CN108164834A - The film and circuit board of resin combination and the application resin combination - Google Patents
The film and circuit board of resin combination and the application resin combination Download PDFInfo
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- CN108164834A CN108164834A CN201611095940.9A CN201611095940A CN108164834A CN 108164834 A CN108164834 A CN 108164834A CN 201611095940 A CN201611095940 A CN 201611095940A CN 108164834 A CN108164834 A CN 108164834A
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- China
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- resin combination
- peroxide
- peroxy
- weight
- polybutadiene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/16—Elastomeric ethene-propene or ethene-propene-diene copolymers, e.g. EPR and EPDM rubbers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/16—Elastomeric ethene-propene or ethene-propene-diene copolymers, e.g. EPR and EPDM rubbers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
Abstract
A kind of resin combination, the resin combination contains ethylene propylene diene rubber, polybutadiene, organic peroxide and solvent, in the resin combination, the content of the ethylene propylene diene rubber is 100 parts by weight, the content of the polybutadiene is 5~30 parts by weight, and the content of the organic peroxide is 0.1~10 parts by weight.In addition, the present invention also provides a kind of film using the resin combination, circuit board made from a kind of application resin combination.
Description
Technical field
The present invention relates to a kind of resin combination, using the film and circuit board of the resin combination.
Background technology
In the big data epoch, the information processing of electronic product is constantly towards signal transmission high frequency and the side of high-speed digitization
To development.There is good signal transmission quality simultaneously under conditions of high frequency signal transmission to ensure electronic product, need
In impedance matching condition between transmission line and its electronic component connected in the copper-foil conducting electricity of flexible PCB, avoid making
Into phenomena such as signal reflex, scattering, attenuation and delay.Jie of the material for the glue-line being in contact in flexible PCB with conducting wire
Electric constant is the one of which factor for influencing high-frequency transmission impedance matching.In order to realize high frequency signal transmission impedance matching, glue-line
Usually require the relatively low material of selection dielectric constant.The glue-line in flexible PCB is generally hybrid epoxidized using nitrile rubber at present
Resin is formed by curing after being reacted with phenols, amine or anhydride curing agent, however, including C ≡ in this based resin composition structure
N, the high polar group such as-OH ,-COOH, dielectric constant all higher than more than 3.0, cause flexible PCB to be unable to reach high-frequency signal
Transfer impedance matches, and affects the high frequency and high-speed digitization of signal transmission.
Invention content
In view of this, it is necessary to which a kind of resin combination of low-k is provided.
A kind of film using the resin combination is provided in addition, there is a need to.
Circuit board made from a kind of application resin combination is provided in addition, there is a need to.
A kind of resin combination, the resin combination contain ethylene propylene diene rubber, polybutadiene, organic peroxide and molten
Agent, in the resin combination, the content of the ethylene propylene diene rubber is 100 parts by weight, and the content of the polybutadiene is 5~30
Parts by weight, the content of the organic peroxide is 0.1~10 parts by weight.
A kind of film using the resin combination including release film and is incorporated into a release film at least surface
Resin layer, which is dried by the resin combination so that solvent is made after removing.
Circuit board made from a kind of application resin combination, including circuit board and is incorporated into the circuit board extremely
The glue-line on a few surface, the glue-line after the toasted pressing of the resin combination by being made, EPDM in the resin combination
The unsaturated bond of rubber is bonded with the vinyl on the molecular side chain of polybutadiene and the peroxy-radical of organic peroxide.
The resin combination of the present invention includes ethylene propylene diene rubber, polybutadiene and organic peroxide, the resin combination
The dielectric constant D of objectkLess than 3.0, dielectric absorption DfLess than 0.02, so as to make the glue of the circuit board as made from the resin combination
Layer has relatively low dielectric constant, and then the circuit board is made to have high frequency and the signal transmission performance of high-speed digitization.In addition,
When the resin combination is used to prepare circuit board, in pressure programming is toasted, the ethylene propylene diene rubber in the resin combination
Unsaturated bond and polybutadiene molecular side chain on vinyl and the peroxide root of organic peroxide can react and key
It closes, forms the network of chemical crosslinking, the crosslink density of the resin combination can be further improved, so as to be conducive to avoid
The cross-linked network structure failure of ethylene propylene diene rubber in the solder of subsequent circuit board, therefore, by the resin combination
The glue-line of circuit board obtained has preferable heat resistance, is suitable for the heat resistance demand of circuit board.
