CN108091771A - A kind of display module manufacturing method, display module and mobile terminal - Google Patents
A kind of display module manufacturing method, display module and mobile terminal Download PDFInfo
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- CN108091771A CN108091771A CN201711133883.3A CN201711133883A CN108091771A CN 108091771 A CN108091771 A CN 108091771A CN 201711133883 A CN201711133883 A CN 201711133883A CN 108091771 A CN108091771 A CN 108091771A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
- G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
- G09G3/3225—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Electroluminescent Light Sources (AREA)
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Abstract
The present invention provides a kind of display module manufacturing method, display module and mobile terminals, are related to display technology field.Wherein, the described method includes：An array layer, an encapsulated layer, a flexible PCB and a driving chip are provided；Material is fixed in default display area coating first in the first side of encapsulated layer；The first side of encapsulated layer with the first side of array layer is bonded, obtains display panel；Flexible PCB and driving chip with display panel are connected respectively, obtain display module.In embodiments of the present invention, the first fixation material can increase the fitting area between array layer and encapsulated layer, improve stability of the display module when falling.In addition, since solid phase is to the better of gas conduction ultrasonic wave, therefore, when the display area between array layer and encapsulated layer is filled up by the first fixation material, ultrasonic wave can be conducted by the first fixation material, so as to which the accuracy rate that ultrasonic fingerprint identification is carried out by display module will greatly improve.
Description
Technical field
The present invention relates to a kind of display technology field more particularly to display module manufacturing method, display module and movement eventually
End.
Background technology
OLED (Organic Light Emitting Diode, Organic Light Emitting Diode) display screen is because of its ultra-thin, high color
The advantages that domain, fast response time, high contrast, it is considered to be the flat panel display product of new generation after liquid crystal display.
Display module is the core component of OLED display screen, with reference to Fig. 1, shows a kind of display module, the display module
It can include array layer 01, encapsulated layer 02, flexible PCB 03 and driving chip 04, the manufacturing process of the display module is：It is first
Array layer 01, encapsulated layer 02, flexible PCB 03 and driving chip 04 are first provided, then on the side of 02 one side surrounding of encapsulated layer
Frame region coating one encloses glass cement 05, and afterwards in inert gas room, array layer 01 is bonded with encapsulated layer 02, thus by array
Layer 01 is fixed together with encapsulated layer 02 by a circle glass cement 05, and array layer 01, encapsulated layer 02 and glass cement 05 are in centre
Display area surrounds gas blanket 06, the display panel of box like structure is formed, finally by flexible PCB 03 and driving chip
04 is connected on display panel, so as to obtain display module.
However, inventor has found in the above-mentioned first technology of application, only pass through a circle glass between array layer and encapsulated layer
Glue is fixed together, therefore when mobile terminal falls, easily display module is caused to be damaged.In addition, it is accounted for the screen of display screen
Than higher and higher, shielding lower fingerprint recognition has become trend, when design is needed to shield lower ultrasonic fingerprint identification function, display module
Intermediate gas blanket will be unfavorable for the conduction of ultrasonic wave, so as to reduce the accuracy rate of the lower ultrasonic fingerprint identification of screen.
The content of the invention
The present invention provides a kind of display module manufacturing method, display module and mobile terminal, to solve the battle array of display module
Only by a circle glass glue laminating between row layer and encapsulated layer, the problem of causing mobile terminal easily impaired when falling and
The gas blanket that array layer, encapsulated layer and glass cement are surrounded is unfavorable for ultrasonic wave conduction, causes to shield lower ultrasonic fingerprint identification
The problem of accuracy rate is low.
In order to solve the above-mentioned technical problem, the present invention is realized in：A kind of display module manufacturing method, applied to shifting
Dynamic terminal, including：
An array layer, an encapsulated layer, a flexible PCB and a driving chip are provided；
Material is fixed in default display area coating first in the first side of the encapsulated layer；
The first side of the encapsulated layer is bonded with the first side of the array layer by the described first fixation material,
Obtain display panel；
The flexible PCB with the display panel is connected and connects the driving chip and the display panel
It connects, obtains display module.
In a first aspect, the embodiment of the present invention additionally provides a kind of display module, which includes：
Display panel, flexible PCB and driving chip；Wherein, the display panel includes array layer and encapsulated layer；
Between default display area and the array layer in the first side of the encapsulated layer material is fixed filled with first
Material；
The flexible PCB is connected with the display panel, and the driving chip is connected with the display panel.
Second aspect, the embodiment of the present invention additionally provide a kind of mobile terminal, which includes above-mentioned first aspect
The display module provided.
