CN108165081B - Epoxy resin polymer daub and preparation method thereof - Google Patents
Epoxy resin polymer daub and preparation method thereof Download PDFInfo
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- CN108165081B CN108165081B CN201711455159.2A CN201711455159A CN108165081B CN 108165081 B CN108165081 B CN 108165081B CN 201711455159 A CN201711455159 A CN 201711455159A CN 108165081 B CN108165081 B CN 108165081B
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Abstract
The invention discloses an epoxy resin polymer daub and a preparation method thereof, and the technical scheme is that the epoxy resin polymer daub is prepared by mixing and modulating a composition A and a composition B, wherein the weight ratio of the composition A to the composition B is 1:0.8-1.2, the composition A comprises the following components in parts by weight: 100 parts of bisphenol A epoxy resin and 16-22 parts of silica powder; the composition B comprises the following components in parts by mass: 100 parts of curing agent and 8-11 parts of gel generating agent, wherein the curing agent is polyamine type alkaline curing agent, the gel generating agent is KOH and/or NaOH, the epoxy resin polymer cement can expand after being filled into a wall crack, so that the surface of the epoxy resin polymer cement is completely attached to the inner side surface of a building crack, the generation of gaps is avoided, and the service life of the filled crack is prolonged.
Description
Technical Field
The invention relates to building gap filling daub, in particular to epoxy resin polymer daub and a preparation method thereof.
Background
With the rapid development of economy in China, a large number of buildings are pulled out of the ground, but cracks are often generated on the walls of the buildings, so that the cracks are caused by a plurality of reasons, such as uneven settlement of foundations and irregular expansion of wall materials caused by temperature change.
The existing solution is to fill the crack with cement, and then polish the crack opening or paint cement or other coatings for leveling, so as to fill the crack. For example, the invention of China with the publication number CN101205129B discloses a two-component bisphenol A epoxy resin cement for building joint filling and a preparation method thereof, which discloses the two-component bisphenol A epoxy resin cement, the two-component bisphenol A epoxy resin cement is prepared by mixing a component A and a component B according to the weight ratio of 1:0.8-1.2, the component content of the component A is 80-120 parts of bisphenol A epoxy resin, 10-30 parts of active dilution toughening agent and 180 parts of talcum powder 160-containing-organic solvent, the component content of the component B is 25-35 parts of active dilution toughening agent, 40-50 parts of alicyclic amine curing agent and 215 parts of talcum powder 205-containing-organic solvent, the preparation method comprises the steps of respectively preparing the component A and the component B, and then stirring the component A and the component B by a three-roller machine or directly mixing the component A and the component B by hand to prepare the product. After the prepared cement is filled into the crack, the subsequent polishing or leveling work can be carried out only after the cement is completely cured.
The curing process of the daub has three states: the surface of the mortar is solidified into a gel state from viscous liquid, the surface of the mortar is solidified into a hardened state from gel on the surface of the mortar, and the inside of the mortar is solidified into a state with grinding strength, so the solidification is also called grinding solidification.
The epoxy resin daub for filling the cracks has the defects that the epoxy resin daub for filling the cracks has large viscosity and poor liquidity in order to prevent the epoxy resin daub from flowing out of the cracks when being filled into the cracks, and even after the epoxy resin daub is pressed and filled, the epoxy resin daub still cannot be filled in the deep part of the cracks or the inner surface of the cracks at the insufficient pressing and filling position of the epoxy resin daub, so that gaps still exist; the gaps can cause the bonding stability of the cured epoxy resin cement and the inner surfaces of the cracks to be reduced, the inner surfaces of the original cracks can expand or contract along with the temperature and deform under the action of external pressure, the gaps are enlarged or connected to finally form gaps communicated with the outside, water and air can enter the gaps to further enlarge the gaps to form new cracks, and the effective time of the filling effect of the epoxy resin cement is shortened.
Disclosure of Invention
The first purpose of the present invention is to provide an epoxy resin polymer mortar which can expand after being filled into a wall crack, so that the surface of the epoxy resin polymer mortar can be completely attached to the inner side surface of a building crack, thereby avoiding the generation of a gap and prolonging the service life of the filled crack.