Specific embodiment
Better embodiment of the present invention provides a kind of resin combination, is mainly used for the base material of circuit board, glue-line or covers
In epiphragma.The resin combination contains ethylene propylene diene rubber (EPDM), polybutadiene, organic peroxide and solvent.It is described
In resin combination, the content of the ethylene propylene diene rubber is 100 parts by weight, and the content of the polybutadiene is 5~30 weight
Part, the content of the organic peroxide is 0.1~10 parts by weight.The addition of the solvent can be adjusted as needed,
As long as ethylene propylene diene rubber, polybutadiene and organic peroxide is enable to be completely dissolved.The door of the resin combination
Buddhist nun's viscosity is preferably 10~60 (ML1+4,125 DEG C), in order to which the resin combination is coated on other materials.
The ethylene propylene diene rubber is the terpolymer of ethylene, propylene and non-conjugated diene hydrocarbon.Wherein, the two of alkadienes
The copolymerization of one of a C=C keys becomes main polymer chain, another undersaturated C=C key will not become main polymer chain, only can be into
For avris chain.The ethylene propylene diene rubber has low-k (i.e. less than 3.0), and the molecule side of the ethylene propylene diene rubber
There is unsaturation C=C keys, which can be when the temperature rises (when temperature be about 180~250 DEG C) and polybutadiene on chain
The peroxy-radical of vinyl and organic peroxide on the molecular side chain of alkene reacts and is bonded.The ethylene propylene diene rubber
The ethylene propylene diene rubber of trade name the KEP 570F or KEP 330 of Jin Hu companies of South Korea production may be selected.
The polybutadiene is in a liquid state, and the contents of ethylene on the molecular side chain of the polybutadiene accounts for the polybutadiene
Weight percent be more than or equal to 50%.The polybutadiene may be selected from the trade name Ricon of Cray Valleylad Inc. production
142nd, the polybutadiene of Ricon 150, Ricon 152, Ricon 153, Ricon 154, Ricon 156 or Ricon 157.
When temperature increases, vinyl on the molecular side chain of the polybutadiene can on the molecular side chain of the ethylene propylene diene rubber
Unsaturated bond reacts and is bonded, and forms the network structure of chemical crosslinking, to improve the crosslink density of the resin combination.
The organic peroxide is utilizes differential scanning calorie meter (differential scanning
Calorimeter, DSC) organic peroxide of the exothermic peak that is measured in the range of 100~200 DEG C.The organic peroxide
Selected from diacyl peroxide, peroxy ketal, peroxycarbonates, peroxy esters, ketone peroxide, dialkyl peroxide and
One or more of hydroperoxides.Wherein, which includes but not limited to different nonyl acyl peroxide, the last of the ten Heavenly stems
Acyl peroxide, lauroyl peroxide, to chlorobenzoyl peroxide and two (3,5,5- trimethyl acetyls base) mistakes
One or more of oxide.The peroxy ketal includes but not limited to the (4,4- bis--(di-t-butyl peroxy) ring of 2,2- bis-
Hexyl) propane.The peroxycarbonates include but not limited to two -3- methoxybutyls peroxydicarbonates and dicyclohexyl peroxide
One or both of two carbonic esters.The peroxy esters include but not limited to t-butyl peroxybenzoate, t-butyl peroxy acetic acid
Ester, t-butyl peroxy -2 ethyl hexanoic acid ester, tert-butylperoxy isobutyrate, t-butyl peroxy valerate, tertiary butyl diperoxy oneself
Two acid esters, cumenyl peroxide neodecanoic acid ester, t-butyl peroxybenzoate, 1,1,3,3- tetramethyl peroxy -2- ethyl hexyls
One or more of acid esters and 2,5- dimethyl -2,5- two (benzoylperoxy) hexane.The ketone peroxide include but
It is not limited to one or both of methyl-ethyl-ketone peroxide and Cyclohexanone peroxides.The dialkyl peroxide include but
Be not limited to di-tert-butyl peroxide, diisopropylbenzyl peroxide, tert butyl isopropyl benzene peroxide, 1,1- bis- (uncle oneself
Base peroxy) in -3,3,5- trimethyl-cyclohexanes, two tert-hexyl peroxide objects and two (2- tert butylperoxyisopropyls) benzene
It is one or more of.The hydroperoxides include but not limited to isopropylbenzene hydroxyl peroxide, tert-butyl hydroperoxide and p- peppermint
One or more of alkane hydrogen peroxide.When being heated to 180~250 DEG C, the peroxy-radical of the organic peroxide and institute
Stating the unsaturated bond on ethylene propylene diene rubber side chain can react and be bonded, and form the network structure of chemical crosslinking, with into one
Step improves the crosslink density of the resin combination.
