CN108153452A - The cover board and its manufacturing process of In-cell touch panel - Google Patents
The cover board and its manufacturing process of In-cell touch panel Download PDFInfo
- Publication number
- CN108153452A CN108153452A CN201810128513.9A CN201810128513A CN108153452A CN 108153452 A CN108153452 A CN 108153452A CN 201810128513 A CN201810128513 A CN 201810128513A CN 108153452 A CN108153452 A CN 108153452A
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- fpc
- key circuit
- ink
- cover board
- insulating layer
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Push-Button Switches (AREA)
Abstract
The invention discloses the cover plate assemblies of In-cell touch panel, including cover board, key circuit, insulating layer and FPC, key circuit is printed on the ink layer in BM areas of cover board, and insulating layer is printed on ink layer and covers key circuit, and FPC is fitted on insulating layer and is electrically connected with key circuit；Key hole is correspondingly provided on folded key circuit, insulating layer and the FPC set.Also disclose the manufacturing process based on carrier board component：Silver ink is printed on the cover board and is toasted obtains key circuit；It prints dielectric ink and toasts and obtain insulating layer；It is bonded FPC on the insulating layer, and the connector of key circuit and FPC are bound.Key circuit is printed on the ink layer in BM areas of cover board, with good adhesion, insulating layer is printed on the ink layer in BM areas of cover board, with good adhesion, it prevents key circuit from being removed with cover board and key circuit is protected, also FPC is enable to be stacked and placed in key circuit, suitable for embedded structure touch screen, there is good touch performance.
Description
Technical field
The invention belongs to touch screen fields, and in particular to the cover board and its manufacturing process of In-cell touch panel.
Background technology
The development of mobile phone is increasingly intended to embedded (On-cell/In-cell) touch screen, Touch Sensor (contacts
Sensor) it is made in display module.
Traditional membrane structure (GF/GFF etc.) touch screen, ITO Film (i.e. ito thin film) coverings are by key mapping, directly by visible area
Same ITO Film is made in Touch Sensor at button, is individually drawn without FPC (flexible circuit board).
In-cell touch panel realizes on touch function difficult point occur in mobile phone lower end button, can not replicate traditional membrane structure and touch
The button scheme of screen is touched, because In-cell touch panel Touch Sensor are made in display module, without using ITO Film
Cover board is fitted in, button Touch Sensor can not be integrally formed with visible area Touch Sensor, lead to button Touch
Sensor need to be fabricated separately, and can not be integrally formed with form Touch Sensor；However the button Touch being fabricated separately
Sensor, complicated, stability is poor, it is difficult to ensure to touch performance.
Invention content
One of the objects of the present invention is to provide a kind of cover plate assembly of In-cell touch panel, to solve to deposit in the prior art
The touch performance for being difficult to ensure that In-cell touch panel the technical issues of.
In order to solve the above technical problems, the cover plate assembly of In-cell touch panel of the present invention the technical solution adopted is that：
The cover plate assembly of In-cell touch panel, including cover board, the cover board has visible area and is printed with the BM areas of ink,
The ink layer in the BM areas is equipped with key circuit, insulating layer and FPC；The key circuit is printed on the ink layer；Institute
It states insulating layer to be printed on the ink layer and cover the key circuit, and exposes the connector of the key circuit；The FPC
It fits on the insulating layer, and the FPC is electrically connected with the connector of the key circuit；The folded key circuit set, institute
State the key hole being correspondingly provided on insulating layer and the FPC for light transmission instruction key area position.
Further, light guiding film and photomask are further included, the light guiding film is fitted on the FPC, and the light guiding film
On sidelight LED light can the key hole be illuminated by the light guiding film；The photomask is fitted in the light guiding film.
Further, the key circuit is elargol circuit.
The advantageous effect of the cover plate assembly of In-cell touch panel provided by the invention is：Key circuit and FPC are set on
On the ink layer in BM areas, key circuit is individually printed on the ink layer of cover board, has good adhesive force, and insulating layer is printed in
On the ink layer of cover board, not only with good adhesive force, but also it can prevent key circuit from being removed with cover board, and can be to key wire
Road is protected, while key circuit and FPC can also be isolated so that FPC can be stacked and placed in key circuit, by key circuit
Connector is electrically connected with FPC, and FPC is plugged in external touch IC during use, you can touch function is realized, suitable for embedded structure
Touch screen；Key hole is reserved with, light source irradiation key hole is facilitated to indicate key area position.
