CN108118318B - Nano chemical plating layer and preparation method and application thereof - Google Patents
Nano chemical plating layer and preparation method and application thereof Download PDFInfo
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- CN108118318B CN108118318B CN201611066573.XA CN201611066573A CN108118318B CN 108118318 B CN108118318 B CN 108118318B CN 201611066573 A CN201611066573 A CN 201611066573A CN 108118318 B CN108118318 B CN 108118318B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/089—Coatings, claddings or bonding layers made from metals or metal alloys
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2245/00—Coatings; Surface treatments
- F28F2245/04—Coatings; Surface treatments hydrophobic
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- General Engineering & Computer Science (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
a nanometer chemical plating layer and a preparation method and application thereof, comprising a substrate layer, a first plating layer and a second plating layer which are arranged in sequence, wherein the first plating layer is a Ni-P-Cu layer; the second coating is Ni-P-Cu-TiO2A layer of TiO in the direction from the substrate layer to the surface layer of the second plating layer2the concentration is increased from zero to 3 ~ 7% and linearly increased, and the nano chemical plating layers are formed by sequentially chemically plating TiO and other plating layers on the surface of the pretreated base material layer2The concentration increased linearly. The nano chemical coating can be applied to a heat exchanger and used as a surface condensation heat exchange coating. TiO contained in the coating2The surface of the coating is hydrophobic, the heat exchange efficiency of the heat exchange equipment is improved, and TiO2The linear increase in concentration makes TiO2The binding force between the particles and the surface of the substrate is increased, the internal stress between the plating layers is reduced, the wear resistance and the corrosion resistance of the plating layers are improved, and the plating layers are not easy to fall off.
Description
Technical Field
The invention relates to a nano chemical coating, in particular to a coating which realizes drop-shaped condensation on a condensation heat exchange surface and has a scale inhibition function, belonging to the technical field of surface engineering.
Background
Condensation heat exchange equipment, such as a condenser of a power plant, has the problems of insufficient heat exchange capacity, dirt deposition and the like.
The heat exchange capacity is insufficient because the film-shaped condensation heat resistance is limited by large heat resistance, a liquid film spreads on the heat exchange surface during film-shaped condensation to cause large heat resistance, the condensation heat exchange mode corresponding to the film-shaped condensation is drop-shaped condensation, and when the drop-shaped condensation is carried out, the condensation liquid forms liquid drops on the heat exchange surface, so that the heat resistance is small, and the heat transfer coefficient is large. The heat exchange surface with low surface energy is obtained by the way of realizing dropwise condensation, and the current main methods comprise precious metal electroplating, organic promoter coating on the surface, molecular self-assembly film coating and the like. Various methods have different problems, the electroplating precious metal is expensive, the organic accelerant and the molecular self-assembly film have poor binding force with the matrix, and the service life of the coating is short.
On the surface of the heat exchange equipment, some dirt, such as calcium ions, magnesium ions and the like, can be deposited on the heat exchange surface, generally, the heat transfer coefficient of the dirt is lower, the heat exchange thermal resistance can be increased, the heat exchange efficiency of the heat exchange equipment is lower, the flow area of fluid can be reduced by the dirt, the pressure drop of the equipment is increased, and the energy consumption of the fluid transportation equipment is increased. The existing methods for solving the problem include adding a chemical scale inhibitor, mechanically cleaning, applying a magnetic field and the like. However, the existing method still has certain problems. The addition of chemical scale inhibitors can cause pollution, the mechanical cleaning and magnetic field application methods can increase the energy consumption of equipment, and the effect is difficult to ensure.
The chemical plating layer using Ni-P, Ni-Cu-P as basic component has high hardness, high wear resistance and excellent corrosion resistance, so that it is widely used in the protection and decoration of steel, copper, plastic, ceramic and other material and is one kind of promising new surface strengthening material. In the prior art, electroless plating has been applied to many fields.
Chinese patent' surface Ni-Cu-P/nano TiO of aluminum product2A preparation method of a chemical composite coating (application number: CN201010228626. X) provides a method for preparing a single-layer Ni-Cu-P/nano TiO on the surface of a magnesium alloy2Chemical composite coating using TiO2The characteristic improves the antibacterial function of the plating.
Chinese patent "aluminum product and its preparation method" (application number: CN 201110403314.2) proposes a method for preparing Ni-Cu-P/Ni-P double-layer coating on the surface of aluminum metal to realize electromagnetic shielding function and anticorrosion function.