Preferably, the organic peroxide is selected from peroxy esters and the one or two of dialkyl peroxide.More preferably
, the organic peroxide be selected from t-butyl peroxybenzoate, 1,1,3,3- tetramethyl peroxy -2 ethyl hexanoic acid ester and
At least one of two (2- tert butylperoxyisopropyls) benzene.
In present embodiment, the solvent is toluene.The addition of toluene can change as needed, as long as making ternary
EP rubbers, polybutadiene and organic peroxide can be completely dissolved.
The resin combination may also include additive, the additive be selected from lubricant, inorganic filler, fire retardant and
One or more of ion capturing agent.When the resin combination includes lubricant, the lubricant is in the resin group
It is 0.01~5 parts by weight to close the content in object.When the resin combination includes inorganic filler, the inorganic filler exists
Content in the resin combination is 1~100 parts by weight.When the resin combination includes fire retardant, the fire retardant
Content be 10~100 parts by weight.When the resin combination includes ion capturing agent, the ion capturing agent is in the tree
Content in oil/fat composition is 0.5~10 parts by weight.
The lubricant includes but not limited to paraffin, polyethylene wax (PE waxes), fatty acid amide, aliphatic acid, fatty amine, tristearin
One or more of sour zinc, calcium stearate and magnesium stearate.
The inorganic filler includes but not limited to silica (molten state, non-melt state, Porous or hollow type), oxygen
Change aluminium, aluminium hydroxide, magnesia, magnesium hydroxide, calcium carbonate, aluminium nitride, boron nitride, aluminum silicon carbide, silicon carbide, sodium carbonate, two
Titanium oxide, zinc oxide, zirconium oxide, quartz, graphite, magnesium carbonate, potassium titanate, mica, calcium phosphate, talcum, silicon nitride, kaolin and
One or more of barium sulfate.The inorganic filler can also be the inorganic particle particle with organic shell layer.
The fire retardant includes but not limited to the one or more of phosphate compounds and nitrogenous phosphate compounds.More
For body, fire retardant includes bis-phenol biphenyl phosphate (bisphenol diphenyl phosphate), ammonium polyphosphate
(ammonium polyphosphate), hydroquinone-bis--(biphenyl based phosphates) (hydroquinone bis-
(diphenyl phosphate)), front three based phosphates (trimethyl phosphate, TMP), dimethyl-methyl phosphate
(dimethyl methyl phosphonate, DMMP), resorcinol bis-xylene based phosphates (resoreinol
Dixylenylphosphate, RDXP), polyphosphoric acid melamine (melamine polyphosphate), even phosphorus-nitrogen compound,
And miscellaneous -10- phosphorus phenanthrene -10- oxides (the 9,10-dihydro-9-oxa-10- of 9,10- dihydro-9-oxies
One or more of phosphaphenanthrene-10-oxide, DOPO).
The ion capturing agent includes but not limited to aluminosilicate, hydrated metal oxide, polyvalent metal hydrochlorate and miscellaneous
One or more of polyacid.Wherein, which includes but not limited to Sb2O5·2H2O and Bi2O3·nH2In O
It is one or two kinds of；The polyvalent metal hydrochlorate includes but not limited to Zr (HPO4)2·H2O and Ti (HPO4)2·H2One kind in O or
Two kinds；The heteropoly acid includes but not limited to (NH4)3Mo12(PO4)40·nH2O)、Ca10(PO4)6(OH)2And AlMg (OH)3CO3·nH2One or more of O.
