CN108130003A - Electronic component waterproof heat resistant protective film - Google Patents

Electronic component waterproof heat resistant protective film Download PDF

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Publication number
CN108130003A
CN108130003A CN201711374030.9A CN201711374030A CN108130003A CN 108130003 A CN108130003 A CN 108130003A CN 201711374030 A CN201711374030 A CN 201711374030A CN 108130003 A CN108130003 A CN 108130003A
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China
Prior art keywords
parts
electronic component
protective film
heat resistant
resistant protective
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Pending
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CN201711374030.9A
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Chinese (zh)
Inventor
蔡磊
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JIANGSU SIRUIDA NEW MATERIAL TECHNOLOGY Co Ltd
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JIANGSU SIRUIDA NEW MATERIAL TECHNOLOGY Co Ltd
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Priority to CN201711374030.9A priority Critical patent/CN108130003A/en
Publication of CN108130003A publication Critical patent/CN108130003A/en
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
    • C09J129/02—Homopolymers or copolymers of unsaturated alcohols
    • C09J129/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/32—Phosphorus-containing compounds
    • C08K2003/321—Phosphates
    • C08K2003/324—Alkali metal phosphate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2429/00—Presence of polyvinyl alcohol
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2461/00—Presence of condensation polymers of aldehydes or ketones
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane

Abstract

The invention discloses a kind of electronic component waterproof heat resistant protective films; including base film, the lower surface of base film is equipped with inner protection film, and the lower surface of inner protection film is coated with Waterproof glue line; the lower surface of Waterproof glue line is sequentially coated with heat-resistant adhesive and viscose, and the lower surface of viscose is covered with release layer.The electronic component of the present invention has good water proofing property, adhesiveness and heat resistance with waterproof heat resistant protective film; it can be very good the heat resistance of raising protective film by adding heat-resisting glue-line in protective film; so as to preferably protect electronic component, to prevent being damaged for a long time using caused fever to electronic component.

