CN108148177A - A kind of preparation method of the incisory high-efficient energy-saving environment friendly resin plate of diamond wire - Google Patents
A kind of preparation method of the incisory high-efficient energy-saving environment friendly resin plate of diamond wire Download PDFInfo
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- CN108148177A CN108148177A CN201810063534.7A CN201810063534A CN108148177A CN 108148177 A CN108148177 A CN 108148177A CN 201810063534 A CN201810063534 A CN 201810063534A CN 108148177 A CN108148177 A CN 108148177A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
- C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
- C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
- C08G18/7671—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups containing only one alkylene bisphenyl group
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2628—Moulds with mould parts forming holes in or through the moulded article, e.g. for bearing cages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4804—Two or more polyethers of different physical or chemical nature
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2007/00—Flat articles, e.g. films or sheets
- B29L2007/002—Panels; Plates; Sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2101/00—Manufacture of cellular products
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2120/00—Compositions for reaction injection moulding processes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2375/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
- C08J2375/04—Polyurethanes
- C08J2375/08—Polyurethanes from polyethers
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention is a kind of preparation method of the incisory high-efficient energy-saving environment friendly resin plate of diamond wire, specifically includes following steps：（1）Two degree of functionality polyethers 204,4110 and two degree of functionality polyethers 330N of tetra functional polyethers are carried out dehydrating in a kettle respectively；（2）（1）Middle addition organotin catalysts, foam stabiliser, foam inhibitor and fire retardant, obtain primary mixture；（3）（2）Masterbatch is mixed to obtain in middle addition packing material glass fiber powder；（4）Prepare curing agent；（5）Masterbatch and curing agent are mixed；（6）Mold is injected, processes to obtain resin plate；Resin plate prepared by the present invention in silicon chip cutting process, can improve product processing efficiency, reduce the environmental pollution that water resource uses, reduces waste generation.
Description
Technical field
The present invention relates to a kind of preparation methods of the incisory high-efficient energy-saving environment friendly resin plate of diamond wire, are mainly used in gold
Firm line slice photoelectric field.
Background technology
Field is sliced by diamond wire, when processing silicon ingot formation silicon chip, a kind of resin plate auxiliary material is needed to be bonded, is cut
Finishing needs to clean silicon chip, and silicon chip is detached with resin plate, and resin plate uses obsolete material, increases at environmental protection
Pressure is managed, a large amount of tap water is needed to be rinsed silicon chip during cleaning of silicon wafer, causes the waste of water resource, is being cut
When, when steel wire is close to resin plate, needs to carry out equipment reduction of speed, affect process time, cause the wave in terms of utilization rate of equipment and installations
Take.
Invention content
It is incisory to provide a kind of diamond wire for the shortcomings that technical problems to be solved by the invention are, overcome the prior art
The preparation method of high-efficient energy-saving environment friendly resin plate in silicon chip cutting process, can improve product processing efficiency, reduce water resource
Using, reduce waste generate environmental pollution.