The preparation method of the resin combination can be：By the ethylene propylene diene rubber, polybutadiene, organic peroxide
And additive is added according to scheduled ratio into reaction bulb, and suitable solvent is added in into reaction bulb, is mixed, and is made described
Ethylene propylene diene rubber, polybutadiene, organic peroxide and additive are dissolved in solvent, obtain the resin combination.
Wherein, which can be toluene.The addition of toluene can change as needed, if make the ethylene propylene diene rubber,
Polybutadiene, organic peroxide and additive can be completely dissolved.
The present invention also provides one kind film as made from above-mentioned resin combination, which includes release film and is incorporated into this
The resin layer on a release film at least surface.The resin combination by being coated on at least table of release film by the resin layer
Face, then be made after the dry evaporation of the solvent made in resin combination.
The present invention also provides one kind circuit boards as made from above-mentioned film, including circuit board and are incorporated into the circuit base
The glue-line on a plate at least surface.The glue-line is removed release by the way that the resin layer of the film to be fitted in the surface of circuit board
Film, then be made through 180~250 DEG C of baking pressings.Because the resin combination has relatively low dielectric constant, therefore by its making
The glue-line of circuit board also has relatively low dielectric constant.The mistake that the glue-line that the resin combination of the present invention is formed is baked
Cheng Zhong, the unsaturated bond on ethylene propylene diene rubber side chain in glue-line and the vinyl on the molecular side chain of polybutadiene and organic
The peroxy-radical of peroxide occurs chemical reaction and is bonded together, and forms the network structure of chemical crosslinking, can be further
The crosslink density of the resin combination is improved, so that the network structure of the chemical crosslinking in the glue-line is in subsequent routine
The processing procedures such as the scolding tin of circuit board in will not fail, therefore, the glue-line of circuit board as made from the resin combination have compared with
Good heat resistance is suitable for the heat resistance demand of circuit board.The lubricant and inorganic filler can reduce the resin combination
The film surface that object is formed is stained with stickiness, waste caused by being not allowed to avoid glue-line and circuit board positioning.
The present invention is specifically described below by embodiment.
Embodiment 1
The EPDM of the trade name KEP 570F of 100g South Korea Jin Hu productions is sequentially added in 1000ml reaction bulbs
Rubber, 142 liquid polybutadienes of trade name Ricon, 4g paraffin, (the 2- tertiary butyls of 1g bis- of the production of 10g Crays Valleylad Inc.
Peroxy isopropyl) benzene, 4gSiO2And 680g toluene, stirring and dissolving are configured and complete resin combination.
Embodiment 2
The ethylene-propylene-diene monomer of the trade name KEP 330 of 100g South Korea Jin Hu productions is sequentially added in 1000ml reaction bulbs
Liquid polybutadiene, 4g paraffin, (the 2- tertiary butyls of 1g bis- of trade name Ricon 142 that glue, 10g Crays Valleylad Inc. produce
Peroxy isopropyl) benzene, 4g SiO2And 680g toluene, stirring and dissolving are configured and complete resin combination.
Comparative example
40g carboxylated nitrile rubbers are dissolved in the methyl iso-butyl ketone (MIBK) (MIBK) of 160g, are configured to 20% rubber solutions.
Sequentially added in 1000ml reaction bulbs 100g phosphorous epoxy resins, 26g phenolic resin, 90g aluminium hydroxides, 10g talcum powder,
0.2g catalyst (models：2E4MI).Then the MIBK solution of the carboxylated nitrile rubbers of 200g is added in previous reaction bottle.Its
In, the product that the comparative example obtains is commonly used for preparing the glue-line of circuit board in the art.