Description

Electronic component waterproof heat resistant protective film
Technical field
The present invention relates to protective film production technical fields, and in particular to a kind of electronic component waterproof heat resistant protective film.
Background technology
Protective film can be divided into protective film for digital product, protection film for automobile, household protective film, food fresh keeping according to purposes to be protected Cuticula etc..Protective film for digital product be widely used in surfacing protection during FPC, PCB and Electronic Components Manufacturing and Prevent the generation of electrostatic.Traditional protective film can only prevent the surface of electronic component not to be worn, but its water proofing property It is less desirable with heat resistance, in consideration of it, it is necessary to traditional electronic component is made improvements with protective film.
Invention content
To solve the deficiencies in the prior art, the purpose of the present invention is to provide one kind to have good water proofing property, adhesiveness With the electronic component waterproof heat resistant protective film of heat resistance.
In order to realize above-mentioned target, the present invention adopts the following technical scheme that：
Electronic component waterproof heat resistant protective film, including base film, the lower surface of base film is equipped with inner protection film, interior guarantor The lower surface of cuticula is coated with Waterproof glue line, and the lower surface of Waterproof glue line is sequentially coated with heat-resistant adhesive and viscose, the following table of viscose Face paste is covered with release layer, and heat-resistant adhesive includes each component of following parts by weight：22 ~ 35 parts of polyvinyl alcohol, nonylphenolic resin 18 ~ 29 Part, 16 ~ 24 parts of acrylic resin, 15 ~ 21 parts of succinic anhydride, 15 ~ 18 parts of nanometer grade silica powder, 12 ~ 16 parts of sodium metasilicate, 8 ~ 13 parts of polyimides, 17 ~ 25 parts of methyl trialkoxysilane, 13 ~ 17 parts of acetone, 8 ~ 14 parts of triethylamine, 9 ~ 12 parts of dispersant, 21 ~ 27 parts of 3 ~ 8 parts of antifoaming agent and water.
Preferably, aforementioned Waterproof glue line includes each component of following parts by weight：26 ~ 38 parts of polyvinyl alcohol, butadiene 21 ~ 25 Part, 19 ~ 26 parts of epoxy resin, 15 ~ 17 parts of acetone, 13 ~ 16 parts of triethylamine, 8 ~ 14 parts of naphthane, 5 ~ 16 parts of calcium stearate and water 12 ~ 18 parts.
More preferably, aforementioned mucigel includes each component of following parts by weight：35 ~ 37 parts of dimethyl silicone polymer, propylene Sour 31 ~ 35 parts of methyl esters, 24 ~ 28 parts of hydroxyethyl cellulose, 12 ~ 16 parts of titanium dioxide, 21 ~ 25 parts of polyvinylpyrrolidone, poly- third 18 ~ 28 parts of 10 ~ 17 parts of olefin(e) acid ester, 14 ~ 19 parts of methyl acetate and water.
It is highly preferred that aforementioned antifoaming agent is organic silicon antifoaming agent.
It is further preferred that foregoing dispersant is calgon.
Specifically, pressure sensitive adhesive is coated between aforementioned substrates film and inner protection film.
Preferably, aforementioned substrates film is made of PET material.
More preferably, the material of aforementioned release layer uses silicone oil paper.
It is highly preferred that the preparation method of aforementioned heat-resistant adhesive includes the following steps：（1）By polyvinyl alcohol, nonylphenolic resin, Acrylic resin, succinic anhydride and water are added in reaction kettle, are stirred evenly, and temperature of reaction kettle risen to 45 ~ 60 DEG C, and reaction 1 ~ 2.5h；（2）It is added in reaction kettle after nanometer grade silica powder and sodium metasilicate are ground to 400 ~ 500 mesh, adds polyamides Imines stirs evenly；（3）Temperature of reaction kettle is increased to 75 ~ 85 DEG C, add in methyl trialkoxysilane, acetone, triethylamine, Dispersant and antifoaming agent, stir evenly, and speed of agitator is 100 ~ 120 turns/min, stirs 0.5 ~ 1.5h, reacts 2 ~ 3h；（4）Cooling To room temperature, heat-resistant adhesive is obtained.
The invention has the beneficial effects that：The electronic component of the present invention has good waterproof with waterproof heat resistant protective film Property, adhesiveness and heat resistance, can be very good to improve the heat resistance of protective film by adding heat-resisting glue-line in protective film, so as to Electronic component can be preferably protected, to prevent being damaged for a long time using caused fever to electronic component.
