CN108148335A - The film and circuit board of resin combination and the application resin combination - Google Patents
The film and circuit board of resin combination and the application resin combination Download PDFInfo
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- CN108148335A CN108148335A CN201611095250.3A CN201611095250A CN108148335A CN 108148335 A CN108148335 A CN 108148335A CN 201611095250 A CN201611095250 A CN 201611095250A CN 108148335 A CN108148335 A CN 108148335A
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- peroxy
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2312/00—Crosslinking
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
A kind of resin combination, it includes styrene butadiene styrene block copolymer, organic peroxide and lubricant, in the resin combination, the content of the styrene butadiene styrene block copolymer is 100 parts by weight, the content of the organic peroxide is 0.1~10 parts by weight, and the content of the lubricant is 0.01~5 parts by weight.The dielectric constant D of the resin combinationkLess than 2.45, dielectric absorption DfLess than 0.011, so as to make the glue-line of the circuit board as made from the resin combination that there is relatively low dielectric constant, and then make the circuit board that there is high frequency and the signal transmission performance of high-speed digitization.In addition, the present invention also provides a kind of film using the resin combination, circuit board made from a kind of application resin combination.
Description
Technical field
The present invention relates to a kind of resin combination, using the film and circuit board of the resin combination.
Background technology
In the big data epoch, the information processing of electronic product is constantly towards signal transmission high frequency and the side of high-speed digitization
To development.There is good signal transmission quality simultaneously under conditions of high frequency signal transmission to ensure electronic product, need
In impedance matching condition between transmission line and its electronic component connected in the copper-foil conducting electricity of flexible PCB, avoid making
Into phenomena such as signal reflex, scattering, attenuation and delay.Jie of the material for the glue-line being in contact in flexible PCB with conducting wire
Electric constant is the one of which factor for influencing high-frequency transmission impedance matching.In order to realize high frequency signal transmission impedance matching, glue-line
Usually require the relatively low material of selection dielectric constant.
The glue-line in flexible PCB is generally using the hybrid epoxidized resin of nitrile rubber and phenols, amine or anhydride at present
It is formed by curing after curing agent reaction, however, the high polar groups such as C ≡ N ,-OH ,-COOH are included in this based resin composition structure,
Dielectric constant all higher than more than 3.0, causes flexible PCB to be unable to reach high frequency signal transmission impedance matching, affects signal biography
Defeated high frequency and high-speed digitization.
Invention content
In view of this, it is necessary to which a kind of resin combination of low-k is provided.
A kind of film using the resin combination is provided in addition, there is a need to.
Circuit board made from a kind of application resin combination is provided in addition, there is a need to.
A kind of resin combination, including Styrene-Butadiene-Styrene Block Copolymer, organic peroxide and profit
Lubrication prescription, in the resin combination, the content of the Styrene-Butadiene-Styrene Block Copolymer is 100 parts by weight, this is organic
The content of peroxide is 0.1~10 parts by weight, and the content of the lubricant is 0.01~5 parts by weight.
A kind of film using the resin combination including resin layer and is incorporated into a resin layer at least surface
Release film, the material of the resin layer is the resin combination.
Circuit board made from a kind of application resin combination, including circuit board and is incorporated into the circuit board extremely
The glue-line on a few surface, the glue-line is toasted rear obtained by the resin combination, when resin combination is baked, resin group
The vinyl of Styrene-Butadiene-Styrene Block Copolymer and the peroxy-radical of organic peroxide in object is closed to react
And it is bonded.
The resin combination of the present invention includes Styrene-Butadiene-Styrene Block Copolymer, organic peroxide and profit
Lubrication prescription, the dielectric constant D of the resin combinationkLess than 2.45, dielectric absorption DfLess than 0.011, so as to make by the resin combination
The glue-line of circuit board obtained has relatively low dielectric constant, and then makes letter of the circuit board with high frequency and high-speed digitization
Number transmission performance.In addition, when the resin combination is used to prepare the glue-line of circuit board, in processing procedure is toasted, the resin combination
The vinyl of Styrene-Butadiene-Styrene Block Copolymer in object and the peroxide root of organic peroxide can react
And be bonded, the network of chemical crosslinking is formed, the crosslink density of the resin combination can be further improved, so as to be conducive to keep away
Exempt from the cross-linked network structure failure of the Styrene-Butadiene-Styrene Block Copolymer in the solder of subsequent circuit board,
Therefore, the glue-line of the circuit board as made from the resin combination has preferable heat resistance, is suitable for the heat resistance of circuit board
Demand.