The technical purpose of the invention is realized by the following technical scheme:
epoxy resin polymer daub which is prepared by mixing and blending component A and component B according to the mass ratio of 1:0.8-1.2,
the composition A comprises the following components in parts by mass: 100 parts of bisphenol A epoxy resin and 16-22 parts of silica powder;
the composition B comprises the following components in parts by mass: 100 parts of polyamine type alkaline curing agent and 8-11 parts of gel generating agent, wherein the gel generating agent is KOH and/or NaOH.
By adopting the technical scheme, the silicon micro powder particles are small, the silicon micro powder can be uniformly dispersed in the epoxy resin polymer cement prepared by mixing, the silicon micro powder can react with the gel generating agent, alkali-silicic acid gel is generated on the surfaces of the silicon micro powder particles, and the alkali-silicic acid gel can absorb water in the air to expand before the surface of the epoxy resin polymer cement is dried, so that the epoxy resin polymer cement expands outwards, the inner surface of a wall crack is pressed, the surfaces of the epoxy resin polymer cement and the inner side surface of a building crack are completely attached, gaps are avoided, the epoxy resin polymer cement is completely filled into the crack, and the service life of the crack after being filled is prolonged; the epoxy resin polymer cement before curing has good texture fluidity, if the cracks are filled with the expanded epoxy resin polymer cement, the expanded epoxy resin polymer cement will overflow the openings of the cracks after being continuously expanded, and the epoxy resin polymer cement overflowing the openings of the cracks can be ground or covered in leveling in the subsequent work of filling the cracks of the wall body, so that the work of filling the cracks is not influenced; the solidified alkali-silicic acid gel can improve the compressive strength of the epoxy resin polymer cement after solidification; the silica powder reacts with cement hydration products in the concrete on the inner surface of the building gap to generate gel, and the surface of the epoxy resin polymer daub and the inner side surface of the building gap are attached together to strengthen the fixation of the epoxy resin polymer daub and the building gap.
Preferably, when the composition A and the composition B are mixed, the mass ratio of the silica micropowder to the gel generating agent is 1.875 to 2.125.
By adopting the technical scheme, when the mass ratio of the silica powder to the gel generating agent is 1.875-2.125, the silica powder and the gel generating agent in fixed amount achieve the best expansion effect of the epoxy resin polymer cement.
Preferably, the polyamine-type basic curing agent is ketimine.
By adopting the technical scheme, the ketimine is prepared by condensation reaction of ketones (such as methyl ethyl ketone, methyl isopropyl ketone and methyl isobutyl ketone) and polyamine (such as diethylenetriamine, m-phenylenediamine, m-xylylenediamine, 1, 3-bis (aminomethyl) cyclohexane and the like), the reaction is reversible, and the ketimine generates reverse reaction after absorbing moisture, so that the polyamine is regenerated; the polyamine is dehydrated in an alkaline environment, and the dehydrated free water is absorbed by the gel and converted into the bonding water, so that the water in the air is conducted to the interior of the epoxy resin polymer cement, and the expansion of the epoxy resin polymer cement in the wall gap is accelerated; meanwhile, the ketimine absorbs the polyamine curable epoxy resin generated by moisture to prevent the alkali-silicic acid gel from absorbing water to wet the epoxy resin polymer daub, so that the curing and curing time is too long.
Preferably, the composition B also comprises 10-15 parts of polyether amine.
By adopting the technical scheme, the polyether amine can be used as a curing accelerator to reduce the curing time, simultaneously reduce the viscosity of the cement, facilitate the cement to be poured into cracks of a wall body and flow in the cracks of the wall body, improve the proportion of the surface drying time of the epoxy resin polymer cement in the time required by the complete curing of the epoxy resin polymer cement, increase the water absorption time and the water absorption capacity of the alkali-silicic acid gel, and improve the volume expansion rate of the epoxy resin polymer cement after the complete curing.
Preferably, the composition A and the composition B also comprise 10-15 parts of dodecyl and tetradecyl glycidyl ether.