The second object of the present invention is to provide a kind of manufacturing process of the cover plate assembly of In-cell touch panel, existing to solve
There is the technical issues of touch performance for being difficult to ensure that In-cell touch panel deposited in technology.
In order to solve the above technical problems, the manufacturing process of In-cell touch panel of the present invention the technical solution adopted is that：
Based on the manufacturing process of carrier board component, including the following steps carried out successively：
Prepare the cover board；
Silver ink is printed on the ink layer of the cover board, the silver ink is toasted and obtains the key circuit；
Dielectric ink is printed on the cover board, the dielectric ink is toasted and obtains the insulating layer；
The FPC is bonded on the insulating layer；
The connector of the key circuit and the FPC are bound.
Further, the print thickness of the silver ink is 6-12 μm；
The temperature for toasting the silver ink is 140 ± 5 DEG C, and the time is 60 ± 5min.
Further, the print thickness of the dielectric ink is 6-18 μm；
The temperature for toasting the dielectric ink is 120 ± 5 DEG C, and the time is 30 ± 5min.
Further, the step of connector of the key circuit being bound with the FPC be：
Anisotropy conductive hot melt adhesive tape is pressed on the cover board, and described in anisotropy conductive hot melt adhesive tape connection
The pin of the connector of key circuit and the FPC, the temperature for pressing the anisotropy conductive hot melt adhesive tape are 150 ± 5 DEG C.
Further, the grain size of the conducting particles of the anisotropy conductive hot melt adhesive tape is the printing width of the silver ink
0.09-0.11 times.
Further, the printing width of the silver ink is 100 ± 4 μm, the conduction of the anisotropy conductive hot melt adhesive tape
The grain size of particle is 10 ± 0.5 μm.
Further, the following steps for carrying out the connector of the key circuit and FPC bindings later are additionally included in：
Light guiding film is bonded on the FPC；
Photomask is bonded in the light guiding film.
The advantageous effect of the manufacturing process of the cover plate assembly of In-cell touch panel provided by the invention is：Pass through printer
Ink layer printing elargol ink, dielectric ink of the skill in the BM areas of cover board obtain key circuit and insulating layer, then are bonded FPC, energy
The ink layer in BM areas is enough avoided to be damaged；Successively setting button circuit, insulating layer and FPC ensure that key circuit, insulating layer can be steady
Fixed is attached on cover board, and also has good binding force between insulating layer and key circuit, and insulation interlayer is in key circuit
Between FPC, key circuit can be protected, flexible circuit board can be set on the insulating layer, by the connector and FPC of key circuit
Binding, you can touch function is realized by FPC grafting external touch IC, it is simple in structure, compact, it is simple for process, be conducive to protecting
Cost is reduced under the premise of demonstrate,proving the embedded touch performance for touching structure.
Description of the drawings
Fig. 1 is that the cover plate assembly of In-cell touch panel provided in an embodiment of the present invention is illustrated in the section in cover sheet thickness direction
Figure；
Fig. 2 is the cover board of the cover plate assembly of In-cell touch panel provided in an embodiment of the present invention on cover sheet thickness direction
Schematic cross-section；
Fig. 3 is the structure diagram of the cover plate assembly of In-cell touch panel provided in an embodiment of the present invention；
Fig. 4 is the structure diagram of the cover board of the cover plate assembly of In-cell touch panel provided in an embodiment of the present invention；
Fig. 5 is the structure diagram of the key circuit of the cover plate assembly of In-cell touch panel provided in an embodiment of the present invention；
Fig. 6 is the structure diagram of the insulating layer of the cover plate assembly of In-cell touch panel provided in an embodiment of the present invention；
Fig. 7 is the structure diagram of the FPC of the cover plate assembly of In-cell touch panel provided in an embodiment of the present invention；
Fig. 8 is the structure diagram of the light guiding film of the cover plate assembly of In-cell touch panel provided in an embodiment of the present invention；
Fig. 9 is the structure diagram of the photomask of the cover plate assembly of In-cell touch panel provided in an embodiment of the present invention.
Wherein：1- cover boards；11- visible areas；12-BM areas；On 121 ink layers；2- key circuits；21- connectors；3- insulate
Layer；4-FPC；5- light guiding films；6- photomasks.
Specific embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to the accompanying drawings and embodiments, it is right
The present invention is further elaborated.It should be appreciated that specific embodiment described herein is only used to explain the present invention, not
For limiting the present invention.