Specific embodiment
Better embodiment of the present invention provides a kind of resin combination, is mainly used for the base material of circuit board, glue-line or covers
In epiphragma.The resin combination includes Styrene-Butadiene-Styrene Block Copolymer (SBS), organic peroxide and lubrication
Agent.The SBS has low-k (2.4~2.5), and has vinyl on the molecular side chain of the SBS, which can be
Temperature reacts with the peroxy-radical of organic peroxide and is bonded (when temperature is about 180~250 DEG C) when increasing.
In the resin combination, the content of the SBS is 100 parts by weight, and the content of the organic peroxide is 0.1
~10 parts by weight, the content of the lubricant is 0.01~5 parts by weight.
The dielectric constant D of the resin combinationkLess than 2.45, dielectric absorption DfLess than 0.011.
The SBS is preferably model Kraton D 1101, Kraton D 1116, Taipol 3201, Kraton
The SBS of DX405 or Taipol 3206.
The organic peroxide is the exothermal peak that is measured using differential scanning calorie meter DSC in 100~200 DEG C of ranges
Interior organic peroxide.The organic peroxide is selected from diacyl peroxide, peroxy ketal, peroxycarbonates, mistake
One or more of oxygen ester, ketone peroxide, dialkyl peroxide and hydroperoxides.Wherein, the diacyl peroxidating
Object include but not limited to different nonyl acyl peroxide, decanol peroxide, lauroyl peroxide, to chlorobenzene formacyl mistake
One or more of oxide and two (3,5,5- trimethyl acetyls base) peroxide.The peroxy ketal includes but not limited to
2,2- bis- (4,4- bis--(two-third butyl peroxy) cyclohexyl) propane.The peroxycarbonates include but not limited to two -3-
One or both of methoxybutyl peroxydicarbonate and dicyclohexyl peroxydicarbonate.The peroxy esters include but unlimited
In third butyl peroxy benzoic ether, third butyl peroxy acetic acid esters, third butyl peroxy -2 ethyl hexanoic acid ester, third butyl
Peroxide isobutyrate, third butyl peroxy valerate, third butyl diperoxy adipate ester, cumenyl peroxide neodecanoic acid ester,
Two (benzene of third butyl peroxy benzoic ether, 1,1,3,3- tetramethyls peroxy -2 ethyl hexanoic acid ester and 2,5- dimethyl -2,5-
One or more of formoxyl peroxy) hexane.The ketone peroxide include but not limited to methyl-ethyl-ketone peroxide and
One or both of Cyclohexanone peroxides.The dialkyl peroxide include but not limited to two-third butylperoxide,
Diisopropylbenzyl peroxide, third butyl cumyl peroxide, 1,1- bis- (third hexyl peroxy) -3,3,5- front threes
One or more of butylcyclohexane, two-third hexyl peroxide and two (2- third butyl peroxies isopropyl) benzene.The hydrogen
Peroxide includes but not limited in isopropylbenzene hydroxyl peroxide, tert-butyl hydroperoxide and p- terpane hydrogen peroxide
One or more.When being heated to 180~250 DEG C, peroxy-radical and the vinyl on SBS side chains of the organic peroxide
It can react and be bonded, form the network structure of chemical crosslinking, the crosslinking that can further improve the resin combination is close
Degree.
Preferably, the organic peroxide is selected from one or both of peroxy esters and dialkyl peroxide.It is more excellent
Choosing, the organic peroxide is selected from third butyl peroxy benzoic ether, 1,1,3,3- tetramethyl butyl peroxy -2- second
One or more of base capronate and two (2- third butyl peroxies isopropyl) benzene.The is selected from the organic peroxide
Tributyl peroxy benzoic ether, 1,1,3,3- tetramethyl butyls peroxy -2 ethyl hexanoic acid ester and two (2- third butyl peroxies
Base isopropyl) one or more of benzene when, obtained resin combination is with the exothermal peak that DSC is measured in 120~180 DEG C of models
In enclosing.