In embodiments of the present invention, the gap of display area is corresponded between array layer and encapsulated layer to fix material by first
Material fills up, and so as to increase the fitting area between array layer and encapsulated layer, improves stabilization of the display module when falling
Property.Further, since solid phase is for the better of gas conduction ultrasonic wave, therefore, when aobvious between array layer and encapsulated layer
When showing that region is filled up by the first fixation material, ultrasonic wave can be conducted by the first fixation material, so as to which mobile terminal leads to
Crossing display module and shield the accuracy rate of lower ultrasonic fingerprint identification will greatly improve.
Description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below by institute in the description to the embodiment of the present invention
Attached drawing to be used is needed to be briefly described, it should be apparent that, the accompanying drawings in the following description is only some implementations of the present invention
Example, for those of ordinary skill in the art, without having to pay creative labor, can also be according to these attached drawings
Obtain other attached drawings.
Fig. 1 shows a kind of display module in first technology；
Fig. 2 shows a kind of flow chart of display module manufacturing method in the embodiment of the present invention one；
Fig. 3 shows a kind of display module in the embodiment of the present invention one；
Fig. 4 shows a kind of flow chart of display module manufacturing method in the embodiment of the present invention two；
Fig. 5 shows a kind of display module in the embodiment of the present invention two；
Fig. 6 shows a kind of flow chart of display module manufacturing method in the embodiment of the present invention three；
Fig. 7 shows a kind of display module in the embodiment of the present invention three；
Fig. 8 shows a kind of flow chart of display module manufacturing method in the embodiment of the present invention four；
Fig. 9 shows a kind of display module in the embodiment of the present invention four；
Figure 10 shows a kind of flow chart of display module manufacturing method in the embodiment of the present invention five；
Figure 11 shows a kind of display module in the embodiment of the present invention five.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is part of the embodiment of the present invention, instead of all the embodiments.Based on this hair
Embodiment in bright, the every other implementation that those of ordinary skill in the art are obtained without creative efforts
Example, belongs to the scope of protection of the invention.
Embodiment one
With reference to Fig. 2, show the flow chart of the display module manufacturing method of the embodiment of the present invention one, can specifically include such as
Lower step：
Step 201, an array layer, an encapsulated layer, a flexible PCB and a driving chip are provided.
In embodiments of the present invention, the process of array layer can include：Anode layer is set on array substrate, then
One layer of organic light emitting material can be deposited on the anode layer, set afterwards on organic light emitting material under vacuum
Cathode layer.When being powered, the carrier in anode layer and cathode layer can be moved to organic light emitting material for anode layer and cathode layer
It moves, so as to which organic light emitting material can shine under the excitation of carrier.
It should be noted that in practical applications, according to the difference of the factors such as emission type, type of drive, array layer
Practical structures will be different, correspondingly, the process of array layer is also different, such as can also be in anode layer and organic
One layer of hole transmission layer is set again between luminous material layer, to adjust the injection rate in hole and injection rate, furthermore it is also possible to
One layer of electron transfer layer is set again between cathode layer and organic light emitting material, to adjust the injection rate of electronics and injection rate.
Alternatively, cathode layer can first be set on array substrate, then organic light emitting material is set on cathode layer, afterwards organic
Anode layer etc. is set on luminous material layer.The process of above-mentioned array layer is only as a kind of example, not to structure of the present invention
Into restriction.
In addition, in practical applications, encapsulated layer also there are many structure, such as encapsulated layer only include a layer package substrate or
Person is provided with the structure of multiple touch-control sensors in the either side of package substrate, and the embodiment of the present invention is for the specific of encapsulated layer
Structure and its corresponding processing method are not especially limited.
It should be noted that in order to subsequently facilitate explanation, in various embodiments of the present invention, to be set on array substrate
Anode layer is put, organic light emitting material is set on anode layer, the array layer and only of cathode layer is set on organic light emitting material
It is illustrated exemplified by encapsulated layer including a layer package substrate.
Step 202, material is fixed in the default display area coating first in the first side of encapsulated layer.
In embodiments of the present invention, the first side of encapsulated layer can be the either side of package substrate, in display panel
After being made, the default display area in first side can be used for showing, which can in advance be set by technical staff
It is fixed.In practical applications, which can be that in first technology, glass cement is set in the first side of encapsulated layer
Deng the region outside the frame region for fixing material, the embodiment of the present invention is not especially limited this.
It should be noted that the encapsulated layer for being provided with multiple touch-control sensors in the either side of package substrate, the
One side can be the side that package substrate is not provided with touch-control sensor.