The Chinese patent 'an anticorrosion wear-resistant material with Ni-Cu-P-TiN load coating and a preparation method thereof' (application number: CN 201410481915.9) provides a method for preparing a Ni-P/Ni-Cu-P/Ni-Cu-P-TiN three-layer chemical composite coating on the surface of metal, which is used for improving the abrasion resistance and the anticorrosion capability of the surface of the metal and improving the performance of a coating scraper.
The three patents use different formulations and different preparation methods to obtain electroless coatings with different characteristics. However, no research is carried out in the field of enhancing the dropwise condensation and condensation heat exchange.
Chinese patent "a nano-particle reinforced composite coating for realizing drop-shaped condensation heat transfer" (application number: CN 102134711A) proposes a method for generating amorphous Ni-P-SiO on the surface of metal2the composite chemical plating layer is formed with the thickness of 20 ~ 30 mu m and the surface energy of 25 ~ 30mN/m, and the chemical plating is applied to the field of enhanced heat exchange, and has better effect on enhancing condensation heat exchange2The binding force with the matrix is weaker, and the plating layer is easy to fall off. Meanwhile, the anti-scaling capability of the coating is lack of research.
Therefore, the existing chemical coating technology lacks a material which can reduce the water condensation on the surface of the heat exchanger and has the function of scale inhibition.
Disclosure of Invention
In order to solve the problem that the prior art lacks a chemical coating material which can reduce the water condensation on the surface of a heat exchanger and has the function of scale inhibition, the invention provides a nano chemical coating which comprises a nano coating and TiO added2The surface hydrophobic coating is formed in the Ni-P-Cu coating material, so that the water condensation and scale inhibition on the surface of the heat exchanger are effectively reduced.
The technical scheme of the invention is as follows:
The technical purpose of the first aspect of the invention is to provide a nano chemical plating layer, which comprises a substrate layer, a first plating layer and a second plating layer which are sequentially arranged, wherein the first plating layer is a Ni-P-Cu layer; the second coating is Ni-P-Cu-TiO2A layer of TiO in the direction from the substrate layer to the surface layer of the second plating layer2the concentration is increased from zero to 3 ~ 7% and is increased linearly.
In the above nano electroless plating layer, the TiO2The linear increase of the concentration is in Ni-P-Cu-TiO2The thickness of the layer is in the range from the surface contacting with the Ni-P-Cu layer to the surface of the coating layer2The concentration increases at a substantially uniform rate, and the concentration-thickness relationship may be non-strictly linearAnd as long as no large concentration fault occurs, TiO2The linear increase of the concentration is to ensure the binding force between two plating layers and in the second plating layer, and the large concentration fault easily causes the weakening of the binding force between the plating layers and in the plating layers, thereby affecting the performance of the plating layers.
in the nano electroless plating layer, the thickness of the second plating layer is 20 ~ 60 μm, preferably 20 ~ 40 μm.
in the nano chemical plating layer, the second plating layer contains 8 ~ 12% of P, 4 ~ 6% of Cu, and TiO by mass percentage2the concentration of (A) is 1 ~ 5%, preferably 2 ~ 4%, and the remainder is Ni.
in the nano electroless plating layer, the thickness of the first plating layer is 10 ~ 20m, preferably 10 ~ 15 μm, and in the Ni ~ P ~ Cu layer, by mass percentage, P is 8 ~ 12%, Cu is 4 ~ 6%, and the balance is Ni.
in the nano electroless plating layer, the base material layer is preferably one selected from a steel material and an alloy, and the alloy is a magnesium alloy, an aluminum alloy or a titanium alloy.
Another technical object of the present invention is to provide a method for preparing the nano electroless plating layer, comprising the steps of: pretreating the surface of a base material, sequentially placing the base material in a plating solution A and a plating solution B to carry out chemical plating, and respectively forming a first plating layer and a second plating layer on the surface of the base material layer to obtain a nano chemical plating layer;
The plating solution A comprises the following components:
NiSO4 25~35g/L
CuSO4 0.3~0.6g/L
NaH2PO2 15~25g/L
CH3COONa 15~20g/L
15 ~ 20g/L citric acid
KIO3 15~25mg/L
0.2-0.4 mg/L of surfactant
Ce(SO4)2 0~0.1mg/L
The plating solution B comprises the following components:
NiSO4 25~35g/L
CuSO4 0.3~0.6g/L
NaH2PO2 25~45g/L
CH3COONa 15~20g/L
15 ~ 20g/L citric acid
KIO3 15~25mg/L
0.2-0.4 mg/L of surfactant
Ce(SO4)2 0~0.1mg/L
The plating solution B also comprises TiO dispersed by ethanol2When the plating solution B is used for chemical plating, TiO is added into the plating solution B at a constant speed according to the set chemical plating time2the concentration of the metal oxide is 5 ~ 12g/L, preferably 7 ~ 10g/L, after the electroless plating is completed.
