the efficiency of the electro-long-wave infrared conversion will be directly caused. In addition, the infrared band generated by the method can cover a wide spectrum range, and the possible energy obtained directly covers a wide range of IR-A, IR-B, IR-C, so that when a band in a specific narrow range is required to be obtained, a filter is needed. However, the efficiency of the filter is further reduced, and the half bandwidth of the bandpass filter for the infrared portion is generally wider, and it is difficult to obtain a smaller infrared spectrum range.

Therefore, the traditional heating mode has poor heating effect and high energy consumption, the peak value of the wave band of the emitted light is generally about 1050-1100nm during heating, the main energy is concentrated in IR-A, and the wave band has strong damage to human eyes.

Therefore, a more efficient LED heating mode is a technical problem to be solved.

Disclosure of Invention

The invention provides an LED heating method, an LED heating device, an LED heating assembly, a bathroom heater and a warmer, so that the problems can be overcome or at least partially solved.

According to an aspect of the present invention, there is provided an LED heating method, comprising:

Setting an LED chip, wherein the LED chip emits excitation light with the wavelength of 200-680nm when in power-on operation;

a spectrum converter which is arranged around the LED chip and can emit infrared rays with the wavelength of 1400-2000nm when being excited by the exciting light rays;

When the LED chip emits the excitation light, the spectrum converter is excited by the excitation light and emits infrared rays with the wavelength of 1400-2000 nm.

Optionally, the spectral converter includes at least one of: can be excited to emit infrared rays with the wavelength of 1400-2000 nm.

Optionally, the spectral converter, which is disposed around the LED chip and capable of emitting infrared rays with a wavelength of 1400-2000nm when excited by the excitation light, includes:

Packaging the LED chip;

the spectral converter is disposed around the encapsulation of the LED chip.

Optionally, the encapsulant includes an encapsulant;

The packaging adhesive comprises silica gel or epoxy resin.

Optionally, the disposing the spectrum converter around the package of the LED chip includes:

Disposing the spectral converter against the encapsulant; or alternatively

And setting a set distance between the spectrum converter and the packaging material.

Optionally, when the spectrum converter is disposed close to the package, the excitation light is emitted from the LED chip and then directly irradiates the spectrum converter.

Optionally, when a set distance exists between the spectrum converter and the package, the excitation light transmits the set distance and irradiates the spectrum converter.

Optionally, the LED chip and the spectrum converter are both packaged in an LED device or module.

Optionally, the package adopts an SMD package or a COB package or a CSP type package;

when the SMD packaging is adopted, the LED chip and the spectrum converter are packaged in an LED device or a module by using a bracket;

When the COB packaging is adopted, the LED chip and the spectrum converter are packaged in an LED device or a module by utilizing a substrate;

The CSP type packaging is adopted, a bracket or a substrate is not needed, and the LED chip and the spectrum converter are directly packaged in an LED device or a module.

Optionally, the method is applicable to any one of a warmer, a bathroom heater product, an automatic drying clothes hanger, a mildew-proof wardrobe lamp, and a drying device or module in the food and drug industry.

According to another aspect of the present invention, there is provided an LED heating device, comprising:

the LED chip is configured to emit excitation light with the wavelength of 200-680nm during power-on operation;

a spectral converter disposed around the LED chip is configured to emit infrared light having a wavelength of 1400-2000nm when excited by the excitation light.

Optionally, the spectral converter includes at least one of: can be stimulated to generate fluorescent material particles, sol, fluorescent film and coating material with the wavelength of 1400-2000 nm.

Optionally, the above-mentioned LED heating device further includes:

An encapsulant configured to encapsulate the LED chip;

the spectral converter is disposed around the encapsulant.

Optionally, the encapsulant includes an encapsulant, and the encapsulant includes a silicone or epoxy.

Optionally, the spectral converter is disposed proximate to the encapsulant; or a set distance is arranged between the packaging material and the packaging material.

Optionally, the LED chip is connected to the driving power supply through a metal wire, where the metal wire includes any one of gold wire, silver wire, alloy wire, and copper wire.

Optionally, the LED chip is a chip with a vertical structure, and the metal wire has only one wire;

the LED chip is a flip chip structure, and the metal wires are not present.

Optionally, the device is packaged in an LED device or module.

Optionally, the device is adapted for any one of the following: warmer, bathroom heater product, automatic drying clothes hanger, mould proof wardrobe lamp, stoving drying device or module of food and medicine trade.

According to still another aspect of the present invention, there is provided an LED heating assembly, wherein any one of the above LED heating devices is packaged, further comprising: and a housing encapsulating the LED heating device, wherein the housing comprises a bracket or a substrate.