First fixation material can be heat curing type optical cement or uv-curing type optical cement.Wherein, heat curing type optical cement
It can be cured in the temperature below 70 degrees Celsius, so as to which excessively high temperature will not be generated in the manufacturing process of display panel
Degree, and then can be to avoid the aging of luminous organic material in acceleration array layer.In addition, uv-curing type optical cement may be employed it is low
The model of energy-curable, it is excessively high so as to avoid curing power, and make the luminous organic material accelerated ageing in array layer.
Step 203, the first side of encapsulated layer with the first side of array layer by the first fixation material is bonded, obtained
Display panel.
It in embodiments of the present invention, can be in inert chamber, by the first of the first side of encapsulated layer and array layer
Side is bonded, so as to which encapsulated layer can be fixed together by the first fixation material with array layer.In manufactured display panel,
The gap of display area is corresponded between array layer and encapsulated layer to be filled up by the first fixation material, so as to increase array layer
Fitting area between encapsulated layer improves stability of the display module when falling.Further, since solid phase is for gas
Conduct ultrasound it is better, therefore, when the display area between array layer and encapsulated layer by first fixation material fill up when,
Ultrasonic wave can be conducted by the first fixation material, so as to which mobile terminal carries out ultrasonic fingerprint identification by display module
Accuracy rate will greatly improve.
Wherein, the first side of array layer can be the top surface that each light emitting functional layer is set in array layer, such as
For cathode layer in the array layer of top layer, the first side of array layer can be one side of the cathode layer backwards to organic light emitting material.
Step 204, flexible PCB with display panel is connected and is connected driving chip with display panel, obtained
Display module.
In embodiments of the present invention, flexible PCB can be used for the mainboard for connecting display panel and mobile terminal, in reality
It, can be by FOG (FPC on Glass) techniques by the array layer bonding in flexible PCB and display panel in the application of border.
Driving chip can be used for driving display panel, specifically, driving chip can to the cathode layer in array layer and
Anode layer is powered, and so as to drive display panel, in practical applications, can will be driven by COG (Chip On Glass) technique
Chip and the array layer bonding in display panel.Driving chip can be connected by array layer with flexible PCB.
Fig. 3 shows a kind of display module that the embodiment of the present invention one provides, which passes through the embodiment of the present invention
The one display module manufacturing method provided is made.With reference to Fig. 3, display module includes display panel 10, flexible PCB 20 and drives
Dynamic chip 30, wherein, display panel 10 includes array layer 11 and encapsulated layer 12, wherein, it is pre- in the first side of encapsulated layer 12
If material 13, such as heat curing type optical cement or uv-curing type light are fixed filled with first between display area and array layer 11
Learn glue.In addition, flexible PCB 20 is connected with display panel 10, driving chip 30 is connected with display panel 10, specifically, flexible
Circuit board 20 is connected with the array layer 11 of display panel 10, and driving chip 30 is connected with the array layer 11 of display panel 10.
In embodiments of the present invention, the gap of display area is corresponded between array layer and encapsulated layer to fix material by first
Material fills up, and so as to increase the fitting area between array layer and encapsulated layer, improves stabilization of the display module when falling
Property.Further, since solid phase is for the better of gas conduction ultrasonic wave, therefore, when aobvious between array layer and encapsulated layer
When showing that region is filled up by the first fixation material, ultrasonic wave can be conducted by the first fixation material, so as to which mobile terminal leads to
Crossing display module and shield the accuracy rate of lower ultrasonic fingerprint identification will greatly improve.
Embodiment two
With reference to Fig. 4, show the flow chart of the display module manufacturing method of the embodiment of the present invention two, can specifically include such as
Lower step：
Step 401, an array layer, an encapsulated layer, a flexible PCB and a driving chip are provided.
This step is similar with the realization process of above-mentioned steps 201, and this will not be detailed here.
Step 402, material is fixed in the default display area coating first in the first side of encapsulated layer.
This step is similar with the realization process of above-mentioned steps 202, and this will not be detailed here.
Step 403, material is fixed in the default frame region coating second in the first side of encapsulated layer；Default rim area
Domain is the region in addition to default display area in the first side of encapsulated layer.
In embodiments of the present invention, second can be coated in the default frame region in the first side of encapsulated layer and fixes material
Material fixes material, in this way, array can be improved so as to which whole covering first is fixed material and second by the first side of encapsulated layer
Fitting area between layer and encapsulated layer improves stability of the display panel when falling.Wherein, the second fixation material can be
Glass cement etc..