Also referring to Fig. 1 to Fig. 9, now the cover plate assembly of In-cell touch panel provided by the invention is illustrated.It is interior
The cover plate assembly of embedded touch screen, including cover board 1, cover board 1 has visible area 11 and is printed with the BM areas 12 of ink, BM areas 12
Ink layer 121 is equipped with key circuit 2, insulating layer 3 and FPC 4；Key circuit 2 is printed on the ink layer 121 of cover board 1；Absolutely
Edge layer 3 is printed on the ink layer 121 of cover board 1 and covers key circuit 2, and exposes the connector 21 of key circuit 2；FPC 4 is pasted
Together on insulating layer 3, and FPC 4 is electrically connected with the connector 21 of key circuit 2；Folded key circuit 2, insulating layer 3 and the FPC 4 set
On be correspondingly provided with for light transmission instruction key area position key hole.
The cover plate assembly of In-cell touch panel provided by the invention, compared with prior art, by key circuit 2 and FPC 4
Ink layer 121 set on BM areas 12, key circuit 2 are individually printed on the ink layer 121 of cover board 1, have good adhesive force,
Insulating layer 3 is printed on the ink layer 121 of cover board 1, not only with good adhesive force, but also can prevent key circuit 2 and cover board 1
Stripping, and key circuit 2 can be protected, while key circuit 2 and FPC 4 can also be isolated so that FPC 4 can be stacked
In in key circuit 2, the connector 21 of key circuit 2 with FPC 4 is electrically connected, FPC 4 is plugged in external touch IC during use,
Touch function can be realized, there is good touch performance, suitable for embedded structure touch screen, can be applied to mobile phone or tablet
Computer etc.；Key hole is reserved with, light source irradiation key hole is facilitated to indicate key area position.
Further, it please refers to Fig.1 and Fig. 3, one kind of the cover plate assembly as In-cell touch panel provided by the invention
Specific embodiment further includes light guiding film 5 and photomask 6, and light guiding film 5 is fitted on FPC 4, and the side view LED in light guiding film 5
Lamp can illuminate key hole by light guiding film 5；Photomask 6 is fitted in light guiding film 5.Wherein, light guiding film 5 has sidelight LED light,
It is the prior art that can illuminate key hole by light guiding film 5, the structure of light guiding film that details are not described herein again 5.Equipped with key circuit 2
On the cover board 1 of FPC 4, light guiding film 5 and photomask 6, light guiding film 5 is set to be contacted with 4 faces of FPC, photomask 6 can be leaded light
The back side shading of film 5 not only ensure that structural stability, but also can illuminate key hole, while avoid light leakage have good use
Performance.
Specifically, key circuit 2 is elargol circuit, and elargol circuit has with the ink layer 121 in BM areas 12 preferably to be matched
Property, ensure elargol circuit in the good adhesion on cover board 1.
Specifically, key circuit 2 includes key legend circuit and lead line, and key legend circuit is drawn for touching
Circuit is used to connect FPC 4.
Now the manufacturing process of the cover plate assembly of In-cell touch panel provided by the invention is illustrated.1 component of cover board
Manufacturing process, including the following steps carried out successively：
Prepare cover board 1 (also referring to Fig. 2 and Fig. 4)；
Print silver ink on the ink layer 121 of cover board 1, baking silver ink obtain key circuit 2 (also referring to Fig. 1,
Fig. 3 and Fig. 5)；
Dielectric ink is printed on cover board 1, baking dielectric ink obtains insulating layer 3 (also referring to Fig. 1, Fig. 3 and figure
6)；
Fitting FPC 4 on the insulating layer 3 (also referring to Fig. 1, Fig. 3 and Fig. 7)；
The connector 21 and FPC 4 of key circuit 2 is bound.
Key wire is obtained by ink layer 121 printing elargol ink, dielectric ink of the printing technology in the BM areas 12 of cover board 1
Road 2 and insulating layer 3, then FPC 4 is bonded, the ink layer 121 that can avoid BM areas 12 is impaired；Successively setting button circuit 2, insulation
Layer 3 and FPC 4, what guarantee key circuit 2, insulating layer 3 can be stablized is attached on cover board 1, and insulating layer 3 and key circuit 2
Between also there is good binding force, between insulating layer 3 between key circuit 2 and FPC 4, key circuit 2, FPC can be protected
4 can be set on the insulating layer 3, and the connector 21 and FPC 4 of key circuit 2 is bound, you can pass through 4 grafting external touch of FPC
IC realizes touch function, has good touch performance, simple in structure, compact, simple for process, is conducive to ensureing embedded touch
Cost is reduced under the premise of the touch performance for touching structure.