The lubricant includes but not limited to paraffin, polyethylene wax (PE waxes), fatty acid amide, aliphatic acid, fatty amine, tristearin
One or more of sour zinc, calcium stearate and magnesium stearate.The crosslinking that the lubricant is used to adjust the resin combination is close
Degree, and make the glue-line formed by the resin combination or cover film more smooth.
The resin combination further includes one or more of filler, fire retardant and ion capturing agent.When the tree
When oil/fat composition includes filler, content of the filler in the resin combination is 1~100 parts by weight.When described
When resin combination includes fire retardant, the content of the fire retardant is 10~100 parts by weight.When the resin combination include from
During sub- agent for capturing, content of the ion capturing agent in the resin combination is 0.5~10 parts by weight.
The filler is inorganic filler, and it is (molten state, non-melt which includes but not limited to silica
State, Porous or hollow type), aluminium oxide, aluminium hydroxide, magnesia, magnesium hydroxide, calcium carbonate, aluminium nitride, boron nitride, carbonization
Aluminium silicon, silicon carbide, sodium carbonate, titanium dioxide, zinc oxide, zirconium oxide, quartz, graphite, magnesium carbonate, potassium titanate, mica, phosphoric acid
One or more of calcium, talcum, silicon nitride, kaolin and barium sulfate.The inorganic filler can also be barium sulfate powder
Or the inorganic particle particle with organic shell layer.
The fire retardant includes but not limited to phosphate compounds and nitrogenous phosphate compounds.More specifically, it is fire-retardant
Agent includes bis-phenol biphenyl phosphate (bisphenol diphenyl phosphate), ammonium polyphosphate (ammonium
Polyphosphate), hydroquinone-bis--(biphenyl based phosphates) (hydroquinone bis- (diphenyl
Phosphate)), front three based phosphates (trimethyl phosphate, TMP), dimethyl-methyl phosphate (dimethyl
Methyl phosphonate, DMMP), resorcinol bis-xylene based phosphates (resoreinol
Dixylenylphosphate, RDXP), polyphosphoric acid melamine (melamine polyphosphate), even phosphorus-nitrogen compound,
And miscellaneous -10- phosphorus phenanthrene -10- oxides (the 9,10-dihydro-9-oxa-10- of 9,10- dihydro-9-oxies
One or more of phosphaphenanthrene-10-oxide, DOPO).
The ion capturing agent includes but not limited to aluminosilicate, hydrated metal oxide, polyvalent metal hydrochlorate and miscellaneous
One or more of polyacid.Wherein, which includes but not limited to Sb2O5·2H2O and Bi2O3·nH2In O
It is one or two kinds of；The polyvalent metal hydrochlorate includes but not limited to Zr (HPO4)2·H2O and Ti (HPO4)2·H2One kind in O or
Two kinds；The heteropoly acid includes but not limited to (NH4)3Mo12(PO4)40·nH2O)、Ca10(PO4)6(OH)2And MgAl (CO3)
(OH)·nH2One or more of O.
The preparation method of the resin combination can be：By SBS, organic peroxide and additive according to scheduled ratio
It adds in into reaction bulb, suitable solvent is added in into reaction bulb, be mixed, make SBS, organic peroxide and additive molten
Solution obtains the resin combination in solvent.Wherein, which can be toluene.The addition of toluene can be as needed
It changes, as long as the SBS, organic peroxide and additive is enable to be completely dissolved.In the present embodiment, institute
The viscosity for stating toluene is more than 4000cps, melt flow index (MI) less than 1g/10min.
The present invention also provides one kind film as made from above-mentioned resin combination, which includes resin layer and is incorporated into this
The release film on a resin layer at least surface.The resin combination by being coated in the surface of release film, then pass through by the resin layer
It is made after the dry evaporation of the solvent made in resin combination.