In addition, it is necessary to which explanation, in practical applications, can be first carried out step 402, step 403 is performed afterwards, when
So, step 403 can also be first carried out, perform step 402 afterwards, the embodiment of the present invention is held for step 402 and step 403
Row order is not construed as limiting.
Step 404, the first side of encapsulated layer and the first side of array layer are consolidated by the first fixation material and second
Determine material fitting, obtain display panel.
It in embodiments of the present invention, can be in inert chamber, by the first of the first side of encapsulated layer and array layer
Side is bonded, and is fixed material so as to which encapsulated layer can fix material and second by first, is fixed together with array layer.It is making
Into display panel in, corresponded between array layer and encapsulated layer display area gap can by first fixation material fill up, from
And the fitting area between array layer and encapsulated layer can be increased, improve stability of the display module when falling.In addition, by
In solid phase for the better of gas conduction ultrasonic wave, therefore, when the display area between array layer and encapsulated layer is by
When one fixation material fills up, ultrasonic wave can be conducted by the first fixation material, so as to which mobile terminal passes through display module
Carrying out the accuracy rate of ultrasonic fingerprint identification will greatly improve.
In addition, the gap of frame region is corresponded between array layer and encapsulated layer to be filled up by the second fixation material, so as to
The fitting area between array layer and encapsulated layer can further be increased, stability of the display module when falling is stronger.Into one
Step, the edge between array layer and encapsulated layer can be sealed by the second fixation material, so as to completely cut off extraneous steam
And oxygen, it so, it is possible the corrosion for avoiding extraneous steam and oxygen to array layer luminous organic material.
Step 405：Flexible PCB with display panel is connected and is connected driving chip with display panel, is obtained
Display module.
This step is similar with the realization process of above-mentioned steps 204, and this will not be detailed here.
Fig. 5 shows a kind of display module provided by Embodiment 2 of the present invention, which passes through the embodiment of the present invention
The two display module manufacturing methods provided are made.With reference to Fig. 5, display module includes display panel 10, flexible PCB 20 and drives
Dynamic chip 30, wherein, display panel 10 includes array layer 11 and encapsulated layer 12, wherein, it is pre- in the first side of encapsulated layer 12
If material 13, such as heat curing type optical cement or uv-curing type light are fixed filled with first between display area and array layer 11
Learn glue.Further, fixed between the default frame region in the first side of encapsulated layer 12 and array layer 11 filled with second
Material 14, such as glass cement, wherein, it presets in the first side that frame region is encapsulated layer 12, in addition to default display area
Region.In addition, flexible PCB 20 is connected with display panel 10, driving chip 30 is connected with display panel 10, specifically, soft
Property circuit board 20 is connected with the array layer 11 of display panel 10, and driving chip 30 is connected with the array layer 11 of display panel 10.
In embodiments of the present invention, the gap of display area is corresponded between array layer and encapsulated layer to fix material by first
Material fills up, and the gap of corresponding frame region can be filled up by the second fixation material, so as to increase array layer and encapsulated layer it
Between fitting area, improve stability of the display module when falling.Further, since solid phase is for gas conduction ultrasonic wave
It is better, therefore, when the display area between array layer and encapsulated layer is filled up by the first fixation material, ultrasonic wave can be with
It is conducted by the first fixation material, so that mobile terminal carries out shielding the accurate of lower ultrasonic fingerprint identification by display module
Rate will greatly improve.
Embodiment three
With reference to Fig. 6, show the flow chart of the display panel manufacturing method of the embodiment of the present invention three, can specifically include such as
Lower step：
Step 601, an array layer, an encapsulated layer, a flexible PCB and a driving chip are provided.
This step is similar with the realization process of above-mentioned steps 201, and this will not be detailed here.
Step 602, material is fixed in the default display area coating first in the first side of encapsulated layer.
This step is similar with the realization process of above-mentioned steps 202, and this will not be detailed here.
Step 603, material is fixed in the default frame region coating first in the first side of encapsulated layer；Default rim area
Domain is the region in addition to default display area in the first side of encapsulated layer.
In embodiments of the present invention, the first fixation can be also coated in the default frame region in the first side of encapsulated layer
Whole covering first is fixed material by material so as to the first side of encapsulated layer, in this way, can improve array layer and encapsulated layer it
Between fitting area, improve stability of the display panel when falling.
In addition, it is necessary to which explanation, in practical applications, can be first carried out step 602, step 603 is performed afterwards, when
So, due to being coated with same fixed material in default display area and default frame region, accordingly it is also possible to by step 602
Execution is merged with step 603 or step 603 can also be first carried out, performs step 602 afterwards, and the present invention is implemented
Example is not construed as limiting for the execution sequence of step 602 and step 603.