According to still another aspect of the present invention, there is provided a bathroom heater, wherein the above-described LED heating assembly is packaged.

According to yet another aspect of the present invention, there is provided a warmer, characterized in that the above-mentioned LED heating assembly is packaged therein.

By adopting the LED heating method, the device, the components, the bathroom heater and the warmer provided by the embodiment of the invention, the following beneficial effects can be achieved:

In the embodiment of the invention, the LED chip is selected firstly, and the LED chip (for example, 200-680 nm) in a stable rated range band is adopted, so that the LED chip can obtain the wavelength in a stable range when emitting light, and a foundation is provided for the improvement of the subsequent conversion rate. Then, the embodiment of the invention arranges a spectrum converter capable of emitting infrared rays with a wavelength of 1400-2000nm when excited by the excitation light around the LED chip. Different from the simple conversion mode of applying infrared powder on a bulb in the prior art, the spectrum converter adopted by the embodiment of the invention is arranged around the LED chip, so that the comprehensive acquisition of the exciting light rays emitted by the LED chip is ensured, the exciting light rays emitted by the LED chip are acquired as much as possible and are converted into infrared rays with high capability of converting unit power density into thermal effect in a human body, and the conversion rate of the exciting light rays is improved. Furthermore, in the embodiment of the invention, the spectrum converter is directly packaged around the LED chip, and even packaged in the LED device or the module together with the LED chip, so that the heating power of the LED device or the module is greatly increased. Therefore, the LED heating method provided by the embodiment of the invention greatly improves the heating function, can be used in the heating field, has a great application space in real life, and is suitable for a heater, a bathroom heater product, an automatic drying clothes rack, a mildew-proof wardrobe lamp, a drying device or module in the food and drug industry and the like.

The foregoing description is only an overview of the present invention, and is intended to be implemented in accordance with the teachings of the present invention in order that the same may be more clearly understood and to make the same and other objects, features and advantages of the present invention more readily apparent.

The above, as well as additional objectives, advantages, and features of the present invention will become apparent to those skilled in the art from the following detailed description of a specific embodiment of the present invention when read in conjunction with the accompanying drawings.

Drawings

Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to designate like parts throughout the figures. In the drawings:

FIG. 1 shows a process flow diagram of a method of heating LEDs in accordance with one embodiment of the invention;

FIG. 2 shows a schematic structural view of an LED heating device according to one embodiment of the present invention;

FIG. 3 shows a schematic diagram of an LED heating assembly according to one embodiment of the invention;

FIG. 4 shows a schematic diagram of spectral energy of infrared rays according to an embodiment of the present invention; and

Fig. 5 shows a spectral energy comparison of a heating bathroom heater, an infrared coated bathroom heater and a metal coated carbon layer heating tube according to an embodiment of the invention.

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

In order to solve the technical problems, the embodiment of the invention provides an LED heating method. Fig. 1 shows a process flow diagram of a method of heating an LED according to one embodiment of the invention. Referring to fig. 1, the method at least includes:

s101, setting an LED chip, wherein the LED chip emits exciting light rays with the wavelength of 200-680nm during power-on operation;

Step S102, a spectrum converter which can emit infrared rays with the wavelength of 1400-2000nm when being excited by exciting light rays is arranged around the LED chip;

and step S103, when the LED chip emits excitation light, the spectrum converter is excited by the excitation light and emits infrared rays with the wavelength of 1400-2000 nm.

The infrared rays are classified into three types of IR-A, IR-B, IR-C, and the functions of the various types are different. In order to improve heating efficiency, IR-B type infrared rays are preferable as the converted infrared rays in the embodiment of the present invention. To ensure the heating effect, the band of the converted infrared rays is limited to 1400-2000nm. Namely, the embodiment of the invention can convert the excitation light of the wave band of 200-680nm into the infrared of the wave band of 1400-2000nm by arranging the spectrum converter around the LED chip. Furthermore, by utilizing infrared rays of 1400-2000nm wave bands, not only is the generation of an IR-A wave band with higher human body danger avoided, but also emitted light rays are all concentrated in an IR-B wave band, the infrared thermal effect of the wave band is more obvious, the resonance frequency of a molecular C-H bond of human tissues can be close to, the heating effect of a product on the human body is greatly improved, the power consumption of heating is greatly reduced, and meanwhile, the infrared danger is greatly reduced.

In an embodiment of the invention, the spectral converter comprises at least one of: can be stimulated to produce fluorescent material powder particles, sol and fluorescent film materials with the wavelength of 1400-2000 nm. Preferably, a phosphor powder, sol, fluorescent film or coating material capable of generating infrared rays in the wavelength band of 1400-2000nm by excitation light in the wavelength band of 200-680 nm.

