CN108108515A - A kind of Thermal design for radar insulating box TEC type selectings - Google Patents
A kind of Thermal design for radar insulating box TEC type selectings Download PDFInfo
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- CN108108515A CN108108515A CN201711157822.0A CN201711157822A CN108108515A CN 108108515 A CN108108515 A CN 108108515A CN 201711157822 A CN201711157822 A CN 201711157822A CN 108108515 A CN108108515 A CN 108108515A
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Abstract
The present invention relates to a kind of Thermal designs for radar insulating box TEC type selectings.The present invention includes the type selecting that semiconductor cooler (TEC), fan and radiator in radar insulating box are completed by theoretical calculation；Establish the threedimensional model of radar insulating box；Establish the computational domain that three dimensional network is formatted；Simulation calculation is carried out to radar insulating box, obtains initial simulation result；The contour cloud atlas of Temperature Distribution and the flowing trace of fluid are established, is improved to not meeting structure inside the radar insulating box of job requirement and layout.The present invention can shorten the R＆D cycle, increase economic efficiency.The radar insulating box obtained by design method of the present invention in actual use, not only good heat dissipation effect, while compact-sized, miniaturization, waterproof sealing and effectiveness are good.
Description
Technical field
The invention belongs to hot design of Simulation fields, are specifically related to a kind of thermal design for radar insulating box TEC type selectings
Method.
Background technology
Thermal design, that is, electronic component thermal design, the electronic component in electronic component generally have temperature in use model
Enclose, and electronic component using when generally have certain heat consumption (caloric value) generate, if taken no action to, electronic component
Interior environment temperature will be more than the temperature range allowed of electronic component, more than being present with performance after electronic component temperature range
Decline, cannot work until burn, and environment temperature is too low, electronic component can not also work normally.Due to the in vivo electricity of case
Submodule is more, and electronic component also develops towards miniaturization, lightness direction, necessarily causes the increase of volumetric power density,
Prevent traditional heat-dissipating method is required from meeting casing field miniaturization and lightness, while electronic component electricity can not be met
Magnetic screen and waterproof requirement.
At present in the heat dissipation design of low heat dissipation (being less than 500W) module, forced air cooling heat dissipation is carried out using fan mostly,
Fan is although economical and practical, and arrangement is simple, but efficiency is too low, and uses fan cooling, certainly will carry out perforate to shell,
It so that fan is easily brought into electronic component extraneous dust, can not ensure to seal, influence electronic component work
Reliability.And in high heat consumption (be higher than 500W) field, it is radiated mostly using modes such as air-conditioning, water coolings, although efficiency is very high,
But involve great expense, it is complicated.Therefore, in low heat dissipation (100~500W) field, it is urgent to provide a kind of compact-sized, small-sized
The heat dissipating method changed, worked well in terms of waterproof sealing and electromagnetic shielding.
The content of the invention
In order to solve the above technical problem, the present invention provides a kind of Thermal designs for radar insulating box TEC type selectings.