By adopting the technical scheme, the volume expansion rate of the epoxy resin polymer cement is high before the surface drying state, the volume expansion rate is obviously reduced after the surface drying, dodecyl and tetradecyl glycidyl ether with epoxy bonds does not generally react with epoxy resin, and the dodecyl and tetradecyl glycidyl ether is used as an active diluting toughening agent to dilute the epoxy resin and a curing agent, can participate in the curing direction of the epoxy resin and becomes a part of a cross-linked network structure of an epoxy resin condensate, so that the toughness of the epoxy resin polymer cement is improved, and cracks are prevented from being generated in the epoxy resin polymer cement when the epoxy resin polymer cement expands in an initial setting state.
Preferably, the mesh number of the silicon micro powder is 1000-1250 meshes.
By adopting the technical scheme, the granularity of the silicon micro powder has influence on the volume expansion rate of the epoxy resin polymer daub, the silicon micro powder has small granularity and large specific surface area, more alkali-silicic acid gel is generated in the curing time, the expansion of the epoxy resin polymer daub is facilitated, and the granularity range of the silicon micro powder is 1250 meshes in consideration of economic benefit.
It is a second object of the present invention to provide a method for producing an epoxy resin polymer cement, which can increase the volume expansion rate of the epoxy resin polymer cement.
The technical purpose of the invention is realized by the following technical scheme:
a method for preparing epoxy resin polymer daub comprises the following steps:
preparation of S1 composition a: adding bisphenol A type epoxy resin, silicon micro powder and other components into a stirrer according to the mass part ratio, stirring for 10-12 minutes, and uniformly stirring to obtain a component A;
preparation of S2 composition B: adding the polyamine alkaline curing agent, the gel generating agent and other components into another stirrer according to the mass part ratio, stirring for 10-12 minutes, and uniformly stirring to obtain a composition B;
s3 hybrid configuration: weighing the component A and the component B according to the mass ratio of the amount of the epoxy resin polymer cement needed for filling the crack, adding the component A into a stirrer to stir for 3-5 minutes at the rotating speed of 50-60r/min, then adding the component B, and stirring and mixing uniformly to obtain the epoxy resin polymer cement.
By adopting the technical scheme, the epoxy resin polymer daub is prepared and used on site as far as possible, the phenomenon that the time is too long after preparation is avoided, the second solidification is avoided, the dispersion state of the silicon powder particles in the composition A changes from uniform dispersion to aggregation state in the long-term standing process, the stirring is carried out before the composition B is added to restore the uniform dispersion state of the silicon powder, the silicon powder particles in the aggregation state are avoided after the limited mixing and stirring time of the composition A and the composition B, the alkali-silicate system gel formed in the daub has large size difference and uneven dispersion, and the expansion rate of the epoxy resin polymer daub is reduced.
Preferably, the S3 mixing configuration is that component A is heated before component B is added, and then component B is added and the heating temperature is kept for stirring, wherein the heating temperature is 55-60 ℃.
By adopting the technical scheme, the heating and stirring are used when the component A and the component B are mixed in the S3 mixing configuration, the volume expansion rate of the completely cured epoxy resin polymer cement can be improved, the curing time can be shortened, the waiting time required by subsequent polishing or leveling work is reduced, the efficiency is improved, and the heating temperature is preferably 50-60 ℃.
Preferably, when the composition A and the composition B are heated and stirred in the S3 mixing configuration, the stirring speed is 100-110r/min, and the stirring time is 4-5 minutes.
By adopting the technical scheme, when the component A and the component B in the S3 mixing configuration are heated and stirred, the stirring speed is 100-110r/min, and the stirring time is 4-5 minutes, so that the volume expansion rate of the epoxy resin polymer cement after being completely cured can be improved, and meanwhile, the problems that the stirring time is too long, and the epoxy resin polymer cement is not convenient to fill cracks due to initial setting are avoided.