Further, there may be various ways of disposing the spectrum converter around the LED chip, and in order to ensure the safety of the LED chip, the embodiment of the present invention preferably directly encapsulates the LED chip. The specific packaging material can be common packaging glue, and the packaging steps comprise: firstly, packaging glue is arranged at a position close to the LED chip, and then a spectrum converter is arranged around the packaging glue. The packaging adhesive comprises silica gel or epoxy resin. Other encapsulants, such as rubber-like encapsulants, solid encapsulants, etc., may also be selected for practical use. The packaging adhesive is a preferred choice because of its strong adaptability. The encapsulation glue is used as an encapsulant in the following description.

Of course, the spectrum converter may be disposed around the encapsulation adhesive, or may be disposed close to the encapsulation adhesive, or may be disposed at a set distance between the spectrum converter and the encapsulation adhesive. The setting distance between the spectrum conversion object and the packaging glue is a deformation treatment of the setting mode of setting the spectrum conversion object closely to the packaging glue. When the spectrum converter is arranged close to the packaging adhesive, the excitation light is emitted from the LED chip and then directly irradiates the spectrum converter. When a set distance exists between the spectrum converter and the packaging adhesive, a remote excitation step is started for the LED chip, namely the spectrum converter is not attached to the packaging adhesive (or other packaging structures), and the spectrum converter is completely separated from the packaging adhesive, so that the excitation light emitted by the LED chip is transmitted to the spectrum converter for a relatively long distance, and the spectrum converter is excited to emit heating light. Such forms are intended to be one form of variation of the present invention and are also within the principles set forth herein.

Based on the same inventive concept, the embodiment of the invention also provides an LED heating device, and fig. 2 shows a schematic structural diagram of the LED heating device according to one embodiment of the invention. Referring to fig. 2, the led heating device includes at least:

An LED chip 210 configured to emit excitation light having a wavelength of 200-680nm when in a power-on operation, wherein the LED chip 210 is powered by a driving power supply 220 (the driving power supply is not packaged in a device that uses LED heating);

The spectral converter 230 disposed around the LED chip 210 is configured to emit infrared rays having a wavelength of 1400-2000nm when excited by the excitation light.

Further, the driving power supply 220 and the LED chip 210 need to be completely connected through a metal wire, so as to realize the power supply of the driving power supply 220 to the LED chip 210, wherein the metal wire includes any one of gold wire, silver wire, alloy wire and copper wire. If the LED chip 210 is a chip with a vertical structure, there is only one metal wire; if the LED chip 210 is a flip chip, no metal wires are present.

In particular applications, both the LED chip 210 and the spectral converter 230 may be packaged in an LED device or module. Specifically, the package may employ an SMD package or a COB package or a CSP type package. When SMD packaging is adopted, the LED chip 210 and the spectrum converter 230 are both packaged in the LED device or the module by using the bracket. When COB packaging is used, the LED chip 210 and the spectral converter 230 are both packaged in an LED device or module using a substrate. The CSP type package is used to directly package both the LED chip 210 and the spectral converter 230 into an LED device or module without a stand or substrate.

Of course, if the LED chip 210 and the spectrum converter 230 are both packaged in an LED device or module, i.e. the LED heating device shown in fig. 2 is packaged in the LED device or module, the LED device or module further provides a device or module housing for packaging the LED heating device. From the appearance, the LED device or module which can be used for heating or warming is not obviously different from the common LED device or module, so that the acceptance of users is greatly improved, meanwhile, the produced common device or module can be fully utilized, the generation of heating light is realized through the improvement of the common device or module, and the production cost is reduced.

In an embodiment of the present invention, the LED device or module that encapsulates the LED heating apparatus shown in fig. 2 is further referred to as an LED heating device or module.

The above-mentioned method and device for heating the LED, and the LED heating device or module in which the LED heating device shown in fig. 2 is packaged have a great application space in real life, for example, they are applicable to heaters, bathroom heater products, automatic drying clothes hangers, mildew-proof wardrobe lamps, drying lamps in food and drug industries, etc.

The embodiment of the invention also provides an LED heating assembly, in which the LED heating device shown in FIG. 2 is packaged, further comprising: a housing enclosing the LED heating device shown in fig. 2, wherein the housing may comprise a stand or a substrate.