In order to achieve the object of the present invention, present invention employs following technical schemes：
A kind of Thermal design for radar insulating box TEC type selectings comprises the following steps：
Step 1, according to telecommunication index request, the electric current I of semiconductor supply refrigerator (TEC) and voltage U is determined in advance；
A kind of semiconductor cooler of model is selected, according to the refrigeration work consumption in the semiconductor cooler model specification book
With the performance map of difference variation, the hot-face temperature Th of semiconductor cooler is selected, further according to target temperature T, obtains temperature difference DT：
DT=Th-T
Become according to the temperature difference DT and the current value I of semiconductor supply refrigerator, and with reference to the refrigeration work consumption with the temperature difference
The performance map of change determines semiconductor cooler refrigerating capacity Q actual under temperature difference DTC；
Step 2, comparison needs to carry out it euthermic chip power consumption Q and semiconductor system in temperature controlled electronic component
The refrigerating capacity Q of cooler realityCIf the refrigerating capacity Q of the semiconductor cooler realityCLess than or equal to the euthermic chip power consumption
Q then reselects the model of semiconductor cooler, until the refrigerating capacity Q of selected semiconductor cooler realityCHigher than fever
Chip power-consumption Q；
Step 3, the total of system is determined according to the voltage U of euthermic chip power consumption Q and semiconductor supply refrigerator, electric current I
Heat consumption Qmax；
Qmax=Q+UI
Step 4, the Q being calculated according to step 3max, the air quantity of fan needed for system radiating is obtained according to following formula
V：
V=Qmax/(0.355ΔT)
In formula：Δ T is the Wen Sheng that air passes through radiator；
Total heat dissipation area F of required radiator：
F=Qmax/(h*ΔT)
In formula：H is the convection transfer rate of spreader surface；
The calculation formula of the size of fin, quantity and rib spacing is as follows in radiator：
F=(2z+w) nL
In formula：Z is the height of fin；L is the length of fin airflow direction；W is rib spacing；N is fin quantity；
Step 5, semiconductor cooler, fan and the radiator selected according to preceding step are arranged in radar insulating box
The electronic component of fever and the threedimensional model that corresponding radar insulating box is established using Pro/E softwares；
The huyashi-chuuka (cold chinese-style noodles) of the semiconductor cooler is located on the inside of the radar insulating box, the hot face position of the semiconductor cooler
On the outside of the radar insulating box, the huyashi-chuuka (cold chinese-style noodles) is respectively disposed with radiator and fan with Re Mianchu；
Step 6, the threedimensional model of the radar insulating box is imported in the hot simulation softwares of FloEFD and carries out hot simulation numerical
Analysis, obtains the Temperature Distribution, the Temperature Distribution of spreader surface, box house on entire insulating box internal electronic component surface
The temperature of air and the distribution of flow velocity；
Step 7, the working condition requirement for whether reaching setting inside radar insulating box is judged according to simulation result, such as meets operating mode
It is required that then terminate；Not meeting working condition requirement such as, then the electronic component by the radar insulating box internal heat generation rearranges, and
Step 5~step 6 is repeated, until meeting working condition requirement inside radar insulating box.
Further technical solution：Hot simulation numerical analytic process comprises the following steps in the step 6：
Step 6.1, selection analysis type, fluent material type, solid material type, wall in the hot simulation softwares of FloEFD
Surface roughness, fluid initial temperature and solid initial temperature, by the current value I of semiconductor cooler, the wind pressure flow of fan
Curve is inputted into the hot simulation softwares of the FloEFD, then establishes the computational domain that three dimensional network is formatted；
Step 6.2, local mesh reflnement is carried out to the target observations region in the radar insulating box；
Step 6.3, the hot simulation softwares of the FloEFD start to calculate and export simulation result.
Further technical solution：Analysis type described in the step 6.1 is flows outside, and fluent material type is sky
Gas and solid material type is aluminium alloy.
Further technical solution：Target observations region includes the euthermic chip of electronic component, half in the step 6.2
The chip of conductor refrigerator and the fin of radiator.
The beneficial effects of the present invention are：
The present invention provides a kind of Thermal design of radar constant temperature TEC type selectings, this method includes theoretical calculation sum number
Value emulation.The present invention can ensure that the refrigerating capacity of selected semiconductor cooler (TEC) can expire by the theoretical calculation of science
Needed for pedal system, radiator, the fan of design meet cooling requirements；It is subject to numerical simulation simultaneously to be verified, uses simulation result
Theoretical calculation is modified, for example, simulation calculation find radiator effect it is bad or inefficient, can utilize formula F=
(2z+w) nL, z, w and n are redesigned in the case where F is constant, is then emulated again, it is ensured that simulation result is close to true shape
Condition shortens the R＆D cycle, increases economic efficiency.The radar insulating box obtained by design method of the present invention is in actual use process
In, not only good heat dissipation effect, while compact-sized, miniaturization, waterproof sealing and effectiveness are good.
Description of the drawings
Fig. 1 is the method for the present invention FB(flow block).
Fig. 2 is invention radar insulating box structure diagram (electronic component of fever is not shown).
Fig. 3 is refrigeration work consumption in a kind of semiconductor cooler model specification book with the performance map of difference variation.