The present invention also provides one kind circuit boards as made from above-mentioned film, including circuit board and are incorporated into the circuit base
The glue-line on a plate at least surface.The glue-line is removed release by the way that the resin layer of the film to be fitted in the surface of circuit board
Film, then be made through 180~250 DEG C of bakings.Because the resin combination has relatively low dielectric constant, therefore by the circuit of its making
The glue-line of plate also has relatively low dielectric constant.Additionally, it is also well known that the molecular configuration of SBS is the triblock copolymer of A-B-A types
Object, polystyrene block is scattered in butadiene or ethylene-butylene elastomer block, and elastomeric blocks are connected into physics
Crosslinked network structure, at temperature higher (such as 100 DEG C or more), the network structure of physics interlinkage easily fails.And this hair
During the resin layer that the bright resin combination is formed is baked, vinyl on SBS side chains in resin layer with
The peroxy-radical of organic peroxide occurs chemical reaction and is bonded together, and forms the network structure of chemical crosslinking, Neng Goujin
One step improves the crosslink density of the resin combination, so as to obtain with the stronger glue-line of the adhesion of circuit board, follow-up
Conventional circuit board solder in, the network structure of the chemical crosslinking in the glue-line will not fail, therefore, by the tree
The glue-line of circuit board made from oil/fat composition has preferable heat resistance, is suitable for the heat resistance demand of circuit board.
The present invention is specifically described below by embodiment.
Embodiment 1
100g SBS (manufacturers are sequentially added in 1000ml reaction bulbs：Section of the U.S. rises, model：Kraton D1101)、4g
Paraffin, 1g bis- (2- third butyl peroxies isopropyl) benzene, 5g Ti (HPO4)2·H2O, 440g toluene, stirring and dissolving are configured
Complete resin combination.
Embodiment 2
100g SBS (manufacturers are sequentially added in 1000ml reaction bulbs：Section of the U.S. rises, model：Kraton D1116)、4g
Paraffin, 1g bis- (2- third butyl peroxies isopropyl) benzene, 5g Ti (HPO4)2·H2O, 440g toluene, stirring and dissolving are configured
Complete resin combination.
Embodiment 3
100g SBS (manufacturers are sequentially added in 1000ml reaction bulbs：Platform rubber, model：Taipol 3201), 4g paraffin,
1g bis- (2- third butyl peroxies isopropyl) benzene, 5g Ti (HPO4)2·H2O, 440g toluene, stirring and dissolving are configured and complete tree
Oil/fat composition.
Embodiment 4
100g SBS (manufacturers are sequentially added in 1000ml reaction bulbs：Section of the U.S. rises, model：Kraton DX405)、4g
Paraffin, 1g bis- (2- third butyl peroxies isopropyl) benzene, 5g Ti (HPO4)2·H2O, 440g toluene, stirring and dissolving are configured
Complete resin combination.
Embodiment 5
100g SBS (manufacturers are sequentially added in 1000ml reaction bulbs：Platform rubber, model：Taipol 3206), 4g paraffin,
1g bis- (2- third butyl peroxies isopropyl) benzene, 5g Ti (HPO4)2·H2O, 440g toluene, stirring and dissolving are configured and complete tree
Oil/fat composition.
Comparative example 1
100g SEBS (manufacturers are sequentially added in 1000ml reaction bulbs：Section of the U.S. rises, model：Kraton G1641)、4g
Paraffin, 1g bis- (2- third butyl peroxies isopropyl) benzene, 5g Ti (HPO4)2·H2O, 440g toluene, stirring and dissolving.
Comparative example 2
40g carboxylated nitrile rubbers are dissolved in the methyl iso-butyl ketone (MIBK) (MIBK) of 160g, are configured to 20% rubber solutions.
Sequentially added in 1000ml reaction bulbs 100g phosphorous epoxy resins, 26g phenolic resin, 90g aluminium hydroxides, 10g talcum powder,
0.2g catalyst (models：2E4MI).Then the MIBK solution of the carboxylated nitrile rubbers of 200g is added in previous reaction bottle.Its
In, the product that comparative example 2 obtains is commonly used for preparing the glue-line of circuit board in the art.