To the dielectric constant D of the product prepared by the 2 kinds of resin combinations and comparative example prepared by Examples 1 to 2kWith
Dielectric absorption DfIt is tested respectively.Then, include copper foil using copper foil and polyimides (Polyimide, PI) film preparation
With the circuit board of polyimide cover layer, wherein, in each circuit board combine each copper foil between each polyimide cover layer
Glue-line prepared respectively using the composition prepared by the 2 kinds of resin combinations and comparative example prepared by Examples 1 to 2 and
Into then carrying out the test of drift tin heat resistance, copper-stripping strength test and PI film peel strengths to the circuit board with glue-line
Test, testing result please refer to the performance detection data of table 1.Wherein, if drift tin heat resistance test condition is more than or equal to 280 DEG C
During 10sec 3 times, phenomena such as glue-line does not generate blistering, stripping, then tin heat resistance test result is floated for " passing through ", shows circuit board
Reach the requirement of heat resistance.
Measured value of the table 1 about the related data of above-mentioned each circuit board
The glue-line formed it can be seen from table one compared to the product prepared by comparative example, the embodiment of the present invention 1~2
The glue-line that resin combination is formed has relatively low dielectric constant DkAnd relatively low dielectric absorption Df, and shelled with larger copper foil
From intensity and PI film peel strengths.In addition, the glue-line that 2 kinds of resin combinations of the embodiment of the present invention 1~2 are formed is in circuit board
In it is heat-resist.
The resin combination of the present invention contains ethylene propylene diene rubber, polybutadiene and organic peroxide, the resin combination
The dielectric constant D of objectkLess than 3.0, dielectric absorption DfLess than 0.02, so as to make the glue of the circuit board as made from the resin combination
Layer has relatively low dielectric constant, and then the circuit board is made to have high frequency and the signal transmission performance of high-speed digitization.In addition,
When the resin combination is used to prepare circuit board, in pressure programming is toasted, the ethylene propylene diene rubber in the resin combination
Unsaturated bond and polybutadiene molecular side chain on vinyl and the peroxide root of organic peroxide can react and key
It closes, forms the network of chemical crosslinking, the crosslink density of the resin combination can be further improved, so as to be conducive to avoid
The cross-linked network structure failure of ethylene propylene diene rubber in the solder of subsequent circuit board, therefore, by the resin combination
The glue-line of circuit board obtained has preferable heat resistance, is suitable for the heat resistance demand of circuit board.
Claims (9)
1. a kind of resin combination, it is characterised in that：The resin combination contains ethylene propylene diene rubber, polybutadiene, organic mistake
Oxide and solvent, in the resin combination, the content of the ethylene propylene diene rubber is 100 parts by weight, the polybutadiene
Content is 5~30 parts by weight, and the content of the organic peroxide is 0.1~10 parts by weight.
2. resin combination as described in claim 1, it is characterised in that：The polybutadiene is in a liquid state, the polybutadiene
Molecular side chain on contents of ethylene account for the polybutadiene weight percent be more than or equal to 50%.
3. resin combination as described in claim 1, it is characterised in that：The organic peroxide is selected from diacyl peroxidating
One in object, peroxy ketal, peroxycarbonates, peroxy esters, ketone peroxide, dialkyl peroxide and hydroperoxides
Kind is several.
4. resin combination as claimed in claim 3, it is characterised in that：The diacyl peroxide is selected from different nonyl acyl peroxide
Compound, decanol peroxide, lauroyl peroxide, to chlorobenzoyl peroxide and two (3,5,5- trimethyls oneself
One or more of acyl group) peroxide；The peroxy ketal is selected from the (4,4- bis--(di-t-butyl peroxy) ring of 2,2- bis-
Hexyl) propane；The peroxycarbonates are selected from two -3- methoxybutyls peroxydicarbonates and dicyclohexyl peroxydicarbonate
One or both of；The peroxy esters are selected from t-butyl peroxybenzoate, tert-butyl peroxy acetate, t-butyl peroxy -2-
Ethylhexoate, tert-butylperoxy isobutyrate, t-butyl peroxy valerate, tertiary butyl diperoxy adipate ester, cumenyl
Peroxide neodecanoic acid ester, t-butyl peroxybenzoate, 1,1,3,3- tetramethyls peroxy -2 ethyl hexanoic acid ester and 2,5- diformazans
One or more of base -2,5- two (benzoylperoxy) hexane；The ketone peroxide is selected from methyl ethyl ketone peroxidating
One or both of object and Cyclohexanone peroxides；The dialkyl peroxide is selected from di-tert-butyl peroxide, diisopropyl
Phenyl peroxide, tert butyl isopropyl benzene peroxide, 1,1- bis- (tertiary hexyl peroxy) -3,3,5- trimethyl-cyclohexanes,
One or more of two tert-hexyl peroxide objects and two (2- tert butylperoxyisopropyls) benzene；The hydroperoxides are selected from different
One or more of propyl benzene hydroxyl peroxide, tert-butyl hydroperoxide and p- terpane hydrogen peroxide.
