CN108165943A - TiB with structure gradient2The preparation method of coating - Google Patents
TiB with structure gradient2The preparation method of coating Download PDFInfo
- Publication number
- CN108165943A CN108165943A CN201810065436.7A CN201810065436A CN108165943A CN 108165943 A CN108165943 A CN 108165943A CN 201810065436 A CN201810065436 A CN 201810065436A CN 108165943 A CN108165943 A CN 108165943A
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- 239000011248 coating agent Substances 0.000 title claims abstract description 44
- 238000000576 coating method Methods 0.000 title claims abstract description 44
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 229910033181 TiB2 Inorganic materials 0.000 claims abstract description 64
- 239000010410 layer Substances 0.000 claims abstract description 58
- 238000000151 deposition Methods 0.000 claims abstract description 22
- 239000002346 layers by function Substances 0.000 claims abstract description 10
- 239000007789 gas Substances 0.000 claims abstract description 9
- 238000004544 sputter deposition Methods 0.000 claims abstract description 9
- 238000007733 ion plating Methods 0.000 claims abstract description 8
- 239000000919 ceramic Substances 0.000 claims abstract description 7
- 239000011261 inert gas Substances 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 abstract description 20
- 230000008569 process Effects 0.000 abstract description 8
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 3
- 229910010060 TiBN Inorganic materials 0.000 description 12
- 238000010849 ion bombardment Methods 0.000 description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 11
- 239000010936 titanium Substances 0.000 description 11
- 239000002131 composite material Substances 0.000 description 8
- 239000012528 membrane Substances 0.000 description 8
- 238000004140 cleaning Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000007667 floating Methods 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000012495 reaction gas Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000004062 sedimentation Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- -1 ferrous metals Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
- C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/027—Graded interfaces
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/067—Borides
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention discloses the TiB with structure gradient2The preparation method of coating, using magnetic controlled sputtering ion plating method, with TiB2Ceramic target is cathode, using inert gas as working gas, vacuum cavity ground connection；First, positive bias, the depositing Ti B on workpiece are applied to workpiece2Layer, i.e. TiB2Adhesion layer；Then, positive bias and back bias voltage are alternately applied to workpiece by predeterminated frequency, in TiB2Continue depositing Ti B on adhesion layer2Layer, i.e. TiB2Gradient layer；Finally, back bias voltage is applied to workpiece, in TiB2Continue depositing Ti B on gradient layer2Layer, i.e. TiB2Functional layer.Present invention process simplifies, and has better technology stability and less process time；The prepared TiB with gradient-structure2Coating has more preferably film base adhesive force and stronger deposits loading capability.
Description
Technical field
The invention belongs to technical field of vacuum plating more particularly to structure gradient TiB2The preparation method of coating.
Background technology
Known TiB2Coating has high rigidity and low adherency tendency, TiB2The hard alloy cutter of coating particularly suitable for copper,
The machining of the non-ferrous metals such as aluminium, titanium and its alloy.Known TiB2Coating has the thermal expansion different from cemented carbide base material
Coefficient and Bulk modulus, therefore film base interface can form residual stress.
TiB2The hard alloy cutter of coating may cause film base point during the cutting process because bearing cutting heat and load
From so as to cause coating failure.And using TiN/TiBN/TiB2The TiB of gradient-structure2Composite multi-layer membrane coat, have TiN and
TiBN stress-buffer layers have than individual layer TiB2The stronger bearing capacity of coating, therefore also there is longer coating useful life.
TiB2Typically under Ar gas vacuum environment, TiB is deposited by magnetically controlled sputter method2Ceramic target obtains.And it wants
TiN/TiBN adhesion layers are obtained, then metal titanium targets and reaction gas N need to be introduced in magnetic control sputtering device2, increase preparation work
The complexity of skill, technique are difficult to control.
Invention content
The object of the present invention is to provide the TiB with structure gradient2The preparation method of coating, preparation process simple and stable and
Efficiently, prepared TiB2Coating has good film base adhesive force and deposits loading capability.