The present invention solve more than technical problem technical solution be：There is provided a kind of diamond wire incisory high-efficient energy-saving environment friendly
The preparation method of resin plate, specifically includes following steps：
Step 1：By two degree of functionality polyethers 204,4110 and two degree of functionality polyethers 330N of tetra functional polyethers respectively in a kettle
It is carried out dehydrating, it is spare；
Step 2 is counted in parts by weight, by two degree of functionality polyethers 204 of step 1 dehydration, 4110 and of tetra functional polyethers
Two degree of functionality polyethers 330N and organotin catalysts, foam stabiliser, foam inhibitor and fire retardant mixing, are stirred with 15-30Hz
Speed is stirred 40-60min, and primary mixture is obtained after being sufficiently mixed；
Step 3 is counted in parts by weight weighs glass fiber powder, and filling material is added in into the primary mixture that step 2 obtains
Expect glass fiber powder, 60-70min is thoroughly mixed to get masterbatch with 15-30Hz mixing speeds；
Step 4：It is prepared by curing agent：
A. 100-120 parts of methyl diphenylene diisocyanate is added in reaction kettle one under stiring, the temperature in reaction kettle one
It is 45-60 DEG C to spend, and obtains component A, spare；
B. under stiring by 72-80 parts of polyether polyol, 0.5-3 parts of fire retardant, 10-20 parts of foaming agent and 1-5 parts
Equal infusion, which is added in reaction kettle two, to stir evenly, and the temperature in reaction kettle two is 45-60 DEG C, obtains B component, spare；
C. component A and B component are extracted out several times, the two is extracted out simultaneously every time, and the mass ratio extracted out every time and component A and B
The mass ratio of component is identical, both greater than equal to 1, then mixes component A and B component, curing agent is made；
Step 5：Masterbatch that step 3 is obtained with and the obtained curing agent of step 4 according to 1:1.1-1:1.2 ratios mix, with
10-20Hz mixing speed uniform stirrings 1.5-2h；
Step 6：Step 3 is treated after mixing in injection moulding mold, the molding die is very high using flatness, and thickness is
The molding die of 35mm, and according to mold length and width dimensions in the middle the pre-buried a diameter of 8-10mm of decile bright and clean stainless steel justify
Steel is several, controlled at 45-60 DEG C, after 20-35min is molded, then demoulds, is cooled to room temperature, then polishes or sandblasting
Afterwards, it is then required according to size, is cut into the resin plate platelet for having stainless steel round steel inside 156*700* 25mm, passes through hydraulic pressure
Top equipment detaches round steel and resin plate, obtains the internal lightweight resin board finished product for having circular hole.
The further of the present invention limits technical solution：
The two degree of functionality polyethers 204 through dehydration, 4110 and two degree of functionality polyethers of tetra functional polyethers in aforementioned step one
The water content of 330N is below 0.1%.
The condition of dehydration is in aforementioned step one：Temperature is 110-135 DEG C, atmospheric pressure value is -0.1Mpa, stirring speed
It spends for 15-30Hz, mixing time 1.5-2h.
Mixing speed is 30HZ, mixing time 40min in aforementioned step two.
Mixing speed is 30HZ, mixing time 60min in aforementioned step three.
In aforementioned step four, the temperature in reaction kettle one is 60 DEG C, and the temperature in reaction kettle two is 55 DEG C.
The beneficial effects of the invention are as follows：The present invention uses the glass fiber powder of lightweight as packing material, and resin plate is close
Degree is reduced to 0.6g/cm3, and the weight of resin plate declines, and material hardness reduces, effectively reduction environmental protection treatment pressure, while by
In the hardness of resin plate of the present invention reduces, thickness increases, steel wire cutting of returning sword in tail portion is avoided to need to drop in advance beyond resin plate
Low speed, and then shorten, tail portion process time, improve the unit output time of equipment；
With round hole in the middle part of resin plate, spray pipeline is inserted into inside, tap water is made to be applied directly among silicon chip, passes through band
The spray management in hole, spray time reduce, and hydraulic pressure also reduces, the time efficiency of cleaning is greatly saved, promotes the profit of water resource
With rate, while 80% water resource can be saved；
The present invention can obtain high efficiency clipping time, the usage amount for reducing degumming rinse water, carry in silicon chip cutting process
The processing efficiency of silicon chip slice time has been risen, the utilization rate of equipment is made to get a promotion, the use of water is reduced, reduces resin plate
The lighting problem of processing as waste product, plays the role of energy-saving and environment-friendly.
