CN108165081A - Epoxide resin polymer clay and preparation method thereof - Google Patents
Epoxide resin polymer clay and preparation method thereof Download PDFInfo
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- CN108165081A CN108165081A CN201711455159.2A CN201711455159A CN108165081A CN 108165081 A CN108165081 A CN 108165081A CN 201711455159 A CN201711455159 A CN 201711455159A CN 108165081 A CN108165081 A CN 108165081A
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/34—Filling pastes
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Abstract
The invention discloses a kind of epoxide resin polymer clay and preparation method thereof, its key points of the technical solution are that a kind of epoxide resin polymer clay, is formed by forming A and forming B hybrid modulations, the proportioning of the composition A and composition B are calculated as 1 by weight:0.8 1.2, the composition A includes following component, and the proportioning of each component is measured according to the mass fraction:100 parts of bisphenol A type epoxy resin, 16 22 parts of silicon powder;The composition B includes following component, and the proportioning of each component is measured according to the mass fraction:100 parts of curing agent, 8 11 parts of gel propellant, wherein curing agent is Polyamine Type alkaline species curing agent, gel propellant is KOH and/or NaOH, having reached epoxide resin polymer clay after inserting wall body slit can expand, the surface and building gap inner surface for making epoxide resin polymer clay are bonded completely, are avoided generating gap, are improved the service life after crack is filled up.
Description
Technical field
The present invention relates to building gaps to fill up clay, more particularly to epoxide resin polymer clay and preparation method thereof.
Background technology
With China's rapid economic development, large amount of building is rised sheer from level ground, but building masonry wall often has crack generation, makes
The reason of such case there are many, for example the variation of uneven settlement of foundation, temperature causes the irregular expansion of materials for wall.
Existing solution uses clay filling cracks, then fracture opening to polish or looked for clay or other coating materials
It is flat, with this filling cracks.Such as Chinese invention " the building joint filling bi-component bisphenol A type ring that notification number is CN101205129B
Oxygen resin-bonded mastic and preparation method thereof ", it discloses a kind of bi-component bisphenol A type epoxy resin clay, through first component and second
Component hybrid modulation forms, mixing match by weight 1: 0.8-1.2, and the constituent content of first component is calculated by weight as double
Phenol A type epoxy resin 80-120, activity dilution toughener 10-30, talcum powder 160-180, the constituent content of second component is activity
Dilute toughener 25-35, alicyclic ring amine hardener 40-50, talcum powder 205-215, preparation method include preparing respectively first component and
Then first component and second component with three-roller are stirred or directly manual mixing are prepared to obtain the final product by second component.The clay of preparation is inserted
It needs just carry out subsequent polishing or levelling work after it is fully cured behind crack.
There are three states for the solidification process of clay:Initial set and is fully cured surface drying, and initial set is consolidated for clay by sticky liquid
Gelatinous state is turned to, surface drying is the state of clay surface gel hardening, and being cured as clay internal curing can extremely polish
Intensity state, therefore curing can also known as polish curing herein.
Disadvantage is that the epoxy resin daub of filling cracks is to prevent it from being flowed out from crack when inserting crack,
Its viscosity is big and poor fluidity, even if the epoxy resin daub after pressure is filled out, is filled out in crack depths or epoxy resin daub pressure
Crack inner surface at deficiency can not still tamp, and still there are gaps;And such gap can lead to the epoxide-resin glue after curing
Mud declines with the stability that crack inner surface bonds, and the inner surface of primary fissure seam expansion or shrinkage and can receive the external world with temperature
Pressure and deform so that void enlargement is connected and ultimately forms the extraneous gap of connection, and water and air, which can enter in gap, makes seam
Gap further expands and forms new crack, reduces the effective time that epoxy resin daub fills up effect.
Invention content
First purpose of the present invention is in view of the deficiencies of the prior art, to provide a kind of epoxide resin polymer clay,
It can be expanded after inserting wall body slit, the surface and building gap inner surface for making epoxide resin polymer clay are pasted completely
It closes, avoids generating gap, improve the service life after crack is filled up.