The present invention has the TiB of structure gradient2The preparation method of coating, using magnetic controlled sputtering ion plating method, with TiB2Ceramics
Target is cathode, using inert gas as working gas, vacuum cavity ground connection；
First, positive bias, the depositing Ti B on workpiece are applied to workpiece2Layer, i.e. TiB2Adhesion layer；
Then, positive bias and back bias voltage are alternately applied to workpiece by predeterminated frequency, in TiB2Continue depositing Ti B on adhesion layer2
Layer, i.e. TiB2Gradient layer；
Finally, back bias voltage is applied to workpiece, in TiB2Continue depositing Ti B on gradient layer2Layer, i.e. TiB2Functional layer.
As a kind of specific embodiment, the workpiece connects DC bias power by contactor, and contactor is also connected with
Programmable logic controller (PLC), by PLC controls contactor, so as to control the output stage of DC bias power
Property.
As another specific embodiment, the workpiece connects bipolar pulse grid bias power supply, by adjusting bipolar pulse
The duty ratio of grid bias power supply output controls bias output polarity；
Depositing Ti B2During adhesion layer, control duty ratio is less than 50%；
Depositing Ti B2During gradient layer, alternately control duty ratio from progressively increased to less than 50% be more than 50%, from more than
50% is gradually reduced to less than 50%；
Depositing Ti B2During functional layer, control duty ratio is more than 50%.
Magnetic controlled sputtering ion plating method is a kind of conventional TiB2Coating production, principle are：Working gas uses Ar
Gas, cathode target use TiB2Ceramic target, applies workpiece surface back bias voltage, and working gas is used for lighting TiB2Ceramic target surface
Neighbouring plasma obtains Ar ions；Ar ion bombardments TiB2Ceramic target, TiB2It evaporates and is deposited in workpiece surface, obtained
TiB2Coating.Apply back bias voltage in workpiece surface, attract the deposited TiB of Ar ion bombardments in plasma2Coating can be carved
Eating away combines loose TiB2Coating, to tamp coating.In addition, Ar ion bombardments can also be to TiB2Coating introduces distortion of lattice, shape
Into stress.Therefore, traditional TiB2Coating has the problem of film base interface residual stress is big.
In ion bombardment, the workpiece surface in plasma can generate the floating potential of -10V~-50V, ion
The bias applied on workpiece in depositing process should be higher than that floating potential, and the bias output less than floating potential can be because in grid bias power supply
The reversed cut-off characteristics of power device and fail.Therefore, it is difficult to obtain the coating of low stress using ion plating method.Ion electroplating method
It needs to apply the back bias voltage not less than floating potential on workpiece, the effect of back bias voltage is compacting coating, but necessarily lead to remnants
The negative interaction of compression.
It is different from traditional magnetic controlled sputtering ion plating technique, it is contemplated that the difference of electronics and ion motion speed, the present invention
Positive bias then is applied to workpiece, bombards workpiece surface to attract the electronics in plasma.Since electronics has the matter of very little
Amount, electron bombardment is mainly an energy transfer process, and ion bombardment is mainly a momentum transfer process.Electron bombardment phase
When in doing primary annealing to coating surface layer, high surface temperature promotes atomic migration, eliminates atom vacancy and distortion of lattice etc.
Defect, so as to reduce internal stress.Therefore, there is low internal stress and relatively low hard using the coating that electron bombardment obtains
Degree using it as the adhesion layer combined with substrate, will have more preferably film base adhesive force.
Compared to the prior art, the present invention has following features and advantageous effect：
(1) being different from traditional has TiN/TiBN/TiB2The TiB of gradient-structure2Composite multi-layer membrane coat, present invention tool
There is the TiB of gradient-structure2Coating composition is single, woth no need to be re-introduced into metal titanium targets and reaction gas in magnetic control sputtering device, because
This preparation process simplifies, and with better technology stability and less process time.