Specific embodiment
Embodiment 1
The present embodiment provides a kind of preparation methods of the incisory high-efficient energy-saving environment friendly resin plate of diamond wire, specifically include following step
Suddenly：
Step 1：By two degree of functionality polyethers 204,4110 and two degree of functionality polyethers 330N of tetra functional polyethers respectively in a kettle
It is carried out dehydrating, the condition of dehydration is：Temperature is 115 DEG C, atmospheric pressure value is -0.1Mpa, mixing speed 30Hz, is stirred
Time is 1.5h.Two degree of functionality polyethers 204,4110 and two degree of functionality polyethers 330N of tetra functional polyethers through dehydration contain
Water is 0.08%；It is spare；
Step 2 is counted in parts by weight, by two degree of functionality polyethers 204 of step 1 dehydration, 4110 and of tetra functional polyethers
Two degree of functionality polyethers 330N and organotin catalysts, foam stabiliser, foam inhibitor and fire retardant mixing, with 30Hz mixing speeds
40min is stirred, primary mixture is obtained after being sufficiently mixed；
Step 3 is counted in parts by weight weighs glass fiber powder, and filling material is added in into the primary mixture that step 2 obtains
Expect glass fiber powder, 70min is thoroughly mixed to get masterbatch with 30Hz mixing speeds；
Step 4：It is prepared by curing agent：
A. 100 parts of methyl diphenylene diisocyanate is added in reaction kettle one under stiring, the temperature in reaction kettle one is
60 DEG C, component A is obtained, it is spare；
B. 75 parts of polyether polyol, 1.5 parts of fire retardant, 15 parts of foaming agent and 2 parts of equal infusion are added under stiring
It is stirred evenly in reaction kettle two, the temperature in reaction kettle two is 55 DEG C, obtains B component, spare；
C. component A and B component are extracted out several times, the two is extracted out simultaneously every time, and the mass ratio extracted out every time and component A and B
The mass ratio of component is identical, both greater than equal to 1, then mixes component A and B component, curing agent is made；
Step 5：Masterbatch that step 3 is obtained with and the obtained curing agent of step 4 according to 1:1.2 ratios mix, and are stirred with 10Hz
Mix speed uniform stirring 2h；
Step 6：Step 3 is treated after mixing in injection moulding mold, the molding die is very high using flatness, and thickness is
The molding die of 35mm, and according to the bright and clean stainless steel round steel of the mold length and width dimensions pre-buried a diameter of 10mm of decile in the middle
It is several, controlled at 55 DEG C, after 25min is molded, then demould, be cooled to room temperature, then polish or sandblasting after, Ran Hougen
It is required according to size, is cut into the resin plate platelet for having stainless steel round steel inside 156*700* 25mm, by the top equipment of hydraulic pressure,
Round steel and resin plate are detached, obtains the internal lightweight resin board finished product for having circular hole.
Embodiment 2
The present embodiment provides a kind of preparation methods of the incisory high-efficient energy-saving environment friendly resin plate of diamond wire, specifically include following step
Suddenly：
Step 1：By two degree of functionality polyethers 204,4110 and two degree of functionality polyethers 330N of tetra functional polyethers respectively in a kettle
It is carried out dehydrating, the condition of dehydration is：Temperature is 125 DEG C, atmospheric pressure value is -0.1Mpa, mixing speed 15Hz, is stirred
Time is 2h, the two degree of functionality polyethers 204 through dehydration, 4110 and two degree of functionality polyethers 330N of tetra functional polyethers it is aqueous
Amount is 0.06%, spare；
Step 2 is counted in parts by weight, by two degree of functionality polyethers 204 of step 1 dehydration, 4110 and of tetra functional polyethers
Two degree of functionality polyethers 330N and organotin catalysts, foam stabiliser, foam inhibitor and fire retardant mixing, with 20Hz mixing speeds
50min is stirred, primary mixture is obtained after being sufficiently mixed；
Step 3 is counted in parts by weight weighs glass fiber powder, and filling material is added in into the primary mixture that step 2 obtains
Expect glass fiber powder, 55min is thoroughly mixed to get masterbatch with 20Hz mixing speeds；
Step 4：It is prepared by curing agent：
A. 110 parts of methyl diphenylene diisocyanate is added in reaction kettle one under stiring, the temperature in reaction kettle one is
58 DEG C, component A is obtained, it is spare；
B. 77 parts of polyether polyol, 2 parts of fire retardant, 16 parts of foaming agent and 4 parts of equal infusion are added under stiring anti-
It answers and is stirred evenly in kettle two, the temperature in reaction kettle two is 53 DEG C, obtains B component, spare；
C. component A and B component are extracted out several times, the two is extracted out simultaneously every time, and the mass ratio extracted out every time and component A and B
The mass ratio of component is identical, both greater than equal to 1, then mixes component A and B component, curing agent is made；
Step 5：Masterbatch that step 3 is obtained with and the obtained curing agent of step 4 according to 1:1.1 ratios mix, and are stirred with 20Hz
Mix speed uniform stirring 1.5h；
Step 6：Step 3 is treated after mixing in injection moulding mold, the molding die is very high using flatness, and thickness is
The molding die of 35mm, and according to the bright and clean stainless steel round steel of the mold length and width dimensions pre-buried a diameter of 9mm of decile in the middle
It is several, controlled at 60 DEG C, after 20min is molded, then demould, be cooled to room temperature, then polish or sandblasting after, Ran Hougen
It is required according to size, is cut into the resin plate platelet for having stainless steel round steel inside 156*700* 25mm, by the top equipment of hydraulic pressure,
Round steel and resin plate are detached, obtains the internal lightweight resin board finished product for having circular hole.