The present invention above-mentioned technical purpose technical scheme is that:
Epoxide resin polymer clay is formed by forming A and forming B 1: 0.8-1.2 hybrid modulations in mass ratio,
The composition A includes following component, and the proportioning of each component is measured according to the mass fraction:100 parts of bisphenol A type epoxy resin, silicon
16-22 parts of micro mist;
The composition B includes following component, and the proportioning of each component is measured according to the mass fraction:100 parts of Polyamine Type alkaline species curing agent,
8-11 parts of gel propellant, the gel propellant are KOH and/or NaOH.
By using above-mentioned technical proposal, silicon powder particle is small, in the epoxide resin polymer clay being hybridly prepared into
It is uniformly dispersed, silicon powder can react with gel propellant, in the Surface Creation alkali-silica gel of silicon powder particle, alkali-silicon
Acid gel before epoxide resin polymer clay surface drying can absorb air in water expand, make epoxide resin polymer clay to
Outer expansion presses to the inner surface of wall body slit, and the surface of epoxide resin polymer clay and building gap inner surface are complete
Fitting, avoids generating gap, and crack is filled up completely so as to fulfill epoxide resin polymer clay, improves the use after crack is filled up
Service life;Epoxide resin polymer clay quality mobility before curing is preferable, if the epoxide resin polymer clay of expansion is being filled out
Behind full crack, continue to expand the opening that will overflow crack, and the epoxide resin polymer clay for overflowing crack openings can be in wall
Body crack is filled up in the polishing in follow-up work grind off or be levelling in be capped, do not influence crack fill up work progress;After curing
Alkali-silica gel can improve epoxide resin polymer clay solidification after compression strength;Silicon powder and building gap inner surface
Concrete in hydrolysis product of cement reaction generation gelinite, will the surface of epoxide resin polymer clay and building gap in
Side surface is attached onto, and strengthens the fixation of the two.
Preferably, when the composition A and composition B are mixed, the mass ratio of silicon powder and gel propellant is 1.875-
2.125。
By using above-mentioned technical proposal, when the mass ratio of silicon powder and gel propellant is 1.875-2.125, fixed amount
Silicon powder with gel propellant to reach epoxide resin polymer clay expansion effect best.
Preferably, the Polyamine Type alkaline species curing agent is ketimide.
By using above-mentioned technical proposal, ketimide is by ketone (such as methyl ethyl ketone, methyl isopropyl Ketone, methyl-isobutyl
Ketone) with polyamine [such as diethylenetriamines, m-phenylene diamine (MPD), m-xylene diamine, 1,3- bis- (aminomethyl) hexamethylene etc.] through condensation
Reaction is made, which is reversible reaction, and ketimide occurs backward reaction after absorbing moisture, regenerates polyamine;And polyamine
It is dehydrated under alkaline environment, the Free water of abjection switchs to engage water by gelinite absorption, realizes the water in air to asphalt mixtures modified by epoxy resin
It is conducted inside lipopolymer clay, accelerates the expansion of epoxide resin polymer clay in wall crack;Ketimide absorbs water simultaneously
It is mitogenetic into polyamine curable epoxy, prevent alkali-silica gel water suction make epoxide resin polymer clay moisten and lead
Cause curing hardening time long.
Preferably, the composition B further includes 10-15 parts of polyetheramine.
By using above-mentioned technical proposal, polyetheramine can be used as curing accelerator to reduce hardening time, while can reduce glue
The viscosity of mud is poured into the crack of wall convenient for clay and is flowed, and improve epoxide resin polymer in wall body slit
The ratio in required time is fully cured in epoxide resin polymer clay the time required to clay surface drying, increases alkali-silica gel
Absorbent time and water absorption improve the cubical expansivity after epoxide resin polymer clay is fully cured.
Preferably, the composition A and composition B further include dodecyl and myristyl glycidol ether 10-15
Part.
By using above-mentioned technical proposal, data are obtained by experiment it is found that epoxide resin polymer clay volume is in surface drying
The swollen rate of its volume is fast before state, and volume expansion rate is substantially reduced after its surface drying, and dodecyl and myristyl shrink are sweet
Oily ether does not react generally with epoxy bond with epoxy resin, as activity dilution toughening dilution agent epoxy resin and curing
Agent, and dodecyl and myristyl glycidol ether may participate in the curing direction of epoxy resin, become epoxy resin cure
A part for object cross-linked network structure improves the toughness of epoxide resin polymer clay, prevents epoxide resin polymer clay from existing
Inside generates crack when being expanded under pre-hardening state.