In the above production method, the TiO2is in anatase structure and has a particle size of 10 ~ 20nm2Adding the particles into an ethanol solution containing a surfactant, and performing ultrasonic dispersion to obtain TiO2Adding the suspension into the plating solution.
in the preparation method, the temperature for implementing the chemical plating is 70 ~ 80 ℃, the pH value is adjusted to be 4 ~ 5, and the time for plating each time is 20 ~ 120min, preferably 20 ~ 80 min.
in the above preparation method, the surfactant is sodium n-octyl sulfate.
In the above production method, the pretreatment of the surface of the substrate comprises: and sequentially polishing, washing, soaking in an aqueous alkali for degreasing, soaking in an acid solution for activation and washing again on the base material.
in the preparation method, when the surface of the base material is pretreated, the alkaline solution comprises 20 ~ 30g/L of NaOH and Na2CO3 20~25g/L，Na3PO435 ~ 40g/L, OP ~ 104 ~ 6mol/L, the time for dipping the base material in the alkali solution to remove the oil is 20 ~ 40min, and the temperature is 70 ~ 80 ℃.
in the preparation method, when the surface of the base material is pretreated, the time for dipping and activating the base material by using the acid solution is 30s, and the acid solution is 8 ~ 12% of H2SO4And (3) solution.
The technical purpose of the other aspect of the invention is to provide the application of the nano chemical coating, and the chemical coating can be applied to a heat exchanger as a surface condensation heat exchange coating. The nano chemical plating layer is an amorphous low surface energy interface and contains nano TiO2The scale inhibitor has a hydrophobic effect, so that condensate cannot spread on the surface of the condensate to form liquid drops, the thermal resistance brought by a liquid film is reduced, the heat exchange efficiency is improved, dirt can timely fall off, a good scale inhibition function is realized, the heat exchange efficiency can be improved, and the operation period of equipment is prolonged.
Compared with the prior art, the invention has the beneficial effects that:
(1) Preparing Ni-P-Cu layer and Ni-P-Cu-TiO on surface of metal substrate by composite chemical plating method2The cladding material has formed the low surface energy interface of amorphous state on the base member surface for during the heat transfer of condensing, the condensate liquid can not spread on the heat transfer surface, but forms the liquid pearl, can effectively strengthen the dribble form condensation, reduces the heat transfer thermal resistance that the liquid film brought, improves heat exchange efficiency, and simultaneously, metallic element coefficient of heat conductivity such as Cu in the cladding material is big, and the unnecessary thermal resistance that the cladding material brought is very little, overall, has improved indirect heating equipment's heat exchange efficiency, can the energy saving, reduces indirect heating equipment size.
（2）Ni-P-Cu-TiO2Layer containing nano TiO in anatase form2So that the coating has strong hydrophobicity, water molecules are difficult to wet the surface of the coating and form dirt, the adhesion between the dirt and the surface of the coating is low, and the dirt is easy to fall off, therefore, the prepared Ni-P-Cu/Ni-P-Cu-TiO2The coating has good scale inhibition effect, can help heat exchange equipment to run for a long period, and keeps good heat exchange efficiency.
(3) Ni-P-Cu layer of the invention to Ni-P-Cu-TiO2The layer is made of TiO2The concentration is gradually increased to increase the TiO content2The binding force between the particles and the surface of the substrate reduces the coatingThe internal stress between the two layers improves the wear resistance and corrosion resistance of the plating layer, and the plating layer is not easy to fall off.
Detailed Description
The following describes the embodiments of the present invention in detail with reference to the technical solutions. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
Example 1
The electroless plating was prepared as follows:
(1) using DN 25X 100 red copper tube as material, polishing the surface of the red copper tube with 400, 800 and 1200 mesh abrasive paper in sequence, removing oxide on the surface of the red copper tube, washing with water, immersing the red copper tube in alkaline solution for 30min to remove oil, keeping the temperature of the alkaline solution at about 75 ℃, washing with water, and then putting the red copper tube in 10% H2SO4The solution was activated for 30 seconds and washed again with water to prepare a base layer.