(2) it is different from traditional TiB2Coating, the present invention have the TiB of gradient-structure2Although coating ingredient is single, by
In each layer hardness difference, there is gradient-structure, in addition TiB2Adhesion layer has relatively low internal stress and hardness, therefore, the present invention
TiB2Coating has more preferably film base adhesive force and stronger deposits loading capability.
Description of the drawings
Fig. 1 is traditional TiN/TiBN/TiB2The structure diagram of composite multi-layer membrane coat；
Fig. 2 is TiB of the present invention2The structure diagram of coating；
Fig. 3 is traditional TiN/TiBN/TiB2Composite multi-layer membrane coat prepares the structure diagram for using equipment；
Fig. 4 is TiB of the present invention2Coating prepares the structure diagram for using equipment.
In figure, 1- substrates, 2-TiN/TiBN/TiB2Composite multi-layer membrane coat, 201-TiN layers, 202-TiBN layers, 203-
TiB2Layer, 3-TiB2Coating, 301-TiB2Adhesion layer, 302-TiB2Gradient layer, 303-TiB2Functional layer, 4- vacuum cavities, 5- rotations
Turn work rest, 6-Ti targets, 7-TiB2Target, 8-Ti target power supplies, 9-TiB2Target power supply, 10- DC bias powers, 11- bipolar pulses are inclined
Voltage source.
Specific embodiment
In order to illustrate the embodiments of the present invention more clearly and/or technical solution of the prior art, attached drawing will be compareed below
Illustrate the specific embodiment of the present invention.It should be evident that the accompanying drawings in the following description is only the embodiment of the present invention, for
For those of ordinary skill in the art, without creative efforts, other are can also be obtained according to these attached drawings
Attached drawing, and obtain other embodiments.
Conventional magnetic controlled sputtering ion plating technique is to apply back bias voltage on workpiece, attracts ion bombardment workpiece.Shown in Fig. 1
For the TiN/TiBN/TiB prepared using conventional magnetron plasma sputter depositing process2The structure of composite multi-layer membrane coat is traditional
TiN/TiBN/TiB2Composite multi-layer membrane coat 2 has TiN/TiBN/TiB2Gradient-structure, in TiB2It is set between layer 203 and substrate 1
There are stress-buffer layer, i.e. TiN layer 201 and TiBN layers 202.Used by Fig. 3 show conventional magnetic controlled sputtering ion plating technique
Equipment prepares TiN/TiBN/TiB2During composite multi-layer membrane coat 2, vacuum cavity 4 is grounded；Ti targets 6 connect the negative of Ti target power supplies 8
Pole, TiB2Target 7 connects TiB2The cathode of target power supply 9, rotational workpieces frame 5 connect the cathode of DC bias power 10, and workpiece is placed in rotation
Turn on work rest 5.Prepare TiB2During layer 203, under Ar gas vacuum environment, TiB is deposited2Target 7 obtains TiB2Layer 203；Preparing should
During power buffer layer, reaction gas N is introduced2, vapor deposition Ti targets 6.
The ion bombardment being different from conventional magnetron plasma sputter depositing process, the method is mainly characterized in that being banged using electronics
It hits, more particularly, first, the adhesion layer of low internal stress is prepared using electron bombardment；Then, alternately using electron bombardment and from
Sub- bombardment prepares gradient layer；Finally, functional layer is prepared using ion bombardment.Due to being related to cutting for electron bombardment and ion bombardment
It changes, according to DC bias power, during ion bombardment, the cathode of DC bias power need to be connected workpiece, DC bias power
Anode connection vacuum cavity；During electron bombardment, the anode of DC bias power need to be connected to workpiece, DC bias power is born
Pole connects vacuum cavity.