The meaning marked in attached drawing is as follows：
1- radar insulating box 2- semiconductor coolers the first radiators of 3-
4- the first fan 5- the second radiator 6- the second fan 7- heat barrier foams
Specific embodiment
More specific detail is made to technical solution of the present invention with reference to embodiment：
A kind of Thermal design for radar insulating box TEC type selectings comprises the following steps：
Step 1, according to telecommunication index request, the electric current I of semiconductor supply refrigerator (TEC) and voltage U is determined in advance；
A kind of semiconductor cooler of model is selected, according to the refrigeration work consumption in the semiconductor cooler model specification book
With the performance map of difference variation, the hot-face temperature Th of semiconductor cooler is selected, further according to target temperature T, obtains temperature difference DT：
DT=Th-T
Become according to the temperature difference DT and the current value I of semiconductor supply refrigerator, and with reference to the refrigeration work consumption with the temperature difference
The performance map of change determines semiconductor cooler refrigerating capacity Q actual under temperature difference DTC。
Since the DC power supply being used for the power supply of radar insulating box is not only powered to TEC, other electronic components are also given
Power supply, therefore the voltage U and electric current I of DC power supply are the values already decided, and can directly bring and be calculated for designing.
Step 2, comparison needs to carry out it euthermic chip power consumption Q and semiconductor system in temperature controlled electronic component
The refrigerating capacity Q of cooler realityCIf the refrigerating capacity Q of the semiconductor cooler realityCLess than or equal to the euthermic chip power consumption
Q then reselects the model of semiconductor cooler, until the refrigerating capacity Q of selected semiconductor cooler realityCHigher than fever
Chip power-consumption Q.
Step 3, the total of system is determined according to the voltage U of euthermic chip power consumption Q and semiconductor supply refrigerator, electric current I
Heat consumption Qmax；
Qmax=Q+UI
Step 4, the Q being calculated according to step 3max, the air quantity of fan needed for system radiating is obtained according to following formula
V：
V=Qmax/(0.355ΔT)
In formula：Δ T is the Wen Sheng that air passes through radiator；
Total heat dissipation area F of required radiator：
F=Qmax/(h*ΔT)
In formula：H is the convection transfer rate of spreader surface；
The calculation formula of the size of fin, quantity and rib spacing is as follows in radiator：
F=(2z+w) nL
In formula：Z is the height of fin；L is the length of fin airflow direction；W is rib spacing；N is fin quantity.
Step 5, semiconductor cooler, fan and the radiator selected according to preceding step are arranged in radar insulating box
The electronic component of fever and the threedimensional model that corresponding radar insulating box is established using Pro/E softwares；
The huyashi-chuuka (cold chinese-style noodles) of the semiconductor cooler is located on the inside of the radar insulating box, the hot face position of the semiconductor cooler
On the outside of the radar insulating box, the huyashi-chuuka (cold chinese-style noodles) is respectively disposed with radiator and fan with Re Mianchu.
As shown in Figure 2：Using TEC as interface, the stuffed heat insulated foam in gap between the huyashi-chuuka (cold chinese-style noodles) of TEC and hot face prevents outer
The heat on boundary enters in radar insulating box, and the lower surface refrigeration of TEC, cold is transferred to by heat conduction above the first radiator, the
One fan blows the first radiator, and air is reduced by the first radiator temperature, and then cold air is to radar insulating box internal cooling.
TEC upper surfaces heat, and heat is transmitted on the second radiator, and the second fan blows the second radiator, and air passes through the second radiator,
Temperature raises, and the heat of the second radiator is taken away.
In order to mitigate Computing burden, it is necessary to the threedimensional model simplify processing to reduce number of grid,
Specifically include following simplified processing mode：
(1) connectors such as boss, groove, corner angle, screw hole and the screw-nut on electronic component are removed；
(2) ignore the chip and circuit of electronic component, electronic component is reduced to simple entity.