Preferably, the mesh number of the silicon powder is 1000-1250 mesh.
By using above-mentioned technical proposal, the granularity of silicon powder has shadow to the cubical expansivity of epoxide resin polymer clay
It rings, the granularity of silicon powder is small, large specific surface area, and the alkali-silica gel that generation is reacted within hardening time is more, is conducive to ring
Oxygen resinous polymer clay expands, and considers economic benefit, the particle size range of silicon powder is 1000-1250 mesh.
Second object of the present invention is to provide a kind of manufacturing method of epoxide resin polymer clay, can improve its ring
Oxygen resinous polymer clay cubical expansivity.
The present invention above-mentioned technical purpose technical scheme is that:
A kind of manufacturing method of epoxide resin polymer clay, includes the following steps:
S1 forms the preparation of A:Bisphenol A type epoxy resin, silicon powder and other components according to mass fraction are matched and add in stirring
It is stirred 10-12 minutes in machine, composition A can be obtained by stirring evenly;
S2 forms the preparation of B:Polyamine Type alkaline species curing agent, gel propellant and other components are matched according to mass fraction and are added in
It is stirred 10-12 minutes in another blender, composition B can be obtained by stirring evenly;
S3 mixed configurations:The amount of epoxide resin polymer clay weighs composition A and group according to mass ratio according to needed for filling cracks
Into B, composition A is first added in blender and is stirred 3-5 minutes with the rotating speed of 50-60r/min, is added composition B, is stirred
It is even, you can to obtain epoxide resin polymer clay.
By using above-mentioned technical proposal, the use of epoxide resin polymer clay is prepared at the scene as far as possible to be used, and is kept away
Exempt from overlong time two after preparing to cure, and the dispersity for forming silicon powder particles of the A during standing for a long time in it can be by equal
Even to disperse to change to coherent condition, being first stirred before composition B is added in makes the dispersity of silicon powder restore homodisperse, keeps away
Exempt from composition A and form limited being mixed after the time of B there are still the silicon powders of coherent condition so that formed in clay
Alkali-silica system gel difference in size is big, and dispersion is uneven, reduces the expansion rate of epoxide resin polymer clay.
Preferably, first component A is heated before composition B is added in the S3 mixed configurations, adds composition B and keep
Heating temperature is stirred, and the heating temperature is 55-60 DEG C.
By using above-mentioned technical proposal, using heating stirring when composition A and composition B are mixed in S3 mixed configurations, can carry
Cubical expansivity after high epoxy resin polymer cement is fully cured can shorten hardening time simultaneously, and reduction is subsequently polished or looked for
Stand-by period needed for flat work improves efficiency, and heating temperature is preferably 50-60 DEG C.
Preferably, in S3 mixed configurations during heating stirring, the stir speed (S.S.) of stirring is the composition A and composition B
100-110r/min, mixing time are 4-5 minutes.
By using above-mentioned technical proposal, when A and composition B heating stirrings are formed in S3 mixed configurations, the stirring speed of stirring
Rate is 100-110r/min, and mixing time is 4-5 minutes, can make epoxide resin polymer clay be fully cured after volume expansion
Rate is improved, while avoids mixing time long, and epoxide resin polymer clay occurs initial set and is not easy to filling cracks.
In conclusion the invention has the advantages that:
The present invention above-mentioned technical purpose technical scheme is that:
1. being uniformly dispersed in the epoxide resin polymer clay that silicon powder is hybridly prepared into, react with gel propellant,
And in the Surface Creation alkali-silica gel of silicon powder particle, alkali-silica gel can be inhaled before epoxide resin polymer clay surface drying
It receives water in air to expand, epoxide resin polymer clay is made to expand outward, press to the inner surface of wall body slit, asphalt mixtures modified by epoxy resin
The surface of lipopolymer clay and building gap inner surface are bonded completely, are avoided generating gap, be gathered so as to fulfill epoxy resin
It closes object clay and is filled up completely crack, improve the service life after crack is filled up;
2. the alkali-silica gel after curing can improve the compression strength after the solidification of epoxide resin polymer clay;
3. the hydrolysis product of cement in concrete of the silicon powder with building gap inner surface reacts generation gelinite, by epoxy resin
The surface of polymer cement and building gap inner surface are attached onto, and strengthen the fixation of the two.