To the dielectric constant D of the resin combination prepared by Examples 1 to 5 and the product prepared by comparative example 1~2k
With dielectric absorption DfIt is tested respectively.Then, include copper using copper foil and polyimides (Polyimide, PI) film preparation
The circuit board of foil and coating uses the resin combination prepared by Examples 1 to 5 and the group prepared by comparative example 1~2
It closes object and prepares film respectively, the glue-line on the surface for being incorporated into circuit board of circuit board is prepared using the film, then to the tool
The circuit board for having glue-line, which carries out the test of drift tin heat resistance, copper-stripping strength test and PI peel strength tests, testing result, asks
With reference to the performance detection data of table one.Wherein, if drift tin heat resistance test condition is more than or equal to 260 DEG C of 10sec, tin does not take off
It falls, then floats tin heat resistance test result for " passing through ", show that circuit board reaches the demand of heat resistance.
Table one：Resin combination of the glue-line material prepared by Examples 1 to 5 and the product prepared by comparative example 1~2
Circuit board performance detection data
It can be seen from table one compared to comparative example 1 prepared by product, the resin combination of the embodiment of the present invention 1~3
Obtained circuit board has preferably heat resistance.Compared to the composition prepared by comparative example 2,1~5 institute of the embodiment of the present invention
The resin combination of preparation has relatively low dielectric constant DkAnd relatively low dielectric absorption Df.In addition, compared to comparative example 1 is used
Product prepared by~2 prepares the glue-line of circuit board, and circuit board is prepared using the resin combination prepared by Examples 1 to 5
After glue-line, the circuit board has preferable peel strength of copper foil and PI peel strengths simultaneously.
In addition, though glue-line made from the resin combination of embodiment 4~5 is not tested by heat resistance, embodiment 4~5
Resin combination have relatively low dielectric constant DkAnd relatively low dielectric absorption Df, the resin combination of embodiment 4~5 is made
Glue-line there is preferable peel strength of copper foil and PI peel strengths, still can be applied to not need to the circuit board of scolding tin
Glue-line in.
The resin combination of the present invention includes SBS, organic peroxide and additive, the dielectric constant of the resin combination
DkLess than 2.45, dielectric absorption DfIt is relatively low so as to have the glue-line of the circuit board as made from the resin combination less than 0.011
Dielectric constant, and then make the circuit board that there is the signal transmission performance of high frequency and high-speed digitization.In addition, using the tree
When oil/fat composition prepares circuit board, in processing procedure is toasted, the vinyl of the SBS in the resin combination and organic peroxide
Peroxide root can react and be bonded, and form the network of chemical crosslinking, can further improve the crosslinking of the resin combination
Density, so as to which the cross-linked network structure for being conducive to avoid the SBS in the solder of subsequent circuit board fails, therefore, by institute
The glue-line for stating circuit board made from resin combination has preferable heat resistance, is suitable for the heat resistance demand of circuit board.
Claims (10)
1. a kind of resin combination, it is characterised in that：The resin combination includes s-B-S block copolymerization
Object, organic peroxide and lubricant, in the resin combination, the content of the Styrene-Butadiene-Styrene Block Copolymer
For 100 parts by weight, the content of the organic peroxide is 0.1~10 parts by weight, and the content of the lubricant is 0.01~5 weight
Part.
2. resin combination as described in claim 1, it is characterised in that：The s-B-S block copolymerization
In the model Kraton D1101 of object, Kraton D1116, Taipol 3201, Kraton DX405 and Taipol 3206
One or more.
3. resin combination as described in claim 1, it is characterised in that：The organic peroxide is selected from diacyl peroxidating
One in object, peroxy ketal, peroxycarbonates, peroxy esters, ketone peroxide, dialkyl peroxide and hydroperoxides
Kind is several, wherein, which is selected from different nonyl acyl peroxide, decanol peroxide, lauroyl mistake
Oxide, to one or more of chlorobenzoyl peroxide and two (3,5,5- trimethyl acetyls base) peroxide；It should
Peroxy ketal is selected from 2,2- bis- (4,4- bis--(two-third butyl peroxy) cyclohexyl) propane；The peroxycarbonates are selected from
One or both of two -3- methoxybutyls peroxydicarbonates and dicyclohexyl peroxydicarbonate；The peroxy esters are selected from
Third butyl peroxy benzoic ether, third butyl peroxy acetic acid esters, third butyl peroxy -2 ethyl hexanoic acid ester, third butyl mistake
Oxygen isobutyrate, third butyl peroxy valerate, third butyl diperoxy adipate ester, cumenyl peroxide neodecanoic acid ester,
Two (benzene first of tributyl peroxy benzoate, 1,1,3,3- tetramethyls peroxy -2 ethyl hexanoic acid ester and 2,5- dimethyl -2,5-
One or more of acyl group peroxy) hexane；The ketone peroxide is selected from methyl-ethyl-ketone peroxide and cyclohexanone peroxide
One or both of compound；The dialkyl peroxide is selected from two-third butylperoxide, diisopropylbenzyl peroxidating
Object, third butyl cumyl peroxide, 1,1- bis- (third hexyl peroxy) -3,3,5- trimethyl-cyclohexanes, two-third
One or more of hexyl peroxide and two (2- third butyl peroxies isopropyl) benzene；The hydroperoxides are selected from isopropyl
One or more of benzene hydroxyl peroxide, tert-butyl hydroperoxide and p- terpane hydrogen peroxide.