Wherein the alkali solution comprises the following components: NaOH 20g/L, Na2CO3 23g/L，Na3PO4 35g/L，OP-10 5mol/L。
(2) Each plating solution was prepared according to the composition of Table 1
TABLE 1
Wherein, TiO in the plating solution B2is anatase-structured particles with the particle size of 10-20 nm. Weighing the required TiO2Adding into dispersant prepared from n-octyl sodium sulfate and anhydrous alcohol, and ultrasonically dispersing for 10min to obtain TiO2And (3) suspension.
(3) sequentially dipping the treated base material into a plating solution A and a plating solution B for chemical plating, wherein the plating time is respectively 25min and 60min, the plating temperature is kept at 75 ~ 80 ℃, the pH is 4.2, and after the plating is finished, washing and drying are carried out to obtain a base material layer/Ni ~ P ~ Cu ~ TiO layer2Nano-electroless plating layers arranged in sequence.
Example 2
(1) The surface treatment was carried out in the same manner as in (1) in example 1 using a No. 45 stainless steel sheet of 30X 1.5 as a material.
(2) Each plating solution was prepared according to the composition of Table 2
TABLE 2
Wherein, TiO in the plating solution B2Is anatase-structured particles with the particle size of 10-20 nm. Weighing the required TiO2Adding into dispersant prepared from n-octyl sodium sulfate and anhydrous alcohol, and ultrasonically dispersing for 10min to obtain TiO2And (3) suspension.
(3) sequentially dipping the treated base material into a plating solution A and a plating solution B for chemical plating, wherein the plating time is 20min and 45min respectively, the plating temperature is kept at 75 ~ 80 ℃, the pH is 4.2, and after the plating is finished, washing and drying are carried out to obtain a base material layer/Ni ~ P ~ Cu ~ TiO layer2nano-electroless plating layers arranged in sequence.
Comparative example 1
Preparation of substrate/Ni-P-Cu/Ni-P-Cu-TiO2(wherein Ni-P-Cu-TiO)2TiO in the layer2Not linearly increasing, but only a single layer concentration):
(1) The pretreatment procedure was the same as in (1) in example 1, except that DN 25X 100 copper tubing was used as the material.
(2) Plating solution A: plating solution A as in example 1
Preparing a plating solution C: the other components were the same as in plating bath B of example 1, and TiO2The solution was added at one time to give a concentration of 10 g/L.
(3) And (3) putting the base materials in the same plating solution A and the plating solution C in sequence to carry out chemical plating, wherein the plating time is respectively 25min and 60min, and obtaining a comparative chemical plating layer.
The contents of the respective components and the thicknesses of the respective layers in the plating layers in examples 1 and 2 and comparative example 1 are shown in table 3.
TABLE 3
And (3) testing the performance of the plating layer:
(1) Scale inhibition and surface condensation performance of the coating in example 1
In the steam condensation test, the test tube is horizontally placed, and it is observed that the plating layer surface of the example 1 is obviously generated by drop-shaped condensation, and the liquid film is obviously spread on the surface of the red copper light tube and is obviously film-shaped condensation. The heat transfer coefficient of the copper tube with the coating in example 1 was determined to be 2.1 times that of the copper tube without the coating.
In saturated CaSO4When a dirt deposition test is carried out in the solution, the dirt deposition speed on the red copper light tube without the coating is far higher than that on the surface of the coating, the dirt on the surface of the red copper light tube is compact, and the dirt on the surface of the coating is loose and easy to fall off.
(2) Scale inhibition and surface condensation performance of the coating in example 2
When the plated layer formed on the steel sheet as the base material obtained in example 2 was compared with a stainless steel sheet having no plated layer, the surface of the plated layer was stained loosely in the pool boiling test, and the plated layer was easily peeled off. The dirt generated on the stainless steel plate has strong adhesive force with the stainless steel plate, and the dirt is not easy to fall off. In the pool boiling test, the thermal conductivity of the stainless steel plate rapidly decreased, indicating that the scale is rapidly deposited on the surface. The heat conductivity coefficient of the steel plate with the coating is slowly reduced, and the coating is proved to have good scale inhibition effect.