Step 604, the first side of encapsulated layer with the first side of array layer by the first fixation material is bonded, obtained
Display panel.
Step 605：Flexible PCB with display panel is connected and is connected driving chip with display panel, is obtained
Display module.
This step is similar with the realization process of above-mentioned steps 204, and this will not be detailed here.
It in embodiments of the present invention, can be in inert chamber, by the first of the first side of encapsulated layer and array layer
Side is bonded, so as to which encapsulated layer can be fixed together by the first fixation material with array layer.In manufactured display panel,
The gap of display area and frame region is corresponded between array layer and encapsulated layer to be filled up by the first fixation material, so as to
Increase the fitting area between array layer and encapsulated layer, improve stability of the display module when falling.Further, since solid
Compared with the better of gas conduction ultrasonic wave, therefore, when the display area between array layer and encapsulated layer is fixed by first
When material fills up, ultrasonic wave can be conducted by the first fixation material, so as to which mobile terminal is surpassed by display module
The accuracy rate of sound wave fingerprint recognition will greatly improve.
Fig. 7 shows a kind of display module that the embodiment of the present invention three provides, which passes through the embodiment of the present invention
The three display module manufacturing methods provided are made.With reference to Fig. 7, display module includes display panel 10, flexible PCB 20 and drives
Dynamic chip 30, wherein, display panel 10 includes array layer 11 and encapsulated layer 12, wherein, it is pre- in the first side of encapsulated layer 12
If material 13, such as heat curing type optical cement or uv-curing type light are fixed filled with first between display area and array layer 11
Learn glue.Further, fixed between the default frame region in the first side of encapsulated layer 12 and array layer 11 filled with first
Material 13, wherein, it presets in the first side that frame region is encapsulated layer 12, the region in addition to default display area.In addition,
Flexible PCB 20 is connected with display panel 10, and driving chip 30 is connected with display panel 10, specifically, flexible PCB 20 with
The array layer 11 of display panel 10 connects, and driving chip 30 is connected with the array layer 11 of display panel 10.
In embodiments of the present invention, the gap of display area and corresponding rim area are corresponded between array layer and encapsulated layer
The gap in domain can be filled up by the first fixation material, so as to increase the fitting area between array layer and encapsulated layer, be improved
Stability of the display module when falling.Further, since solid phase is for the better of gas conduction ultrasonic wave, therefore,
When the display area between array layer and encapsulated layer is filled up by the first fixation material, ultrasonic wave can fix material by first
It is conducted, so that the accuracy rate that mobile terminal by display module shield lower ultrasonic fingerprint identification will greatly improve.
Example IV
With reference to Fig. 8, show the flow chart of the display module manufacturing method of the embodiment of the present invention four, can specifically include such as
Lower step：
Step 801, an array layer, an encapsulated layer, a flexible PCB and a driving chip are provided.
This step is similar with the realization process of above-mentioned steps 201, and this will not be detailed here.
Step 802, material is fixed in the default display area coating first in the first side of encapsulated layer.
This step is similar with the realization process of above-mentioned steps 202, and this will not be detailed here.
Step 803, material is fixed in the default frame region coating second in the first side of encapsulated layer；Default rim area
Domain is the region in addition to default display area in the first side of encapsulated layer.
This step is similar with the realization process of above-mentioned steps 403, and this will not be detailed here.
Step 804, packaging film is formed in the first side of array layer.
In embodiments of the present invention, since the first fixation material may bring steam and oxygen into, thus can be to array layer
Luminous organic material cause a degree of corrosion, therefore, can the first side of array layer formed packaging film, so as to
Array layer can be sealed by the way that the packaging film of steam, oxygen can be completely cut off, in this way, can be brought into avoid the first fixation material
Steam, oxygen corrosion luminous organic material.Wherein, packaging film can be silicon nitride film or silicon oxide film etc..
Further, since different types of first fixation material is different to the extent of corrosion of luminous organic material, therefore,
In practical applications, can material be fixed for different first respectively in advance, the extent of corrosion of luminous organic material is carried out
Experiment, and then can be according to seriously corroded degree, it is determined whether the first side in array layer is needed to form packaging film, works as corruption
When degree of corrosion is serious, packaging film can be formed in the first side of array layer, it, can not be in array when extent of corrosion is lighter
The first side of layer forms packaging film, and the embodiment of the present invention is not especially limited this.