4. ketimide can conduct the water in air to the inside of epoxide resin polymer clay as curing agent, accelerate wall
The expansion of epoxide resin polymer clay in gap;
5. composition B further includes polyetheramine, epoxide resin polymer clay surface drying required time is improved in epoxide resin polymer
The ratio in required time is fully cured in clay, increases alkali-silica gel absorption amount, and it is complete to improve epoxide resin polymer clay
Cubical expansivity after curing;
6. providing a kind of manufacturing method of epoxide resin polymer clay, it is swollen that its epoxide resin polymer clay volume can be improved
Swollen rate;
Heating stirring can improve the body after epoxide resin polymer clay is fully cured when 7. A and composition B is formed in mixed configuration
Product expansion rate can shorten hardening time simultaneously, reduce the stand-by period needed for follow-up polishing or levelling work, improve efficiency.
Description of the drawings
Fig. 1 is the result data figure of embodiment A5;
The result data figure of Fig. 2 positions embodiment A6.
Specific embodiment
The present invention is described in further detail below in conjunction with attached drawing.
Epoxide resin polymer clay is formed by forming A and forming B 1: 0.8-1.2 hybrid modulations in mass ratio, is formed
A includes following component, and the proportioning of each component is measured according to the mass fraction:100 parts of bisphenol A type epoxy resin, 16-22 parts of silicon powder;
It forms B and includes following component, the proportioning of each component is measured according to the mass fraction:100 parts of Polyamine Type alkaline species curing agent, gel occur
8-11 parts of agent, the gel propellant are KOH and/or NaOH.
Bisphenol A type epoxy resin is selected as the E-44 (epoxide numbers of Ba Ling petrochemical industry:0.41-0.47) or E-51 (epoxide numbers:
0.47-0.54), it is bisphenol-A liquid epoxy resin.
Silicon powder select Anhui Yi Na new and high technologies Co., Ltd silicon powder (including granularity mesh number for 500 mesh, 800 mesh,
1000 mesh, 1250 mesh, 1500 mesh, 2000 mesh).
Ketimide selects the epoxy curing agent ketimide of Wuxi Qian Guang industrial chemicals Co., Ltd.Main component is
Double-N, N '-(methyl-butvl methylene)-diethylenetriamine are the condensation products of diethylenetriamine and methyl iso-butyl ketone (MIBK), point
Son amount 267.45, weak yellow liquid has ammonia taste, and viscosity 25mPa/s-30mPa/s at room temperature being capable of stable storage.
Gel propellant is KOH and/or NaOH, obtained from commercially available.Dodecyl and myristyl glycidol ether,
No. CAS is 68609-97-2, obtained from commercially available.
Embodiment A1,
S1 forms the preparation of A:It is matched according to mass fraction by 100 parts of bisphenol A type epoxy resin, silicon powder (1250 mesh of granularity) 16
It is stirred 10-12 minutes in part addition blender, composition A can be obtained by stirring evenly;
S2 forms the preparation of B:It is another according to 8 parts of 100 parts of ketimide of mass fraction proportioning, gel propellant (selecting NaOH) additions
It is stirred 10-12 minutes in a blender, composition B can be obtained by stirring evenly;
S3 mixed configurations:Composition A and composition B proportionings are calculated as 1: 1 measurement by weight, and composition A and composition B add in blender, stir
Rate is mixed as 100r/min, stirring obtains epoxide resin polymer clay in 4-5 minutes.
Wherein composition A and composition B proportionings use convenient for live practical prepare by weight being 1: 0.8-1.2, reduce meter
It calculates, this is selected as 1: 1.