In conclusion, the invention has the following beneficial effects:
the technical purpose of the invention is realized by the following technical scheme:
1. the epoxy resin polymer cement prepared by mixing the silicon micropowder is uniformly dispersed, reacts with a gel generating agent and generates alkali-silicic acid gel on the surface of silicon micropowder particles, the alkali-silicic acid gel can absorb water in the air to expand before the surface of the epoxy resin polymer cement is dried, so that the epoxy resin polymer cement expands outwards to apply pressure to the inner surface of a wall crack, the surface of the epoxy resin polymer cement is completely attached to the inner side surface of a building crack, gaps are avoided, the epoxy resin polymer cement is completely filled into the crack, and the service life of the crack after being filled is prolonged;
2. the solidified alkali-silicic acid gel can improve the compressive strength of the epoxy resin polymer cement after solidification;
3. the silica powder reacts with cement hydration products in the concrete on the inner surface of the building gap to generate gel, and the surface of the epoxy resin polymer daub and the inner side surface of the building gap are attached together to strengthen the fixation of the epoxy resin polymer daub and the building gap.
4. The ketimine is used as a curing agent, so that water in the air can be conducted into the epoxy resin polymer cement, and the expansion of the epoxy resin polymer cement in the wall gap is accelerated;
5. the component B also comprises polyether amine, so that the proportion of the time required by surface drying of the epoxy resin polymer cement to the time required by complete curing of the epoxy resin polymer cement is improved, the absorption amount of alkali-silicic acid gel is increased, and the volume expansion rate of the epoxy resin polymer cement after complete curing is improved;
6. provides a method for manufacturing epoxy resin polymer clay, which can improve the volume expansion rate of the epoxy resin polymer clay;
7. the volume expansion rate of the epoxy resin polymer cement after complete curing can be improved by heating and stirring when the component A and the component B are prepared in a mixed configuration, the curing time can be shortened, the waiting time for subsequent polishing or leveling work is reduced, and the efficiency is improved.
Drawings
FIG. 1 is a data plot of the results of example A5;
FIG. 2 is a data diagram of the results of example A6.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
The epoxy resin polymer daub is prepared by mixing and modulating a component A and a component B according to the mass ratio of 1:0.8-1.2, wherein the component A comprises the following components in parts by mass: 100 parts of bisphenol A epoxy resin and 16-22 parts of silica powder; the composition B comprises the following components in parts by mass: 100 parts of polyamine type alkaline curing agent and 8-11 parts of gel generating agent, wherein the gel generating agent is KOH and/or NaOH.
The bisphenol A type epoxy resin is selected from E-44 (epoxy value: 0.41-0.47) or E-51 (epoxy value: 0.47-0.54) of ba ling petrochemical, which is bisphenol A type liquid epoxy resin.
The silicon micropowder is prepared from the silica micropowder of Anhui Yina high and new technology, Inc. (including 500 mesh, 800 mesh, 1000 mesh, 1250 mesh, 1500 mesh, 2000 mesh).
The ketimine is epoxy resin curing agent ketimine of Wuxi Qian Guanghong chemical industry raw materials Co. The main component is bis-N, N' - (methyl-butylmethylene) -diethylenetriamine which is a condensation product of diethylenetriamine and methyl isobutyl ketone, has the molecular weight of 267.45, is light yellow liquid, has ammonia smell and the viscosity of 25-30 mPa/s, and can be stably stored at room temperature.
The gel generator is KOH and/or NaOH, and is commercially available. Dodecyl and tetradecyl glycidyl ethers, having CAS number 68609-97-2, are commercially available.
In the case of the embodiment A1,
preparation of S1 composition a: adding 100 parts of bisphenol A type epoxy resin and 16 parts of silicon micropowder (granularity 1250 meshes) into a stirrer according to the mass part ratio, stirring for 10-12 minutes, and uniformly stirring to obtain a composition A;
preparation of S2 composition B: 100 parts of ketimine and 8 parts of gel generating agent (NaOH is selected) are added into another stirrer to be stirred for 10-12 minutes according to the mass parts, and the mixture is uniformly stirred to obtain a composition B;
s3 hybrid configuration: the mixture ratio of the component A and the component B is 1: 1 by weight, the component A and the component B are added into a stirrer, the stirring speed is 100r/min, and the epoxy resin polymer daub is obtained after stirring for 4-5 minutes.