When it is implemented, the contactor of PLC (programmable logic controller (PLC)) controls can be used to realize that grid bias power supply exports
Bipolar pulse grid bias power supply can also be used to realize the alternating of power supply output polarity in the alternating of polarity.Using bipolar pulse power supply
Realize that the principle that the alternating of power supply output polarity changes is：Power supply output stage is controlled by adjusting the duty ratio of power supply output
Property.Duty ratio accounts for the ratio of pulse period for the negative pulse duration, and when duty ratio is more than 50%, negative pulse is dominant, to work
Part carries out ion bombardment；When duty ratio is less than 50%, the positive pulse time is long, and electron bombardment is carried out to workpiece.Therefore, coating mistake
Cheng Zhong only need to adjust duty ratio i.e. controllable power output polarity, so as to fulfill electron bombardment and the alternate transition of ion bombardment.
The embodiment of the present invention is provided below, which realizes power supply output polarity using bipolar pulse grid bias power supply
Alternately change.The present embodiment prepares the TiB with structure gradient using equipment shown in Fig. 42Coating prepares TiB2During coating, vacuum
Cavity 4 is grounded, and Ti targets 6 connect the cathode of Ti target power supplies 8, and rotational workpieces frame 5 connects bipolar pulse grid bias power supply 11, and workpiece is placed in
On rotational workpieces frame 5.
Specific process step is as follows：
(1) preparation：
Cleaning workpiece, the workpiece after cleaning are installed on rotational workpieces frame 5, check Ti target power supplies 8 and bipolar pulse bias
The insulating properties of power supply 11 and vacuum cavity 4 closes vacuum chamber door.
(2) to heating and vacuumizing in vacuum chamber：
Vacuum pump is opened, vacuum chamber is vacuumized 1 hour~2 hours, air pressure in vacuum chamber is made to be less than 5.0 × 10-3Pa；Together
When, to being heated in vacuum chamber, vacuum cavity temperature is made to reach 450 degree.
(3) plasma cleaning：
450 degree of vacuum cavity temperature is maintained, it is 1 that volume ratio is filled with into vacuum chamber：The mixed gas of 1 Ar and Kr, directly
Vacuum degree reaches 0.3Pa in vacuum chamber.Bipolar pulse grid bias power supply 11 is opened, plasma is lighted and plasma is carried out to workpiece
Cleaning.
The related process parameters of plasma cleaning are：Bias voltage 800V, duty ratio 80%, frequency 100KHZ, during cleaning
Between 30 minutes.
(4) depositing Ti B2Adhesion layer：
It is filled with the Ar gases of 250sccm in vacuum chamber, adjusts in vacuum chamber air pressure to 0.35Pa, open shielding power supply, and
It is 10KW by power setting, the bias voltage of bipolar pulse grid bias power supply 11 is set to 100V, and bipolar pulse grid bias power supply 11 accounts for
Empty ratio 20%, sedimentation time are 10 minutes.
(5) depositing Ti B2Gradient layer：
Maintain other technological parameters in step (4) constant, by the duty ratio of bipolar pulse grid bias power supply 11 from 20% gradually
It adjusts to 80%, sedimentation time is 30 minutes, obtains TiB2Gradient layer.
(6) depositing Ti B2Functional layer：
It maintains other technological parameters in step (4) constant, but the duty ratio of bipolar pulse grid bias power supply 11 is made to be 80%, sink
Product 150 minutes obtains TiB2Functional layer.
(7) performance detection：
Technique terminates, and obtains being sequentially depositing TiB in substrate 12Adhesion layer 301, TiB2Gradient layer 302, TiB2Functional layer 303
TiB2Coating, as shown in Figure 2.Gained TiB is tested using nanoindenter2The hardness of coating, using ball hole method test gained
TiB2The thickness of coating tests gained TiB using Lip river formula indentation method2The coating adhesion of coating, gained hardness, thickness, coating are attached
Put forth effort be respectively：15Gpa~30Gpa, 1.5 μm~3.5 μm, HF1~HF2.
Above-described embodiment be used for illustrate the present invention rather than limit the invention, the present invention spirit and
In scope of the claims, any modifications and changes are made to the present invention, both fall within protection scope of the present invention.