In addition to the implementation, the present invention can also have other embodiment.It is all to use equivalent substitution or equivalent transformation shape
Into technical solution, all fall within the present invention claims protection domain.
Claims (6)
1. a kind of preparation method of the incisory high-efficient energy-saving environment friendly resin plate of diamond wire, it is characterised in that：It specifically includes following
Step：
Step 1：By two degree of functionality polyethers 204,4110 and two degree of functionality polyethers 330N of tetra functional polyethers respectively in a kettle
It is carried out dehydrating, it is spare；
Step 2 is counted in parts by weight, by two degree of functionality polyethers 204 of step 1 dehydration, 4110 and of tetra functional polyethers
Two degree of functionality polyethers 330N and organotin catalysts, foam stabiliser, foam inhibitor and fire retardant mixing, are stirred with 15-30Hz
Speed is stirred 40-60min, and primary mixture is obtained after being sufficiently mixed；
Step 3 is counted in parts by weight weighs glass fiber powder, and filling material is added in into the primary mixture that step 2 obtains
Expect glass fiber powder, 60-70min is thoroughly mixed to get masterbatch with 15-30Hz mixing speeds；
Step 4：It is prepared by curing agent：
A. 100-120 parts of methyl diphenylene diisocyanate is added in reaction kettle one under stiring, the temperature in reaction kettle one
It is 45-60 DEG C to spend, and obtains component A, spare；
B. under stiring by 72-80 parts of polyether polyol, 0.5-3 parts of fire retardant, 10-20 parts of foaming agent and 1-5 parts
Equal infusion, which is added in reaction kettle two, to stir evenly, and the temperature in reaction kettle two is 45-60 DEG C, obtains B component, spare；
C. component A and B component are extracted out several times, the two is extracted out simultaneously every time, and the mass ratio extracted out every time and component A and B
The mass ratio of component is identical, both greater than equal to 1, then mixes component A and B component, curing agent is made；
Step 5：Masterbatch that step 3 is obtained with and the obtained curing agent of step 4 according to 1:1.1-1:1.2 ratios mix, with
10-20Hz mixing speed uniform stirrings 1.5-2h；
Step 6：Step 3 is treated after mixing in injection moulding mold, the molding die is very high using flatness, and thickness is
The molding die of 35mm, and according to mold length and width dimensions in the middle the pre-buried a diameter of 8-10mm of decile bright and clean stainless steel justify
Steel is several, controlled at 45-60 DEG C, after 20-35min is molded, then demoulds, is cooled to room temperature, then polishes or sandblasting
Afterwards, it is then required according to size, is cut into the resin plate platelet for having stainless steel round steel inside 156*700* 25mm, passes through hydraulic pressure
Top equipment detaches round steel and resin plate, obtains the internal lightweight resin board finished product for having circular hole.