Specific embodiment
Make specific introduce to the present invention below in conjunction with specific embodiment.
Embodiment 1
Electronic component waterproof heat resistant protective film, including base film, the lower surface of base film is equipped with inner protection film, base material Pressure sensitive adhesive is coated between film and inner protection film, the lower surface of inner protection film is coated with Waterproof glue line, the following table of Waterproof glue line Face is sequentially coated with heat-resistant adhesive and viscose, and the lower surface of viscose is covered with release layer, and heat-resistant adhesive includes each group of following parts by weight Point：22 parts of polyvinyl alcohol, 18 parts of nonylphenolic resin, 16 parts of acrylic resin, 15 parts of succinic anhydride, nanometer grade silica powder 15 parts of end, 12 parts of sodium metasilicate, 8 parts of polyimides, 17 parts of methyl trialkoxysilane, 13 parts of acetone, 8 parts of triethylamine, six inclined phosphorus 21 parts of sour 9 parts of sodium, 3 parts of machine silicon class antifoaming agent and water.
Wherein, Waterproof glue line includes each component of following parts by weight：26 parts of polyvinyl alcohol, 21 parts of butadiene, epoxy resin 12 parts of 19 parts, 15 parts of acetone, 13 parts of triethylamine, 8 parts of naphthane, 5 parts of calcium stearate and water.Mucigel includes following parts by weight Each component：35 parts of dimethyl silicone polymer, 31 parts of methyl acrylate, 24 parts of hydroxyethyl cellulose, 12 parts of titanium dioxide, polyethylene 18 parts of 21 parts of pyrrolidones, 10 parts of polyacrylate, 14 parts of methyl acetate and water.Base film is made of PET material, release The material of layer uses silicone oil paper.
The preparation method of heat-resistant adhesive includes the following steps：（1）By polyvinyl alcohol, nonylphenolic resin, acrylic resin, fourth Dicarboxylic anhydride and water are added in reaction kettle, are stirred evenly, and temperature of reaction kettle is risen to 45 DEG C, react 1h；（2）By nanoscale dioxy SiClx powder and sodium metasilicate are added in after being ground to 400 mesh in reaction kettle, are added polyimides, are stirred evenly；（3）By reaction kettle Temperature is increased to 75 DEG C, adds in methyl trialkoxysilane, acetone, triethylamine, dispersant and antifoaming agent, stirs evenly, and stirs Rotating speed is 100 turns/min, stirs 0.5h, reacts 2h；（4）It is cooled to room temperature, obtains heat-resistant adhesive.
Embodiment 2
Electronic component waterproof heat resistant protective film, including base film, the lower surface of base film is equipped with inner protection film, base material Pressure sensitive adhesive is coated between film and inner protection film, the lower surface of inner protection film is coated with Waterproof glue line, the following table of Waterproof glue line Face is sequentially coated with heat-resistant adhesive and viscose, and the lower surface of viscose is covered with release layer, and heat-resistant adhesive includes each group of following parts by weight Point：35 parts of polyvinyl alcohol, 29 parts of nonylphenolic resin, 24 parts of acrylic resin, 21 parts of succinic anhydride, nanometer grade silica powder 18 parts of end, 16 parts of sodium metasilicate, 13 parts of polyimides, 25 parts of methyl trialkoxysilane, 17 parts of acetone, 14 parts of triethylamine, six are partially 27 parts of 12 parts of sodium phosphate, 8 parts of machine silicon class antifoaming agent and water.
Wherein, Waterproof glue line includes each component of following parts by weight：38 parts of polyvinyl alcohol, 25 parts of butadiene, epoxy resin 18 parts of 26 parts, 17 parts of acetone, 16 parts of triethylamine, 14 parts of naphthane, 16 parts of calcium stearate and water.Mucigel includes following parts by weight Each component：37 parts of dimethyl silicone polymer, 35 parts of methyl acrylate, 28 parts of hydroxyethyl cellulose, 16 parts of titanium dioxide, poly- second 28 parts of 25 parts of alkene pyrrolidone, 17 parts of polyacrylate, 19 parts of methyl acetate and water.Base film is made of PET material, from The material of type layer uses silicone oil paper.