Specifically, a kind of specific implementation as the manufacturing process of the cover plate assembly of In-cell touch panel provided by the invention
Mode,
Silver ink is printed on cover board 1, the thickness of silver ink is 6-12 μm；
Silver ink is toasted, baking temperature is 140 ± 5 DEG C, and the time is 60 ± 5min；
Be conducive to improve the adhesive force of key circuit 2, ensure that key circuit 2 is more than 4B in the adhesive force on cover board 1.
Further, a kind of specific reality as the manufacturing process of the cover plate assembly of In-cell touch panel provided by the invention
Apply mode,
The print thickness of dielectric ink is 6-18 μm；
The temperature for toasting dielectric ink is 120 ± 5 DEG C, and the time is 30 ± 5min；
Be conducive to improve the adhesive force of insulating layer 3, ensure that insulating layer 3 is more than in the adhesive force on cover board 1, ammonium key circuit
4B。
Further, a kind of specific reality as the manufacturing process of the cover plate assembly of In-cell touch panel provided by the invention
The step of applying mode, the connector 21 and FPC 4 of key circuit 2 is bound be：
Anisotropy conductive hot melt adhesive tape is pressed on cover board 1, and anisotropy conductive hot melt adhesive tape connection key circuit 2
The pin of connector 21 and FPC 4, the temperature of pressing anisotropy conductive hot melt adhesive tape is 150 ± 5 DEG C.Anisotropy conductive hot melt adhesive tape
Unilateal conduction and glued fixed function are had both, microscopic wire can be connected, button is bound using anisotropy conductive hot melt adhesive tape
The connector 21 of circuit 2 and the pin of FPC 4, can ensure the reliability that key circuit 2 is connect with FPC 4；Pressing-in temp controls
At 150 ± 5 DEG C, can either ensure to be reliably connected key circuit 2 and pin, and ink layer 121, the button in BM areas 12 can be avoided
Circuit 2, insulating layer 3 and FPC 4 are damaged.
Specifically, 0.09- of the grain size of the conducting particles of anisotropy conductive hot melt adhesive tape for the printing width of silver ink
0.11 times, preferably 0.1 times.Be conducive to improve the electric conductivity of the pin junction of the connector 21 and FPC 4 of key circuit 2, protect
Demonstrate,prove good touch-control performance.
Specifically, a kind of specific implementation as the manufacturing process of the cover plate assembly of In-cell touch panel provided by the invention
Mode, the printing width of silver ink is 100 ± 4 μm, and the grain size of the conducting particles of anisotropy conductive hot melt adhesive tape is 10 ± 0.5 μ
m；Contact resistance is advantageously reduced, ensures good touch-control performance.
Further, a kind of specific reality as the manufacturing process of the cover plate assembly of In-cell touch panel provided by the invention
Mode is applied, is additionally included in the following steps that the connector 21 of key circuit 2 and FPC 4 are bound and carried out later：
Light guiding film 5 is bonded on FPC 4；(also referring to Fig. 1, Fig. 3 and Fig. 8)
Photomask 6 is bonded in light guiding film 5 (also referring to Fig. 1, Fig. 3 and Fig. 9).
On the cover board 1 equipped with key circuit 2 and FPC 4, light guiding film 5 and photomask 6, light guiding film 5 and 4 faces of FPC are set
Contact, photomask 6 can be 5 shading of light guiding film, and light is prevented to be emitted towards the back side of light guiding film 5, both ensure that structural stability,
Key hole can be illuminated again, while avoids light leakage, and there is good performance.
Specifically, light guiding film 5 includes PC films and the double faced adhesive tape set on the PC films back side, and transparency is high, and light is stablized, facilitates patch
Together on FPC 4.
Specifically, photomask 6 includes being posted film and set on the black and white photomask for being posted the film back side, and photomask 6 is fitted in
In light guiding film 5, you can be the back side shading of light guiding film, prevent light leakage, when needing, tear and be posted film, reservation is transferred to light guiding film 5
The black and white photomask at the back side.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement made within refreshing and principle etc., should all be included in the protection scope of the present invention.