In the steam condensation test, test steel is vertically placed, and in the test, obvious drop-shaped condensation is observed on the surface of a coating, and no drop-shaped condensation phenomenon is observed on the surface of a stainless steel plate. The heat exchange coefficient of the stainless steel plate with the coating is 1.9 times that of the stainless steel plate without the coating.
(3) Determination of the Performance of the inter-plating adhesion force of example 1 and comparative example 1
And (3) adopting a plating adhesion scratch experiment, detecting the bonding force of the plating by using a scratch tester, and measuring the critical load when the plating is damaged. The result shows that the critical load of the plating layer of the embodiment 1 is 94N, the critical load of the comparison example 1 is 76N, and the bonding force of the plating layer and the substrate of the invention is better than that of the comparison example 1.
Claims (14)
1. A nano-electroless plating, characterized by: the coating comprises a substrate layer, a first coating and a second coating which are sequentially arranged, wherein the first coating is a Ni-P-Cu layer; the second coating is Ni-P-Cu-TiO2A layer of TiO in the direction from the substrate layer to the surface layer of the second plating layer2the concentration is increased from zero to 3 ~ 7% and is increased linearly.
2. the nano-electroless plating layer according ~ claim 1, wherein the thickness of the second plating layer is 20 ~ 60 μm.
3. the nano-electroless plating layer according ~ claim 2, wherein the thickness of the second plating layer is 20 ~ 40 μm.
4. the nano-electroless plating layer according ~ claim 1, wherein the second plating layer comprises, by mass, 8 ~ 12% of P, 4 ~ 6% of Cu, and TiO2the concentration of (A) is 1 ~ 5%, and the balance is Ni.
5. The nano-electroless plating layer according to claim 4, wherein: TiO in the second coating according to the mass percentage2the concentration of (A) is 2 ~ 4%.
6. the nano-electroless plating layer according ~ claim 1, wherein the thickness of the first plating layer is 10 ~ 20m, and the Ni-P-Cu layer comprises 8 ~ 12% by mass of P, 4 ~ 6% by mass of Cu, and the balance of Ni.
7. the nano-electroless plating layer according ~ claim 6, wherein the thickness of the first plating layer is 10 ~ 15 μm.
8. The nano-electroless plating layer of claim 1 wherein: the substrate layer is selected from one of steel or alloy, and the alloy is magnesium alloy, aluminum alloy or titanium alloy.
9. the method for preparing a nano electroless plating layer according ~ any one of claims 1 ~ 8, comprising the steps of pretreating the surface of a substrate, sequentially placing the substrate in a plating solution A and a plating solution B for electroless plating, and forming a first plating layer and a second plating layer on the surface of the substrate respectively ~ obtain the nano electroless plating layer;
The plating solution A comprises the following components:
NiSO4 25~35g/L
CuSO4 0.3~0.6g/L
NaH2PO2 15~25g/L
CH3COONa 15~20g/L
15 ~ 20g/L citric acid
KIO3 15~25mg/L
0.2-0.4 mg/L of surfactant
Ce(SO4)2 0~0.1mg/L
The plating solution B comprises the following components:
NiSO4 25~35g/L
CuSO4 0.3~0.6g/L
NaH2PO2 25~45g/L
CH3COONa 15~20g/L
15 ~ 20g/L citric acid
KIO3 15~25mg/L
0.2-0.4 mg/L of surfactant
Ce(SO4)2 0~0.1mg/L
the plating solution B also comprises TiO dispersed by ethanol2when the plating solution B is used for chemical plating, the plating solution B is added according to the set chemical plating timeAdding TiO at uniform speed2so that the concentration of the metal oxide reaches 5 ~ 12g/L after the chemical plating is finished.
10. The method of claim 9, wherein: TiO is added into the plating solution B at a constant speed2so that the concentration of the copper alloy reaches 7 ~ 10g/L after the chemical plating is finished.
11. The method of claim 9, wherein: the TiO is2has an anatase structure and a particle size of 10 ~ 20 nm.
12. the method according ~ claim 9, wherein the electroless plating is carried out at a temperature of 70 ~ 80 ℃ and a pH of 4 ~ 5 for 20 ~ 120min per time.
13. the method according ~ claim 12, wherein the plating time is 20 ~ 80 min.
14. use of an electroless plating layer according ~ any of claims 1 ~ 8 as a condensation heat exchange plating layer on a heat exchanger surface.
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