The preparation method of heat-resistant adhesive includes the following steps：（1）By polyvinyl alcohol, nonylphenolic resin, acrylic resin, fourth Dicarboxylic anhydride and water are added in reaction kettle, are stirred evenly, and temperature of reaction kettle is risen to 60 DEG C, react 2.5h；（2）By nanoscale two Silicon oxide powder and sodium metasilicate are added in after being ground to 500 mesh in reaction kettle, are added polyimides, are stirred evenly；（3）It will reaction Kettle temperature degree is increased to 85 DEG C, adds in methyl trialkoxysilane, acetone, triethylamine, dispersant and antifoaming agent, stirs evenly, stir Mix rotating speed is 120 turns/min, stirs 1.5h, reacts 3h；（4）It is cooled to room temperature, obtains heat-resistant adhesive.
Embodiment 3
Electronic component waterproof heat resistant protective film, including base film, the lower surface of base film is equipped with inner protection film, base material Pressure sensitive adhesive is coated between film and inner protection film, the lower surface of inner protection film is coated with Waterproof glue line, the following table of Waterproof glue line Face is sequentially coated with heat-resistant adhesive and viscose, and the lower surface of viscose is covered with release layer, and heat-resistant adhesive includes each group of following parts by weight Point：27 parts of polyvinyl alcohol, 22 parts of nonylphenolic resin, 20 parts of acrylic resin, 18 parts of succinic anhydride, nanometer grade silica powder 17 parts of end, 14 parts of sodium metasilicate, 11 parts of polyimides, 21 parts of methyl trialkoxysilane, 15 parts of acetone, 12 parts of triethylamine, six are partially 25 parts of 11 parts of sodium phosphate, 6 parts of machine silicon class antifoaming agent and water.
Wherein, Waterproof glue line includes each component of following parts by weight：32 parts of polyvinyl alcohol, 23 parts of butadiene, epoxy resin 16 parts of 24 parts, 16 parts of acetone, 14 parts of triethylamine, 11 parts of naphthane, 10 parts of calcium stearate and water.Mucigel includes following parts by weight Each component：36 parts of dimethyl silicone polymer, 33 parts of methyl acrylate, 26 parts of hydroxyethyl cellulose, 14 parts of titanium dioxide, poly- second 23 parts of 23 parts of alkene pyrrolidone, 14 parts of polyacrylate, 17 parts of methyl acetate and water.Base film is made of PET material, from The material of type layer uses silicone oil paper.
The preparation method of heat-resistant adhesive includes the following steps：（1）By polyvinyl alcohol, nonylphenolic resin, acrylic resin, fourth Dicarboxylic anhydride and water are added in reaction kettle, are stirred evenly, and temperature of reaction kettle is risen to 54 DEG C, react 1.7h；（2）By nanoscale two Silicon oxide powder and sodium metasilicate are added in after being ground to 450 mesh in reaction kettle, are added polyimides, are stirred evenly；（3）It will reaction Kettle temperature degree is increased to 80 DEG C, adds in methyl trialkoxysilane, acetone, triethylamine, dispersant and antifoaming agent, stirs evenly, stir Mix rotating speed is 110 turns/min, stirs 1h, reacts 2.5h；（4）It is cooled to room temperature, obtains heat-resistant adhesive.
Comparative example 1
This comparative example is roughly the same with the protective film in embodiment 1, and difference lies in do not add in heat-resistant adhesive.
Comparative example 2
This comparative example is roughly the same with the protective film in embodiment 1, and difference lies in do not add in marine glue.
Performance detection
（1）Heat-resistance test：According to the assay method in GB/T 1735-2009, sample is put into convection oven, is heated to 120 DEG C and heated at constant temperature for 24 hours, after heating, make sample be cooled to room temperature together with convection oven, take out observation；
（2）Adhesion test：Assay method in GB/T 9286-1998 is tested.
Water-fast experiment：Sample is immersed in water tank and is observed.
It follows that the present invention electronic component with waterproof heat resistant protective film have good water proofing property, adhesiveness and Heat resistance can also keep not falling off, not crack, do not blister in the environment of long-time high temperature, can effectively protect electronic component Work and service life.
The basic principles, main features and advantages of the invention have been shown and described above.The technical staff of the industry should Understand, the invention is not limited in any way above-described embodiment, all to be obtained by the way of equivalent substitution or equivalent transformation Technical solution is all fallen in protection scope of the present invention.