Step 805, the first side of encapsulated layer and the first side of array layer are consolidated by the first fixation material and second
Determine material fitting, obtain display panel.
It in embodiments of the present invention, can be in inert chamber, by the first of the first side of encapsulated layer and array layer
Side is bonded, and be that is to say and is bonded with the packaging film of array layer, so as to which encapsulated layer can fix material and array layer by first
It is fixed together.The gap that display area is corresponded in manufactured display panel, between array layer and encapsulated layer can be by first
Fixed material fills up, and so as to increase the fitting area between array layer and encapsulated layer, improves display module when falling
Stability.Further, since solid phase is for the better of gas conduction ultrasonic wave, therefore, when array layer and encapsulated layer it
Between display area when being filled up by the first fixation material, ultrasonic wave can be conducted by the first fixation material, so as to mobile
The accuracy rate that terminal carries out ultrasonic fingerprint identification by display module will greatly improve.
Step 806：Flexible PCB with display panel is connected and is connected driving chip with display panel, is obtained
Display module.
This step is similar with the realization process of above-mentioned steps 204, and this will not be detailed here.
Fig. 9 shows a kind of display module that the embodiment of the present invention four provides, which passes through the embodiment of the present invention
The four display module manufacturing methods provided are made.With reference to Fig. 9, display module includes display panel 10, flexible PCB 20 and drives
Dynamic chip 30, wherein, display panel 10 includes array layer 11 and encapsulated layer 12, wherein, it is pre- in the first side of encapsulated layer 12
If material 13, such as heat curing type optical cement or uv-curing type light are fixed filled with first between display area and array layer 11
Learn glue.Further, fixed between the default frame region in the first side of encapsulated layer 12 and array layer 11 filled with second
Material 14, such as glass cement, wherein, it presets in the first side that frame region is encapsulated layer 12, in addition to default display area
Region.Further, the first side of array layer 11 is formed with packaging film 15, such as silicon nitride film or silica
Film.In addition, flexible PCB 20 is connected with display panel 10, driving chip 30 is connected with display panel 10, specifically, flexible
Circuit board 20 is connected with the array layer 11 of display panel 10, and driving chip 30 is connected with the array layer 11 of display panel 10.
In embodiments of the present invention, the gap of display area is corresponded between array layer and encapsulated layer to fix material by first
Material fills up, and the gap of corresponding frame region can be filled up by the second fixation material, so as to increase array layer and encapsulated layer it
Between fitting area, improve stability of the display module when falling.Further, since solid phase is for gas conduction ultrasonic wave
It is better, therefore, when the display area between array layer and encapsulated layer is filled up by the first fixation material, ultrasonic wave can be with
It is conducted by the first fixation material, so that mobile terminal carries out shielding the accurate of lower ultrasonic fingerprint identification by display module
Rate will greatly improve.Furthermore packaging film is formed in the first side of array layer, so as to by the way that steam, oxygen can be completely cut off
Packaging film array layer is sealed, in this way, can to avoid first fixation material bring into steam, oxygen corrosion organic light emission material
Material.
Embodiment five
With reference to Figure 10, show the flow chart of the display module manufacturing method of the embodiment of the present invention five, can specifically include
Following steps：
Step 1001, an array layer, an encapsulated layer, a flexible PCB and a driving chip are provided.
This step is similar with the realization process of above-mentioned steps 201, and this will not be detailed here.
Step 1002, material is fixed in the default display area coating first in the first side of encapsulated layer.
This step is similar with the realization process of above-mentioned steps 202, and this will not be detailed here.
Step 1003, material is fixed in the default frame region coating first in the first side of encapsulated layer；Default frame
Region is the region in addition to default display area in the first side of encapsulated layer.
This step is similar with the realization process of above-mentioned steps 603, and this will not be detailed here.
Step 1004, packaging film is formed in the first side of array layer.
This step is similar with the realization process of above-mentioned steps 804, and this will not be detailed here.
Step 1005, the first side of encapsulated layer with the first side of array layer by the first fixation material is bonded, obtained
To display panel.
Step 1006：Flexible PCB with display panel is connected and is connected driving chip with display panel, is obtained
Display module.
This step is similar with the realization process of above-mentioned steps 204, and this will not be detailed here.