An embodiment is described. In an embodiment of the invention, the LED package at least comprises one or more blue or violet or red emitting LED chips, an LED support or substrate, and a phosphor that can be used as a spectral converter. Fig. 3 shows a schematic structural view of an LED heating assembly (also referred to as an LED heating device or module) according to one embodiment of the present invention. Referring to fig. 3,1, fig. 3 illustrates a typical SMD package, where the package carrier 1 may be in the form of an SMD, a ceramic or aluminum nitride substrate, an aluminum substrate, or other COB and filament package.

2 And 3 are electrodes, and the material of the electrodes can be copper, iron or other metal materials. And 4 is gold wire, and can also be silver wire/alloy wire/copper wire. If the LED chip is of a vertical structure, there may be only one gold wire 4; if the LED chip is of flip-chip construction, money 4 may not be present; fig. 3 shows a typical chip of a horizontal structure, with two gold wires 4.

The LED chip emitting exciting light rays can be a chip with a horizontal structure, a chip with a vertical structure or a flip chip structure. The wavelength of the light emitted by the LED chip 5 is between 200-680 nm. 6 is fluorescent material powder particles which can be stimulated to generate infrared rays with the wavelength of 1400-2000nm, sol, or fluorescent film or coating material. And 7 is encapsulation glue, and can be silica gel or epoxy resin. 8 is the excitation light emitted by the LED chip 5, which has a wavelength between 200-680 nm. 9 is the infrared ray emitted by the special infrared fluorescent material 6 in the excited state, and the wavelength range is 1400nm-2000nm.

As shown in fig. 3, when a certain current is applied between the electrode 2 and the electrode 3, the current flows through the LED chip 5 via the gold wire 4, the LED chip 5 emits light 8 with a wavelength of 200-680nm under the driving of the current, the LED chip 5 emits light 8 to irradiate a special infrared fluorescent material 6 through the encapsulation glue 7, and the infrared fluorescent material 6 is stimulated to radiate infrared rays 9.

It should be noted that, in fig. 3, the electrodes 2 and 3 are used to connect to a driving power source, and in practical application, the driving power source is not encapsulated in the LED heating assembly of fig. 3. In implementation, the package structure shown in fig. 3 may be arranged on a circuit substrate of any heating device, where the circuit substrate is electrically connected to a driving power supply of the heating device (for example, a bathroom heater, a warmer, etc.), so as to supply power to the LED heating assembly, and generate excited infrared light.

The spectral diagram of the wavelengths of the infrared ray 9 produced by the product shown in fig. 3 is concentrated at 1400nm-2000nm, and fig. 4 shows a schematic diagram of the spectral energy of the infrared ray according to an embodiment of the present invention. The horizontal axis of fig. 4 represents the wavelength of infrared rays, and the vertical axis represents the percentage of spectral energy, and it can be seen from fig. 4 that the spectrum obtained by using the embodiment of the present invention is concentrated and has higher energy. To further demonstrate this fact, fig. 5 shows a spectral energy comparison plot of an embodiment of the present invention against a conventional heating bathroom heater, an infrared coated bathroom heater, and a metal coated carbon layer heating tube. In fig. 5, the dotted line represents the spectrum of a general heating bathroom heater, the dotted line represents the spectrum of a bathroom heater with an infrared coating, the thin solid line represents the spectrum of a carbon layer heating tube with a metal coating, and the thick solid line represents the spectrum of an embodiment of the present invention. Referring to fig. 5, it can be seen that the spectrum of the embodiment of the present invention is significantly more concentrated and more energetic than the other modes.

The embodiment of the invention also provides a bathroom warmer, wherein the LED heating assembly shown in fig. 3 is packaged.

The embodiment of the invention also provides a warmer, wherein the LED heating component shown in fig. 3 is also packaged.

In the description provided herein, numerous specific details are set forth. However, it is understood that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.

Similarly, it should be appreciated that in the foregoing description of exemplary embodiments of the invention, various features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and aiding in the understanding of one or more of the various inventive aspects. However, the disclosed method should not be construed as reflecting the intention that: i.e., the claimed invention requires more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive aspects lie in less than all features of a single foregoing disclosed embodiment. Thus, the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of this invention.

Those skilled in the art will appreciate that the modules in the apparatus of the embodiments may be adaptively changed and disposed in one or more apparatuses different from the embodiments. The modules or units or components of the embodiments may be combined into one module or unit or component and, furthermore, they may be divided into a plurality of sub-modules or sub-units or sub-components. Any combination of all features disclosed in this specification (including any accompanying claims, abstract and drawings), and all of the processes or units of any method or apparatus so disclosed, may be used in combination, except insofar as at least some of such features and/or processes or units are mutually exclusive. Each feature disclosed in this specification (including any accompanying claims, abstract and drawings), may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise.