Claims (9)

1. electronic component waterproof heat resistant protective film, which is characterized in that including base film, the lower surface of the base film Equipped with inner protection film, the lower surface of the inner protection film is coated with Waterproof glue line, and the lower surface of the Waterproof glue line coats successively There are heat-resistant adhesive and viscose, the lower surface of the viscose is covered with release layer, and the heat-resistant adhesive includes each component of following parts by weight： 22 ~ 35 parts of polyvinyl alcohol, 18 ~ 29 parts of nonylphenolic resin, 16 ~ 24 parts of acrylic resin, 15 ~ 21 parts of succinic anhydride, nanoscale 15 ~ 18 parts of SiO 2 powder, 12 ~ 16 parts of sodium metasilicate, 8 ~ 13 parts of polyimides, 17 ~ 25 parts of methyl trialkoxysilane, acetone 21 ~ 27 parts of 13 ~ 17 parts, 8 ~ 14 parts of triethylamine, 9 ~ 12 parts of dispersant, 3 ~ 8 parts of antifoaming agent and water.
2. electronic component according to claim 1 waterproof heat resistant protective film, which is characterized in that the Waterproof glue line packet Include each component of following parts by weight：26 ~ 38 parts of polyvinyl alcohol, 21 ~ 25 parts of butadiene, 19 ~ 26 parts of epoxy resin, acetone 15 ~ 17 12 ~ 18 parts of part, 13 ~ 16 parts of triethylamine, 8 ~ 14 parts of naphthane, 5 ~ 16 parts of calcium stearate and water.
3. electronic component according to claim 1 waterproof heat resistant protective film, which is characterized in that the mucigel includes The each component of following parts by weight：35 ~ 37 parts of dimethyl silicone polymer, 31 ~ 35 parts of methyl acrylate, hydroxyethyl cellulose 24 ~ 28 Part, 12 ~ 16 parts of titanium dioxide, 21 ~ 25 parts of polyvinylpyrrolidone, 10 ~ 17 parts of polyacrylate, 14 ~ 19 parts of methyl acetate and 18 ~ 28 parts of water.
4. electronic component according to claim 1 waterproof heat resistant protective film, which is characterized in that the antifoaming agent is has Machine silicon class antifoaming agent.
5. electronic component according to claim 1 waterproof heat resistant protective film, which is characterized in that the dispersant is six Sodium metaphosphate.
6. electronic component according to claim 1 waterproof heat resistant protective film, which is characterized in that the base film and Pressure sensitive adhesive is coated between inner protection film.
7. electronic component according to claim 1 waterproof heat resistant protective film, which is characterized in that the base film is adopted It is made of PET material.
8. electronic component according to claim 1 waterproof heat resistant protective film, which is characterized in that the material of the release layer Material is using silicone oil paper.
9. electronic component according to claim 1 waterproof heat resistant protective film, which is characterized in that the system of the heat-resistant adhesive Preparation Method includes the following steps：（1）Polyvinyl alcohol, nonylphenolic resin, acrylic resin, succinic anhydride and water are added in and reacted It in kettle, stirs evenly, and temperature of reaction kettle is risen to 45 ~ 60 DEG C, react 1 ~ 2.5h；（2）By nanometer grade silica powder and Sodium metasilicate is added in after being ground to 400 ~ 500 mesh in reaction kettle, is added polyimides, is stirred evenly；（3）By temperature of reaction kettle liter Up to 75 ~ 85 DEG C, methyl trialkoxysilane, acetone, triethylamine, dispersant and antifoaming agent are added in, is stirred evenly, speed of agitator For 100 ~ 120 turns/min, 0.5 ~ 1.5h is stirred, reacts 2 ~ 3h；（4）It is cooled to room temperature, obtains heat-resistant adhesive.
CN201711374030.9A 2017-12-19 2017-12-19 Electronic component waterproof heat resistant protective film Pending CN108130003A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023023554A1 (en) * 2021-08-18 2023-02-23 Terecircuits Corporation Release layer composition for transfer of components
CN116814174A (en) * 2023-08-24 2023-09-29 佛山市奥川顺新材料实业有限公司 Composite PET protective film and preparation method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4824727A (en) * 1984-05-24 1989-04-25 Chr Industries, Inc. Char-forming protective coating for flexible base materials
CN1147268A (en) * 1994-05-06 1997-04-09 美国3M公司 High temp. resistant antistatic pressure-sensitive adhesive tape
CN106626666A (en) * 2016-12-28 2017-05-10 苏州培华电子材料有限公司 High-temperature-resistant protective film

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4824727A (en) * 1984-05-24 1989-04-25 Chr Industries, Inc. Char-forming protective coating for flexible base materials
CN1147268A (en) * 1994-05-06 1997-04-09 美国3M公司 High temp. resistant antistatic pressure-sensitive adhesive tape
CN106626666A (en) * 2016-12-28 2017-05-10 苏州培华电子材料有限公司 High-temperature-resistant protective film

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023023554A1 (en) * 2021-08-18 2023-02-23 Terecircuits Corporation Release layer composition for transfer of components
CN116814174A (en) * 2023-08-24 2023-09-29 佛山市奥川顺新材料实业有限公司 Composite PET protective film and preparation method thereof
CN116814174B (en) * 2023-08-24 2023-11-28 佛山市奥川顺新材料实业有限公司 Composite PET protective film and preparation method thereof

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Application publication date: 20180608