2. the preparation method of the incisory high-efficient energy-saving environment friendly resin plate of diamond wire according to claim 1, feature exist
In：The two degree of functionality polyethers 204 through dehydration, 4110 and two degree of functionality polyethers 330N of tetra functional polyethers in the step 1
Water content be below 0.1%.
3. the preparation method of the incisory high-efficient energy-saving environment friendly resin plate of diamond wire according to claim 1, feature exist
In：The condition of dehydration is in the step 1：Temperature is 110-135 DEG C, atmospheric pressure value is -0.1Mpa, mixing speed 15-
30Hz, mixing time 1.5-2h.
4. the preparation method of the incisory high-efficient energy-saving environment friendly resin plate of diamond wire according to claim 1, feature exist
In：Mixing speed is 30HZ, mixing time 40min in the step 2.
5. the preparation method of the incisory high-efficient energy-saving environment friendly resin plate of diamond wire according to claim 1, feature exist
In：Mixing speed is 30HZ, mixing time 60min in the step 3.
6. the preparation method of the incisory high-efficient energy-saving environment friendly resin plate of diamond wire according to claim 1, feature exist
In：In the step 4, the temperature in reaction kettle one is 60 DEG C, and the temperature in reaction kettle two is 55 DEG C.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810063534.7A CN108148177A (en) | 2018-01-23 | 2018-01-23 | A kind of preparation method of the incisory high-efficient energy-saving environment friendly resin plate of diamond wire |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810063534.7A CN108148177A (en) | 2018-01-23 | 2018-01-23 | A kind of preparation method of the incisory high-efficient energy-saving environment friendly resin plate of diamond wire |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114958281A (en) * | 2021-02-26 | 2022-08-30 | 天津市环智新能源技术有限公司 | Preparation method of glue for bonding silicon crystal, bonding process and line cutting process |
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| CN106893075A (en) * | 2017-03-13 | 2017-06-27 | 南宁珀源能源材料有限公司 | Buddha's warrior attendant wire cutting polyurethane lightweight resin plate and preparation method thereof |
| CN107033315A (en) * | 2017-05-12 | 2017-08-11 | 南宁珀源能源材料有限公司 | Resin plate for Buddha's warrior attendant wire cutting and preparation method thereof |
| CN107033314A (en) * | 2017-04-27 | 2017-08-11 | 南宁珀源能源材料有限公司 | Buddha's warrior attendant wire cutting polyurethane lightweight resin plate host, preparation method and application |
| CN107082864A (en) * | 2017-04-27 | 2017-08-22 | 南宁珀源能源材料有限公司 | Buddha's warrior attendant wire cutting polyurethane lightweight resin plate curing agent, preparation method and application |
-
2018
- 2018-01-23 CN CN201810063534.7A patent/CN108148177A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102438791A (en) * | 2009-05-22 | 2012-05-02 | 吉布尔·施密德有限责任公司 | Carrier for a silicon block and method for producing such a carrier and arrangement |
| CN102504164A (en) * | 2011-11-22 | 2012-06-20 | 中国农业大学 | Manufacture method of enhanced corncob base polyurethane foam materials |
| CN106893075A (en) * | 2017-03-13 | 2017-06-27 | 南宁珀源能源材料有限公司 | Buddha's warrior attendant wire cutting polyurethane lightweight resin plate and preparation method thereof |
| CN107033314A (en) * | 2017-04-27 | 2017-08-11 | 南宁珀源能源材料有限公司 | Buddha's warrior attendant wire cutting polyurethane lightweight resin plate host, preparation method and application |
| CN107082864A (en) * | 2017-04-27 | 2017-08-22 | 南宁珀源能源材料有限公司 | Buddha's warrior attendant wire cutting polyurethane lightweight resin plate curing agent, preparation method and application |
| CN107033315A (en) * | 2017-05-12 | 2017-08-11 | 南宁珀源能源材料有限公司 | Resin plate for Buddha's warrior attendant wire cutting and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114958281A (en) * | 2021-02-26 | 2022-08-30 | 天津市环智新能源技术有限公司 | Preparation method of glue for bonding silicon crystal, bonding process and line cutting process |
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