Embodiment A2,
S1 forms the preparation of A:It is matched according to mass fraction by 100 parts of bisphenol A type epoxy resin, silicon powder (1250 mesh of granularity) 16
It is stirred 10-12 minutes in part addition blender, composition A can be obtained by stirring evenly;
S2 forms the preparation of B:It is another according to 8 parts of 100 parts of ketimide of mass fraction proportioning, gel propellant (selecting KOH) additions
It is stirred 10-12 minutes in a blender, composition B can be obtained by stirring evenly;
S3 mixed configurations:Composition A and composition B proportionings are calculated as 1: 1 measurement by weight, and composition A and composition B add in blender, stir
Rate is mixed as 100r/min, stirring obtains epoxide resin polymer clay in 4-5 minutes.
Embodiment A3,
S1 forms the preparation of A:It is matched according to mass fraction by 100 parts of bisphenol A type epoxy resin, silicon powder (1250 mesh of granularity) 16
It is stirred 10-12 minutes in part addition blender, composition A can be obtained by stirring evenly;
S2 forms the preparation of B:Another stirring is added according to 100 parts of ketimide of mass fraction proportioning, 4 parts of NaOH, 4 parts of KOH
It is stirred 10-12 minutes in machine, composition B can be obtained by stirring evenly;
S3 mixed configurations:Composition A and composition B proportionings are calculated as 1: 1 measurement by weight, and composition A and composition B add in blender, stir
Rate is mixed as 100r/min, stirring obtains epoxide resin polymer clay in 4-5 minutes.
Comparative example A 4,
S1 forms the preparation of A:It is matched according to mass fraction by 100 parts of bisphenol A type epoxy resin, silicon powder (1250 mesh of granularity) 16
It is stirred 10-12 minutes in part addition blender, composition A can be obtained by stirring evenly;
S2 forms the preparation of B:100 parts of ketimide is added in another blender and is stirred 10-12 minutes, as composition B comparisons;
S3 mixed configurations:Composition A and composition B comparison proportionings are calculated as 1: 1 measurement by weight, and composition A and composition B comparison additions are stirred
Machine, heating stirring are mixed, heating temperature is 80 DEG C, stir speed (S.S.) 100r/min, and stirring obtains polymerization of epoxy resins in 4-5 minutes
Object clay.
The epoxide resin polymer clay obtained to embodiment A1 to embodiment A3 and comparative example A 4 is subjected to hardening time
Experiment and cubical expansivity experiment.
Hardening time tests:Epoxide resin polymer clay obtained is poured into the cubic container of multiple top openings
It is interior, the epoxide resin polymer clay in opening is scraped off after each cubic container is filled up and is struck off, is put into constant temperature and humidity
In incubator.Temperature control is at 25 DEG C, and humid control is in 53-55%, and to simulate indoor environment, timing sampling detects its solidification path
Degree determines the set time.
Cubical expansivity is tested:Epoxide resin polymer clay obtained is poured into the cubic container of multiple top openings
It is interior, the clay in opening is scraped off after each cubic container is filled up and is struck off, is put into the incubator of constant temperature and humidity, temperature control
System is at 25 DEG C, and for humid control in 53-55%, timing sampling measures cubical expansivity, and cubical expansivity is volume change and original
There is the ratio of volume, original volume is cubic container volume herein, and sampling cut-off to epoxide resin polymer clay can polish solid
4 hours after the change time.
Hardening time experimental result data such as following table:
Embodiment A1 | Embodiment A1 | Embodiment A3 | Comparative example A 4 | |
Presetting period/h | 5 | 5 | 5 | 5 |
Surface drying time/h | 12 | 12 | 12 | 12 |
Can polish hardening time/h | 20 | 20 | 20 | 20 |
Cubical expansivity Experiments Results Section data such as following table:
By upper table it is found that the OH that silicon powder can be provided with gel propellant-React Surface Creation alkali-silicon in silicon powder particle
Acid gel, alkali-silica gel can absorb water and expand so that epoxide resin polymer clay expands outward, absorbs expansion
Time is predominantly located at before epoxide resin polymer clay surface drying.The NaOH's or KOH of gel propellant selection simultaneously or both is mixed
It closes object and can reach effect.