4. resin combination as described in claim 1, it is characterised in that：The lubricant is selected from paraffin, polyethylene wax, fat
One or more of amide, aliphatic acid, fatty amine, zinc stearate, calcium stearate and magnesium stearate.
5. resin combination as described in claim 1, it is characterised in that：The resin combination further includes filler, fire-retardant
One or more of agent and ion capturing agent, in the resin combination, the content of the filler is 1~100 weight
Part, the content of the fire retardant is 10~100 parts by weight, and the content of the ion capturing agent is 0.5~10 parts by weight.
6. resin combination as claimed in claim 5, it is characterised in that：The filler is inorganic filler, this is inorganic to fill out
It fills object and is selected from silica, aluminium oxide, aluminium hydroxide, magnesia, magnesium hydroxide, calcium carbonate, aluminium nitride, boron nitride, aluminium carbide
Silicon, silicon carbide, sodium carbonate, titanium dioxide, zinc oxide, zirconium oxide, quartz, graphite, magnesium carbonate, potassium titanate, mica, calcium phosphate,
One or more of talcum, silicon nitride, kaolin and barium sulfate.
7. resin combination as claimed in claim 5, it is characterised in that：Fire retardant is selected from phosphate compounds and nitrogenous phosphoric acid
Salt compound, the fire retardant include bis-phenol biphenyl phosphate, ammonium polyphosphate, hydroquinone-bis--(biphenyl based phosphates), front three
Based phosphates, dimethyl-methyl phosphate, resorcinol bis-xylene based phosphates, polyphosphoric acid melamine, even phosphorous nitride close
One or more of object and the miscellaneous -10- phosphorus phenanthrene -10- oxides of 9,10- dihydro-9-oxies.
8. resin combination as claimed in claim 5, it is characterised in that：The ion capturing agent is selected from aluminosilicate, hydration
Metal oxide, polyvalent metal hydrochlorate, heteropoly acid, wherein, which is selected from Sb2O5·2H2O and Bi2O3·nH2O
One or both of；The polyvalent metal hydrochlorate is selected from Zr (HPO4)2·H2O and Ti (HPO4)2·H2One kind in O or two
Kind；The heteropoly acid is selected from (NH4)3Mo12(PO4)40·nH2O)、Ca10(PO4)6(OH)2And MgAl (CO3)(OH)·nH2In O
It is one or more of.
9. a kind of film, including resin layer and it is incorporated into the release film on a resin layer at least surface, it is characterised in that：The tree
The material of lipid layer is the resin combination described in claim 1~8 any one.
10. a kind of circuit board, including circuit board and the glue-line on a circuit board at least surface is incorporated into, feature exists
In：The glue-line is toasted rear obtained as the resin combination described in claim 1~8 any one, is dried in resin combination
When roasting, the vinyl of Styrene-Butadiene-Styrene Block Copolymer and the peroxy of organic peroxide in resin combination
Group reacts and is bonded.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201611095250.3A CN108148335A (en) | 2016-12-02 | 2016-12-02 | The film and circuit board of resin combination and the application resin combination |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201611095250.3A CN108148335A (en) | 2016-12-02 | 2016-12-02 | The film and circuit board of resin combination and the application resin combination |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109370141A (en) * | 2018-08-31 | 2019-02-22 | 苏州益可泰电子材料有限公司 | The electronics composite substrate that a kind of thermosetting property electronics composite material and preparation method are prepared with it |
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