5. resin combination as described in claim 1, it is characterised in that：The resin combination further includes lubricant, inorganic
One or more of filler, fire retardant and ion capturing agent, when the resin combination includes lubricant, inorganic fill
When object, fire retardant or ion capturing agent, parts by weight are respectively：The content of the lubricant be 0.01~5 parts by weight, the nothing
The content of machine filler is 1~100 parts by weight, and the content of the fire retardant is 10~100 parts by weight, the ion capturing agent
Content is 0.5~10 parts by weight.
6. resin combination as described in claim 1, it is characterised in that：The lubricant is selected from paraffin, polyethylene wax, fat
One or more of amide, aliphatic acid, fatty amine, zinc stearate, calcium stearate and magnesium stearate, the inorganic filler choosing
From silica, aluminium oxide, aluminium hydroxide, magnesia, magnesium hydroxide, calcium carbonate, aluminium nitride, boron nitride, aluminum silicon carbide, carbonization
Silicon, sodium carbonate, titanium dioxide, zinc oxide, zirconium oxide, quartz, graphite, magnesium carbonate, potassium titanate, mica, calcium phosphate, talcum, nitrogen
One or more of SiClx, kaolin and barium sulfate, the fire retardant are selected from bis-phenol biphenyl phosphate, ammonium polyphosphate, to benzene
Diphenol-bis--(biphenyl based phosphates), front three based phosphates, dimethyl-methyl phosphate, resorcinol bis-xylene base phosphoric acid
Salt, polyphosphoric acid melamine, even phosphorus-nitrogen compound and one kind in the miscellaneous -10- phosphorus phenanthrene -10- oxides of 9,10- dihydro-9-oxies or
It is several, one kind in aluminosilicate, hydrated metal oxide, polyvalent metal hydrochlorate and heteropoly acid of the ion capturing agent or
It is several.
7. resin combination as claimed in claim 6, it is characterised in that：The water alloyed oxide is selected from Sb2O5·2H2O and
Bi2O3·nH2One or both of O；The polyvalent metal hydrochlorate is selected from Zr (HPO4)2·H2O and Ti (HPO4)2·H2In O
It is one or two kinds of；The heteropoly acid is selected from (NH4)3Mo12(PO4)40·nH2O)、Ca10(PO4)6(OH)2And AlMg (OH)3CO3·
nH2One or more of O.
8. a kind of film, including release film and it is incorporated into the resin layer on a release film at least surface, it is characterised in that：The tree
Lipid layer is dried as the resin combination as described in claim 1~7 any one so that being made after solvent removal.
9. a kind of circuit board, including circuit board and it is incorporated into the glue-line on a circuit board at least surface, it is characterised in that：
The glue-line after the toasted pressing of the resin combination described in claim 1~7 any one as being made, three in the resin combination
The unsaturated bond of first EP rubbers and vinyl and the peroxy-radical key of organic peroxide on the molecular side chain of polybutadiene
It closes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611095940.9A CN108164834A (en) | 2016-12-02 | 2016-12-02 | The film and circuit board of resin combination and the application resin combination |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611095940.9A CN108164834A (en) | 2016-12-02 | 2016-12-02 | The film and circuit board of resin combination and the application resin combination |
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| Publication Number | Publication Date |
|---|---|
| CN108164834A true CN108164834A (en) | 2018-06-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611095940.9A Pending CN108164834A (en) | 2016-12-02 | 2016-12-02 | The film and circuit board of resin combination and the application resin combination |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114456528A (en) * | 2021-12-30 | 2022-05-10 | 东莞市艾德嘉电子有限公司 | Wear-resistant anti-aging electronic connecting wire sheath material and preparation method thereof |
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