Step 6, the threedimensional model of the radar insulating box is imported in the hot simulation softwares of FloEFD and carries out hot simulation numerical
Analysis, obtains the Temperature Distribution, the Temperature Distribution of spreader surface, box house on entire insulating box internal electronic component surface
The temperature of air and the distribution of flow velocity, specifically comprise the following steps：
Step 6.1, selection analysis type, fluent material type, solid material type, wall in the hot simulation softwares of FloEFD
Surface roughness, fluid initial temperature and solid initial temperature, by the current value I of semiconductor cooler, the wind pressure flow of fan
Curve is inputted into the hot simulation softwares of the FloEFD, then establishes the computational domain that three dimensional network is formatted；The analysis type is outer
Portion is flowed, and fluent material type is air, solid material type is aluminium alloy；
The analysis type is divided into flows outside and internal flow, wherein flows outside analysis is related to not solid in addition
Surface is border and the flowing only using computational domain border as border, and in the case, solid model is surrounded completely by fluid；And
Internal flow analysis is related to the flowing using solid appearing surface as border, such as pipeline is interior, pipe fitting is interior, storage tank is interior, equipotential in building
The flowing put.If to analyze internal flow and flows outside simultaneously, such as the flowing above building and by building, then this
Alanysis is considered as flows outside analysis in the hot simulation softwares of FloEFD；
Step 6.2, local mesh reflnement, the target observations are carried out to the target observations region in the radar insulating box
Region includes electronic component, the chip of semiconductor cooler and the fin of radiator of fever；
Step 6.3, the hot simulation softwares of the FloEFD start to calculate and export simulation result.
Step 7, the working condition requirement for whether reaching setting inside radar insulating box is judged according to simulation result, such as meets operating mode
It is required that then terminate；Not meeting working condition requirement such as, then the electronic component by the radar insulating box internal heat generation rearranges, and
Step 5~step 6 is repeated, until meeting working condition requirement inside radar insulating box.
Following instance is the design example carried out according to the above method：
The total power consumption of system is determined as 24W according to radar insulating box internal electronic component and selected TEC, before utilization
The calculation formula in face calculates institute's required airflow and heat dissipation area, and then selects fan model, and the wind pressure flow for obtaining fan is bent
Line designs the size, quantity and rib spacing of the fin of radiator.
The analysis type of simulation calculation is set in the hot simulation softwares of FloEFD for flows outside, fluid selected as air,
Radar insulating box external insulation thermal insulation material selects polyurethane foam, other solid materials selection aluminium alloy 6061, radar constant temperature
Tank wall surface roughness is arranged to 3.2 microns, and original solid and fluid temperature (F.T.) are arranged to 60 DEG C, inputs the current value 6A of TEC, keeps watch
The wind pressure flow curve of fan is inputted into simulation software, finally establishes the computational domain that three dimensional network is formatted.
Since the minimum gap size of part-structure is less than global grid minimum dimension, just need to carry out Local grid at this time
Encryption, it is therefore desirable to the chip (cooling piece) of euthermic chip, semiconductor cooler to electronic component and the rib of radiator
Piece carries out local mesh reflnement.Local mesh reflnement includes tessellated mesh rank, the minimum gap size of reduction and passage refinement
The modes such as grade.
Calculating is proceeded by after condition setting is good, convergence is calculated and obtains entire radar insulating box internal electronic component table
The section cloud atlas of the Temperature Distribution cloud atlas in face, the Temperature Distribution cloud atlas of spreader surface, box house air themperature and flow velocity.It is imitative
True the results show electronic component average surface temperature is 47.3 DEG C, and maximum temperature is 49.67 DEG C, and minimum temperature is 46.23 DEG C,
48 DEG C of the target temperature of the close setting of mean temperature, 3.44 DEG C of maximum temperature difference, in reasonable temperature range.Box house air
Temperature section cloud atlas shows that inner air maximum temperature difference is 0.31 DEG C, and than more uniform, design is reasonable.