Embodiment A5,
Variable experiment is carried out on the basis of embodiment A1 and embodiment A2, changes the addition of silicon powder in the preparation of S1 compositions A
Amount carries out the cubical expansivity experiment of the additive amount of multigroup different silicon powders.Experimental result is as shown in Figure 1.
By attached drawing 1 it is found that silicon powder can react with gel propellant, in Surface Creation alkali-silicon of silicon powder particle
Acid gel, alkali-silica gel can absorb water and expands before epoxide resin polymer clay is curing so that epoxy resin gathers
It closes object clay to expand outward, the quality parts ratio that silicon powder and gel propellant are dosed is preferably 1.875-2.125.
Embodiment A6:
On the basis of embodiment A1 carry out variable experiment, change S1 composition A preparation in silicon powder additive amount and according to silicon
Micro mist and gel propellant quality parts ratio are 2: 1 addition gel propellants.Carry out the body of the additive amount of multigroup different silicon powders
Product expansion rate experiment.Experimental result is as shown in Figure 2.
By attached drawing 2 it is found that silicon powder mass fraction is more than 24 parts of cubical expansivities increases reduction with silicon powder mass fraction,
Its reason is in environment that humidity is limited, and water absorption is limited before the curing of epoxide resin polymer clay, therefore it is preferred that silicon powder
Extra mass number is 16-22 parts, and preferably gel propellant mass fraction is 8-11 parts
Embodiment A7,
Variable experiment is carried out on the basis of embodiment A1, changes the granularity mesh number of silicon powder in the preparation of S1 compositions A, it is multigroup to make
It is tested with the cubical expansivity of varigrained silicon powder, experimental result such as following table:
By upper table it is found that the granularity of silicon powder has an impact the cubical expansivity for forming the epoxide resin polymer clay of A, silicon
The granularity of micro mist is small, large specific surface area, and the alkali-silica gel that generation is reacted within hardening time is more, is conducive to asphalt mixtures modified by epoxy resin
Lipopolymer clay expands, and considers that the granularity of economic benefit silicon powder is preferably 1000-1250 mesh.
Embodiment B1,
S1 forms the preparation of A:It is matched according to mass fraction by 100 parts of bisphenol A type epoxy resin, silicon powder (1250 mesh of granularity) 16
It is stirred 10-12 minutes in part addition blender, composition A can be obtained by stirring evenly;
S2 forms the preparation of B:According to 100 parts of ketimide of mass fraction proportioning, 8 parts of gel propellant (selecting NaOH), polyetheramine
12 parts add in another blender and stir 10-12 minutes, and composition B can be obtained by stirring evenly;
S3 mixed configurations:Composition A and composition B proportionings are calculated as 1: 1 measurement by weight, and composition A and composition B add in blender, add
Thermal agitation, heating temperature is 80 DEG C, stir speed (S.S.) 100r/min, and stirring obtains epoxide resin polymer clay in 4-5 minutes.
Embodiment B2,
S1 forms the preparation of A:It is matched according to mass fraction by 100 parts of bisphenol A type epoxy resin, silicon powder (1250 mesh of granularity) 16
It is stirred 10-12 minutes in part, activity dilution 12 parts of addition blenders of toughener, composition A can be obtained by stirring evenly;
S2 forms the preparation of B:It is dilute according to 100 parts of ketimide of mass fraction proportioning, 8 parts of gel propellant (selecting NaOH), activity
It releases 12 parts of toughener and adds in another blender and stir 10-12 minutes, composition B can be obtained by stirring evenly;
S3 mixed configurations:Composition A and composition B proportionings are calculated as 1: 1 measurement by weight, and composition A and composition B add in blender, add
Thermal agitation, heating temperature is 80 DEG C, stir speed (S.S.) 100r/min, and stirring obtains epoxide resin polymer clay in 4-5 minutes.
Embodiment B3,
S1 forms the preparation of A:It is matched according to mass fraction by 100 parts of bisphenol A type epoxy resin, silicon powder (1250 mesh of granularity) 16
It is stirred 10-12 minutes in part, activity dilution 12 parts of addition blenders of toughener, composition A can be obtained by stirring evenly;
S2 forms the preparation of B:According to 100 parts of ketimide of mass fraction proportioning, 8 parts of gel propellant (selecting NaOH), polyetheramine
12 parts, activity 12 parts of toughener of dilution add in another blender and stir 10-12 minutes, stirring evenly can obtain forming B;
S3 mixed configurations:Composition A and composition B proportionings are calculated as 1: 1 measurement by weight, and composition A and composition B add in blender, add
Thermal agitation, heating temperature is 80 DEG C, stir speed (S.S.) 100r/min, and stirring obtains epoxide resin polymer clay in 4-5 minutes.