It in embodiments of the present invention, can be in inert chamber, by the first of the first side of encapsulated layer and array layer
Side is bonded, and is fixed material so as to which encapsulated layer can fix material and second by first, is fixed together with array layer.It is making
Into display panel in, corresponded between array layer and encapsulated layer display area gap can by first fixation material fill up, from
And the fitting area between array layer and encapsulated layer can be increased, improve stability of the display module when falling.In addition, by
In solid phase for the better of gas conduction ultrasonic wave, therefore, when the display area between array layer and encapsulated layer is by
When one fixation material fills up, ultrasonic wave can be conducted by the first fixation material, so as to which mobile terminal passes through display module
Carrying out the accuracy rate of ultrasonic fingerprint identification will greatly improve.
In addition, the gap of frame region is corresponded between array layer and encapsulated layer to be filled up by the second fixation material, so as to
The fitting area between array layer and encapsulated layer can further be increased, stability of the display module when falling is stronger.Into one
Step, the edge between array layer and encapsulated layer can be sealed by the second fixation material, so as to completely cut off extraneous steam
And oxygen, it so, it is possible the corrosion for avoiding extraneous steam and oxygen to array layer luminous organic material.
Furthermore packaging film is formed in the first side of array layer, so as to the encapsulation by the way that steam, oxygen can be completely cut off
Film seals array layer, in this way, steam, the oxygen that can be brought into avoid the first fixation material corrode luminous organic material.
Figure 11 shows a kind of display module that the embodiment of the present invention five provides, which passes through the embodiment of the present invention
The five display module manufacturing methods provided are made.With reference to Figure 11, display module includes display panel 10, flexible PCB 20 and drives
Dynamic chip 30, wherein, display panel 10 includes array layer 11 and encapsulated layer 12, wherein, it is pre- in the first side of encapsulated layer 12
If material 13, such as heat curing type optical cement or uv-curing type light are fixed filled with first between display area and array layer 11
Learn glue.Further, fixed between the default frame region in the first side of encapsulated layer 12 and array layer 11 filled with first
Material 13, wherein, it presets in the first side that frame region is encapsulated layer 12, the region in addition to default display area.More into
One step, the first side of array layer 11 is formed with packaging film 15, such as silicon nitride film or silicon oxide film.
In embodiments of the present invention, the gap of display area and corresponding rim area are corresponded between array layer and encapsulated layer
The gap in domain can be filled up by the first fixation material, so as to increase the fitting area between array layer and encapsulated layer, be improved
Stability of the display module when falling.Further, since solid phase is for the better of gas conduction ultrasonic wave, therefore,
When the display area between array layer and encapsulated layer is filled up by the first fixation material, ultrasonic wave can fix material by first
It is conducted, so that the accuracy rate that mobile terminal by display module shield lower ultrasonic fingerprint identification will greatly improve.Again
Person forms packaging film, so as to by that can completely cut off the packaging film of steam, oxygen by array in the first side of array layer
Layer sealing, in this way, steam, the oxygen that can be brought into avoid the first fixation material corrode luminous organic material.
The embodiment of the present invention additionally provides a kind of mobile terminal, which can be mobile phone, tablet computer etc., be somebody's turn to do
Mobile terminal includes display module provided in an embodiment of the present invention.Wherein, which further includes ultrasonic fingerprint identification mould
Group, ultrasonic fingerprint identification module are located at display module backwards to the one side of light direction, are also located at display module lower section immediately,
So as to which ultrasonic fingerprint recognition module can realize that the ultrasonic fingerprint under screen is known by display module provided in an embodiment of the present invention
Not.
In embodiments of the present invention, the gap of display area is corresponded between array layer and encapsulated layer to fix material by first
Material fills up, and so as to increase the fitting area between array layer and encapsulated layer, improves stabilization of the display module when falling
Property.Further, since solid phase is for the better of gas conduction ultrasonic wave, therefore, when aobvious between array layer and encapsulated layer
When showing that region is filled up by the first fixation material, ultrasonic wave can be conducted by the first fixation material, so as to which mobile terminal leads to
Crossing display module and shield the accuracy rate of lower ultrasonic fingerprint identification will greatly improve.
Each embodiment in this specification is described by the way of progressive, the highlights of each of the examples are with
The difference of other embodiment, just to refer each other for identical similar part between each embodiment.
In the specification provided in this place, numerous specific details are set forth.It is to be appreciated, however, that the implementation of the present invention
Example can be put into practice without these specific details.In some instances, well known method, structure is not been shown in detail
And technology, so as not to obscure the understanding of this description.
Similarly, it should be understood that in order to simplify the disclosure and help to understand one or more of each inventive aspect,
Above in the description of exemplary embodiment of the present invention, each feature of the invention is grouped together into single implementation sometimes
In example, figure or descriptions thereof.However, the method for the disclosure should be construed to reflect following intention：I.e. required guarantor
Shield the present invention claims the more features of feature than being expressly recited in each claim.It is more precisely, such as following
Claims reflect as, inventive aspect is all features less than single embodiment disclosed above.Therefore,
Thus the claims for following specific embodiment are expressly incorporated in the specific embodiment, wherein each claim is in itself
Separate embodiments all as the present invention.