Furthermore, those skilled in the art will appreciate that while some embodiments described herein include some features but not others included in other embodiments, combinations of features of different embodiments are meant to be within the scope of the invention and form different embodiments. For example, in the claims, any of the claimed embodiments may be used in any combination.

It should be noted that the above-mentioned embodiments illustrate rather than limit the invention, and that those skilled in the art will be able to design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The invention may be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer. In the unit claims enumerating several means, several of these means may be embodied by one and the same item of hardware. The use of the words first, second, third, etc. do not denote any order. These words may be interpreted as names.

By now it should be appreciated by those skilled in the art that while a number of exemplary embodiments of the invention have been shown and described herein in detail, many other variations or modifications of the invention consistent with the principles of the invention may be directly ascertained or inferred from the present disclosure without departing from the spirit and scope of the invention. Accordingly, the scope of the present invention should be understood and deemed to cover all such other variations or modifications.

Claims

1. A method of heating an LED, comprising:

when the LED chip emits the exciting light, the spectrum converter is excited by the exciting light and emits infrared rays with the wavelength of 1400-2000nm, and the infrared rays are heating light with high capability of converting unit power density into thermal effect on a human body; wherein the method comprises the steps of

The step of disposing around the LED chip a spectral converter capable of emitting infrared rays having a wavelength of 1400-2000nm when excited by the excitation light includes:

Arranging packaging glue at a position close to the LED chip;

and disposing the spectrum converter around the packaging adhesive.

2. The method of claim 1, wherein the spectral converter comprises at least one of: can be excited to emit infrared rays with the wavelength of 1400-2000 nm.

3. The method of claim 1, wherein the step of determining the position of the substrate comprises,

The packaging adhesive comprises silica gel or epoxy resin.

4. The method of claim 1, wherein disposing the spectral converter around the encapsulation glue comprises:

The spectrum converter is arranged close to the packaging adhesive; or alternatively

And setting a set distance between the spectrum converter and the packaging adhesive.

5. The method of claim 4, wherein the excitation light is emitted from the LED chip and then directly irradiated to the spectral converter when the spectral converter is disposed proximate to the encapsulation compound.

6. The method of claim 4, wherein the excitation light is transmitted by a set distance and then irradiated to the spectrum converter when the spectrum converter has the set distance from the encapsulation.

7. The method of claim 1, wherein the LED chip and the spectral converter are both packaged in an LED device or module.

8. The method according to claim 7, wherein the package is an SMD package or a COB package or a CSP type package;

9. The method according to any one of claims 1-8, wherein the method is applicable to any one of heaters, bathroom heater products, automatic drying hangers, mildew-proof wardrobe lamps, and drying devices or modules in the food and pharmaceutical industry.

10. An LED heating device, comprising:

a spectrum converter arranged around the LED chip and configured to emit infrared rays with a wavelength of 1400-2000nm when excited by the excitation light, wherein the infrared rays are heating light rays with high capability of converting unit power density into thermal effects on a human body; and

The packaging adhesive is configured to package the LED chip and is arranged at a position close to the LED chip; wherein the method comprises the steps of

The spectrum converter is arranged around the packaging adhesive.

11. The apparatus of claim 10, wherein the spectral converter comprises at least one of: can be stimulated to generate fluorescent material particles, sol, fluorescent film and coating material with the wavelength of 1400-2000 nm.

12. The device of claim 10, wherein the encapsulation glue comprises a silicone or epoxy.

13. The apparatus of claim 10, wherein the device comprises a plurality of sensors,

The spectrum converter is closely attached to the packaging adhesive; or a set distance is arranged between the packaging adhesive and the packaging adhesive.

14. The device of claim 10, wherein the LED chip is connected to a driving power source through a metal wire, wherein the metal wire comprises any one of gold wire, silver wire, alloy wire, and copper wire.

15. The apparatus of claim 14, wherein the device comprises a plurality of sensors,

The LED chip is of a vertical structure, and the metal wire is only one;

the LED chip is a flip chip structure, and the metal wires are not present.

16. The apparatus of claim 10, wherein the apparatus is packaged in an LED device or module.

17. The apparatus according to any one of claims 10-16, wherein the apparatus is adapted for use in any one of the following: warmer, bathroom heater product, automatic drying clothes hanger, mould proof wardrobe lamp, stoving drying device or module of food and medicine trade.

18. An LED heating assembly having the LED heating device of any of claims 10-17 packaged therein, further comprising: and a housing encapsulating the LED heating device, wherein the housing comprises a bracket or a substrate.

19. A bathroom warmer having the LED heating assembly of claim 18 encapsulated therein.

20. A warmer, wherein the LED heating assembly of claim 18 is packaged.