Wherein the proportion of the component A and the component B is 1:0.8-1.2 by weight, which is convenient for on-site actual preparation and use and reduces calculation, and the proportion is 1: 1.
In the case of the embodiment A2,
preparation of S1 composition a: adding 100 parts of bisphenol A type epoxy resin and 16 parts of silicon micropowder (granularity 1250 meshes) into a stirrer according to the mass part ratio, stirring for 10-12 minutes, and uniformly stirring to obtain a composition A;
preparation of S2 composition B: 100 parts of ketimine and 8 parts of gel generating agent (KOH is selected) are added into another stirrer to be stirred for 10-12 minutes according to the mass parts, and the mixture is uniformly stirred to obtain a composition B;
s3 hybrid configuration: the mixture ratio of the component A and the component B is 1: 1 by weight, the component A and the component B are added into a stirrer, the stirring speed is 100r/min, and the epoxy resin polymer daub is obtained after stirring for 4-5 minutes.
In the case of the embodiment A3,
preparation of S1 composition a: adding 100 parts of bisphenol A type epoxy resin and 16 parts of silicon micropowder (granularity 1250 meshes) into a stirrer according to the mass part ratio, stirring for 10-12 minutes, and uniformly stirring to obtain a composition A;
preparation of S2 composition B: 100 parts of ketimine, 4 parts of NaOH and 4 parts of KOH are added into another stirrer to be stirred for 10-12 minutes according to the mass parts, and the mixture is uniformly stirred to obtain a composition B;
s3 hybrid configuration: the mixture ratio of the component A and the component B is 1: 1 by weight, the component A and the component B are added into a stirrer, the stirring speed is 100r/min, and the epoxy resin polymer daub is obtained after stirring for 4-5 minutes.
In a comparative example a4 which was,
preparation of S1 composition a: adding 100 parts of bisphenol A type epoxy resin and 16 parts of silicon micropowder (granularity 1250 meshes) into a stirrer according to the mass part ratio, stirring for 10-12 minutes, and uniformly stirring to obtain a composition A;
preparation of S2 composition B: adding 100 parts of ketimine into another stirrer, and stirring for 10-12 minutes to obtain a composition B contrast; s3 hybrid configuration: the mixture ratio of the composition A and the composition B is 1: 1 by weight, the composition A and the composition B are added into a stirrer, heated and stirred at the heating temperature of 80 ℃ and the stirring speed of 100r/min, and the epoxy resin polymer daub is obtained after stirring for 4-5 minutes.
The epoxy resin polymer cements obtained in examples a1 to A3 and comparative example a4 were subjected to a curing time experiment and a volume expansion rate experiment.
Curing time experiment: and pouring the prepared epoxy resin polymer cement into a plurality of cubic containers with openings at the upper parts, scraping off the epoxy resin polymer cement on the openings after each cubic container is filled, and putting into a constant-temperature and constant-humidity incubator. The temperature is controlled at 25 ℃, the humidity is controlled at 53-55%, and the fixed time is determined by simulating the indoor environment and sampling and detecting the curing degree of the indoor environment at regular time.
Volume expansion rate experiment: pouring the prepared epoxy resin polymer cement into a plurality of cubic containers with openings at the upper parts, scraping off the cement on the openings after each cubic container is filled, putting the cubic containers into a constant-temperature and constant-humidity incubator, controlling the temperature at 25 ℃ and the humidity at 53-55%, sampling at regular time to measure the volume expansion rate, wherein the volume expansion rate is the ratio of the volume change to the original volume, the original volume is the volume of the cubic container, and sampling is stopped until 4 hours after the epoxy resin polymer cement can be polished and cured.
The cure time test results data are given in the following table:
| example A1 | Example A1 | Example A3 | Comparative example A4 | |
| Initial setting time/ |
5 | 5 | 5 | 5 |
| Surface drying time/ |
12 | 12 | 12 | 12 |
| Grindable curing time/ |
20 | 20 | 20 | 20 |
Volume expansion ratio experimental results part of the data is as follows:
as can be seen from the above table, the fine silica powder reacts with OH provided by the gel generating agent-The reaction generates alkali-silicic acid gel on the surface of the silicon micropowder particles, the alkali-silicic acid gel can absorb water to expand, so that the epoxy resin polymer cement is expanded outwards, and the time for absorbing the expansion is mainly before the surface of the epoxy resin polymer cement is dried. Meanwhile, the gel generating agent can be selected from NaOH or KOH or a mixture of the NaOH and the KOH.