Claims (10)
1. the cover plate assembly of In-cell touch panel, including cover board, the cover board has visible area and is printed with the BM areas of ink,
It is characterized in that：The ink layer in the BM areas is equipped with key circuit, insulating layer and FPC；The key circuit is printed in the oil
In layer of ink；The insulating layer is printed on the ink layer and covers the key circuit, and exposes connecing for the key circuit
Head；The FPC is fitted on the insulating layer, and the FPC is electrically connected with the connector of the key circuit；It is folded set it is described by
It is correspondingly provided on key circuit, the insulating layer and the FPC for the key hole of light transmission instruction key area position.
2. the cover plate assembly of In-cell touch panel according to claim 1, which is characterized in that further include light guiding film and shading
Film, the light guiding film are fitted on the FPC, and the sidelight LED light in the light guiding film can be illuminated by the light guiding film
The key hole；The photomask is fitted in the light guiding film.
3. the cover plate assembly of In-cell touch panel according to claim 1 or 2, which is characterized in that the key circuit is
Elargol circuit.
4. the manufacturing process of cover plate assembly according to claim 1, which is characterized in that including the following step carried out successively
Suddenly：
Prepare the cover board；
Silver ink is printed on the ink layer of the cover board, the silver ink is toasted and obtains the key circuit；
Dielectric ink is printed on the cover board, the dielectric ink is toasted and obtains the insulating layer；
The FPC is bonded on the insulating layer；
The connector of the key circuit and the FPC are bound.
5. the manufacturing process of cover plate assembly according to claim 4, which is characterized in that the print thickness of the silver ink is
6-12μm；
The temperature for toasting the silver ink is 140 ± 5 DEG C, and the time is 60 ± 5min.
6. the manufacturing process of cover plate assembly according to claim 4, which is characterized in that the print thickness of the dielectric ink
It is 6-18 μm；
The temperature for toasting the dielectric ink is 120 ± 5 DEG C, and the time is 30 ± 5min.
7. the manufacturing process of cover plate assembly according to claim 4, which is characterized in that by the connector of the key circuit with
The step of FPC binding is：
Anisotropy conductive hot melt adhesive tape is pressed on the cover board, and the anisotropy conductive hot melt adhesive tape connects the button
The pin of the connector of circuit and the FPC, the temperature for pressing the anisotropy conductive hot melt adhesive tape are 150 ± 5 DEG C.
8. the manufacturing process of cover plate assembly according to claim 7, which is characterized in that the anisotropy conductive hot melt adhesive tape
Conducting particles 0.09-0.11 times of printing width for the silver ink of grain size.
9. the manufacturing process of cover plate assembly according to claim 8, which is characterized in that the printing width of the silver ink is
100 ± 4 μm, the grain size of the conducting particles of the anisotropy conductive hot melt adhesive tape is 10 ± 0.5 μm.
10. the manufacturing process of cover plate assembly according to claim 4, which is characterized in that be additionally included in the key wire
The following steps that the connector on road carries out later with FPC bindings：
Light guiding film is bonded on the FPC；
Photomask is bonded in the light guiding film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810128513.9A CN108153452A (en) | 2018-02-08 | 2018-02-08 | The cover board and its manufacturing process of In-cell touch panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810128513.9A CN108153452A (en) | 2018-02-08 | 2018-02-08 | The cover board and its manufacturing process of In-cell touch panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108153452A true CN108153452A (en) | 2018-06-12 |
Family
ID=62457261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810128513.9A Pending CN108153452A (en) | 2018-02-08 | 2018-02-08 | The cover board and its manufacturing process of In-cell touch panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108153452A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109471555A (en) * | 2018-10-25 | 2019-03-15 | 惠州Tcl移动通信有限公司 | Touch-control display module and touch control display apparatus, electronic equipment |
| CN109491548A (en) * | 2018-12-29 | 2019-03-19 | 深圳市骏达光电股份有限公司 | The cover plate assembly and its manufacturing process of In-cell touch panel |
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| CN109471555A (en) * | 2018-10-25 | 2019-03-15 | 惠州Tcl移动通信有限公司 | Touch-control display module and touch control display apparatus, electronic equipment |
| CN109491548A (en) * | 2018-12-29 | 2019-03-19 | 深圳市骏达光电股份有限公司 | The cover plate assembly and its manufacturing process of In-cell touch panel |
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Application publication date: 20180612 |