The epoxide resin polymer clay that embodiment B1 to embodiment B3 is obtained carries out hardening time and cubical expansivity
Experiment, experimental result such as following table, cubical expansivity experimental result is the cubical expansivity after being fully cured herein.
Embodiment C1,
S1 forms the preparation of A:It is matched according to mass fraction by 100 parts of bisphenol A type epoxy resin, silicon powder (1250 mesh of granularity) 16
Part adds in blender and stirs 10-12 minutes, and composition A can be obtained by stirring evenly;
S2 forms the preparation of B:According to 100 parts of ketimide of mass fraction proportioning, 8 parts of gel propellant (selecting NaOH), add in separately
It is stirred 10-12 minutes in one blender, composition B can be obtained by stirring evenly;
S3 mixed configurations:Composition A and composition B proportionings are calculated as 1: 1 measurement by weight, and composition A adds in blender, with 50-60r/
The rotating speed of min is stirred 3-5 minutes, adds composition B stirrings, stir speed (S.S.) 100r/min, and stirring obtains for 4-5 minutes
Epoxide resin polymer clay.
The epoxide resin polymer clay of embodiment C1 is subjected to cubical expansivity experiment, cubical expansivity 5.8%.
Embodiment C2,
It improves, is added in S3 mixed configurations before composition B stirrings to forming A heating, after adding in composition B on the basis of embodiment C1
Keep that heating temperature is constant is stirred.Multigroup epoxide resin polymer clay is obtained for different heating temperature value, is cured
Time and cubical expansivity experiment, experimental result such as following table, cubical expansivity experimental result is the volume after being fully cured herein
Expansion rate.
By upper table it is found that heating stirring can improve epoxide resin polymer glue when A and composition B is formed in S3 mixed configurations
Cubical expansivity after mud is fully cured can shorten hardening time simultaneously, when the follow-up polishing of reduction or levelling work need to wait for
Between, efficiency is improved, and heating temperature is preferably 50-60 DEG C.
Embodiment C3,
When A and composition B heating stirrings are formed on the basis of embodiment C2, in S3 mixed configurations, 55 DEG C of heating temperature is selected simultaneously
Multigroup epoxide resin polymer clay is obtained using different stir speed (S.S.)s, carries out cubical expansivity experiment, experimental result is as follows
Table, cubical expansivity experimental result is the cubical expansivity after being fully cured herein,
Stir speed (S.S.)/rmin-1 | 90 | 95 | 100 | 105 | 110 | 115 |
Cubical expansivity/% | 6 | 6.23 | 6.45 | 6.5 | 6.51 | 6.52 |
By upper table it is found that forming A and heating stirring when forming B in S3 mixed configurations, stir speed (S.S.) is preferably 100-110r/
min。
Embodiment D1,
S1 forms the preparation of A:It is matched according to mass fraction by 100 parts of bisphenol A type epoxy resin, silicon powder (1250 mesh of granularity) 16
It is stirred 10-12 minutes in part, activity dilution 12 parts of addition blenders of toughener, composition A can be obtained by stirring evenly;
S2 forms the preparation of B:According to 100 parts of ketimide of mass fraction proportioning, 8 parts of gel propellant (selecting NaOH), polyetheramine
12 parts, activity 12 parts of toughener of dilution add in another blender and stir 10-12 minutes, stirring evenly can obtain forming B;
S3 mixed configurations:Composition A and composition B proportionings are calculated as 1: 1 measurement by weight, and composition A adds in blender, with 50-60r/
The rotating speed of min is stirred 3-5 minutes, is heated to 55 DEG C after having stirred, and is added in after composition B and is kept that heating temperature is constant to be stirred
It mixes, stir speed (S.S.) 100r/min, stirring obtains epoxide resin polymer clay in 4-5 minutes.