In the case of the embodiment A5,
a variable experiment was performed on the basis of example a1 and example a2, and volume expansion experiments were performed on a plurality of different amounts of added fine silica powder, with varying amounts of added fine silica powder in the preparation of S1 composition a. The experimental results are shown in figure 1.
As shown in the attached figure 1, the silica micropowder reacts with the gel generating agent to generate alkali-silicic acid gel on the surface of silica micropowder particles, the alkali-silicic acid gel can absorb water to expand before the epoxy resin polymer cement is cured, so that the epoxy resin polymer cement expands outwards, and the ratio of the added mass parts of the silica micropowder and the gel generating agent is preferably 1.875-2.125.
Example a 6:
a variation experiment was conducted on the basis of example A1, in which the amount of fine silica powder added in the preparation of composition A S1 was changed and a gel generator was added in a mass ratio of 2: 1. And carrying out volume expansion rate experiments of a plurality of groups of different addition amounts of the silicon micro powder. The experimental results are shown in figure 2.
As can be seen from the attached figure 2, the volume expansion rate of the silicon micropowder with the mass part exceeding 24 parts is reduced along with the increase of the mass part of the silicon micropowder because the humidity in the environment is limited and the water absorption capacity of the silicon micropowder before the epoxy resin polymer daub is cured is limited, so that the excessive mass part of the silicon micropowder is preferably 16-22 parts, and the mass part of the gel generator is preferably 8-11 parts
In the case of the embodiment A7,
variable experiments are carried out on the basis of the example A1, the particle size mesh number of the silicon powder in the preparation of the S1 composition A is changed, and the volume expansion rate experiments of the silicon powder with different particle sizes are carried out in a plurality of groups, and the experimental results are as follows:
as can be seen from the above table, the particle size of the silica powder has an influence on the volume expansion rate of the epoxy resin polymer cement of the composition A, the silica powder has a small particle size and a large specific surface area, the more alkali-silicic acid gel is generated in the curing time, the expansion of the epoxy resin polymer cement is facilitated, and the particle size of the silica powder is preferably 1000-1250 mesh in consideration of economic benefit.
In the case of the embodiment B1,
preparation of S1 composition a: adding 100 parts of bisphenol A type epoxy resin and 16 parts of silicon micropowder (granularity 1250 meshes) into a stirrer according to the mass part ratio, stirring for 10-12 minutes, and uniformly stirring to obtain a composition A;
preparation of S2 composition B: 100 parts of ketimine, 8 parts of gel generating agent (NaOH is selected) and 12 parts of polyether amine are mixed according to the mass parts and added into another stirrer to be stirred for 10-12 minutes, and the mixture is uniformly stirred to obtain a composition B;
s3 hybrid configuration: the mixture ratio of the component A and the component B is 1: 1 by weight, the component A and the component B are added into a stirrer, heated and stirred, the heating temperature is 80 ℃, the stirring speed is 100r/min, and the epoxy resin polymer daub is obtained after stirring for 4-5 minutes.
In the case of the embodiment B2,
preparation of S1 composition a: adding 100 parts of bisphenol A type epoxy resin, 16 parts of silicon micropowder (granularity 1250 meshes) and 12 parts of active diluent toughening agent into a stirrer according to the mass part ratio, stirring for 10-12 minutes, and uniformly stirring to obtain a component A;
preparation of S2 composition B: 100 parts of ketimine, 8 parts of gel generating agent (NaOH is selected) and 12 parts of active dilution toughening agent are added into another stirrer to be stirred for 10-12 minutes according to the mass parts, and the mixture is uniformly stirred to obtain a composition B;
s3 hybrid configuration: the mixture ratio of the component A and the component B is 1: 1 by weight, the component A and the component B are added into a stirrer, heated and stirred, the heating temperature is 80 ℃, the stirring speed is 100r/min, and the epoxy resin polymer daub is obtained after stirring for 4-5 minutes.