Claims (3)
1. the TiB with structure gradient2The preparation method of coating, using magnetic controlled sputtering ion plating method, it is characterized in that：
With TiB2Ceramic target is cathode, using inert gas as working gas, vacuum cavity ground connection；
First, positive bias, the depositing Ti B on workpiece are applied to workpiece2Layer, i.e. TiB2Adhesion layer；
Then, positive bias and back bias voltage are alternately applied to workpiece by predeterminated frequency, in TiB2Continue depositing Ti B on adhesion layer2Layer,
That is TiB2Gradient layer；
Finally, back bias voltage is applied to workpiece, in TiB2Continue depositing Ti B on gradient layer2Layer, i.e. TiB2Functional layer.
2. there is the TiB of structure gradient as described in claim 12The preparation method of coating, it is characterized in that：
The workpiece connects DC bias power by contactor, and contactor is also connected with programmable logic controller (PLC), by that can compile
Journey logic controller control contactor, so as to control the output polarity of DC bias power.
3. there is the TiB of structure gradient as described in claim 12The preparation method of coating, it is characterized in that：
The workpiece connects bipolar pulse grid bias power supply, is controlled partially by adjusting the duty ratio of bipolar pulse grid bias power supply output
Press output polarity；
Depositing Ti B2During adhesion layer, control duty ratio is less than 50%；
Depositing Ti B2During gradient layer, alternately control duty ratio from progressively increased to less than 50% be more than 50%, from more than 50% gradually
It is reduced to less than 50%；
Depositing Ti B2During functional layer, control duty ratio is more than 50%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810065436.7A CN108165943B (en) | 2018-01-23 | 2018-01-23 | TiB with structural gradient2Method for producing a coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810065436.7A CN108165943B (en) | 2018-01-23 | 2018-01-23 | TiB with structural gradient2Method for producing a coating |
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| Publication Number | Publication Date |
|---|---|
| CN108165943A true CN108165943A (en) | 2018-06-15 |
| CN108165943B CN108165943B (en) | 2020-03-10 |
Family
ID=62515801
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| CN201810065436.7A Active CN108165943B (en) | 2018-01-23 | 2018-01-23 | TiB with structural gradient2Method for producing a coating |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113249689A (en) * | 2021-05-12 | 2021-08-13 | 东莞市华升真空镀膜科技有限公司 | Workpiece coating and preparation method and application thereof |
| CN114592166A (en) * | 2022-03-16 | 2022-06-07 | 株洲钻石切削刀具股份有限公司 | Hard coating cutter containing gradient composite structure and preparation method thereof |
| CN115612984A (en) * | 2022-09-09 | 2023-01-17 | 中国科学院金属研究所 | Titanium diboride coating with stress and structural gradient and preparation method thereof |
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| WO2014105239A1 (en) * | 2012-09-28 | 2014-07-03 | Babcock & Wilcox Technical Services Y-12, L.L.C. | Hardface coating systems and methods for metal alloys and other materials for wear and corrosion resistant applications |
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| WO2014105239A1 (en) * | 2012-09-28 | 2014-07-03 | Babcock & Wilcox Technical Services Y-12, L.L.C. | Hardface coating systems and methods for metal alloys and other materials for wear and corrosion resistant applications |
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| Title |
|---|
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113249689A (en) * | 2021-05-12 | 2021-08-13 | 东莞市华升真空镀膜科技有限公司 | Workpiece coating and preparation method and application thereof |
| CN114592166A (en) * | 2022-03-16 | 2022-06-07 | 株洲钻石切削刀具股份有限公司 | Hard coating cutter containing gradient composite structure and preparation method thereof |
| CN114592166B (en) * | 2022-03-16 | 2023-09-15 | 株洲钻石切削刀具股份有限公司 | Hard coating cutter containing gradient composite structure and preparation method thereof |
| CN115612984A (en) * | 2022-09-09 | 2023-01-17 | 中国科学院金属研究所 | Titanium diboride coating with stress and structural gradient and preparation method thereof |
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| Publication number | Publication date |
|---|---|
| CN108165943B (en) | 2020-03-10 |
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