Epoxide resin polymer clay made from embodiment D1 is subjected to cubical expansivity experiment, the volume after being fully cured
Expansion rate is 8.3%.
This specific embodiment is only explanation of the invention, is not limitation of the present invention, people in the art
Member can as needed make the present embodiment the modification of no creative contribution after this specification is read, but as long as at this
It is all protected in the right of invention by Patent Law.
Claims (9)
1. epoxide resin polymer clay, which is characterized in that it is by forming A and forming B in mass ratio 1:0.8-1.2 hybrid modulations
It forms,
The composition A includes following component, and the proportioning of each component is measured according to the mass fraction:100 parts of bisphenol A type epoxy resin, silicon
16-22 parts of micro mist;
The composition B includes following component, and the proportioning of each component is measured according to the mass fraction:100 parts of Polyamine Type alkaline species curing agent,
8-11 parts of gel propellant, the gel propellant are KOH and/or NaOH.
2. epoxide resin polymer clay according to claim 1, which is characterized in that the composition A and composition B mixing
When, the mass ratio of silicon powder and gel propellant is 1.875-2.125.
3. epoxide resin polymer clay according to claim 1, which is characterized in that the Polyamine Type alkaline species curing agent
For ketimide.
4. epoxide resin polymer clay according to claim 1, which is characterized in that the composition B further includes polyetheramine
10-15 parts.
5. epoxide resin polymer clay according to claim 1, which is characterized in that the composition A and composition B are also wrapped
Include 10-15 parts of dodecyl and myristyl glycidol ether.
6. epoxide resin polymer clay according to claim 1, which is characterized in that the mesh number of the silicon powder is
1000-1250 mesh.
7. the manufacturing method of epoxide resin polymer clay as claimed in any of claims 1 to 6, including as follows
Step:
S1 forms the preparation of A:Bisphenol A type epoxy resin, silicon powder and other components according to mass fraction are matched and add in stirring
It is stirred 10-12 minutes in machine, composition A can be obtained by stirring evenly;
S2 forms the preparation of B:Polyamine Type alkaline species curing agent, gel propellant and other components are matched according to mass fraction and are added in
It is stirred 10-12 minutes in another blender, composition B can be obtained by stirring evenly;
S3 mixed configurations:The amount of epoxide resin polymer clay weighs composition A and group according to mass ratio according to needed for filling cracks
Into B, composition A is first added in blender and is stirred 3-5 minutes with the rotating speed of 50-60r/min, is added composition B, is stirred
It is even, you can to obtain epoxide resin polymer clay.
8. the manufacturing method of epoxide resin polymer clay according to claim 7, in composition B in the S3 mixed configurations
First component A is heated before adding in, composition B is added and heating temperature is kept to be stirred, the heating temperature is 55-60 DEG C.
9. the manufacturing method of epoxide resin polymer clay according to claim 8, the composition A and composition B are mixed in S3
When closing heating stirring in configuration, the stir speed (S.S.) of stirring is 100-110r/min, and mixing time is 4-5 minutes.
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CN111724952A (en) * | 2020-06-28 | 2020-09-29 | 三瑞科技(江西)有限公司 | Cementing process of glass insulator |
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CN101367637A (en) * | 2007-08-13 | 2009-02-18 | 江西铜业集团公司 | Method of preparing composite material |
CN102674376A (en) * | 2012-04-19 | 2012-09-19 | 田辉明 | Production method of quartz tailing purification |
CN105885759A (en) * | 2016-04-07 | 2016-08-24 | 主义 | Epoxy resin polymer daub and preparation method thereof |
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CN101367637A (en) * | 2007-08-13 | 2009-02-18 | 江西铜业集团公司 | Method of preparing composite material |
CN102674376A (en) * | 2012-04-19 | 2012-09-19 | 田辉明 | Production method of quartz tailing purification |
CN105885759A (en) * | 2016-04-07 | 2016-08-24 | 主义 | Epoxy resin polymer daub and preparation method thereof |
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CN111724952A (en) * | 2020-06-28 | 2020-09-29 | 三瑞科技(江西)有限公司 | Cementing process of glass insulator |
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