In the case of the embodiment B3,
preparation of S1 composition a: adding 100 parts of bisphenol A type epoxy resin, 16 parts of silicon micropowder (granularity 1250 meshes) and 12 parts of active diluent toughening agent into a stirrer according to the mass part ratio, stirring for 10-12 minutes, and uniformly stirring to obtain a component A;
preparation of S2 composition B: 100 parts of ketimine, 8 parts of gel generating agent (selected NaOH), 12 parts of polyether amine and 12 parts of active dilution toughening agent are mixed according to the mass parts and added into another stirrer to be stirred for 10-12 minutes, and the mixture is uniformly stirred to obtain a composition B;
s3 hybrid configuration: the mixture ratio of the component A and the component B is 1: 1 by weight, the component A and the component B are added into a stirrer, heated and stirred, the heating temperature is 80 ℃, the stirring speed is 100r/min, and the epoxy resin polymer daub is obtained after stirring for 4-5 minutes.
The epoxy resin polymer cements obtained from examples B1 to B3 were subjected to curing time and volume expansion rate experiments, the results of which are shown in the following table, where the volume expansion rate experiments are the volume expansion rates after complete curing.
In the case of the embodiment C1,
preparation of S1 composition a: adding 100 parts of bisphenol A type epoxy resin and 16 parts of silicon micropowder (with the granularity of 1250 meshes) into a stirrer according to the mass part ratio, stirring for 10-12 minutes, and uniformly stirring to obtain a composition A;
preparation of S2 composition B: 100 parts of ketimine and 8 parts of gel generating agent (NaOH is selected) are mixed according to the mass parts, added into another stirrer and stirred for 10-12 minutes, and the mixture is uniformly stirred to obtain a composition B;
s3 hybrid configuration: the mixture ratio of the component A and the component B is 1: 1 by weight, the component A is added into a stirrer and stirred for 3-5 minutes at the rotating speed of 50-60r/min, then the component B is added and stirred, the stirring speed is 100r/min, and the epoxy resin polymer daub is obtained after stirring for 4-5 minutes.
The epoxy polymer cement of example C1 was subjected to a volume expansion test, resulting in a volume expansion of 5.8%.
In the case of the embodiment C2,
in an improvement over example C1, the S3 mixing configuration was such that composition A was heated before addition of composition B and stirred after addition of composition B while maintaining the heating temperature. And (3) aiming at a plurality of groups of epoxy resin polymer daubs with different heating temperature values, carrying out curing time and volume expansion rate experiments, wherein the experiment results are shown in the following table, and the volume expansion rate experiment result is the volume expansion rate after complete curing.
As can be seen from the above table, the heating and stirring of the component a and the component B in the S3 mixing configuration can increase the volume expansion rate of the epoxy resin polymer cement after being completely cured, and simultaneously can shorten the curing time, reduce the waiting time required for the subsequent polishing or leveling work, and increase the efficiency, and the heating temperature is preferably 50-60 ℃.
In the case of the embodiment C3,
based on example C2, the volume expansion rate test was performed by selecting a heating temperature of 55 ℃ and using different stirring rates to obtain multiple sets of epoxy resin polymer cements when the composition A and the composition B in the S3 mixing configuration were heated and stirred, and the results are shown in the following table, where the results of the volume expansion rate test are the volume expansion rate after complete curing,
| stirring speed/r.min-1 | 90 | 95 | 100 | 105 | 110 | 115 |
| Volume expansion ratio/%) | 6 | 6.23 | 6.45 | 6.5 | 6.51 | 6.52 |
As can be seen from the above table, the stirring speed is preferably 100-110r/min when the composition A and the composition B in the S3 mixing configuration are heated and stirred.