Claims (4)
1. a kind of Thermal design for radar insulating box TEC type selectings, it is characterised in that comprise the following steps：
Step 1, according to telecommunication index request, the electric current I of semiconductor supply refrigerator (TEC) and voltage U is determined in advance；
A kind of semiconductor cooler of model is selected, the refrigeration work consumption in the semiconductor cooler model specification book is with temperature
The performance map of difference variation, selects the hot-face temperature Th of semiconductor cooler, further according to target temperature T, obtains temperature difference DT：
DT=Th-T
According to the temperature difference DT and the current value I of semiconductor supply refrigerator, and with reference to the refrigeration work consumption with difference variation
Performance map determines semiconductor cooler refrigerating capacity Q actual under temperature difference DTC；
Step 2, comparison needs to carry out it euthermic chip power consumption Q and semiconductor cooler in temperature controlled electronic component
Actual refrigerating capacity QCIf the refrigerating capacity Q of the semiconductor cooler realityCLess than or equal to the euthermic chip power consumption Q, then
The model of semiconductor cooler is reselected, until the refrigerating capacity Q of selected semiconductor cooler realityCHigher than euthermic chip
Power consumption Q；
Step 3, the overall heat consumption of system is determined according to the voltage U of euthermic chip power consumption Q and semiconductor supply refrigerator, electric current I
Qmax；
Qmax=Q+UI
Step 4, the Q being calculated according to step 3max, the air quantity V of fan needed for system radiating is obtained according to following formula：
V=Qmax/(0.355ΔT)
In formula：Δ T is the Wen Sheng that air passes through radiator；
Total heat dissipation area F of required radiator：
F=Qmax/(h*ΔT)
In formula：H is the convection transfer rate of spreader surface；
The calculation formula of the size of fin, quantity and rib spacing is as follows in radiator：
F=(2z+w) nL
In formula：Z is the height of fin；L is the length of fin airflow direction；W is rib spacing；N is fin quantity；
Step 5, semiconductor cooler, fan and the radiator selected according to preceding step arrange radar insulating box internal heat generation
Electronic component and the threedimensional model of corresponding radar insulating box is established using Pro/E softwares；
The huyashi-chuuka (cold chinese-style noodles) of the semiconductor cooler is located on the inside of the radar insulating box, and the hot face of the semiconductor cooler is located at institute
It states on the outside of radar insulating box, the huyashi-chuuka (cold chinese-style noodles) is respectively disposed with radiator and fan with Re Mianchu；
Step 6, the threedimensional model of the radar insulating box is imported in the hot simulation softwares of FloEFD and carries out hot simulation numerical analysis,
Obtain the Temperature Distribution, the Temperature Distribution of spreader surface, box house air on entire insulating box internal electronic component surface
Temperature and flow velocity distribution；
Step 7, the working condition requirement for whether reaching setting inside radar insulating box is judged according to simulation result, such as meeting operating mode will
It asks, then terminates；Working condition requirement is not met such as, then the electronic component by the radar insulating box internal heat generation rearranges, and lays equal stress on
Multiple step 5~step 6, until meeting working condition requirement inside radar insulating box.
2. Thermal design as described in claim 1, it is characterised in that：Hot simulation numerical analytic process bag in the step 6
Include following steps：
Step 6.1, selection analysis type, fluent material type, solid material type, wall surface are thick in the hot simulation softwares of FloEFD
Rugosity, fluid initial temperature and solid initial temperature, by the current value I of semiconductor cooler, the wind pressure flow curve of fan
It inputs into the hot simulation softwares of the FloEFD, then establishes the computational domain that three dimensional network is formatted；
Step 6.2, local mesh reflnement is carried out to the target observations region in the radar insulating box；
Step 6.3, the hot simulation softwares of the FloEFD start to calculate and export simulation result.
3. Thermal design as claimed in claim 2, it is characterised in that：Analysis type described in the step 6.1 is outside
Flowing, fluent material type is air, solid material type is aluminium alloy.
4. Thermal design as claimed in claim 2, it is characterised in that：Target observations region includes electricity in the step 6.2
The fin of the euthermic chip of sub- component, the chip of semiconductor cooler and radiator.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| CN112084691A (en) * | 2020-09-09 | 2020-12-15 | 北京卫星环境工程研究所 | Thermal design method for space-mounted low-power-consumption electronic case |
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| CN112965549A (en) * | 2021-02-09 | 2021-06-15 | 杭州小电科技股份有限公司 | Constant temperature control system and constant temperature control method |
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