CN108115270A - The processing method of metal surface and the method for preparing alloy mold base - Google Patents
The processing method of metal surface and the method for preparing alloy mold base Download PDFInfo
- Publication number
- CN108115270A CN108115270A CN201810031809.9A CN201810031809A CN108115270A CN 108115270 A CN108115270 A CN 108115270A CN 201810031809 A CN201810031809 A CN 201810031809A CN 108115270 A CN108115270 A CN 108115270A
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- Prior art keywords
- alloy
- mold base
- gold
- metal
- method described
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Adornments (AREA)
Abstract
Description
Claims (10)
- A kind of 1. method being surface-treated to metal, which is characterized in that this method includes:Laser throwing is carried out to metal surface Light, the metal are alloy material and/or gold.
- 2. according to the method described in claim 1, wherein, when the metal is alloy material, optical maser wavelength 1064nm, work( Rate is 200~500W, and frequency is 5~20Hz, a diameter of 0.1~2mm of focal beam spot.
- 3. according to the method described in claim 1, wherein, when the metal is gold, optical maser wavelength 808nm, power is 200~1000W, frequency are 5~20Hz, a diameter of 0.1~2mm of focal beam spot.
- 4. method according to claim 1 or 2, wherein, the alloy material is sn-bi alloy and/or lead bismuth alloy.
- 5. according to the method described in claim 4, wherein, on the basis of the total weight of the sn-bi alloy, the sn-bi alloy The content of middle tin is 40~60 weight %, and the content of bismuth is 40~60 weight %.
- 6. according to the method described in claim 4, wherein, on the basis of the total weight of the lead bismuth alloy, the lead bismuth alloy The content of middle lead is 40~50 weight %, and the content of bismuth is 50~60 weight %.
- 7. according to the method described in claim 1, wherein, the gold is one kind in 18K, 22K and 24K gold.
- A kind of 8. method for preparing alloy mold base, which is characterized in that this method includes:It is alloy mould with alloy raw material machine-shaping Then embryo is surface-treated the alloy mold base after shaping according to the method described in any one in claim 1-7;Preferably, the alloy raw material is sn-bi alloy and/or lead bismuth alloy.
- 9. according to the method described in claim 8, wherein, the method for machine-shaping includes:(1) 3D of punching block used in mold base is drawn Figure;(2) punching block is produced according to the 3D figures of drafting;(3) alloy raw material is filled in the punching block obtained to step (2), and pressed Die casting is carried out to alloy raw material in casting machine, obtains alloy mold base;Preferably, the cast temperature of die casting machine is 150~260 DEG C, and clamp force is 100~600kg/cm2。
- 10. according to the method described in claim 8, wherein, the method for machine-shaping includes:(1) the 3D figures of mold base are drawn;(2) Alloy mold base is cut on numerically-controlled machine tool according to the 3D figures of drafting.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201810031809.9A CN108115270B (en) | 2018-01-12 | 2018-01-12 | The processing method of metal surface and the method for preparing alloy mold base |
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CN201810031809.9A CN108115270B (en) | 2018-01-12 | 2018-01-12 | The processing method of metal surface and the method for preparing alloy mold base |
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CN108115270A true CN108115270A (en) | 2018-06-05 |
CN108115270B CN108115270B (en) | 2019-01-25 |
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CN201810031809.9A Active CN108115270B (en) | 2018-01-12 | 2018-01-12 | The processing method of metal surface and the method for preparing alloy mold base |
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CN (1) | CN108115270B (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1368420A (en) * | 2001-02-07 | 2002-09-11 | 三圆模型企业有限公司 | Technology for fastly manufacturing less-quantity different dies |
CN1820677A (en) * | 2006-03-30 | 2006-08-23 | 上海市激光技术研究所 | Method for producing holographic souvenir coin |
CN102410469A (en) * | 2010-09-26 | 2012-04-11 | 佛山市国星光电股份有限公司 | Street lamp holder and manufacturing method |
CN103263128A (en) * | 2013-04-25 | 2013-08-28 | 深圳金一文化发展有限公司 | Manufacturing method of gold jewelry composed of silver base inlaid with gold |
JP2017092503A (en) * | 2017-02-21 | 2017-05-25 | 株式会社東京精密 | Wafer dividing system and wafer dividing method |
-
2018
- 2018-01-12 CN CN201810031809.9A patent/CN108115270B/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1368420A (en) * | 2001-02-07 | 2002-09-11 | 三圆模型企业有限公司 | Technology for fastly manufacturing less-quantity different dies |
CN1820677A (en) * | 2006-03-30 | 2006-08-23 | 上海市激光技术研究所 | Method for producing holographic souvenir coin |
CN102410469A (en) * | 2010-09-26 | 2012-04-11 | 佛山市国星光电股份有限公司 | Street lamp holder and manufacturing method |
CN103263128A (en) * | 2013-04-25 | 2013-08-28 | 深圳金一文化发展有限公司 | Manufacturing method of gold jewelry composed of silver base inlaid with gold |
JP2017092503A (en) * | 2017-02-21 | 2017-05-25 | 株式会社東京精密 | Wafer dividing system and wafer dividing method |
Non-Patent Citations (1)
Title |
---|
DAVID B. TUCKERMAN,ETC: "Planarization of Gold and Aluminum Thin Films Using a Pulsed Laser", 《ELECVTORLO.N LDE ETVTIECRES,IEEE》 * |
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CN108115270B (en) | 2019-01-25 |
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CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Tang Shuangxi Inventor after: Wang Shuhan Inventor after: He Laisheng Inventor before: Tang Shuangxi Inventor before: He Laisheng |
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SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 518019 Luohu District, Shenzhen, Guangdong Province East Street xiaonhu street, 5 north of Cui Zhu Road, No. 3, 7, 2 West 1. Patentee after: Shenzhen United blue ocean gold material technology Co.,Ltd. Address before: 518019 Guangdong city of Shenzhen province Luohu District Cuizhu north petrochemical industrial area 3 Building 7 floor west area A Patentee before: SHENZHEN UNITED BLUEOCEAN TECHNOLOGY DEVELOPMENT Co.,Ltd. |
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CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 518020 floor 7, warehouse 7, Sungang, No. 1007, Bao'an North Road, Sunxi community, Sungang street, Luohu District, Shenzhen, Guangdong Patentee after: Shenzhen United Blue Ocean Applied Materials Technology Co.,Ltd. Address before: 518019 Luohu District, Shenzhen, Guangdong Province East Street xiaonhu street, 5 north of Cui Zhu Road, No. 3, 7, 2 West 1. Patentee before: Shenzhen United blue ocean gold material technology Co.,Ltd. |