In the case of the embodiment D1,
preparation of S1 composition a: adding 100 parts of bisphenol A type epoxy resin, 16 parts of silicon micropowder (granularity 1250 meshes) and 12 parts of active diluent toughening agent into a stirrer according to the mass part ratio, stirring for 10-12 minutes, and uniformly stirring to obtain a component A;
preparation of S2 composition B: 100 parts of ketimine, 8 parts of gel generating agent (selected NaOH), 12 parts of polyether amine and 12 parts of active dilution toughening agent are mixed according to the mass parts and added into another stirrer to be stirred for 10-12 minutes, and the mixture is uniformly stirred to obtain a composition B;
s3 hybrid configuration: the component A and the component B are weighed according to the weight ratio of 1: 1, the component A is added into a stirrer and stirred for 3-5 minutes at the rotating speed of 50-60r/min, the mixture is heated to 55 ℃ after being stirred, the component B is added, the heating temperature is kept unchanged, the stirring speed is 100r/min, and the epoxy resin polymer daub is obtained after stirring for 4-5 minutes.
The epoxy resin polymer cement prepared in example D1 was subjected to a volume expansion test, and the volume expansion after complete curing was 8.3%.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications of the present embodiment without inventive contribution as needed after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present invention.
Claims (7)
1. The epoxy resin polymer daub is characterized by being prepared by mixing a component A and a component B according to the mass ratio of 1:0.8-1.2,
the composition A comprises the following components in parts by mass: 100 parts of bisphenol A epoxy resin and 16-22 parts of silica powder;
the composition B comprises the following components in parts by mass: 100 parts of polyamine type alkaline curing agent, wherein the polyamine type alkaline curing agent is ketimine, 8-11 parts of gel generating agent is KOH and/or NaOH;
when the composition A and the composition B are mixed, the mass ratio of the silicon micropowder to the gel generating agent is 1.875-2.125;
the polyamine alkaline curing agent is ketimine.
2. The epoxy polymer cement of claim 1 wherein composition B further comprises 10-15 parts of a polyetheramine.
3. The epoxy polymer cement of claim 1, wherein each of composition a and composition B further comprises 10-15 parts of dodecyl and tetradecyl glycidyl ether.
4. The epoxy resin polymer cement according to claim 1, wherein the mesh number of the silica micropowder is 1000-1250 mesh.
5. The method of making an epoxy polymer cement according to any one of claims 1 to 4, comprising the steps of:
preparation of S1 composition a: adding bisphenol A type epoxy resin, silicon micro powder and other components into a stirrer according to the mass part ratio, stirring for 10-12 minutes, and uniformly stirring to obtain a component A;
preparation of S2 composition B: adding the polyamine alkaline curing agent, the gel generating agent and other components into another stirrer according to the mass part ratio, stirring for 10-12 minutes, and uniformly stirring to obtain a composition B;
s3 hybrid configuration: weighing the component A and the component B according to the mass ratio of the amount of the epoxy resin polymer cement needed for filling the crack, adding the component A into a stirrer to stir for 3-5 minutes at the rotating speed of 50-60r/min, then adding the component B, and stirring and mixing uniformly to obtain the epoxy resin polymer cement.
6. The method of claim 5, wherein the S3 mixing configuration includes heating component A before adding component B, and then adding component B while stirring while maintaining the heating temperature, the heating temperature being 55-60 ℃.
7. The method for preparing epoxy resin polymer daub as claimed in claim 6, wherein the stirring speed of the stirring is 100-110r/min and the stirring time is 4-5 min when the composition A and the composition B are heated and stirred in the S3 mixing configuration.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101367637A (en) * | 2007-08-13 | 2009-02-18 | 江西铜业集团公司 | Method of preparing composite material |
| CN102674376A (en) * | 2012-04-19 | 2012-09-19 | 田辉明 | Production method of quartz tailing purification |
| CN105885759A (en) * | 2016-04-07 | 2016-08-24 | 主义 | Epoxy resin polymer daub and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101367637A (en) * | 2007-08-13 | 2009-02-18 | 江西铜业集团公司 | Method of preparing composite material |
| CN102674376A (en) * | 2012-04-19 | 2012-09-19 | 田辉明 | Production method of quartz tailing purification |
| CN105885759A (en) * | 2016-04-07 | 2016-08-24 | 主义 | Epoxy resin polymer daub and preparation method thereof |
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