In addition, it will be appreciated by those of skill in the art that although some embodiments described herein include other embodiments
In included some features rather than other feature, but the combination of the feature of different embodiments means in of the invention
Within the scope of and form different embodiments.For example, in the following claims, embodiment claimed is appointed
One of meaning mode can use in any combination.
It should be noted that the present invention will be described rather than limits the invention for above-described embodiment, and ability
Field technique personnel can design alternative embodiment without departing from the scope of the appended claims.In the claims,
Any reference symbol between bracket should not be configured to limitations on claims.Word "comprising" does not exclude the presence of not
Element or step listed in the claims.Word "a" or "an" before element does not exclude the presence of multiple such
Element.The present invention can be by means of including the hardware of several different elements and being come by means of properly programmed computer real
It is existing.If in the unit claim for listing equipment for drying, several in these devices can be by same hardware branch
To embody.The use of word first, second, and third does not indicate that any order.These words can be explained and run after fame
Claim.
It is apparent to those skilled in the art that for convenience and simplicity of description, the hardware of foregoing description
With the specific work process of device, the corresponding process in preceding method embodiment is may be referred to, details are not described herein.
The above description is merely a specific embodiment, but protection scope of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can readily occur in change or replacement, should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be subject to the protection scope in claims.
Claims (13)
1. a kind of display module manufacturing method, applied to mobile terminal, which is characterized in that the described method includes：
An array layer, an encapsulated layer, a flexible PCB and a driving chip are provided；
Material is fixed in default display area coating first in the first side of the encapsulated layer；
The first side of the encapsulated layer with the first side of the array layer by the described first fixation material is bonded, is obtained
Display panel；
The flexible PCB with the display panel is connected and is connected the driving chip with the display panel,
Obtain display module.
2. according to the method described in claim 1, it is characterized in that, the first side by the encapsulated layer and the array
Before the first side of layer fixes the step of material is bonded, obtains display panel by described first, further include：
Material is fixed in default frame region coating second in the first side of the encapsulated layer；The default frame region is
In the first side of the encapsulated layer, the region in addition to the default display area.
3. according to the method described in claim 1, it is characterized in that, the first side by the encapsulated layer and the array
Before the first side of layer fixes the step of material is bonded, obtains display panel by described first, further include：
Material is fixed in default frame region coating described first in the first side of the encapsulated layer；The default rim area
Domain is the region in addition to the default display area in the first side of the encapsulated layer.
4. method according to any one of claims 1 to 3, which is characterized in that the first side by the encapsulated layer with
Before the first side of the array layer fixes the step of material is bonded, obtains display panel by described first, further include：
Packaging film is formed in the first side of the array layer.
5. according to the method described in claim 1, it is characterized in that, described first fixes material as heat curing type optical cement or purple
Outer curing type optical cement.
6. according to the method described in claim 2, it is characterized in that, described second fixes material as glass cement.
7. a kind of display module, which is characterized in that the display module includes：
Display panel, flexible PCB and driving chip；Wherein, the display panel includes array layer and encapsulated layer；
Between default display area and the array layer in the first side of the encapsulated layer material is fixed filled with first；
The flexible PCB is connected with the display panel, and the driving chip is connected with the display panel.
8. display module according to claim 7, which is characterized in that the default frame in the first side of the encapsulated layer
Between region and the array layer material is fixed filled with second；The default frame region is the first side of the encapsulated layer
In, the region in addition to the default display area.
9. display module according to claim 7, which is characterized in that the default frame in the first side of the encapsulated layer
Between region and the array layer material is fixed filled with described first；The default frame region is the first of the encapsulated layer
In side, the region in addition to the default display area.
10. according to any display module of claim 7 to 9, which is characterized in that the first side of the array layer is formed
There is packaging film.
11. display module according to claim 7, which is characterized in that described first fixes material as heat curing type optical cement
Or uv-curing type optical cement.
12. display module according to claim 8, which is characterized in that described second fixes material as glass cement.
13. a kind of mobile terminal, which is characterized in that the mobile terminal includes any display mould of claim 7 to 12
Group.
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| WO2020191600A1 (en) * | 2019-03-25 | 2020-10-01 | 深圳市汇顶科技股份有限公司 | Fingerprint recognition apparatus and electronic device |
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